JP2023060534A - Electronic component bonding device - Google Patents

Abstract

To provide an electronic component bonding device capable of matching, by means of a simple structure, the degrees of parallelization of an electronic component and a substrate, and precisely aligning and bonding electrodes of the electronic component and electrodes of the substrate.SOLUTION: An electronic component bonding device 1 has an electronic component lifting mechanism 11 for moving a bonding tool 33 up and down with respect to a stage 13. The electronic component lifting mechanism 11 has: a high-speed movement mechanism 20 for moving the bonding tool 33 until a distance between an electrode 70 of an electronic component M and an electrode 71 of a substrate P becomes a predetermined distance D1; and a low-speed movement mechanism 21 for moving the bonding tool 33 at a speed lower than that of the high-speed movement mechanism 20. The low-speed movement mechanism 21 has a parallelization degree adjustment mechanism 44 that enables matching the degrees of parallelization of an electronic component holding surface 33a of the bonding tool 33 with respect to a stage surface 13a of the stage 13. The parallelization degree adjustment mechanism 44 is connected by a hemisphere face 65a of a convex spherical face member 65 and a hemisphere face 66a of a concave spherical face member 66.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electronic component bonding apparatus.

2. Description of the Related Art An electronic component bonding apparatus is known that presses an electrode of an electronic component against an electrode of a substrate through a bonding material and melts the bonding material to bond the electronic component to the substrate. In such an electronic component bonding apparatus, it is required to press the electronic component and the substrate in parallel and to align the electrode positions of the electronic component and the electrode positions of the substrate with high accuracy. As an electronic component bonding apparatus capable of adjusting the parallelism between an electronic component and a substrate, there is a parallelism adjustment mechanism on the stage side that holds the substrate, and the bonding tool that holds the electronic component by suction has a There is an electronic component bonding apparatus capable of adjusting the parallelism of the substrate holding surface of the stage by using the device (see, for example, Patent Document 1).

In addition, there is an electronic component bonding apparatus capable of simultaneously capturing images of the electrode position of an electronic component and the electrode position of a substrate by a camera unit with two vertical fields of view and aligning them with high accuracy (see, for example, Patent Document 2). ).

JP 2012-84740 A JP 2017-183451 A

The parallelism adjusting mechanism described in Patent Document 1 is composed of a convex spherical member having a substrate holding surface and a concave spherical member fitted to the convex spherical member. The parallelism is adjusted by detecting the height position of the electronic component holding surface by the height detection means, changing the inclination of the substrate holding surface by the driving means while the electronic component holding surface of the bonding tool is pressed against the substrate holding surface, At a position where the height position of the electronic component holding surface is the lowest point, the inclined position of the board holding surface is held by the control means. Parallelism adjustment requires a plurality of driving means for changing the inclination of the substrate holding surface, and a control means for holding the inclined position. There is a problem of putting away.

Further, in the electronic component bonding apparatus described in Patent Document 2, it is possible to align the electrodes of the electronic component and the electrodes of the substrate with high precision using the camera unit with two vertical views. However, the heat generated when the stage and the bonding tool melt the bonding material may cause the optical axis of the upper and lower two-field-of-view units to deviate, which may hinder stable alignment. Also, the upper and lower two-view camera unit is movably fixed to the base plate to which the stage and the bonding tool are fixed. As a result, when the upper and lower dual view camera unit moves between the detection position and the retracted position, and when the bonding tool moves related to bonding, the stage, bonding tool, and upper and lower dual view camera unit are affected by vibrations during operation. Therefore, it is considered difficult to achieve high-precision alignment and high-speed bonding between the electrodes of the electronic component and the electrodes of the substrate.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve at least one of the above problems. An object of the present invention is to realize an electronic component bonding apparatus which is realized by a structure and is capable of highly accurate alignment between electrodes of an electronic component and electrodes of a substrate.

[1] An electronic component bonding apparatus according to the present invention has an electronic component elevating mechanism that moves up and down a bonding tool that adsorbs and holds an electronic component with respect to a stage that adsorbs and holds a substrate. An electronic component bonding apparatus capable of bonding electrodes via a bonding material capable of being melted by heat, wherein the electronic component elevating mechanism adjusts the distance between the electrode of the electronic component and the electrode of the substrate A high-speed movement mechanism for moving the bonding tool until it reaches a predetermined distance, a low-speed movement mechanism for moving the bonding tool at a speed lower than that of the high-speed movement mechanism, and a stage surface of the stage provided in the low-speed movement mechanism. and a parallelism adjusting mechanism capable of adjusting the parallelism of the electronic component holding surface of the bonding tool, wherein the parallelism adjusting mechanism has a hemispherical surface of the convex spherical member and a hemispherical surface of the concave spherical member. characterized by being connected.

[2] In the electronic component bonding apparatus of the present invention, the low-speed movement mechanism has a piezo drive mechanism using a piezo element as a drive source, and the parallelism adjustment mechanism is mounted directly above the piezo drive mechanism. preferably.

[3] In the electronic component bonding apparatus of the present invention, a moving part that connects the high-speed moving mechanism and the low-speed moving mechanism; Preferably, the hemispherical surface of the spherical member further includes a plurality of springs for biasing the hemispherical surface of the convex spherical member.

[4] In the electronic component bonding apparatus of the present invention, when adjusting the parallelism between the stage surface and the electronic component holding surface, the high-speed moving mechanism brings the stage surface and the electronic component holding surface into close contact with each other. and a high load sensor capable of controlling the load when the hemispherical surface of the concave spherical member is urged against the hemispherical surface of the convex spherical member.

[5] In the electronic component bonding apparatus of the present invention, the center of the radius of curvature of the hemispherical surfaces of the convex spherical member and the concave spherical member is the center of the contact surface between the stage surface and the electronic component holding surface. is preferred.

[6] In the electronic component bonding apparatus of the present invention, a heater is arranged on the stage for thermally melting the bonding material, and two upper and lower fields of view are arranged so as to be able to move forward and backward between the stage and the bonding tool. further comprising: a camera unit; and an insulating plate disposed between the stage and the two-field-of-view camera unit, and movable between a position covering the top of the stage and a position retracted from the stage. preferably.

[7] In the electronic component bonding apparatus of the present invention, the upper and lower two-view camera unit includes a lower portion that supports the electronic component lifting mechanism and the stage via an X-axis drive section, a Y-axis drive section, and a Z-axis drive section. It is preferably attached to a base plate independent of the base.

The electronic component bonding apparatus described above has a convex spherical member and a concave spherical member, and a parallelism adjusting mechanism that biases the hemispherical surfaces of the convex spherical member and the concave spherical member with a spring. are doing. The parallelism adjusting mechanism is arranged on the upper side of the bonding tool. After exchanging the bonding tool, when the electronic component holding surface is brought into contact with the stage surface and a predetermined load is applied, the convex spherical member oscillates along the hemispherical surfaces of the concave spherical member and is fixed. The electronic component holding surface on the bonding tool side comes into close contact with the stage surface on which the bonding tool is located. As a result, the stage surface and the electronic component holding surface become parallel. The electronic component bonding apparatus configured in this manner can perform parallelism alignment between the electronic component and the substrate with a simple structure without providing control means or driving means for parallelism alignment.

Also, the electronic component bonding apparatus has a heat insulating plate between the stage and the upper and lower two-view camera unit. By providing the heat insulating plate, the heat from the heater arranged on the stage is transmitted to the upper and lower dual visual field units, thereby preventing the optical axes of the upper and lower dual visual field units from being shifted due to the heat. In addition, the upper and lower two-view camera unit is arranged on a base plate that is independent of the lower base that supports the electronic component lifting mechanism and the stage. For this reason, it is necessary to suppress the influence of the vibration caused by the operation of the electronic component lifting mechanism being transmitted to the two-vertical view camera unit, and conversely, the vibration caused by the operation of the two-vertical view camera unit being transmitted to the electronic component lifting mechanism. becomes possible.

According to the electronic component bonding apparatus of the present invention configured as described above, in bonding the electronic component and the substrate, the parallelism adjusting mechanism between the electronic component and the substrate is realized by a small and simple structure, and the electronic component It is possible to align the electrodes of the substrate with the electrodes of the substrate with high accuracy.

1 is a cross-sectional view showing the overall configuration of an electronic component bonding apparatus 1; FIG. 2 is a front view of the electronic component bonding apparatus 1 viewed from the Y-axis direction; FIG. FIG. 11 is an explanatory view showing a state in which an electronic component holding surface 33a is adjusted parallel to a stage surface 13a by a parallelism adjusting mechanism 44; 1 is a diagram showing an example of an electronic component M; FIG. 1 is a diagram showing an example of a substrate P; FIG. 4 is a diagram showing a state after bonding the electronic component M and the substrate P; FIG. It is a process flow figure which shows the main process of electronic component joining. 4 is a cross-sectional view showing a state of alignment between an electronic component M and a substrate P; FIG. 3A and 3B are schematic diagrams for explaining the bonding operation of the electronic component bonding apparatus 1; FIG. 3 is a cross-sectional view showing a state in which the electronic component bonding apparatus 1 is bonding an electronic component M and a substrate P; FIG.

(Structure of electronic component bonding apparatus 1)
An electronic component bonding apparatus 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 10. FIG.

FIG. 1 is a cross-sectional view showing the overall configuration of an electronic component bonding apparatus 1. As shown in FIG. FIG. 2 is a front view of the electronic component bonding apparatus 1 viewed from the Y-axis direction. 1 shows the electronic component bonding apparatus 1 immediately before operation, and FIG. 2 is an explanatory view showing a simplified positional relationship between the heat insulating plate 57 and the upper and lower two-view camera unit 12. As shown in FIG. In FIG. 1, the horizontal direction of the drawing is the Y-axis, the vertical direction to the paper surface is the X-axis, and the vertical direction to the XY plane is the Z-axis or vertical direction. The electronic component bonding apparatus 1 has a stage mechanism 10 , an electronic component elevating mechanism 11 , and an upper and lower two-view camera unit 12 . The stage mechanism 10 has a stage 13 that attracts and holds the substrate P, which is a material to be bonded, an X-axis drive table 14 that moves the stage 13 in the X-axis direction, and a Y-axis drive table 15 that moves the stage 13 in the Y-axis direction. are doing.

The stage 13 has a heater 16 for thermally melting the solder layer H2 (see FIG. 5) mainly as a bonding material on the substrate P side when the electronic component M is bonded to the substrate P. FIG. The stage 13 is fixed to the lower base 17 via an X-axis drive table 14 and a Y-axis drive table 15 . A stage surface 13a of the stage 13 has a vacuum suction hole (not shown) and can vacuum-suck the substrate P. As shown in FIG. The X-axis drive table 14 and the Y-axis drive table 15 are configured to allow fine adjustment of the position of the substrate P in the XY direction.

The electronic component lifting mechanism 11 is composed of a high-speed moving mechanism 20 and a low-speed moving mechanism 21 . The high speed movement mechanism 20 has a motor 22 , a ball screw 23 and a ball screw nut 24 . The ball screw nut 24 is coupled to the output shaft 26 of the motor 22 via the coupling portion 25 . The ball screw nut 24 is fixed to the connecting moving part 27 . Also, the ball screw nut 24 is screwed to the ball screw 23 . The connecting moving part 27 is attached to an upper base 28 arranged above the electronic component lifting mechanism 11 via a first guide part 29 , a second guide part 30 and a side plate 31 . The first guide portion 29 and the second guide portion 30 guide the connecting moving portion 27 so as to be vertically movable with respect to the upper base 28 . In other words, the high-speed moving mechanism 20 is configured to move the connecting moving portion 27 vertically by driving the motor 22 .

The high-speed moving mechanism 20 has a displacement sensor 32 , and the displacement sensor 32 detects the amount of vertical movement of the connecting moving part 27 , that is, the amount of vertical movement of the bonding tool 33 by the high-speed moving mechanism 20 . The displacement sensor 32 can be composed of, for example, a linear encoder.

A moving portion 41 is supported by the connecting moving portion 27 via a high load sensor 40 . A large load spring 42 as a biasing means is provided between the connecting moving portion 27 and the moving portion 41 . The large load spring 42 generates a reaction force against the connecting moving portion 27 and urges the moving portion 41 downward. A cross roller guide or an air slide guide, for example, can be used for the first guide portion 29 and the second guide portion 30 . The high-speed moving mechanism 20 raises and lowers the low-speed moving mechanism 21 via the moving portion 41 .

When a push-up force acts on the moving part 41 from below (the side of the bonding tool 33 ), the moving part 41 is biased upward relative to the connecting moving part 27 , and the pushing-up force acts on the moving part 41 via the bonding tool 33 . can be measured by the high load sensor 40.

The low-speed movement mechanism 21 includes a motor 43, a parallelism adjustment mechanism 44, a piezo drive mechanism 45, a low load sensor 46, a displacement sensor 47, and, in order from the high-speed movement mechanism 20 side along the central axis Cp of the high-speed movement mechanism 20. A bonding tool 33 is connected. The parallelism adjusting mechanism 44 is attached directly above the piezo drive mechanism 45 . The bonding tool 33 has a heater 48 for thermally melting the solder layer H1 (see FIG. 4) mainly as a bonding material on the electronic component M side when the electronic component M is bonded to the substrate P. As shown in FIG. The low-speed movement mechanism 21 moves vertically on the central axis Cp. The configuration of the parallelism adjusting mechanism 44 will be described with reference to FIG.

The piezo drive mechanism 45 has a piezo element (not shown) as a drive source, and moves the bonding tool 33 downward according to a voltage signal applied to the piezo element. The piezo driving mechanism 45 may be configured to transmit the deformation amount of the piezo element to the bonding tool 33 as it is, or may be configured to increase the displacement amount using a displacement magnifying mechanism and transmit it to the bonding tool 33 . be.

A displacement sensor 47 detects the amount of displacement of the bonding tool 33 . The detection accuracy is approximately 0.01 μm, and for example, a capacitive displacement sensor can be used. The low load sensor 46 detects a load applied to the bonding tool 33 from below. That is, the load applied when the electronic component M and the board P are joined can be detected. The bonding tool 33 has a vacuum suction hole (not shown) on the electronic component holding surface 33a, and can vacuum-suck the electronic component M onto the stage surface 13a.

The motor 43 is connected to the parallelism adjusting mechanism 44 and rotates the bonding tool 33 in the horizontal plane via the parallelism adjusting mechanism 44 . That is, the motor 43 rotates the electronic component M around the central axis Cp as a rotation axis, and finely adjusts the position of the electronic component M with respect to the substrate P in the rotational direction. The electronic component elevating mechanism 11 configured as described above is fixed so as to hang down from the upper base 28 , and the upper base 28 is fixed to the lower base 17 via a rigid columnar frame 49 .

Since the upper and lower two-view camera unit 12 can employ a known one, detailed description thereof will be omitted. The upper and lower two-view camera unit 12 includes an imaging section 50 which is a main body, an upper opening 51 for inputting reflected light from an electrode 70 (see FIG. 4) of an electronic component M provided in the imaging section 50, and an electrode 71 (see FIG. 4) of the substrate P. 5) has a lower opening 52 for inputting reflected light. The imaging unit 50 includes a prism (not shown) for switching the optical axis of the input reflected light, an imaging camera for imaging the electrode 70 and an imaging camera for imaging the electrode 71 (not shown). The two-view camera unit 12 is fixed to the side of the base plate 56 via the Z-axis driving section 53 , the X-axis driving section 54 and the Y-axis driving section 55 in a hanging posture.

The base plate 56 is fixed to the lower base 17 by a rigid columnar frame 49 independent of the electronic component lifting mechanism 11 . This makes it difficult for vibrations during the operation of the electronic component lifting mechanism 11 and the stage mechanism 10 to be transmitted to the upper and lower two-view camera unit 12 . Conversely, it is made difficult to transmit vibrations to the electronic component lifting mechanism 11 and the stage mechanism 10 when the camera unit 12 operates.

As shown in FIGS. 1 and 2 , a heat insulating plate 57 is arranged between the stage 13 and the two-view camera unit 12 . FIG. 1 shows a state in which the electronic component bonding apparatus 1 is in a state immediately before operation, and a situation in which the upper and lower double-view camera unit 12 is retracted from the bonding tool 33 in the Y-axis direction. The heat insulating plate 57 is attached to the Y-axis drive table 15 via a support frame 58 and a linear drive section 59 . That is, the heat insulating plate 57 is movable with respect to the Y-axis drive table 15 in the moving direction (Y-axis direction) of the two-vertical-view camera unit 12 so as to block the space between the two-vertical-view camera unit 12 and the stage 13 . It is configured to be able to move between a position covering the upper part of the stage 13 and a position separated from the bonding tool 33 in the planar direction. When aligning the electronic component M and the board P, the central positions of the upper opening 51 and the lower opening 52 of the upper and lower dual-view camera unit 12 move to the central axis Cp. When the upper and lower two-view camera unit 12 moves to a position where the electrodes 70 and 71 (see FIGS. 4 and 5) of the electronic component M and the substrate P can be imaged, the heat insulating plate 57 prevents at least the operation of the bonding tool 33. It retreats in the Y-axis direction to a position where it does not exist.

FIG. 2 shows the situation after the two-view camera unit 12 has moved to a position where the electronic component M and the substrate P can be imaged. At this time, the central positions of the upper opening 51 and the lower opening 52 are on the central axis Cp. The heat insulating plate 57 is retracted to a position away from the stage 13 in the depth direction of the paper surface. The heat insulating plate 57 is supported by two support frames 58 and configured to be movable in the Y-axis direction with respect to the Y-axis drive table 15 by a linear drive unit 59 . The low-speed movement mechanism 21 is laterally surrounded by side plates 31 .

(Configuration of Parallelism Adjusting Mechanism 44)
3A and 3B are explanatory diagrams showing a situation in which the parallelism adjusting mechanism 44 adjusts the electronic component holding surface 33a so as to be parallel to the stage surface 13a. 3(a) is a cross-sectional view of the electronic component bonding apparatus 1, and FIG. 3(b) is a plan view of the AA section of FIG. 3(a) viewed from above. As shown in FIG. 3( a ), the parallelism adjusting mechanism 44 is composed of a convex spherical member 65 , a concave spherical member 66 and a spring 67 . The convex spherical member 65 has a convex hemispherical surface 65a. The concave spherical member 66 has a concave hemispherical surface 66a. The convex hemispherical surface 65a is biased by a spring 67 via an air bearing 68 against the concave hemispherical surface 66a. Although not shown, the parallelism adjusting mechanism 44 is connected to a compressed air supply device that supplies compressed air to form the air bearing 68 . Incidentally, when the electronic component M and the substrate P are joined together, air is sucked from the air bearing 68 and the connecting portion between the convex spherical member 65 and the concave spherical member 66 is vacuum-bonded.

As shown in FIG. 3A, the concave spherical member 66 is fixed to the motor 43, and the convex spherical member 65 is fixed to the piezo drive mechanism 45. As shown in FIG. 3(a) and 3(b), the outer diameter of the convex spherical member 65 is square, and springs are provided between the side surfaces 65b of each of the four sides and the end surface 41a of the moving portion 41. As shown in FIGS. 67 is suspended. The four springs 67 always urge the convex hemispherical surface 66a against the concave hemispherical surface 65a. That is, the convex spherical member 65, the piezo drive mechanism 45, the low load sensor 46, the displacement sensor 47, and the bonding tool 33 are integrated and held by the spring 67 on the moving portion 41 via the concave spherical member 66. . Therefore, the spring 67 has an urging force capable of bringing the convex spherical member 65 and the concave spherical member 66 into close contact while holding the components from the parallelism adjusting mechanism 44 to the bonding tool 33 .

Next, the operation of the parallelism adjusting mechanism 44 will be described with reference to FIG. 3(a). The bonding tool 33 is for sucking and holding the electronic component M, and is replaced for each type of the electronic component M. As shown in FIG. Therefore, when exchanging the bonding tool 33, it is important to match the parallelism between the electronic component holding surface 33a of the bonding tool 33 and the stage surface 13a of the stage 13. FIG. For parallelism alignment, first, the high-speed moving mechanism 20 is driven to bring the electronic component holding surface 33a of the bonding tool 33 and the stage surface 13a of the stage 13 into contact. The concave spherical member 66 is supported by the moving portion 41 . The convex spherical member 65 is urged against the concave spherical member 66 with a tensile force by a spring 67 . The high-speed movement mechanism 20 causes the concave spherical member 66 to push the convex spherical member 65 along the central axis Cp. An air bearing 68 is formed between the concave spherical member 66 and the convex spherical member 65 by supplying compressed air from a compressed air supply device (not shown). By providing the air bearing 68, the convex spherical member 65 freely swings following the hemispherical surface 66a, and the electronic component holding surface 33a is in close contact with the horizontal stage surface 13a. That is, the electronic component holding surface 33a and the stage surface 13a are parallel.

The center Rc of the radius of curvature R of the convex spherical member 65 and the concave spherical member 66 is set to be the center of the plane of the contact surface between the electronic component holding surface 33a of the bonding tool 33 and the stage surface 13a of the stage 13. ing. That is, since the center Rc is on the central axis Cp, the convex spherical member 65 can freely swing following the concave spherical member 66 . Air is vacuum-sucked from the air bearing 68 after the parallelism between the electronic component holding surface 33a and the stage surface 13a has been adjusted. Then, since the convex hemispherical surface 65a and the concave hemispherical surface 66a are in the same state as when they are vacuum-sucked, the convex spherical member 65 and the concave spherical member 66 do not oscillate relative to each other. Able to maintain horizontal posture. The electronic component M and the substrate P are joined together in a parallel posture. Although the biasing force of the four springs 67 varies depending on the degree of parallelism, the difference is negligible.

(Electronic component joining method)
Next, a method for bonding the electronic component M and the substrate P will be described according to the process flow diagram shown in FIG. First, the electronic component M and the substrate P to be joined will be described. FIG. 4 is a diagram showing an example of the electronic component M. As shown in FIG. FIG. 5 is a diagram showing an example of the substrate P. FIG. FIG. 6 is a diagram showing a state after the electronic component M and the substrate P are joined. FIG. 4(a) is a plan view of the electronic component M viewed from the bonding tool 33 side, and FIG. 4(b) is a side view. The electronic component M has a large number of electrodes 70, and a bonding material (not shown) such as a solder layer H1 is formed on the surfaces of the electrodes 70. As shown in FIG. FIG. 5(a) is a plan view of the substrate P viewed from the bonding tool 33 side, and FIG. 5(b) is a side view. The substrate P has a large number of electrodes 71, and a bonding material (not shown) such as a solder layer H2 is formed on the surfaces of the electrodes 71. As shown in FIG. After aligning the electrodes 70 and 71 of the electronic component M and the substrate P, the electronic component M and the substrate P are electrically connected by the electrodes 70 and 71 by pressing them while melting the solder layers H1 and H2. and mechanically joined.

FIG. 7 is a process flow diagram showing the main process of bonding electronic components. FIG. 8 is a cross-sectional view showing how the electronic component M and the substrate P are aligned. As a preparatory step, as shown in FIG. 3, the bonding tool 33 is attached to the electronic component bonding apparatus 1, and parallelism between the electronic component holding surface 33a of the bonding tool 33 and the stage surface 13a of the stage 13 is adjusted. An air bearing 68 is formed between the convex spherical member 65 and the concave spherical member 66 when parallelism is adjusted. The concave spherical member 66 is brought into close contact to maintain parallelism. The electronic component bonding apparatus 1 performs the bonding operation while maintaining the parallelism. First, the heat insulating plate 57 is moved from the stage 13 and retracted to a position where the bonding tool 33 can be driven (the position shown in FIG. 8) (step S1). At this time, as shown in FIG. 1, the two-view camera unit 12 is retracted to the initial position where the bonding tool 33 can be driven.

Next, the substrate P is transported to the stage 13 and vacuum-sucked (step S2), and the electronic component M is transported to the bonding tool 33 and vacuum-sucked (step S3). Then, the upper and lower two-view camera unit 12 is moved to a position where both the electronic component M and the substrate P can be recognized (S4). Next, as shown in FIG. 8, the positions of the electronic component M and the board P are detected by the two-view camera unit 12 (step S5), and the electronic component M and the board P are aligned (step S6).

Alignment between the electronic component M and the board P is performed by the upper and lower two-view camera unit 12 . The bonding tool 33 is positioned at the top of its movable range. The upper and lower two-view camera unit 12 aligns respective positions in the XYZ directions where the upper opening 51 can capture the image of the electrode 70 (or alignment mark) of the electronic component M. FIG. The position of the substrate P in the XY direction is adjusted until the lower opening 52 is positioned so that the electrodes 71 (or alignment marks) of the substrate P can be detected. At this time, the center C1 of the electrode 70 of the electronic component M and the center C2 of the electrode 71 of the substrate P are on the central axis Cp. Based on the data detected by the upper imaging camera and the lower imaging camera, the motor 43 of the low speed movement mechanism 21 is driven to rotate the bonding tool 33 (electronic component M) on the central axis Cp, and the deviation of the rotation direction of the electronic component M with respect to the substrate P is detected. to match. Note that this adjustment by rotation is a fine adjustment, and the displacement of the spring 67 of the parallelism adjusting mechanism 44 due to the rotation is negligible and does not affect the parallelism adjustment.

Next, the camera unit 12 with two vertical fields of view is moved to the initial position (the position shown in FIG. 1) (step S7), and the electronic component M is lowered toward the substrate P as shown in FIGS. M is bonded to the substrate P (step S8). At this time, the heater 48 of the bonding tool 33 and the heater 16 of the stage 13 are heated to a temperature sufficient to thermally melt the bonding materials such as the solder layers H1 and S2. The heaters 16 and 48 are ceramic heaters or the like, and it is desirable that they are always heated while the electronic component bonding apparatus 1 is in operation. Note that the bonding operation of the electronic component M and the substrate P is performed in two steps. First, the joining operation will be described with reference to FIG.

9A and 9B are schematic diagrams for explaining the bonding operation of the electronic component bonding apparatus 1. FIG. FIG. 10 is a cross-sectional view showing a state in which the electronic component bonding apparatus 1 is bonding the electronic component M and the substrate P. As shown in FIG. The electronic component bonding apparatus 1 has a high speed movement mechanism 20 and a low speed movement mechanism 21 . The motor 22 of the high-speed moving mechanism 20 is a high-torque motor, and pushes the low-speed moving mechanism 21 via a large load spring 42 . Therefore, if the joining operation is performed by the high-speed moving mechanism 20, the electronic component M and the substrate P may be deformed, or the electrodes 70 and 71 may be destroyed. Therefore, as shown in FIG. 9, the high-speed moving mechanism 20 moves the bonding tool 33 toward the substrate P until the distance between the electrode 70 of the electronic component M and the electrode 71 of the substrate P reaches a predetermined distance D1. After that, it shifts to driving by the low-speed moving mechanism 21 . The predetermined distance D1 is approximately 100 μm.

After the distance between the electrode 70 of the electronic component M and the electrode 70 of the substrate P reaches a predetermined distance D1, the low-speed moving mechanism 21 moves the bonding tool 33 at a speed lower than that of the high-speed moving mechanism 20. move. The low-speed moving mechanism 21 brings the solder layer H1 of the electrode 70 of the electronic component M into contact with the solder layer H2 of the electrode 71 of the substrate P. As shown in FIG. Contact can be detected by the low load sensor 46 and the displacement sensor 47 . The driving source of the low-speed moving mechanism 21 is a piezo driving mechanism 45, and after detecting that the electronic component M and the substrate P are in contact with each other, the piezo driving mechanism 45 outputs the detection data of the low load sensor 46 and the displacement sensor 47. The electronic component M is bonded to the substrate P by applying a predetermined load. Next, with reference to FIG. 10, the state of the electronic component bonding apparatus 1 when bonding the electronic component M and the substrate P will be described.

In the electronic component bonding apparatus 1, when the electronic component M and the substrate P are bonded, the two-view camera unit 12 and the heat insulating plate 57 are retracted to a position where the operation of the bonding tool 33 is not hindered. The bonding tool 33 is lowered by the piezo driving mechanism 45 to bond the electronic component M and the substrate P together. The movement speed of the bonding tool 33 and the load applied to the electronic component M and the substrate P during bonding are controlled by the displacement sensor 47 and the low load sensor 46 .

Returning to FIG. 7, the operation after bonding the electronic component M to the substrate P will be described. After bonding the electronic component M to the substrate P, the bonding tool 33 is moved to the initial position (the position shown in FIG. 1) (step S9). During this operation, the upper and lower two-view camera unit 12 and the heat insulating plate 57 are retracted to a position where the operation of the bonding tool 33 is not hindered. After the bonding tool 33 has moved to the initial position, the substrate P to which the electronic component M is bonded is unloaded from the stage 13 (step S10). After unloading, the heat insulating plate 57 is moved onto the stage 13 (step S11). As described above, the heat insulating plate 57 covers the upper side of the stage 13 except for the operations related to the bonding of the electronic component M and the substrate P (operations in steps S2 to S10).

The electronic component bonding apparatus 1 described above has the parallelism adjusting mechanism 44 connected to the hemispherical surfaces 65a and 66a of the convex spherical member 65 and the concave spherical member 66, respectively. The parallelism adjusting mechanism 44 is arranged on the upper side of the bonding tool 33 . After exchanging the bonding tool, when the electronic component holding surface 33a is brought into contact with the stage surface 13a by the high-speed moving mechanism 20 and a predetermined load is applied, the concave spherical member 66 swings along the concave hemispherical surface 66a. The electronic component holding surface 33a on the bonding tool 33 side is in close contact with the horizontally fixed stage surface 13a. As a result, the stage surface 13a and the electronic component holding surface 33a become parallel. The electronic component bonding apparatus 1 configured in this manner can bond the electronic component M and the substrate with a small size and simple structure without providing control means or driving means for parallelism matching as in the above-described prior art. High-precision parallelism matching with P becomes possible. Therefore, it is possible to obtain good bonding quality between the electronic component M and the substrate P.

The parallelism adjusting mechanism 44 has an air bearing 68 between the convex spherical member 65 and the concave spherical member 66 . By using the air bearing 68 when adjusting the parallelism, the convex spherical member 65 can be oscillated with a low load. Further, after the parallelism is adjusted, the air in the air bearing 68 is sucked to create a vacuum state, whereby the convex spherical member 65 and the concave spherical member 66 can be brought into close contact with each other in a vacuum state, and the parallelism can be maintained for a long period of time. becomes possible.

Further, the parallelism adjusting mechanism 44 is arranged on the bonding tool 33 side. It is also possible to dispose the parallelism adjusting mechanism 44 on the stage 13 side as in the prior art. However, since the substrate P is generally larger in size than the chip-like electronic component M, the parallelism adjusting mechanism 44 is enlarged, and not only the stage mechanism 10 but also the electronic component bonding apparatus 1 are enlarged. put away.

The low-speed movement mechanism 21 has a piezo drive mechanism 45 that uses a piezo element as a drive source, and the parallelism adjustment mechanism 44 is attached directly above the piezo drive mechanism 45 . As a result, the piezo drive mechanism 45 can join the electronic component M and the substrate P with a low load and high accuracy without being affected by the mass of the parallelism adjustment mechanism 44 .

In the electronic component bonding apparatus 1, the semispherical surface 65a of the convex spherical member 65 is brought into close contact with the semispherical surface 66a of the concave spherical member 66 by the biasing force of a plurality of (four in the example of FIG. 5B) springs 67. there is By doing so, there is no play between the hemispherical surfaces 65a and 66a, and the parallelism between the stage surface 13a and the electronic component holding surface 33a can be adjusted with high accuracy. However, since an air bearing 68 is formed between the convex spherical member 65 and the concave spherical member 66 during the parallelism adjustment operation, play is eliminated between the hemispherical surfaces 65a and 66a. The spring 67 suspends the convex spherical member 65 and the lower components, and the load necessary to bring the convex spherical member 65 into close contact with the concave spherical member 66, and It has an urging force that is combined with a load of about several N required to tightly constrain the convex spherical member 65 to the concave spherical member 66 .

The electronic component bonding apparatus 1 also has a high load sensor 40 . When the stage surface 13a and the electronic component holding surface 33a are brought into close contact with each other by the high-speed moving mechanism 20 and the parallelism is adjusted, the high load sensor 40 controls the applied load. Appropriate load management makes it possible to obtain high-precision parallelism and prevent damage to other components due to application of excessive loads.

In the parallelism adjusting mechanism 44, the center Rc of the radius of curvature R of the hemispherical surfaces 65a and 66a of the convex spherical member 65 and the concave spherical member 66 is positioned at the center of the contact surface between the stage surface 13a and the electronic component holding surface 33a. is set to be That is, the center C1 of the electronic component M (the central position of the arrangement of the electrodes 70), the center C2 of the substrate P (the central position of the arrangement of the electrodes 71), and the center Rc of the radius of curvature R are arranged on the central axis Cp. . By configuring in this manner, the convex spherical member 65 can accurately follow the concave spherical member 66 .

The electronic component bonding apparatus 1 also includes a heater 16 disposed on a stage 13 for thermally melting bonding materials such as the solder layers H1 and H2, and a bonding tool 33 which is movable between the stage 13 and the bonding tool 33. It has an upper and lower two-view camera unit 12. The heat insulating plate 57 is arranged between the stage 13 and the upper and lower two-field-of-view camera unit 12 , and is configured to be movable between a position covering the upper side of the stage 13 and a position retracted from the stage 13 . The heat insulating plate 57 makes it difficult for the heat from the stage 13 to be transmitted to the upper and lower two-view camera unit 12 . When the bonding material is the solder layers H1 and H2, the melting temperature is 140.degree. C. to 260.degree. By providing the heat insulating plate 57, it is possible to suppress the influence of the heat on the upper and lower two-view camera unit 12 itself and the deviation of the optical axis. Alignment can be performed.

In addition, the upper and lower two-view camera unit 12 is fixed to the lower base 17 by a rigid columnar frame 49 that is independent of the electronic component lifting mechanism 11 . This makes it difficult for vibrations during the operation of the electronic component lifting mechanism 11 and the stage mechanism 10 to be transmitted to the upper and lower two-view camera unit 12 . Conversely, it is made difficult to transmit vibrations to the electronic component lifting mechanism 11 and the stage mechanism 10 when the camera unit 12 operates. In this way, by suppressing the influence of mutual vibration, highly accurate and stable positioning and bonding are possible. Also, by suppressing mutual transmission of vibration, the speed of each operation of the electronic component lifting mechanism 11, the stage mechanism 10, and the upper and lower two-view camera unit 12 can be increased, and the operation of each mechanism can be performed in each process shown in FIG. can be executed in parallel, shortening the takt time.

The electronic component bonding apparatus 1 described above realizes the parallelism adjusting mechanism 44 between the electronic component M and the substrate P with a small and simple structure, and the electrodes 70 of the electronic component M and the electrodes 71 of the substrate P are connected with high accuracy. position alignment.

DESCRIPTION OF SYMBOLS 1... Electronic component bonding apparatus 10... Stage mechanism 11... Electronic component lifting mechanism 12... Up-and-down two-view camera unit 13... Stage, 13a... Stage surface, 14... X-axis drive table, 15... Y-axis drive table, Reference Signs List 16, 48 Heater 17 Lower base 20 High-speed movement mechanism 21 Low-speed movement mechanism 28 Upper base 32, 47 Displacement sensor 33 Bonding tool 33a Electronic component holding surface 40 Height Load sensor 41 Moving part 42 Large load spring 44 Parallelism adjusting mechanism 45 Piezo drive mechanism 46 Low load sensor 53 Z axis drive part 54 X axis drive part 55 Y Axial drive unit 56 Base plate 57 Heat insulating plate 59 Heat insulating plate drive mechanism 65 Convex spherical member 65a Convex hemisphere 65b Side surface 66 Concave spherical member 66a Concave hemisphere Surface 67 Spring 68 Air bearing 59 Linear drive 70, 71 Electrode C1 Center of electronic component M C2 Center of substrate P Cp Center axis D1 Predetermined distance H1 , H2... Solder layer (bonding material), M... Electronic component, P... Substrate, R... Radius of curvature, Rc... Center of radius of curvature

Claims (7)

It has an electronic component elevating mechanism that moves up and down a bonding tool that adsorbs and holds an electronic component with respect to a stage that adsorbs and holds the substrate, and the electrodes of the substrate and the electrodes of the electronic component are connected via a bonding material that can be thermally melted. An electronic component bonding apparatus capable of bonding,
The electronic component lifting mechanism includes:
a high-speed movement mechanism for moving the bonding tool until the distance between the electrode of the electronic component and the electrode of the substrate reaches a predetermined distance;
a low-speed movement mechanism that moves the bonding tool at a speed lower than that of the high-speed movement mechanism;
a parallelism adjusting mechanism provided in the low-speed movement mechanism and capable of adjusting the parallelism of the electronic component holding surface of the bonding tool with respect to the stage surface of the stage;
The parallelism adjusting mechanism is connected to the hemispherical surface of the convex spherical member and the hemispherical surface of the concave spherical member,
An electronic component bonding apparatus characterized by: In the electronic component bonding apparatus according to claim 1,
The low-speed movement mechanism has a piezo drive mechanism using a piezo element as a drive source,
The parallelism adjustment mechanism is attached directly above the piezo drive mechanism,
An electronic component bonding apparatus characterized by: In the electronic component bonding apparatus according to claim 1,
a moving part that connects the high-speed movement mechanism and the low-speed movement mechanism;
a plurality of springs suspended between the side surface of the convex spherical member and the moving part for urging the hemispherical surface of the convex spherical member against the hemispherical surface of the concave spherical member;
further having
An electronic component bonding apparatus characterized by: The electronic component bonding apparatus according to claim 1,
When the parallelism between the stage surface and the electronic component holding surface is adjusted, the stage surface and the electronic component holding surface are brought into close contact with each other by the high-speed moving mechanism, and the convex shape is formed on the hemispherical surface of the concave spherical member. further comprising a high load sensor capable of controlling the load when urging the hemispherical surface of the spherical member;
An electronic component bonding apparatus characterized by: In the electronic component bonding apparatus according to claim 1,
The center of the radius of curvature of the hemispherical surfaces of the convex spherical member and the concave spherical member is located at the center of the contact surface between the stage surface and the electronic component holding surface,
An electronic component bonding apparatus characterized by: In the electronic component bonding apparatus according to claim 1,
a heater disposed on the stage for thermally melting the bonding material;
an upper and lower two-view camera unit arranged so as to be able to advance and retreat between the stage and the bonding tool;
a heat insulating plate disposed between the stage and the two-field-of-view camera unit and movable between a position covering the top of the stage and a position retracted from the stage;
further having
An electronic component bonding apparatus characterized by: In the electronic component bonding apparatus according to claim 6,
The upper and lower two-view camera unit is attached to a base plate independent from a lower base that supports the electronic component lifting mechanism and the stage via an X-axis drive section, a Y-axis drive section, and a Z-axis drive section.
An electronic component bonding apparatus characterized by:

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