JP2012166263A - Pressurizing device and pressurizing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of more flexibly controlling the flatness of a pressurizing face.SOLUTION: The pressurizing device 1 is the device pressurizing the objects 91, 92 to be pressurized. The pressurizing device 1 includes: a head 22; and a stage 12. After the head 22 and the stage 12 are relatively moved in a mutually adjoining direction in a Z direction (vertical direction), both the objects 91, 92 to be pressurized are sandwiched between the stage 12 and the head 22 to be pressurized. The head 22 includes: a pressurizing face FC of transmitting force for pressurization to the object 92 to be pressurized; and a piezo actuator 37. The piezo actuator 37 displaces the central part of the pressurizing face FC in a Z direction, and relatively displaces the central part of the pressurizing face FC in a Z direction to the outer circumferential side part of the pressurizing face FC.

Description

  The present invention relates to a pressurizing apparatus that pressurizes two objects to be pressed and a technology related thereto.

  There is a technique in which two objects to be pressed are pressed between two pressing members. Specifically, there is an apparatus that pressurizes two objects to be pressed by sandwiching two objects to be pressed (for example, a semiconductor wafer) between the upper pressure member and the lower pressure member.

  In such an apparatus, both objects to be pressed are sandwiched between the lower surface of the upper pressure member and the upper surface of the lower pressure member, and both the objects to be pressed are pressurized. In this case, generally, the lower surface of the upper pressure member and the upper surface of the lower pressure member are each configured as a flat surface.

  However, when the lower surface (pressure surface) of the upper pressure member and the upper surface (pressure surface) of the lower pressure member are each configured as a flat surface, sufficient pressure treatment is possible due to various circumstances. May not be possible.

  For example, when an object to be pressurized is pressurized with a heat treatment, there is a problem that the pressing surface may be deformed due to heating and the flatness of the pressing surface may not be sufficiently secured.

  In order to solve such a problem, the holding surface is planarly polished while the holding surface is heated so that the pressing surface that pressurizes the object to be pressed becomes flat when heated to a predetermined temperature. Can be considered.

  However, even if such a technique is adopted, there is a problem that the flatness of the pressing surface is not always sufficient at a temperature other than the predetermined temperature at the time of surface polishing.

  Alternatively, for example, when two objects to be pressed are bonded by two members to be pressed, voids (voids) are formed at the bonding interface due to insufficient flatness of the pressing surfaces. There is a problem that may occur.

  As described above, there are various problems resulting from the fact that the flatness of the pressing surface cannot be sufficiently controlled.

  Therefore, an object of the present invention is to provide a technique capable of more flexibly controlling the flatness of the pressing surface.

  In order to solve the above-mentioned problems, the invention of claim 1 is a pressurizing device for pressurizing both the first object to be pressurized and the second object to be pressurized, the first pressure object. A pressure unit; a second pressure unit; and a driving unit that relatively moves the first pressure unit and the second pressure unit in a predetermined direction. The first pressurizing object and the second pressurizing object are the first pressurizing member and the second pressurizing unit after the relative movement of the first pressurizing unit and the second pressurizing unit in the predetermined direction. The pressurizing unit is pressed between the second pressurizing unit and the second pressurizing unit, and the first pressurizing unit transmits a pressurizing force to the first object to be pressed. A central portion change that displaces the pressing surface and the central portion of the pressing surface in the predetermined direction, and displaces the central portion of the pressing surface relative to the outer peripheral side portion of the pressing surface in the predetermined direction. And having a means.

  According to a second aspect of the present invention, in the pressurizing apparatus according to the first aspect of the invention, the central portion displacing means displaces the central portion of the pressure surface in the predetermined direction during the pressurization of the objects to be pressed. It is characterized by making it.

  According to a third aspect of the present invention, in the pressurizing apparatus according to the first aspect of the invention, the central portion displacing means displaces the central portion of the pressurizing surface in the predetermined direction during the pressurization of the two objects to be pressed. By doing so, the central portion of the pressure surface is in the predetermined direction from the first state in which the central portion of the pressure surface protrudes from the outer peripheral side portion of the pressure surface toward the first object to be pressed. In the step, the uneven state of the pressurizing surface is shifted to a second state existing at substantially the same position as the outer peripheral side portion of the pressurizing surface.

  According to a fourth aspect of the present invention, in the pressurizing apparatus according to the first aspect of the invention, the central portion displacing means displaces the central portion of the pressure surface in the predetermined direction during the pressurization of the objects to be pressed. By doing so, the central portion of the pressure surface and the pressure surface from the first state where the central portion of the pressure surface protrudes from the outer peripheral side portion of the pressure surface toward the first object to be pressed. Through the second state in which the outer peripheral side portion of the pressing surface exists at substantially the same position in the predetermined direction, the outer peripheral side portion of the pressing surface is directed toward the first object to be pressed from the central portion of the pressing surface. Further, the uneven state of the pressure surface is shifted to the protruding third state.

  According to a fifth aspect of the present invention, in the pressurizing apparatus according to any one of the first to fourth aspects of the present invention, the pressurizing apparatus further comprises first measuring means for measuring a pressurizing pressure at a central portion of the pressurizing surface, The central portion displacing means adjusts the displacement of the central portion in the predetermined direction based on the pressurizing pressure at the central portion.

  A sixth aspect of the present invention is the pressure device according to any one of the first to fifth aspects, wherein the first pressure portion has a substantially truncated cone shape or a substantially polygonal frustum shape, and A first transmission member that transmits a force for applying pressure to both the objects to be pressed, and the first transmission member and the first object to be pressed. And a substantially plate-like second transmission member that further transmits a pressing force from the first transmission member to the first object to be pressed.

  A seventh aspect of the invention is the pressurizing apparatus according to the sixth aspect of the invention, further comprising a parallel adjusting means for adjusting a parallel degree between the first object to be pressed and the second object to be pressed. The drive means, after the parallel adjustment operation by the parallel adjustment means, the first pressurizing section for holding the first object to be pressed and the second for holding the first object to be pressed. The pressurizing unit is moved relatively in the predetermined direction to bring the two objects to be pressed into contact with each other.

  According to an eighth aspect of the present invention, in the pressurizing apparatus according to the seventh aspect of the present invention, on the apex side of the first transmission member having a substantially truncated cone shape or a substantially polygonal truncated cone shape, the predetermined base member and the first Expansion / contraction means disposed between the transmission member and the expansion / contraction means, wherein the expansion / contraction means expands and contracts after the parallel adjustment operation is performed by the parallel adjustment means and the objects to be pressed come into contact with each other. The pressure applied to the first transmission means is adjusted.

  According to a ninth aspect of the present invention, in the pressurizing apparatus according to the sixth aspect of the present invention, a predetermined base member and the first base are formed on the apex side of the first transmission member having a substantially truncated cone shape or a substantially polygonal truncated cone shape. It is further characterized by further comprising expansion / contraction means arranged between the transmission member.

  According to a tenth aspect of the present invention, in the pressurizing apparatus according to the eighth or ninth aspect of the invention, the expansion / contraction means has a piezo actuator.

  According to an eleventh aspect of the present invention, in the pressurizing apparatus according to any one of the first to sixth aspects, the central portion displacing means is a piezo actuator provided in the vicinity of the central portion of the pressurizing surface. And a piezoelectric actuator that extends and contracts in a direction to displace a central portion of the pressure surface in the predetermined direction.

  According to a twelfth aspect of the present invention, in the pressurizing apparatus according to the sixth aspect of the invention, the central portion displacing means is provided in the vicinity of the central portion of the pressurizing surface, and the first transmission member and the second transmission member. And a heating means for heating the connecting member, and the center displacing means extends the connecting member in the predetermined direction by heating the connecting member, and the pressure surface The center portion of the slab is displaced in the predetermined direction.

  A thirteenth aspect of the present invention is a pressurizing method for pressurizing both the first object to be pressed and the second object to be pressed, and a) the first object to be pressed is applied. A step of relatively moving a first pressure member to be held and a second pressure member to hold the second object to be pressed; and b) a step of holding the first object to be pressed. Displacing a central portion of the pressure surface in the predetermined direction, and displacing the central portion of the pressure surface relative to the outer peripheral side portion of the pressure surface in the predetermined direction.

  According to a fourteenth aspect of the present invention, in the pressurizing method according to the thirteenth aspect, in the step b), the displacement amount in the predetermined direction of the central portion of the pressurizing surface is adjusted in accordance with the processing temperature during pressurization. It is characterized by being.

  According to the invention described in claims 1 to 14, it is possible to satisfactorily adjust the flatness of the pressing surface.

  In particular, according to the invention described in claim 3, it is possible to appropriately pressurize both objects to be pressed while moving the action position of a relatively large pressure from the center part to the peripheral part of both objects to be pressed. it can.

  In particular, according to the invention described in claim 4, it is possible to apply a sufficiently large pressure even in the peripheral portion of both objects to be pressurized.

  In particular, according to the invention described in claim 5, it is possible to further ensure the flatness of the pressing surface.

  In particular, according to the seventh aspect of the present invention, the positional deviation at the time of contact hardly occurs.

  In particular, according to the invention described in claim 14, it is possible to satisfactorily adjust the flatness of the pressurizing surface of the first pressurizing portion even when the processing temperature during pressurization is other than a predetermined value. It is.

It is a longitudinal cross-sectional view which shows the pressurization apparatus which concerns on 1st Embodiment. It is a perspective view which shows schematic structure of a stage and head vicinity. It is a longitudinal cross-sectional view of a head. It is a top view of a head. It is a figure which shows the relationship between the processing temperature at the time of pressurization, and the displacement amount which planarizes a pressurization surface. It is a figure which shows the mode of both pressurization object vicinity. It is a schematic diagram which shows a non-parallel arrangement | positioning state. It is a figure which shows the state which the center part of the lower side member protrudes toward the lower side. It is a figure which shows the state after grinding | polishing and cooling. It is a flowchart which shows the operation | movement which concerns on 1st Embodiment. It is a figure which shows the "middle convex state" of a pressurization surface. It is a figure which shows the "flat state" of a pressurization surface. It is a figure which shows the "indented state" of a pressurization surface. It is a flowchart which shows the operation | movement which concerns on 2nd Embodiment. It is a figure which shows the pressurization state by the pressurization surface of a middle convex state. It is a figure which shows the pressurization state by the pressurization surface of a middle convex state. It is a figure which shows the pressurization state by the pressurization surface of a middle convex state. It is a figure which shows the pressurization state by the pressurization surface of a middle concave state. It is a figure which shows the time-dependent change curve of the target value for in-plane pressure adjustment. It is a figure which shows the state by which the resin layer was pinched | interposed between both to-be-pressurized objects. It is sectional drawing which shows the state in which the resin layer was provided partially. It is a top view which shows the state in which the resin layer was provided partially. It is sectional drawing which shows the state in which the resin layer was provided partially. It is a figure which shows the operation | movement which concerns on a modification in time series. It is a figure which shows typically a mode that a "void" arises around a sharp part. It is a figure which shows the modification concerning a chip on wafer. It is a figure which shows the modification concerning a chip on wafer. It is a block diagram which shows the pressurization apparatus (nanoimprint apparatus) which concerns on a modification. It is a figure which shows the to-be-pressurized object pressurized in a nanoimprint apparatus. It is a figure which shows a mode that an ultraviolet-ray is irradiated to both to-be-pressurized objects. It is a figure which shows the "indented state" concerning a modification. It is a figure which shows the "middle convex state" which concerns on a modification. It is a figure which shows the head vicinity which concerns on a modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<1. First Embodiment>
<1-1. Device>
FIG. 1 is a longitudinal sectional view showing a pressure device 1 (also referred to as 1A) according to a first embodiment of the present invention. In the following, in each figure, directions and the like are shown using an XYZ orthogonal coordinate system for convenience.

  The pressurizing apparatus 1 pressurizes the pressurized object 91 and the pressurized object 92 so as to face each other (superimpose) in a chamber (vacuum chamber) 2 under reduced pressure. Is a device for joining. Therefore, the pressurizing device 1 is also expressed as a joining device.

  The pressurizing apparatus 1 includes a vacuum chamber 2 that is a processing space for the objects to be pressed 91 and 92. The vacuum chamber 2 is connected to a vacuum pump 5 via an exhaust pipe 6 and an exhaust valve 7. The vacuum chamber 2 is put into a vacuum state by reducing (reducing pressure) the pressure in the vacuum chamber 2 in accordance with the suction operation of the vacuum pump 5. Further, the exhaust valve 7 can adjust the degree of vacuum in the vacuum chamber 2 by the opening / closing operation and the exhaust flow rate adjusting operation.

  Here, a semiconductor wafer (substrate) is used as the objects to be pressurized 91 and 92. The objects to be pressed 91 and 92 are also referred to as “objects to be bonded”, and the pressure treatment (pressure method) in the apparatus 1 is also referred to as a bonding process (bonding method).

  In addition, when the pressure is applied (bonding), both of the objects to be pressed 91 and 92 are the pressure surface 22f (see FIG. 2) of the head 22 (pressure member) and the pressure surface 12f (see FIG. 2) of the stage 12 (pressure member). (See FIG. 2). Specifically, the upper object 92 is held by the head 22 (more specifically, an electrostatic chuck or a mechanical chuck provided at the lower end of the head 22). Similarly, the lower object to be pressurized 91 is held by the stage 12 (more specifically, an electrostatic chuck or a mechanical chuck provided at the upper end of the stage 12).

  Both the head 22 and the stage 12 are installed in the vacuum chamber 2. The head 22 is heated by a heater 22 h (FIG. 3) built in the head 22, and the temperature of an object to be pressurized (object to be pressurized on the head 22 side) 92 held by the head 22 can be adjusted. . Similarly, the stage 12 is heated by a heater 12 h built in the stage 12, and the temperature of the object to be pressurized (the object to be pressurized on the stage 12 side) 91 on the stage 12 can be adjusted.

  The head 22 is moved (translationally moved) in the X direction and the Y direction by the alignment table 24 and is rotated in the θ direction (rotation direction about the Z axis) by the rotation drive mechanism 25. The head 22 is driven by an alignment table 24 and a rotation drive mechanism 25 based on a position detection result by a position recognition unit 28 described later, and alignment operations in the X direction, the Y direction, and the θ direction are executed.

  The head 22 is moved (lifted / lowered) in the Z direction (vertical direction) by the Z-axis lifting / lowering drive mechanism 26. The movement of the head 22 in the Z direction (lifting / lowering operation) causes the stage 12 and the head 22 to move relative to each other, and the pressurized object 91 held on the stage 12 and the pressurized object 92 held on the head 22. The relative positional relationship between and fluctuates. As a result, the states of the objects to be pressed 91 and 92 are changed from the separated state to the contact state, and the objects to be pressed 91 and 92 are pressurized. The pressurizing pressure at the time of joining is controlled based on signals detected by a plurality of pressure detection sensors (load cells, etc.) 32 (32a, 32b, 32c), 36, 38 (see FIGS. 2 to 4). .

  Further, the pressurizing apparatus 1 includes a position recognition unit 28 that recognizes the positions (specifically, X, Y, θ) of the objects to be pressed 91, 92.

  As illustrated in FIG. 1, the position recognition unit 28 includes imaging units (cameras) 28 c and 28 d that acquire a light image related to an object to be pressed as image data. The imaging units 28c and 28d each have a coaxial illumination system. In addition, a position identification pattern mark (hereinafter also simply referred to as a pattern or a mark) is attached to each of the objects to be pressed 91 and 92. For example, two position identification marks are provided on one pressurized object 91, and two position identification marks are provided on the other pressurized object 92. Each mark preferably has a specific shape.

  In the positioning operation (alignment operation) of the objects to be pressed 91 and 92, the position recognition unit (camera or the like) 28 recognizes the positions of the two sets of marks attached to the objects to be pressed 91 and 92. Executed by.

  As shown in FIG. 1, the position recognizing unit 28 relates to transmitted light and reflected light of illumination light emitted from the respective coaxial illumination systems of the imaging units 28 c and 28 d in a state where the objects to be pressed 91 and 92 face each other. The positions of the objects to be pressed 91 and 92 are recognized using the image data. In addition, as a light source of each coaxial illumination system of the imaging units 28c and 28d, light (for example, infrared light) that passes through both the objects to be pressed 91 and 92 is used.

  Specifically, the light emitted from the light source (not shown) of the coaxial illumination system in the camera 28M is reflected by the mirror 28e, changes its traveling direction, and travels upward. When the light further passes through the window 2b (FIG. 1) and part (or all) of the objects to be pressed 91 and 92 and then is reflected by the marks of the objects to be pressed 91 and 92, This time it proceeds in the opposite direction (downward). Then, the light again passes through the window 2b and is reflected by the mirror 28e, and its traveling direction is changed to the left, and reaches the imaging unit 28c of the camera 28M. In this way, the position recognizing unit 28 acquires the optical images (images including the respective marks) related to the objects to be pressed 91 and 92 as image data, and applies the pressure to the objects to be pressed 91 and 92 based on the image data. The position of a given set of marks is recognized, and the amount of positional deviation between the set of marks is obtained.

  Similarly, the light emitted from the light source (not shown) of the coaxial illumination system in the camera 28N is reflected by the mirror 28f, changes its traveling direction, and travels upward. When the light further passes through part or all of the window portion 2b (FIG. 1) and the objects to be pressed 91 and 92 and then is reflected by the marks of the objects to be pressed 91 and 92, this time, Proceeds backward (downward). Then, the light is again transmitted through the window portion 2b and reflected by the mirror 28f, and the traveling direction thereof is changed to the right, and reaches the imaging unit 28d of the camera 28N. In this way, the position recognizing unit 28 acquires the optical images (images including the respective marks) related to the objects to be pressed 91 and 92 as image data, and applies the pressure to the objects to be pressed 91 and 92 based on the image data. While recognizing the position of another set of attached marks, the amount of positional deviation between the set of marks is obtained.

  Thereafter, the position recognizing unit 28 calculates the relative shift amounts of the pressed objects 91 and 92 in the X direction, the Y direction, and the θ direction based on the shift amounts of the two sets of marks. Then, the head 22 is driven in two translational directions (X direction and Y direction) and a rotational direction (θ direction) so that the relative shift amount recognized by the position recognition unit 28 is reduced. Thereby, both the to-be-pressurized objects 91 and 92 are relatively moved, and the above-described positional deviation amount is corrected.

  In this way, the alignment operation (with respect to the X direction, the Y direction, and the θ direction) is executed.

  Further, such a position recognition operation and an alignment driving operation are repeatedly executed. According to this, the drive error at the time of driving the head 22 is gradually reduced, and a more accurate alignment operation is executed.

  FIG. 2 is a perspective view showing a schematic configuration in the vicinity of the stage 12 and the head 22. FIG. 3 is a longitudinal sectional view of the head 22, and FIG. 4 is a plan view of the head 22. 2 and 4, the base member 23, the alignment table 24, and the like are omitted for convenience of illustration.

  As shown in these drawings, the stage 12 has a substantially cylindrical shape, and the head 22 has a substantially truncated cone shape.

  The head 22 includes an upper member 221 having a substantially truncated cone shape and a lower member 223 that is a substantially disk-shaped plate member.

  The upper member 221 and the lower member 223 transmit the pressing force from the base member 23 to the objects to be pressed 91 and 92.

  The lower member 223 has an electrostatic adsorption mechanism or the like, and can adsorb and hold the article 92 to be pressurized. Further, the lower member 223 incorporates a heater and a heat insulating member, and can heat the article 92 to be pressed held by the lower member 223 to an appropriate temperature.

  Further, the pressurizing device 1 includes three piezo actuators 31 (31a, 31b, 31c), three pressure detection sensors 32 (32a, 32b, 32c), three distance measuring sensors 33 (33a, 33b, 33c), and three. And two reflecting plates 34 (34a, 34b, 34c).

  As shown in FIG. 3, the head 22 is connected to an alignment table 24 via three piezoelectric actuators 31 (31a, 31b, 31c), a base member 23, and the like.

  The three piezoelectric actuators 31a, 31b, and 31c and the three pressure detection sensors 32a, 32b, and 32c are provided between the head 22 and the base member 23. Specifically, as shown in the plan view of FIG. 4, each of the piezo actuators 31a, 31b, and 31c is in a top view (specifically, different positions in the virtual horizontal plane (three positions on a non-collinear line) PE1. , PE2 and PE3), the upper surface of the head 22 and the base member 23 are connected via pressure detection sensors 32a, 32b and 32c, respectively. More specifically, the three piezoelectric actuators 31a, 31b, 31c are arranged at substantially equal intervals in the vicinity of the outer peripheral portion of the upper surface (conical surface) of the substantially truncated cone-shaped head 22. The three pressure detection sensors 32a, 32b, and 32c connect the upper end surfaces of the corresponding piezoelectric actuators 31a, 31b, and 31c and the lower surface of the base member 23, respectively. In other words, the three pressure detection sensors 32a, 32b, and 32c are disposed at three independent positions (non-collinear positions) PE1, PE2, and P3 in a plane parallel to the pressure surface of the head 22.

  The three piezo actuators 31a, 31b, and 31c can extend and contract in the Z direction independently of each other, and the posture of the head 22 (specifically, the posture angle around two axes (for example, around the X axis and around the Y axis)) and The position (specifically, the position in the Z direction) can be finely adjusted. Further, the three pressure detection sensors 32a, 32b, and 32c respectively apply pressures at three positions (positions on non-collinear lines) PE1, PE2, and P3 in a plane parallel to the lower surface (pressure surface) 22f of the head 22. Can be measured.

  The three distance measuring sensors 33a, 33b, and 33c are located at different positions P1, P2, and P3 on a non-collinear line on a plane parallel to the upper surface 12f of the stage 12 (a plane parallel to the XY plane) (in the top view). Is arranged (see FIG. 3). More specifically, the three distance measuring sensors 33a, 33b, 33c are fixed at substantially equal intervals on the outer peripheral side surface of the substantially cylindrical stage 12 (see FIG. 2). In addition, on the outer peripheral side surface of the head 22, reflectors 34a, 34b, and 34c are provided at fixed positions corresponding to the distance measuring sensors 33a, 33b, and 33c, respectively.

  As each distance measuring sensor 33a, 33b, 33c, for example, a laser type distance measuring sensor is used. Each distance measuring sensor (laser type distance measuring sensor or the like) 33a, 33b, 33c fixed to the stage 12 measures the distance to the corresponding reflectors 34a, 34b, 34c, respectively. Specifically, each distance measuring sensor 33 emits a laser beam and measures the distance DM from the distance measuring sensor 33 to the reflecting plate 34 using the laser beam (reflected light) reflected by the reflecting plate 34. To do. More specifically, each of the distance measuring sensors 33a, 33b, and 33c measures the distance DM (DM1, DM2, DM3) at each of the positions P1, P2, and P3 in a plane parallel to the XY plane. Then, by subtracting the thicknesses and the like of the objects to be pressed 91 and 92 from the distance DM, the object to be pressed 91 held on the stage 12 and the object to be pressed 92 held on the head 22 in the Z direction. A separation distance DA is calculated. Specifically, the separation distance DA (DA1, DA2, DA3) at each position P1, P2, P3 is calculated.

  As described above, the three distance measuring sensors 33a, 33b, and 33c measure the Z direction distance DA at the three positions P1, P2, and P3 as described above to thereby determine the Z direction position of the head 22 with respect to the stage 12. It is possible to measure (relative position) and attitude (relative attitude) very accurately. In other words, it is possible to measure the relative positions and relative postures of the objects to be pressed 91 and 92 very accurately.

  Furthermore, the pressurizing device 1 drives the three piezoelectric actuators 31a, 31b, and 31c based on the measurement value related to the Z-direction distance DA, so that the lower surface 22f (see FIG. 2) of the head 22 and the upper surface (acceleration) of the stage 12 are added. It is possible to adjust the degree of parallelism with the pressure surface 12f. As a result, the pressure device 1 can adjust the degree of parallelism between the pressed object 91 held by the stage 12 and the pressed object 92 held by the head 22. Specifically, the pressurizing device 1 drives the three piezo actuators 31a, 31b, and 31c to equalize the Z-direction distance DA at the three positions P1, P2, and P3. The object 91 to be pressed and the object 92 to be pressed held by the head 22 can be arranged in parallel.

  As shown in FIGS. 2 and 3, the pressurizing device 1 further includes a piezo actuator 35 and a pressure detection sensor 36.

  The pressure detection sensor 36 is fixed to a cylindrical recess 23b provided at the bottom side central portion of the substantially cylindrical base member 23, and the piezo actuator 35 is fixed to the lower surface side (bottom side) of the pressure detection sensor 36. Has been.

  The piezoelectric actuator 35 is disposed on the upper surface 22b side of the head 22 having a substantially truncated cone shape. In other words, the piezo actuator 35 has the base member 23 and the upper member 221 on the apex side of the head 22 having a substantially truncated cone shape (the upper surface side having a relatively small area between the upper surface and the lower surface of the truncated cone). It is arranged between.

  The piezo actuator 35 can be expanded and contracted in the Z direction. The piezo actuator 35 can switch between a state where it does not contact the upper surface 22 b of the head 22 and a state where it contacts the upper surface 22 b of the head 22 by changing the degree of expansion and contraction in the Z direction. As will be described later, the parallel adjustment operation by the plurality of piezo actuators 31 before the contact of the objects to be pressed 91 and 92 is executed in a state where the piezo actuators 35 do not contact the upper surface 22 b of the head 22. On the other hand, the pressurizing operation of the objects to be pressed 91 and 92 is executed in a state where the piezo actuator 35 is in contact with the upper surface 22 b of the head 22. During the pressurizing operation, a pressurizing force is transmitted from the piezo actuator 35 via the head 22 to the objects to be pressed 91 and 92. Further, in the state where the piezo actuator 35 is in contact with the upper surface 22b of the head 22, the amount of expansion and contraction of the piezo actuator 35 is further adjusted to adjust the pressurizing pressure in the pressurizing operation. Specifically, the pressurization pressure increases as the extension amount of the piezo actuator 35 increases, and the pressurization pressure decreases as the extension amount of the piezo actuator 35 decreases.

  As shown in FIGS. 2 and 3, the pressurizing device 1 further includes a piezo actuator 37 and a pressure detection sensor 38.

  The piezo actuator 37 and the pressure detection sensor 38 are disposed in a substantially cylindrical recess (also referred to as a hollow portion) 221 b provided in the lower surface side central portion of the upper member 221. In other words, the piezo actuator 37 and the pressure detection sensor 38 are located on the upper side of the lower member 223 near the central portion of the lower member 223 in the horizontal direction (also expressed as the vicinity of the central portion of the lower surface 22f of the lower member 223). Is provided. The lower surface 22f (hereinafter also referred to as “FC”) of the lower member 223 is also referred to as a contact surface with respect to the object to be pressurized 92 or a pressure surface that transmits a pressing force to the object to be pressurized 92. Is done. The lower surface FC is also expressed as an outer main surface (lower main surface) of the substantially plate-like lower member 223.

  The pressure detection sensor 38 is fixed to the upper end surface of the hollow portion 221b. The piezo actuator 37 is fixed to the lower surface side (bottom surface side) of the pressure detection sensor 38 and is fixed to the upper surface side central portion of the lower member 223. As described above, the upper member 221 and the lower member 223 are connected to each other via the piezo actuator 37 and the pressure detection sensor 38 at the center of the head 22. In other words, the piezo actuator 37 and the like connect the upper member 221 and the lower member 223.

  The upper member 221 and the lower member 223 are also fixed to each other by bolts or the like at the outer peripheral edge of the head 22. In other words, the outer peripheral edge of the lower member 223 and the outer peripheral edge of the upper member 221 are fixed.

  The piezo actuator 37 adjusts the magnitude of the force in the Z direction acting on the central portion of the pressing surface FC by expanding and contracting in the Z direction, and the central portion of the lower surface of the substantially plate-like lower member 223 is adjusted in the Z direction. Can be displaced. Specifically, the piezo actuator 37 expands and contracts to displace (small displacement) the central portion of the pressing surface FC in the Z direction, and the central portion of the pressing surface FC is Z with respect to the outer peripheral side portion of the pressing surface FC. It can be displaced relatively in the direction. Thus, the piezo actuator 37 adjusts the Z-direction displacement amount of the central portion of the pressing surface FC. The piezo actuator 37 is also expressed as a central portion displacing means for displacing the lower member 223 (specifically, the pressing surface FC223) in the Z direction at the central portion. Further, the piezo actuator 37 is also expressed as a driving means for adjusting flatness with respect to the pressing surface FC.

  During the pressurizing operation, a pressurizing force is transmitted from the piezo actuator 35 via the head 22 to the objects to be pressed 91 and 92. Specifically, the force from the piezo actuator 35 is transmitted to the central portion of the pressing surface FC via the central portion of the upper member 221 and the piezo actuator 37. Further, the force from the piezo actuator 35 is also transmitted to the outer peripheral portion and the like of the pressing surface FC through the outer peripheral portion and the like of the upper member 221. Thus, the force from the piezo actuator 35 is distributed and transmitted not only to the central portion but also to a portion having an annular expansion (linear or planar expansion) at least in the vicinity of the outer peripheral edge. Therefore, the pressure for pressurization is distributed and transmitted relatively evenly. In particular, as compared with the case where the force from the base member 23 is transmitted by only three piezo actuators 31 (when the force is transmitted by only three points), the pressure force is applied to each portion of the lower member 223 relatively evenly. Can be transmitted.

<1-2. Adjustment of flatness of pressure surface FC>
Here, the lower member 223 has a characteristic that its center portion swells downward as compared to its peripheral portion (also referred to as an outer peripheral portion) due to thermal expansion accompanying a temperature rise (in other words, the pressure member FC). The central portion has a characteristic of projecting downward from the peripheral portion of the pressing surface FC). The lower member 223 is in contact with the upper member 221 on the upper side of the lower member 223, and may be fixed to the upper member 221 at the outer peripheral edge of the lower member 223. This is because when it occurs, a particularly large deformation occurs in the central portion of the lower member 223.

  Such deformation is not preferable when flatness of the pressing surface FC is required.

  Therefore, in this embodiment, first, the pressure surface FC is planarly polished in a state where the lower member 223 is heated to the temperature TX so that the pressure surface FC becomes flat when heated to the predetermined temperature TX. Keep it. However, the temperature TX (for example, 500 ° C.) is higher than the processing temperature TP (for example, 200 ° C. to 400 ° C.) during the pressurizing process.

  Specifically, as shown in FIG. 8, the lower member 223 is heated to a temperature TX. In FIG. 8, the state in which the central portion protrudes downward relative to the peripheral portion due to thermal expansion accompanying a rise in temperature is exaggerated. Then, in such a protruding state, the lower surface (pressure surface) FC of the lower member 223 is planarly polished, and the lower member 223 is manufactured. At normal temperature after cooling (for example, 25 ° C.), as shown in FIG. 9, the lower member 223 has a thinner central portion than its peripheral portion (in other words, the central portion of the pressing surface FC is Indented state (also referred to as “indented” state). Further, the lower member 223 can have an indented state at a temperature lower than the temperature TX (even at a temperature other than room temperature).

  Here, it is assumed that the temperature TX during surface polishing is equal to the processing temperature TP2 (for example, 400 ° C.). In this case, when the processing temperature during pressurization is the temperature TP2, the pressurization surface FC is almost completely flat, and the flatness of the pressurization surface FC at the processing temperature TP2 is very good. However, when the processing temperature during pressurization is the processing temperature TP1 (for example, 200 ° C.), the pressurizing surface FC at the processing temperature TP1 is slightly “indented”, and the flatness of the pressurizing surface FC is lowered. As described above, when only the surface polishing technique at a certain processing temperature is used, there is a problem that sufficient flatness cannot be obtained when pressurizing at a temperature other than the processing temperature.

  On the other hand, in this embodiment, as described above, first, the lower member 223 is manufactured using a technique in which the pressing surface FC is planarly polished at the temperature TX. At the time of pressurization using the lower member 223, the central portion of the pressurization surface FC is displaced in the Z direction by using the piezoelectric actuator 37, and the central portion of the pressurization surface FC is Z with respect to the outer peripheral side portion of the pressurization surface FC. Relatively displaced in the direction. That is, the flatness of the pressure surface FC is adjusted by the expansion and contraction operation of the piezo actuator 37.

  More specifically, the displacement amount ΔZ in the Z direction of the central portion of the pressurizing surface FC is adjusted according to the processing temperature during pressurization. That is, the displacement amount ΔZ for flattening the pressure surface FC is adjusted according to the processing temperature T.

  FIG. 5 is a diagram showing the relationship between the processing temperature T during pressurization and the displacement amount ΔZ for flattening the pressurization surface FC. By setting a value that satisfies the relationship indicated by the curve LC1 in FIG. 5 as the displacement amount ΔZ of the piezo actuator 37 during pressurization, the pressurization surface FC during pressurization is flattened.

  For example, at a temperature TP1 (for example, 200 ° C.) that is relatively far from a temperature TX (for example, 500 ° C.) at the time of surface polishing, the displacement amount (extension amount) ΔZ of the piezoelectric actuator 37 is a relatively large value ΔZ1 (for example, 30). Micrometer (μm)). On the other hand, at a temperature TP2 (for example, 400 ° C.) that is relatively close to the temperature TX during surface polishing, the displacement (elongation) ΔZ of the piezo actuator 37 is set to a relatively small value ΔZ2 (for example, 10 micrometers). . Thereby, it is possible to adjust the flatness of the pressurization surface FC at the time of pressurization very well at any of the plurality of processing temperatures TP1 and TP2.

  In this embodiment, the temperature TX (for example, 500 ° C.) is higher than the processing temperature TP (for example, 200 ° C. to 400 ° C.) during the pressurizing process. Thereby, an indented state can be generated at a temperature (for example, room temperature) lower than the processing temperature TP. Therefore, even when the upward expansion of the lower member 223 is restricted due to the presence of the upper member 221, the flatness of the pressing surface FC can be favorably adjusted by adjusting the degree of extension of the piezoelectric actuator 37. It is.

<1-3. Operation>
Next, pressurizing operations and the like regarding the two objects to be pressed 91 and 92 will be described. Note that the pressurizing operation and the like are executed under the control of the controller 100.

  FIG. 6 is a diagram showing a state in the vicinity of the objects to be pressed 91 and 92 showing a state where the alignment operation as described above is completed.

  FIG. 6 shows a state in which the objects to be pressed 91 and 92 are not yet in contact with each other and are arranged with a space therebetween in the Z direction. Further, in the state of FIG. 6, it is assumed that the relative positions of the objects to be pressed 91 and 92 in the XY direction and the θ direction have a desired state by the alignment operation described above.

  In the following, as shown in FIG. 10, from the state shown in FIG. 6 (or FIG. 7), (1) the adjustment operation of the flatness of the pressure surface FC (step S11), (2) the parallel adjustment operation of the head 22 (step An example will be described where S12) and (3) heating and pressurizing operations (step S13) are further executed in this order.

<Adjustment operation of flatness of pressure surface FC>
As described above, the lower member 223 has a characteristic (in other words, a pressure surface) that the center part swells downward as compared to the peripheral part (also referred to as the outer peripheral part) due to thermal expansion accompanying a temperature rise. The center portion of the FC has a characteristic of projecting downward from the peripheral portion of the pressing surface FC). Moreover, the protrusion degree of the center part (center part of the pressurization surface FC) of the lower side member 223 becomes large with a temperature rise.

  On the other hand, in this embodiment, in order to suppress the influence due to such thermal expansion in step S11, the pressurizing device 1 drives the piezo actuator 37 and the lower surface (contact surface) FC of the head 22. Is adjusted to adjust the flatness of the pressure surface FC.

  Specifically, the extension amount ΔZ of the piezoelectric actuator 37 (in other words, the displacement amount in the Z direction of the central portion of the pressurizing surface FC) is adjusted according to the processing temperature TP during pressurization. That is, the displacement amount ΔZ for flattening the pressure surface FC is adjusted according to the processing temperature T.

  More specifically, as described above, the displacement amount ΔZ of the piezo actuator 37 with respect to the processing temperature T during pressurization is determined based on the curve LC1 of FIG. For example, when the processing temperature T is the value TP1, the displacement amount (extension amount) ΔZ of the piezoelectric actuator 37 is set to a relatively large value ΔZ1 (for example, 30 micrometers). When the processing temperature T is the value TP2, the displacement amount (extension amount) ΔZ of the piezoelectric actuator 37 is set to a relatively small value ΔZ2 (for example, 10 micrometers). Thereby, it is possible to adjust the flatness of the pressurization surface FC at the time of pressurization very well at any of the plurality of processing temperatures TP1 and TP2.

<Parallel adjustment operation of the head 22>
Next, in step S <b> 12, the relative posture between the head 22 and the stage 12 is controlled, and the parallel adjustment operation of the objects to be pressed 91 and 92 is executed. Note that the parallel adjustment operation by the plurality of piezo actuators 31 before the contact between the objects to be pressed 91 and 92 is executed in a state where the piezo actuators 35 do not contact the upper surface 22b of the head 22 (see FIGS. 6 and 7). .

  FIG. 6 shows an ideal state (completely parallel arrangement state) in which the head 22 and the stage 12 are arranged completely in parallel. However, in practice, as shown in FIG. 7, the head 22 and the stage 12 are often arranged out of a completely parallel arrangement state. FIG. 7 is a schematic diagram showing such a state (non-parallel arrangement state). In FIG. 7, the state in which the head 22 and the stage 12 are arranged with a minute inclination angle is exaggerated.

  First, in the state of FIG. 7, three distance sensors 33a, 33b, and 33c are used to measure each distance DM (specifically DMi (i = 1, 1) at three positions P1, P2, and P3 (see FIG. 3)). 2, 3)) are measured (see FIG. 7). Then, based on the distances DMi and the thicknesses of the objects to be pressed 91 and 92, the distance DAi between the objects to be pressed 91 and 92 at each position Pi is calculated.

  Then, the three piezoelectric actuators 31a, 31b, and 31c are driven so that these values DAi are the same value.

  Thereby, the state shown in FIG. 7 is changed to the state shown in FIG. That is, both the objects to be pressed 91 and 92 are arranged in parallel to each other.

  If the contact between the objects to be pressed 91 and 92 is started in the state shown in FIG. 7 without performing such a parallel adjustment operation, in the process of contact between the objects to be pressed 91 and 92. In some cases, the positions of the objects to be pressed 91 and 92 in the XY directions may be displaced due to dragging of some contact portions. Such positional deviation is preferably suppressed.

  On the other hand, if the parallel adjustment operation as described above is performed in advance before the contact of the objects to be pressed 91 and 92 (step S12), the objects to be pressed 91 and 92 have a relative posture parallel to each other. In this state, the contact between the workpieces 91 and 92 is started in the next step S13. Therefore, the position shift in the XY plane when the objects to be pressed 91 and 92 are in contact can be satisfactorily suppressed.

  In addition, it is preferable that said alignment operation | movement is performed again after a parallel adjustment operation | movement. Thereby, both the to-be-pressurized objects 91 and 92 are more accurately aligned (aligned) in the XY direction and the θ direction.

<Heating and pressing operation>
In step S13 after the parallel adjustment operation (step S12), the stage 12 and the head 22 are relatively moved in directions close to each other in the Z direction, so that the objects to be pressed 91 and 92 are in contact with each other. Specifically, when the Z-axis elevating drive mechanism 26 is driven, the head 22 is lowered, and the objects to be pressed 91 and 92 come into contact with each other. Then, a joining operation (pressurizing operation) for joining the objects to be pressed 91 and 92 to each other is executed. As described above, after the stage 12 and the head 22 are relatively moved in the direction close to each other in the Z direction, the pressed objects 91 and 92 are sandwiched between the stage 12 and the head 22. Pressurized and joined.

  This pressurizing operation is executed in a state where the piezo actuator 35 is extended and the piezo actuator 35 contacts the upper surface 22 b of the head 22. During this pressurizing operation, a pressurizing force is transmitted from the piezo actuator 35 to both of the objects to be pressed 91 and 92 by the extension operation of the piezo actuator 35. Further, the pressurizing operation is executed in a state where both the objects to be pressurized 91 and 92 are heated to a predetermined temperature TP by the heaters 12h and 22h.

  Further, during the pressurizing operation, two types of pressure adjustment processes are further executed using the measurement values obtained by the pressure detection sensors 32a, 32b, 32c, 36, and 38. One is an adjustment process of the overall pressurization pressure, and the other is an in-plane pressure equalization process. By executing these pressure adjustment processes, the pressures acting on both the objects to be pressed 91 and 92 are adjusted very well.

  The former pressure adjustment process is executed by controlling the extension amount of the piezo actuator 35. That is, when the piezo actuator 35 expands and contracts, the pressurizing force transmitted from the upper member 221 to the pressed members 91 and 92 via the lower member 223 and the like is adjusted.

  Specifically, the extension amount of the piezoelectric actuator 35 is controlled based on the measurement value PRt of the pressure detection sensor 36. The measurement value PRt of the pressure detection sensor 36 is a value indicating an average pressurization pressure (overall pressurization pressure) applied to the entire contact surfaces (joint surfaces) of the objects to be pressed 91 and 92. More specifically, when the value PRt is larger than the target value PD, the extension amount of the piezo actuator 35 is reduced, and when the value PRt is smaller than the target value PD, the extension amount of the piezo actuator 35 is increased. According to this, the magnitude of the overall pressurizing pressure is adjusted more appropriately.

  The latter pressure adjustment processing (in-plane pressure equalization processing) is executed by controlling the extension amount of the piezo actuator 37 based on the detection result of the pressure detection sensor 38 or the like. Note that, as described above, according to the displacement amount ΔZ of the piezo actuator 37 being determined in advance according to the processing temperature at the time of pressurization (step S11), the flatness of the pressurization surface FC is secured to some extent. . However, when the in-plane pressure equalization process as described below is executed (the displacement amount ΔZ of the piezo actuator 37 is adjusted based on the actual pressure measurement value), the pressure surface FC is flattened. It is possible to ensure better properties.

  Specifically, first, the pressure detection result (measured value) PRc by the pressure detection sensor 38 disposed in the central portion (specifically, the lower side of the central portion) and three pressure detections disposed in the peripheral portion (outer peripheral portion). The average value (measured value) PRu of the pressure detection results by the sensors 32a, 32b, 32c is compared. Here, the measured value PRc by the pressure detection sensor 38 is a value indicating the pressurizing pressure applied to the contact surface (joint surface) at the center portion (horizontal direction) of the objects to be pressed 91 and 92. Further, the measured value PRu by the pressure detection sensors 32a, 32b, and 32c is a value that indicates the pressurizing pressure applied to the contact surfaces (bonding surfaces) in the peripheral portions of the objects to be pressed 91 and 92.

  Then, the extension amount of the piezo actuator 37 is adjusted so that the two measured values PRc and PRu are the same. More specifically, when the central part pressure value PRc is larger than the peripheral part pressure value PRu, the pressurizing device 1 reduces the extension amount of the piezo actuator 37 to reduce the central part pressure. On the other hand, when the central part pressure value PRc is smaller than the peripheral part pressure value PRu, the pressurizing device 1 increases the extension amount of the piezoelectric actuator 37 to increase the central part pressure.

  According to such an operation, the pressure distribution in the pressurizing surface FC can be made more uniform.

  Various semiconductor devices are generated (manufactured) through the processes described above.

  As described above, since the central portion of the pressing surface FC is displaced in the Z direction relative to the outer peripheral side portion of the pressing surface FC by the piezo actuator 37, the flatness of the pressing surface FC is adjusted well. Is possible. Specifically, the pressure acting on the objects to be pressed 91 and 92 can be made uniform over the entire pressing surface by the expansion and contraction operation of the piezo actuator 37. In particular, in the above-described bonding operation, the bonding pressure acting on both objects to be pressurized (both objects to be bonded) 91 and 92 can be made uniform over the entire bonding surface.

  Further, the flatness of the pressure surface FC is well adjusted according to the temperature TP at the time of the pressurizing process (at the time of the joining process), so even when the processing temperature at the time of pressurization is other than the predetermined value, It is possible to satisfactorily adjust the flatness of the pressing surface of the one pressing unit. Therefore, it is possible to pressurize both objects to be pressed well corresponding to various heating temperatures. In particular, in the above-described joining operation, both objects to be joined can be satisfactorily joined corresponding to various heating temperatures.

  In this embodiment, the case where the parallel adjustment operation (step S12) of the head 22 is performed after the adjustment operation (step S11) of the flatness degree of the pressure surface FC is illustrated, but the present invention is not limited to this. For example, conversely, the adjustment operation (step S11) of the flatness of the pressure surface FC may be performed after the parallel adjustment operation (step S12) of the head 22.

<2. Second Embodiment>
The second embodiment is a modification of the first embodiment. Below, it demonstrates centering on difference with 1st Embodiment.

  In the second embodiment, a technique for changing the flatness of the pressing surface FC over time by the expansion and contraction operation of the piezo actuator 37 during the pressing operation of the objects to be pressed 91 and 92 will be described. Specifically, by changing the expansion / contraction amount (extension amount) ΔZ of the piezo actuator 37, the central portion of the pressing surface FC is displaced in the Z direction, and the flatness of the pressing surface FC is changed. More specifically, as the extension amount of the piezo actuator 37 is gradually reduced, the uneven state (flatness) of the pressing surface FC changes from “medium convex state” (FIG. 11) to “flat state” (FIG. 12). After that, the state transits to the “indented state” (FIG. 13). In FIGS. 11 to 13, the amount of extension of the piezo actuator 37 is indicated by the length of the white arrow. 11 to 13 exaggerate the flatness of the pressing surface FC. The same applies to FIGS. 15 to 18 described later.

  Here, as shown in FIG. 11, the “middle convex state” means that the central portion of the pressurizing surface FC faces both the objects to be pressed 91 and 92 (the lower side in FIG. 11) and the outer peripheral side portion of the pressurizing surface FC. It is the state which protruded more (state where the center part is convex downward). Further, as shown in FIG. 12, the “flat state” is a state in which the central portion of the pressing surface FC and the outer peripheral portion of the pressing surface FC exist at substantially the same position in the Z direction. Further, as shown in FIG. 13, the “indented state” is a state in which the outer peripheral side portion of the pressurizing surface FC protrudes from the central portion of the pressurizing surface FC toward both the objects to be pressed 91 and 92. In other words, the “indented state” is a state in which the central portion of the pressing surface FC is recessed more than the outer peripheral side portion of the pressing surface FC.

  FIG. 14 is a flowchart showing an operation according to the second embodiment. The operation according to the second embodiment will be described with reference to FIG.

  First, the operation of step S21 is performed. In step S21, by adjusting the displacement amount ΔZ of the piezo actuator 37, the uneven state (flatness) of the pressing surface FC is set to the “medium convex state”. It differs from step S11 of the first embodiment in that the uneven state of the pressurizing surface FC is first set to “medium convex state” instead of “flat state”.

  Here, the expansion / contraction amount of the piezo actuator 37 for realizing the “middle convex state” is determined based on the processing temperature during the pressurizing process (bonding process).

  Specifically, when the processing temperature during the pressurizing process is the temperature TP1 (for example, 200 ° C.), the predetermined amount α (for example, for the displacement amount ΔZ1 (for example, 30 micrometers) for realizing the flat state of the pressing surface FC). A value (ΔZ1 + α) (for example, 35 micrometers) obtained by adding 5 micrometers) is calculated as the displacement amount ΔZ for realizing the “middle convex state”. A displacement amount ΔZ1 (for example, 30 micrometers) that realizes a flat state of the pressure surface FC is calculated based on a curve LC1 as shown in FIG. By setting the extension amount of the piezo actuator 37 to a value (ΔZ1 + α), the “middle convex state” is realized.

  Alternatively, when the processing temperature during the pressurizing process is a temperature TP2 (for example, 400 ° C.), a predetermined amount α (for example, 5 μm) with respect to the displacement amount ΔZ2 (for example, 10 μm) for realizing the flat state of the pressurizing surface FC. A value (ΔZ2 + α) (for example, 15 micrometers) obtained by adding (meter) is calculated as the displacement amount ΔZ for realizing the “middle convex state”. A displacement amount ΔZ2 (for example, 10 micrometers) that realizes a flat state of the pressing surface FC is calculated based on a curve LC1 as shown in FIG. By setting the extension amount of the piezo actuator 37 to a value (ΔZ2 + α), the “middle convex state” is realized.

  As will be described later, in step S23, the amount of extension of the piezo actuator 37 is gradually reduced, so that the state of the pressing surface FC changes from “medium convex state” to “flat state” through “flat state”. It will transition to.

  Next, the parallel adjustment operation in step S22 is performed. The operation in step S22 is the same as the operation in step S12 in the first embodiment.

  Then, the operation of step S23 is performed.

  Specifically, as in the first embodiment, the head 22 is lowered in accordance with the driving of the Z-axis elevating drive mechanism 26, and the objects to be pressurized 91 and 92 are in contact with each other. Thereby, the joining operation | movement (pressurization operation | movement) which joins both the to-be-pressurized objects 91 and 92 mutually is started.

  As in the first embodiment, this joining operation (pressing operation) is executed in a state where the piezo actuator 35 is extended and the piezo actuator 35 contacts the upper surface 22 b of the head 22. During the pressurizing operation, the pressurizing force is transmitted from the piezo actuator 35 to the object to be pressurized 92 via the head 22 by the extending operation of the piezo actuator 35. Further, the pressurizing operation is executed in a state where both the objects to be pressurized 91 and 92 are heated to the predetermined processing temperature TP by the heaters 12h and 22h.

  However, in this step S23, the extension amount ΔZ of the piezo actuator 37 is gradually reduced after both the objects to be pressed 91 and 92 start contact with the pressing surface FC having the “intermediate convex state”. . As a result, the uneven state of the pressure surface FC gradually transitions from the “middle convex state” to the “flat concave state” through the “flat state”. It should be noted that the overall change in pressure accompanying the change in the extension amount ΔZ of the piezo actuator 37 is adjusted by changing the extension amount ΔZ of the piezo actuator 35.

  FIG. 15 to FIG. 18 are diagrams showing such transitions in time series. In addition, the arrow and the black dot in each of FIGS. 15-18 have shown the part to which comparatively big joining pressure (pressurization pressure) acts.

  As shown in FIG. 15, at the start of contact of the objects to be pressurized 91 and 92, the pressure surface FC that comes into contact with the object to be pressurized 92 has a “middle convex state”, and is A very large pressure is acting on the central portion of the pressurized article 92. As a result, a large bonding pressure acts on the central portion between the objects to be pressed 91 and 92. Thereby, generation | occurrence | production of the void in the center part of both to-be-pressurized objects 91 and 92 is suppressed.

  Thereafter, the extension amount ΔZ of the piezo actuator 37 (for flatness adjustment) is gradually reduced, and the extension amount ΔZ of the piezo actuator 35 (for overall pressure adjustment) is gradually increased. Thereby, the contact part of both to-be-pressurized objects 91 and 92 spreads gradually from the center part of both to-be-pressurized objects 91 and 92 to a peripheral part (outer peripheral side part) (refer FIG. 16 and FIG. 17). At this time, a portion to which a relatively large pressure acts (a circular portion or an annular portion in a top view) spreads to a relatively peripheral portion. Thereby, it is possible to gradually expand a good joint portion in which generation of voids is suppressed from the central portion to the peripheral portion.

  Eventually, the pressure surface FC changes to a “flat state”. As a result, a good bonded portion in which the generation of voids is suppressed expands to a relatively wide range in the bonded surfaces of the objects to be pressed 91 and 92.

  Thereafter, the extension amount ΔZ of the piezo actuator 37 is further reduced, and the pressure surface FC shifts to the “indented state”. In the “indented state”, it is possible to apply a relatively large bonding pressure to the peripheral portions of the objects to be pressed 91 and 92 compared to the “flat state” (see FIG. 18). According to this, it is possible to make sufficient joining pressure act also on the peripheral part of both the to-be-pressurized objects 91 and 92.

  According to such an operation, it is possible to satisfactorily join the objects to be pressed 91 and 92 with the voids reduced.

  In the second embodiment, two types of pressure adjustment processing are executed using measured values by the pressure detection sensors 32a, 32b, 32c, 36, and 38 during the pressurizing operation. One is an adjustment process of the overall pressurizing pressure, and the other is a process of gradually moving a position where a relatively high pressure acts (also referred to as a high-pressure action position movement process). is there.

  The former pressure adjustment process is executed in the same manner as in the first embodiment.

  The latter pressure adjustment processing (high pressure action position movement processing) is performed so as to appropriately realize the uneven state of the pressing surface FC.

  Specifically, the pressure detection result (measured value) PRc by the pressure detection sensor 38 disposed below the central portion and the pressure detection by the three pressure detection sensors 32a, 32b, 32c disposed at the peripheral portion (outer peripheral portion). A difference DF (= PRc−PRu) from the average value (measured value) PRu of the result is calculated at each time. By using this difference DF, the uneven state of the pressing surface FC is appropriately controlled.

  FIG. 19 is a diagram showing a time-dependent change curve LC2 of the target value DFd regarding the difference DF. At the joining start time t10 of the objects to be pressed 91 and 92, a value DFc for realizing a desired “middle convex state” (see FIGS. 11 and 15) is set as the target value DFd. Thereafter, the target value DFd for the difference DF is gradually reduced and becomes zero at time t20. Further, the target value DFd is further gradually reduced to become the value DFu (<0) at time t30. The target value DFu is a value for realizing a desired “indented state” (see FIGS. 13 and 18).

  In step S23, the extension amount ΔZ of the piezoelectric actuator 37 is controlled (feedback control) so that the difference DF matches the target value DFd (t) at each time point t. For example, at time t10, the extension amount ΔZ of the piezo actuator 37 is adjusted so that the difference DF matches the target value DFc. Thereafter, the target value DFd is reduced over time. At each time point, the extension amount ΔZ of the piezo actuator 37 is adjusted so as to realize the target value DFd (t) at each time point t. At time t30, the extension amount ΔZ of the piezo actuator 37 is adjusted so that the difference DF matches the predetermined value DFu.

  In this way, the extension amount of the piezo actuator 37 is gradually reduced in accordance with the time-dependent reduction of the target value DFd, and the state of the pressing surface FC changes from “medium convex state” to “flat state” via “flat state”. Transition to "state".

  As described above, since the central portion of the pressurizing surface FC is displaced in the Z direction relative to the outer peripheral side portion of the pressurizing surface FC by the piezo actuator 37, the flatness of the pressurizing surface FC can be adjusted well. Is possible.

  Specifically, by the expansion and contraction operation of the piezo actuator 37, the central portion of the pressurizing surface FC is displaced in the Z direction at the time when the pressurization of both the pressurized objects 91 and 92 is started, and the central portion of the pressurizing surface FC is both pressed. It protrudes from the outer peripheral side portion of the pressing surface FC toward the objects 91 and 92 side. Therefore, it is possible to apply a relatively large pressure to the central portions of the objects to be pressed 91 and 92 at the start of pressurization. For this reason, in the above-described joining process, it is possible to suppress the generation of voids in the central portions of the objects to be pressed 91 and 92.

  Moreover, in the said 2nd Embodiment, during pressurization of both to-be-pressurized objects 91 and 92, the uneven | corrugated state (flatness) of the pressurization surface FC changes from a "medium convex state" to a "flat state". To be controlled. Therefore, the pressurizing apparatus 1 can pressurize both the pressurized objects 91 and 92 while moving the operation position of a relatively large pressure from the central part to the peripheral part of the both pressurized objects 91 and 92. . Therefore, in the above bonding process, it is possible to satisfactorily suppress the generation of voids in the objects to be pressed 91 and 92.

  Furthermore, in the said 2nd Embodiment, the unevenness | corrugation state (flatness) of the pressurization surface FC passes through the "flat state" from the "medium convex state" during the pressurization of both the to-be-pressurized objects 91 and 92, Control is made so as to transition to the “indented state”. Therefore, the pressurizing apparatus 1 can apply a sufficiently large pressure even in the peripheral portions of both the pressurized objects 91 and 92. Therefore, in the joining process described above, it is possible to very well suppress the generation of voids in the objects to be pressed 91 and 92.

  Further, according to the second embodiment, in step S21, the expansion / contraction amount ΔZ of the piezo actuator 37 for realizing the “middle convex state” is determined based on the processing temperature during the pressurizing process (bonding process). The Therefore, it is possible to more accurately realize the “middle convex state” corresponding to various heating temperatures. As a result, it is possible to satisfactorily join both objects to be bonded to various heating temperatures.

  In the above embodiment, the case where a series of operations of transitioning from the “center-convex state” to the “center-concave state” through the “flat state” is executed only once is not limited to this. A series of operations that transition from the “middle convex state” to the “middle concave state” through the “flat state” may be executed a plurality of times (repeatedly).

  In addition, after the above-described series of operations that transition from the “convex state” to the “flat state” through the “flat state” is performed one or more times, the “indented state” to the “flat state” The pressure adjustment process (in-plane pressure equalization process) may be performed in the same manner as in the first embodiment. According to this, it is possible to make the pressure acting on the objects to be pressed 91 and 92 uniform over the entire pressing surface by the expansion and contraction operation of the piezo actuator 37. In particular, in the above-described bonding operation, the bonding pressure acting on both objects to be pressurized (both objects to be bonded) 91 and 92 can be made uniform over the entire bonding surface.

  In the second embodiment, the case where the piezo actuator 37 is adjusted according to the difference DF related to the two types of measurement values is illustrated, but the present invention is not limited to this. For example, based on FIG. 5, the displacement amount ΔZ for realizing the “flat state” is obtained in advance for each processing temperature during pressurization, and the displacement amount for realizing the “medium convex state” and the “center concave state”, respectively. Δ may be obtained in advance for each processing temperature during pressurization. Then, the piezoelectric actuator 37 may be driven so that the displacement amount Δ at each time point is sequentially realized.

  Specifically, when the processing temperature during pressurization is a temperature TP1 (for example, 200 ° C.), the extension amount ΔZ of the piezo actuator 37 is changed from a value (ΔZ1 + α) to a value (ΔZ1-α). Here, the displacement amount ΔZ1 (for example, 30 micrometers) for realizing the flat state of the pressing surface FC is obtained based on the curve LC1 of FIG. The value α is a predetermined value (for example, 5 micrometers).

  When the extension amount ΔZ of the piezo actuator 37 is set to a value (ΔZ1 + α) (for example, 35 micrometers), the pressing surface FC has a “middle convex state”. Further, when the extension amount ΔZ of the piezo actuator 37 is set to a value ΔZ1 (for example, 30 micrometers), the pressing surface FC has a “flat state”. Further, when the extension amount ΔZ of the piezo actuator 37 is set to a value (ΔZ1−α) (for example, 25 micrometers), the pressure surface FC has the “indented state”.

  Similarly, when the processing temperature at the time of pressurization is another temperature, the expansion amounts ΔZa and ΔZb for realizing the “middle convex state” and the “middle concave state” are obtained, and the piezoelectric actuator 37 is expanded. The amount ΔZ may be gradually changed from the value ΔZa to the value ΔZb. However, as described above, by adjusting the displacement amount ΔZ of the piezo actuator 37 based on the actual pressure measurement value, it is possible to adjust the flatness of the pressing surface FC more accurately.

<3. Modified example>
Although the embodiments of the present invention have been described above, the present invention is not limited to the contents described above.

<Resin layer, metal layer, etc.>
For example, in each of the above embodiments, a semiconductor wafer (silicon wafer) is used as each of the objects to be pressed 91 and 92, and the two semiconductor wafers are directly brought into contact with each other and bonded. Not.

  Specifically, an operation similar to that of the first embodiment is performed using an object to be pressed in which a resin layer is stacked on at least one semiconductor wafer as the object to be pressed 91 (and / or the object to be pressed 92). You may be made to do. In other words, in the state where the resin layer 93 (see FIG. 20) is sandwiched between the objects to be pressed 91 and 92, the objects to be pressed 91 and 92 are pressurized in the same manner as in the first embodiment. You may make it do. According to this, it is possible to make the film thickness (layer thickness) of the resin layer 93 uniform, in particular, by ensuring good flatness of the pressing surface FC. Alternatively, both the pressurized objects 91 and 92 are pressurized in the same manner as in the second embodiment with the resin layer 93 (see FIG. 20) sandwiched between the pressurized objects 91 and 92. It may be. In addition, as a material of the resin layer 93, for example, a thermosetting resin that is cured by heating may be used. The resin layer 93 is cured by heat treatment during pressurization. Alternatively, as the material of the resin layer 93, a photo-curing resin that is cured by light such as ultraviolet rays may be used.

  Alternatively, an operation similar to that of each embodiment may be performed using an object to be pressed in which a metal layer is stacked on a semiconductor wafer or the like as the object to be pressed 91 (and / or the object to be pressed 92). Good. In other words, in the state where a metal layer (for example, a metal layer formed of gold, copper, aluminum, solder, or the like) instead of the resin layer is sandwiched between the objects to be pressed 91 and 92, both objects to be pressed are provided. 91 and 92 may be pressurized.

  In addition, the resin layer does not need to be formed over the entire opposing surfaces of the objects to be pressed 91 and 92, and is formed on a part of the opposing surfaces of the objects to be pressed 91 and 92. It may be. The same applies to the metal layer. That is, the metal layer may be formed as a metal bump.

  More specifically, for example, as shown in FIGS. 21 to 23, when the resin layer 94 is partially provided on one of the objects to be pressurized 91, 92 (for example, the object to be pressurized 91), the second An operation similar to that of the embodiment may be executed.

  22 and 23 are schematic views showing a state in which both the objects to be pressed 91 and 92 are bonded with a resin layer 94 formed on a part of the facing surface interposed therebetween. 21 and 23 are sectional views, and FIG. 22 is a plan view. Here, in order to perform vacuum sealing, in the gap between the semiconductor wafer 91 and the semiconductor wafer 92, a lattice-like portion (in detail, a boundary wall region surrounding the vacuum sealing region) (not the whole) when viewed from above. The resin material is sandwiched between the portions).

  FIG. 23 and FIG. 24 are diagrams showing operations according to such a modification in time series.

  As shown in the cross-sectional view of FIG. 23, when the resin layer 94 is manufactured, a sharp portion (also referred to as a sharp portion) may be generated at the end portion of the resin layer 94 that is partially formed. At this time, just applying a surface pressure in the opposing direction (vertical direction) to the objects to be pressed 91 and 92 using a very flat pressing surface does not necessarily cause the sharp portion to be crushed. In the peripheral part of the sharp part (part lower than the sharp part), a “void” may be generated due to the difference between the height of the sharp part and the height of the peripheral part. FIG. 25 is a diagram schematically showing the void VD generated around such a sharp portion. The void VD is also schematically shown in the plan view of FIG.

  By increasing the overall uniform surface pressure, a large amount of pressure is required to crush the sharpened portion as described above. On the other hand, by gradually deforming the pressing surface FC from the “middle convex state” to the “middle concave state” as in the above embodiment, a portion where a relatively large pressure acts (circular shape). The part or the annular part) gradually moves. At a certain point in time, a relatively large pressing force acts intensively on the sharpened portion of the resin layer 94 (see FIG. 24). Therefore, it is possible to satisfactorily crush each sharpened portion by applying the force partially and intensively even with the same force as a whole. According to this, each sharp portion can be crushed well with a force of about a fraction of 1 to 1 as compared with a case where the sharp portion is crushed only with uniform surface pressure as a whole. is there. For example, when the sharp portion is crushed only by a uniform surface pressure as a whole, a force of 100 kN (kilonewtons) is required, whereas according to the operation of the above embodiment, the whole is 10 kN (kilonewtons). The power of Therefore, it is possible to satisfactorily suppress the generation of voids with a relatively small force.

  The operation similar to that of the second embodiment is also useful when there are variations in height in a plurality of partially formed resin layers (resin portions) 94. Specifically, according to the operation, it is possible to satisfactorily crush a plurality of resin portions having the variation with a partially concentrated force. That is, it is possible to cope with variations in the height direction well.

  Similarly, the above concept may be applied when metal bumps are provided instead of the resin layer 94. According to this, it is possible to satisfactorily plastically deform and crush a plurality of metal bumps having variations with a force that is partially concentrated. Therefore, it is possible to cope with the variation in the height direction satisfactorily.

<Chip on wafer>
Similarly, it is possible to apply the above idea to a chip on wafer (COW) technology. Specifically, as shown in FIG. 26, when the chip (semiconductor chip) 95 is disposed on the semiconductor wafer 91 via the metal bump 96, the above concept may be applied.

  In FIG. 26, a chip 95 is employed instead of the semiconductor wafer 92 as the upper object to be pressed. For example, solder is used as the material of the metal bump 96. However, the present invention is not limited to this, and Au (gold), Cu (copper), Al (aluminum), or the like may be used as the material of the metal bump 96.

  Then, in a state where the metal bump 96 (layer) is sandwiched between the semiconductor wafer 91 and the chip 95, the pressed objects 91 and 95 are sandwiched between the stage 12 and the head 22 and pressed. Is done.

  Also in this case, a plurality of chips (particularly portions of the metal bumps) having variations in height can be plastically deformed and crushed by a force that is partially concentrated. Therefore, it is possible to cope with the variation in the height direction satisfactorily.

  Further, the above concept may be applied not only when a single layer of chips is stacked on the semiconductor wafer 91 but also when a plurality of chip layers are stacked on the semiconductor wafer 91. More specifically, as shown in FIG. 27, a plurality of chips 95 (95a, 95b, 95c) and a plurality of metal bumps 96 (96a, 96b, 96c) layers are alternately stacked in the Z direction. In addition, the above idea may be applied.

<Nanoimprint>
Moreover, in each said embodiment, although the joining apparatus with a heating was illustrated as a pressurization apparatus, it is not limited to this, It is made to apply said thought to the pressurization apparatus without a joining and / or a heating. Also good.

  For example, the above idea may be applied to a nanoimprint apparatus.

  FIG. 28 is a configuration diagram showing a pressurizing apparatus (nanoimprint apparatus (fine transfer apparatus)) 1C according to such a modification, and FIG. 29 shows both pressurized objects 92 to be pressurized in the nanoimprint apparatus, FIG. Here, the object to be pressed 92 is a semiconductor wafer, and the object to be pressed 97 is a mold.

  The pressing device 1C has the same configuration as the pressing device 1A of the first embodiment. However, the pressurizing apparatus 1C is different from the pressurizing apparatus 1A in that the pressurizing apparatus 1C includes a UV (ultraviolet) irradiation unit 61 and that the mirror fixing member 28g can be moved and retracted in the Y-axis direction during UV irradiation. To do. The mirror fixing member 28g is a member that fixes the mirrors 28e and 28f.

  In addition, here, a case where the object to be pressurized (semiconductor wafer) 92 is held by the head 22 and the mold (original plate) 97 is held by the stage 12 is illustrated (see FIG. 29). Further, a photo-curing resin is applied in advance to the surface (lower surface) of the object to be pressed 92. In other words, a resin layer 98 made of a photo-curing resin is provided on the lower surface side of the object to be pressed 92. Further, the mold 97 is formed of a translucent member (for example, quartz), and an uneven pattern is provided on the surface of the mold 97 (upper side in the drawing). In short, the mold 97 is a transparent mold.

  Both the pressed objects 92 and 97 are pressed with the resin layer 98 formed of a photo-curing resin interposed therebetween, and the uneven pattern of the mold 97 is pressed against the resin material of the resin layer 98. The pattern is transferred to the resin layer 98. Further, the resin layer 98 (photocurable resin material) is cured using the UV irradiation unit 61 as a curing unit (photocuring unit) (see FIG. 30).

  In the nanoimprint technique, a predetermined pattern is formed on the pressed object 92 based on such a principle.

  Even in such an apparatus, it is possible to apply the same idea as in the above embodiments.

<Others>
Moreover, in each said embodiment, although the case where the head 22 had a substantially truncated cone shape was illustrated, it is not limited to this. For example, the head 22 may have a substantially polygonal frustum shape (such as a quadrangular frustum shape or a hexagonal frustum shape).

  In each of the above embodiments, the case where the idea of the present invention is applied to the pressure surface FC in the head 22 has been described, but the present invention is not limited to this. For example, the same idea can be applied to the pressing surface FC in the stage 12 (the contact surface between the stage 12 and the pressed object 91). Specifically, the stage 12 may have the same configuration as the head 22. Alternatively, the above idea may be applied only to the stage 12.

  Moreover, in the said 1st Embodiment, the equalization process of in-plane pressure was arrange | positioned in the pressure detection result (measurement value) PRc by the pressure detection sensor 38 arrange | positioned in the center part, and the peripheral part (outer peripheral part). Although the case where the extension amount of the piezoelectric actuator 37 is adjusted so that the average values PRu of the pressure detection results by the three pressure detection sensors 32a, 32b, and 32c become the same as each other is illustrated, the present invention is not limited to this.

  For example, the pressure detection result (measurement value) PRc by the pressure detection sensor 38 arranged on the lower side of the central part and the pressure detection result (measurement value) PRd by the pressure detection sensor 36 arranged on the upper side of the central part are the same. In addition, the extension amount of the piezo actuator 37 may be adjusted. The measured value PRc is a value indicating the pressurizing pressure at the central portion of the pressurizing surface FC (pressurizing pressure at the central portion of the two objects to be pressurized 91 and 92), and the measured value PRd is the two objects to be pressurized. This is a value indicating the overall pressure applied between 91 and 92.

  In this manner, the expansion / contraction amount of the piezo actuator 37 may be adjusted based on the measurement value of the pressurization pressure at the central portion of the pressurization surface FC.

  Similarly, in the high-pressure acting position movement process of the second embodiment, the pressure detection result (measured value) PRc by the pressure detection sensor 38 disposed in the central portion and the three pieces disposed in the peripheral portion (outer peripheral portion). Although the case where the uneven state of the pressing surface FC is appropriately controlled by using the difference DF (= PRc−PRu) from the average value PRu of the pressure detection results by the pressure detection sensors 32a, 32b, and 32c is illustrated, It is not limited to.

  For example, the difference DG (= PRc) between the pressure detection result (measurement value) PRc by the pressure detection sensor 38 disposed on the lower side of the central part and the pressure detection result (measurement value) PRd by the pressure detection sensor 36 disposed on the upper side of the central part. -PRd) may be used to adjust the extension amount of the piezoelectric actuator 37. Specifically, the difference DG is handled in the same manner as the above-described difference DF, and the same operation as in the second embodiment may be executed.

  In this manner, the expansion / contraction amount of the piezo actuator 37 may be adjusted based on the measurement value of the pressurization pressure at the central portion of the pressurization surface FC.

  Moreover, in each said embodiment, although the case where the concave state of the pressurization surface FC in normal temperature was produced | generated by carrying out surface polishing of the lower surface of the lower member 223 in the heating state to temperature TX was illustrated, it is limited to this. Not.

  For example, a structure as shown in FIGS. 31 and 32 may be adopted. In FIG. 31, an annular shim member 227 is provided between the lower member 223 and the upper member 221 at the outer peripheral side edge portion (in a top view), and the center of the lower member 223 and the center of the upper member 221 are provided. A state in which a gap is formed between the portions is shown. By extending / contracting the piezo actuator 37 that connects the central portion of the lower member 223 and the central portion of the upper member 221, the "center concave state", "flat state", "center convex state", etc. of the pressing surface FC are formed. Is done. Specifically, when the piezo actuator 37 has the reference length ZB, the “flat state” of the pressing surface FC is realized. Further, when the piezo actuator 37 extends to a length Zc (= Zb + β) larger than the reference length Zb, the “middle convex state” of the pressing surface FC is realized (see FIG. 32). On the other hand, when the piezo actuator 37 contracts to a length Za (= Zb−β) smaller than the reference length Zb, the “indented state” of the pressing surface FC is realized (see FIG. 31). The value β is a positive value. Moreover, it is preferable that the Z direction length of the clearance gap formed between the center part of the lower side member 223 and the center part of the upper side member 221 is larger than the value (beta).

  Moreover, in each said embodiment, although the technique which changes the Z direction displacement of the pressurization surface FC and adjusts the flatness degree of the pressurization surface FC using the piezo actuator 37 was illustrated, it is not limited to this. For example, as shown in FIG. 33, a substantially cylindrical connecting member 372 for connecting the upper member 221 and the lower member 223 is provided in place of the piezo actuator 37, and the heater 374 is provided so as to surround the connecting member 372. You may make it provide. Then, the heater 374 is heated to extend the connection member 372 in the Z direction by thermal expansion. Thus, instead of extending the piezo actuator 37, the connecting member 372 may be extended to displace the center portion of the pressing surface FC in the Z direction. Further, the extension amount of the connecting member 372 may be adjusted as appropriate by adjusting the heating amount of the heater 374. However, when the piezo actuator 37 is used as described above, it is not necessary to provide the heater 374, and thus heat generation near the piezo actuator 37 is suppressed. Therefore, it is possible to suppress the occurrence of temperature unevenness on the pressurizing surface FC (and thus temperature unevenness on the objects to be pressed 91 and 92).

  Moreover, in the said 2nd Embodiment, the outer peripheral part of a pressurization surface passes through a flat state from the state (center convex state) (FIG. 15) in which the center part of the pressurization surface protruded from the outer peripheral part at the time of a pressurization start. Although the aspect which changes to the state (mid-recessed state) (FIG. 18) which protruded from the center part is illustrated, it is not limited to this. For example, conversely, the central portion of the pressing surface protrudes from the outer peripheral portion through a flat state from a state where the outer peripheral portion of the pressing surface protrudes from the central portion (indented state) (FIG. 18) at the start of pressurization. You may modify | change so that it may change to the state (medium convex state) (FIG. 15) which carried out. In the second embodiment, since the pressurization is started by pressing both objects to be pressed with the central portion of the pressurization surface protruding, a state close to a point contact state occurs at the start of pressurization. In some cases, a positional shift (a positional shift in the translational direction and / or rotational direction) may occur due to the relative translational movement and / or rotational movement of the objects to be pressed. On the other hand, according to such a modified example, the outer peripheral portion of the pressing surface protrudes from the central portion at the time of pressurization start (in a concave state) (FIG. 18), so It is possible to obtain a relatively large contact area by making contact earlier than the above. Therefore, a relatively large frictional force can be obtained, and the above-described positional deviation (particularly positional deviation in the rotational direction) due to point contact can be reduced. Thus, the state where the outer peripheral portion of the pressing surface protrudes from the central portion (indented state) (FIG. 18) starts contact and pressurization, and then passes through the flat state so that the central portion of the pressing surface is more than the outer peripheral portion. It may be preferable to make a transition to a protruding state (medium convex state) (FIG. 15).

DESCRIPTION OF SYMBOLS 1 Pressure apparatus 12 Stage 22 Head 31, 31a, 31b, 31c (For parallel adjustment) Piezo actuator 32, 32a, 32b, 32c, 36, 38 Pressure detection sensor 33, 33a, 33b, 33c Distance sensor 34 Reflector 35 (For overall pressure adjustment) Piezo actuator 37 (For flatness adjustment) Piezo actuator 91, 92 Pressurized object FC Pressurized surface

Claims (14)

A pressurizing device that pressurizes both the first object to be pressed and the second object to be pressed,
A first pressure unit;
A second pressure unit;
Driving means for relatively moving the first pressurizing unit and the second pressurizing unit in a predetermined direction;
With
After the first pressurizing unit and the second pressurizing unit are relatively moved in the direction in which they are close to each other in the predetermined direction, the first pressurized object and the second pressurized unit The object is sandwiched between the first pressurizing unit and the second pressurizing unit and pressurized,
The first pressure unit includes
A pressing surface for transmitting a pressing force to the first object to be pressed;
A central portion displacing means for displacing the central portion of the pressing surface in the predetermined direction and displacing the central portion of the pressing surface relative to the outer peripheral side portion of the pressing surface in the predetermined direction;
A pressurizing apparatus comprising: The pressurizing apparatus according to claim 1, wherein
The central part displacing means displaces the central part of the pressing surface in the predetermined direction during the pressurization of the objects to be pressed. The pressurizing apparatus according to claim 1, wherein
The central portion displacing means displaces the central portion of the pressurizing surface in the predetermined direction during the pressurization of both the pressurized objects, so that the central portion of the pressurizing surface becomes the first pressurized object. A second state in which the central portion of the pressing surface is located at substantially the same position as the outer peripheral portion of the pressing surface in the predetermined direction from the first state protruding from the outer peripheral portion of the pressing surface toward the side. A pressurizing apparatus, wherein the uneven state of the pressurizing surface is shifted to a state. The pressurizing apparatus according to claim 1, wherein
The central portion displacing means displaces the central portion of the pressurizing surface in the predetermined direction during the pressurization of both the pressurized objects, so that the central portion of the pressurizing surface becomes the first pressurized object. A second portion in which the central portion of the pressurizing surface and the outer peripheral portion of the pressurizing surface are present at substantially the same position in the predetermined direction from the first state protruding from the outer peripheral portion of the pressurizing surface toward the side. The uneven state of the pressure surface is shifted to a third state in which the outer peripheral side portion of the pressure surface protrudes from the central portion of the pressure surface toward the first object to be pressed through the state. A pressure device characterized by the above. The pressurizing device according to any one of claims 1 to 4,
First measuring means for measuring a pressurizing pressure at a central portion of the pressurizing surface;
Further comprising
The pressurizing apparatus characterized in that the central portion displacing means adjusts the displacement of the central portion in the predetermined direction based on the pressurizing pressure in the central portion. The pressurizing apparatus according to any one of claims 1 to 5,
The first pressure unit includes
A first transmission member having a substantially frustoconical shape or a substantially polygonal frustum shape and transmitting a force for pressurizing both of the objects to be pressurized;
It arrange | positions between the said 1st transmission member and the said 1st to-be-pressurized object, The force for the pressurization from the said 1st transmission member is a said 1st to-be-pressurized object from the said 1st transmission member. A substantially plate-like second transmission member that further transmits to
The pressurizing apparatus further comprising: The pressurizing apparatus according to claim 6, wherein
Parallel adjustment means for adjusting the parallelism between the first object to be pressed and the second object to be pressed;
Further comprising
The drive means, after the parallel adjustment operation by the parallel adjustment means, the first pressurizing unit that holds the first object to be pressed and the second that holds the first object to be pressed. A pressurizing apparatus, wherein the pressurizing unit moves relative to each other in the predetermined direction to bring the objects to be pressed into contact with each other. The pressurizing device according to claim 7,
Telescopic means disposed between a predetermined base member and the first transmission member on the apex side of the first transmission member having a substantially truncated cone shape or a substantially polygonal truncated cone shape;
Further comprising
The expansion / contraction means adjusts the applied pressure transmitted to the first transmission means by performing expansion / contraction after the parallel adjustment operation by the parallel adjustment means is performed and the two objects to be pressed are in contact with each other. Pressurizing device. The pressurizing apparatus according to claim 6, wherein
Telescopic means disposed between a predetermined base member and the first transmission member on the apex side of the first transmission member having a substantially truncated cone shape or a substantially polygonal truncated cone shape;
The pressurizing device further comprising: The pressurizing device according to claim 8 or 9,
The pressurizing device, wherein the expansion / contraction means has a piezo actuator. The pressurizing apparatus according to any one of claims 1 to 6,
The central portion displacing means is
A piezo actuator provided near a central portion of the pressure surface, wherein the piezo actuator expands and contracts in the predetermined direction to displace the central portion of the pressure surface in the predetermined direction;
A pressurizing apparatus comprising: The pressurizing apparatus according to claim 6, wherein
The central portion displacing means is
A connection member that is provided near a central portion of the pressure surface and connects the first transmission member and the second transmission member;
Heating means for heating the connecting member;
Have
The pressurizing apparatus characterized in that the central portion displacing means elongates the connecting member in the predetermined direction by heating the connecting member and displaces a central portion of the pressurizing surface in the predetermined direction. A pressurizing method for pressurizing both the pressurized object of the first pressurized object and the second pressurized object,
a) relatively moving a first pressure unit that holds the first object to be pressed and a second pressure unit that holds the second object to be pressed;
b) Displace the central portion of the pressure surface holding the first object to be pressed in the predetermined direction, and move the central portion of the pressure surface relative to the outer peripheral side portion of the pressure surface in the predetermined direction. A step of displacing;
A pressurizing method comprising: The pressurizing method according to claim 13,
In the step b), the amount of displacement in the predetermined direction of the central portion of the pressure surface is adjusted according to the processing temperature at the time of pressure.

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