JP2022122403A - Substrate bonding device and substrate bonding method - Google Patents

Abstract

To provide a substrate bonding device and a substrate bonding method capable of appropriately bonding substrates in a short time even when the substrates are enlarged and thinned.SOLUTION: A substrate bonding device 100 includes a first plate 20 and a second plate 30 sandwiching a plurality of substrates S1 and S2 in an overlapping state, and a pressing mechanism 50 that presses one of the first plate 20 and the second plate 30 against the other, and the pressing mechanism 50 includes a central load shaft 51A arranged corresponding to the central portions of the plurality of substrates S1 and S2, a plurality of peripheral load shafts 51B to 51E arranged corresponding to the peripheral portions of the plurality of substrates excluding the central portion, and a plurality of drive units 52A to 52E that individually drive the central load shaft 51A and the plurality of peripheral load shafts 51B to 51E.SELECTED DRAWING: Figure 1

Description

The present invention relates to a substrate bonding apparatus and a substrate bonding method.

A substrate bonding apparatus that bonds a plurality of substrates in an overlapping state is known. This substrate bonding apparatus has a plate (also referred to as a pressing member or pressure plate) that presses the substrates when the substrates are bonded together, and a pressing mechanism that applies a pressing force to the plate. The pressing mechanism has one load shaft so as to apply a load to the central portion of the plate (see Patent Document 1, for example). In recent years, substrates have become larger and thinner, and plates have also become larger. away from it will cause underload. In the portion apart from the axial direction, the substrates may be stuck together poorly.

To solve this problem, it is necessary to increase the rigidity of the plate by making it thicker, which not only increases the manufacturing cost of the device, but also drives the heavy plate, which leads to an increase in operating costs. Further, a form has been proposed in which a pressing force is applied to the plate by a plurality of load axes (for example, Patent Documents 2, 3, 4, and 5). In this way, by pressing the plate with a plurality of load axes, the pressing force is widely distributed on the plate, thereby reducing adhesion failures between the substrates.

JP 2007-311683 A JP-A-2002-323694 Japanese Patent Application Laid-Open No. 2003-241160 JP-A-2004-268113 JP 2008-147249 A

In the substrate bonding apparatuses disclosed in Patent Documents 2, 3, 4, and 5, pressing force is applied to the plate by a plurality of load shafts. is given. That is, the plurality of load shafts are not driven individually, the pressing forces by the plurality of load shafts are substantially the same, and the driving timings for applying the pressing forces are also substantially the same. As described above, when substrates are made larger and thinner, warpage and distortion of substrates also increase. In some cases, the pressing force is insufficient, and there is a problem that the substrates cannot be properly attached to each other. Furthermore, in order to make up for insufficient pressing force, it is necessary to maintain the pressed state for a long time.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate bonding apparatus and a substrate bonding method capable of appropriately bonding substrates together in a short time even when the substrates are large and thin.

A substrate bonding apparatus according to an aspect of the present invention includes a first plate and a second plate for sandwiching a plurality of substrates in a stacked state, and a pressing mechanism for pressing one of the first plate and the second plate against the other. , wherein the pressing mechanism includes a central load shaft arranged corresponding to the central portion of the plurality of substrates, and a plurality of peripheral load shafts arranged corresponding to the peripheral portion of the plurality of substrates excluding the central portion. and a plurality of drives for individually driving each of the central load shaft and the plurality of peripheral load shafts.

A method of attaching a plurality of substrates according to an aspect of the present invention is a method of attaching a plurality of substrates by sandwiching the plurality of substrates in an overlapping state between a first plate and a second plate. When one of the substrates is pressed against the other, pressing on a portion corresponding to the central portion of the plurality of substrates, and pressing on a plurality of portions corresponding to the peripheral portion of the plurality of substrates excluding the central portion, Including setting each individually.

According to the substrate bonding apparatus and the substrate bonding method according to the aspect of the present invention, the central load shaft and the plurality of peripheral load shafts provided in the pressing mechanism are driven by the plurality of drive units. Alternatively, different pressing forces can be applied to the second plate at different drive timings. As a result, it is possible to arbitrarily set the pressing force to be applied to the substrates to be bonded and the driving timing thereof, so that substrates can be appropriately bonded in a short time even if the substrates are large and thin.

It is a front view which shows an example of the board|substrate sticking apparatus which concerns on embodiment. FIG. 2 is a plan view of the substrate bonding apparatus shown in FIG. 1; It is the perspective view which looked the 1st plate from the downward direction. An example of alignment operation is shown, (A) is a diagram showing a state before positioning the substrate, and (B) is a diagram showing a state after positioning the substrate. An example of the operation of the spacer is shown, (A) is a diagram showing a state in which the spacer is waiting, and (B) is a diagram showing a state in which the spacer supports the substrate. It is a flow chart which shows an example of the board|substrate affixing method which concerns on this embodiment. FIG. 6 is a flow chart showing an example of the substrate bonding method according to the present embodiment, following FIG. An example of the operation of the substrate bonding apparatus is shown, (A) is a view with the gate valve of the chamber opened, and (B) is a view with the upper substrate passed from the arm to the lift pins. An example of the operation of the substrate bonding apparatus is shown, (A) is a diagram of performing an alignment operation on the upper substrate, and (B) is a diagram of raising the upper substrate to a predetermined position after the alignment operation. An example of the operation of the substrate bonding apparatus is shown, (A) is a diagram in which the upper substrate is supported by spacers, and (B) is a diagram in which the lower substrate is passed from the arm to the lift pins. An example of the operation of the substrate bonding apparatus is shown, (A) is a diagram in which the chamber is evacuated and the lower substrate is subjected to warp-suppressing baking processing, and (B) is a diagram in which warp-suppressing baking processing is performed on the lower substrate in a vacuum atmosphere. It is a figure to do. An example of the operation of the substrate bonding apparatus is shown, (A) is a diagram showing an alignment operation performed on the lower substrate, and (B) is a diagram showing the lower substrate being lifted after the alignment operation. An example of the operation of the substrate bonding apparatus is shown, (A) is a diagram in which the second plate is lowered and the upper substrate is pressed by spring pins, and (B) is a diagram in which the spacers are retracted and the upper substrate and the lower substrate are separated. It is the figure made to contact|abut. An example of the operation of the substrate bonding apparatus is shown, (A) is a diagram in which the lift pins are lowered while the second plate is lowered, and the lower substrate is placed on the first plate, (B) is the first plate and the first plate. 2 is a diagram in which an upper substrate and a lower substrate are sandwiched between two plates; FIG. FIG. 5 is a graph showing applied loads and their drive timings with respect to a central load axis and a plurality of peripheral load axes; An example of the operation of the substrate bonding apparatus is shown, (A) is a diagram in which the second plate is lifted and the lift pins are lifted, and (B) is a diagram in which the bonded upper and lower substrates are passed from the lift pins to the arm. It is a diagram. It is a figure which shows an example of the 2nd plate which concerns on a modification. 18 is a diagram showing a state in which the upper substrate is pressed by the second plate shown in FIG. 17; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the invention is not limited to the following description. In addition, in the drawings, some portions are omitted in order to explain the embodiments in an easy-to-understand manner. In addition, the scale is changed as appropriate, such as by enlarging or emphasizing a part of the product, and the size and shape of the actual product may differ. In each figure below, directions in the figure are explained using an XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, the plane parallel to the horizontal plane is the XY plane. In this XY plane, the direction parallel to the transport direction of the substrates S1 and S2 is defined as the X direction, and the direction orthogonal to the X direction is defined as the Y direction. Also, the direction perpendicular to the XY plane is referred to as the Z direction (height direction). Regarding each of the X direction, Y direction, and Z direction, the direction indicated by the arrow in the drawing is the + direction, and the direction opposite to the direction indicated by the arrow is the − direction.

<Substrate bonding device>
A substrate bonding apparatus 100 according to an embodiment will be described. FIG. 1 is a diagram showing an example of a substrate bonding apparatus 100 according to an embodiment. 2 is a plan view of the substrate bonding apparatus 100 shown in FIG. 1. FIG. The substrate bonding apparatus 100 bonds a substrate S1 having an adhesive layer F formed thereon and a substrate S2 having an adhesive layer F formed thereon so that the adhesive layers F are in contact with each other. Note that the adhesive layer F is not limited to being formed on both the substrate S1 and the substrate S2, and may be formed on either the substrate S1 or the substrate S2. The adhesive layer F is formed by coating and drying the substrate S1 and the substrate S2 by, for example, a coating device before being carried into the substrate bonding apparatus 100 . Note that this coating device may be provided in the substrate bonding device 100 .

The substrates S1 and S2 are, for example, glass substrates, but may be semiconductor substrates other than glass substrates, resin substrates, or the like. In this embodiment, of the two substrates to be attached, the upper substrate (first substrate) is referred to as substrate S1, and the lower substrate (second substrate) is referred to as substrate S2. Also, the form in which the substrate S1 and the substrate S2 are attached together is referred to as a substrate S (see FIG. 18). Both of the substrates S1 and S2 are square substrates that are rectangular (square, rectangular) in plan view (as seen from the Z direction), but are not limited to square substrates, and are circular in plan view. , an elliptical shape, an elliptical shape, or the like.

As shown in FIGS. 1 and 2, the substrate bonding apparatus 100 includes a chamber 10, a first plate 20, a second plate 30, a lift section 40, a pressing mechanism 50, an alignment mechanism 60, and a spacer mechanism. 70, a block 80, and a controller C. In FIG. 2, the upper surface side of the chamber 10 is omitted in order to make the inside of the chamber 10 easier to understand. The control section C controls the operation of each section in the substrate bonding apparatus 100 in an integrated manner.

The chamber 10 accommodates therein the first plate 20 , the second plate 30 , the lift section 40 , part of the pressing mechanism 50 , the alignment mechanism 60 , and the spacer mechanism 70 . The chamber 10 is box-shaped and has an opening 11 in a part of the side wall. The opening 11 is formed on the −X side surface of the chamber 10 and allows communication between the inside and the outside of the chamber 10 . The opening 11 is formed to have a size that allows passage of the substrates S1 and S2 held by the transport device 90 (see FIG. 8B) and the substrate S to which both are attached.

The substrates S1 and S2 are carried into the chamber 10 through the opening 11 by the arm 91 (see FIG. 8B) of the transfer device 90, respectively. Also, the substrate S is unloaded from the chamber 10 through the opening 11 . In this embodiment, the transport device 90 has two flat plate-shaped arms 91, and when the substrate S1 is carried into the chamber 10, the substrate S1 is held by suction from the upper side of the substrate S1, and the substrate S2 is held. and when the substrate S is unloaded from the chamber 10, the substrates S2 and S are held by suction from below. In addition, the arm 91 may have a configuration in which the substrates S2 and S are placed and held on the upper surface side of the arm 91 without sucking the substrates S2 and S when the substrates S2 and S are transported. Note that the number of arms 91 is not limited to two, and may be three or more. When the substrate S1 is loaded into the chamber 10, the substrate S1 is transported with the adhesive layer F facing downward (-Z direction). Further, when the substrate S2 is loaded into the chamber 10, the substrate S2 is loaded with the adhesive layer F facing upward (+Z direction).

The chamber 10 has a gate valve 12 that opens and closes the opening 11 . The gate valve 12 is arranged on the outside of the -X side of the chamber 10, and is slidable, for example, in the vertical direction (Z direction) by a drive unit (not shown). The gate valve 12 can open and close the opening 11 by sliding, and close the chamber 10 by closing the opening 11 . Further, the upper surface of the chamber 10 is provided with a plurality of through portions 10a through which a plurality of load shafts 51 (to be described later) penetrate. A load shaft 51 is inserted in each of the through portions 10a in a vertically movable state, and the interior of the chamber 10 is maintained in a sealed state by a sealing member (not shown).

The inside of the chamber 10 is connected to a suction device (not shown). By sucking (exhausting) the inside of the chamber 10 with this suction device, the inside of the chamber 10 can be made into a vacuum atmosphere. Chamber 10 may include a valve releasable to the outside to release the vacuum atmosphere inside. Also, the interior of the chamber 10 may be connected to a gas supply device (not shown). By supplying a predetermined gas into the chamber 10 from this gas supply device, the inside of the chamber 10 can be made into a predetermined gas atmosphere. As the predetermined gas, for example, a gas such as nitrogen gas, which is inert to the thin films formed on the substrates S1 and S2, or dry air is used. The substrate bonding apparatus 100 may optionally include the chamber 10 or not, and may be of a form without the chamber 10 (open-to-atmosphere type).

The first plate 20 supports the substrates S1 and S2 loaded into the chamber 10 from below. The first plate 20 has a rectangular shape (square shape, rectangular shape) in a plan view, but is not limited to this shape, and may have, for example, a circular shape, an elliptical shape, an oval shape, or the like. The first plate 20 is set to have dimensions larger than those of the substrates S1 and S2 in the X direction and the Y direction.

The first plate 20 has a support plate 21 , a heater (heating section) 22 and a base plate 23 . The support plate 21, the heater 22, and the base plate 23 are stacked in this order from the lower side (-Z side). The first plate 20 is supported by a plurality of legs 24 provided on the lower surface side of the support plate 21 and fixed to the bottom of the chamber 10 via the legs 24 . Between the support plate 21 and the heater 22 and between the heater 22 and the base plate 23 are fixed by fastening members such as bolts, for example. The support plate 21, the heater 22, and the base plate 23 are provided with a plurality of through holes 20a in the vertical direction through which lift pins 41 of the lift section 40, which will be described later, pass.

The support plate 21 is, for example, a plate-like body made of a material such as metal, resin, or ceramics. The heater 22 is an example of a heating unit, and is, for example, a hot plate having a heating mechanism (heat source) such as a heating wire inside. The substrates S1 and S2 are heated through the base plate 23 by the heater 22 . Note that the heater 22 may be a laminated structure in which a sheet-like heat source is sandwiched. The substrates S<b>1 , S<b>2 and the substrate S are placed on the +Z side placement surface 23 a of the base plate 23 . The base plate 23 is, for example, a plate-like body made of ceramics, but may be made of metal, resin, or the like. A mounting surface 23a of the base plate 23 serves as a contact surface with the substrate S2. Therefore, it is preferable that the mounting surface 23a has high flatness and small surface roughness (or is a mirror surface).

FIG. 3 is a perspective view of the first plate 20 viewed from below. As shown in FIG. 3 , a plurality of leg portions 24 are provided on the lower surface of the support plate 21 . The plurality of legs 24 includes a leg 24A arranged in the center of the lower surface of the support plate 21, legs 24B arranged at each of the four corners of the support plate 21, and the legs 24A. It is formed of eight legs 24C arranged in the same manner. Leg 24B is less rigid than legs 24A and 24C. The pressing force when attaching the substrates S1 and S2 is mainly received by the legs 24A and 24C.

By supporting the first plate 20 with the plurality of legs 24 in this manner, deformation of the first plate 20 is prevented even when the pressing force is large. Note that the number and arrangement of the legs 24 are not limited to the form described above, and can be arbitrarily set according to the size of the first plate 20, the size of the pressing force used, and the like. For example, they may be arranged at the four corners of the lower surface of the support plate 21 and one may be arranged at the central portion.

As shown in FIGS. 1 and 2, the second plate 30 presses the substrate S1 toward the substrate S2 side (the first plate 20 side) when bonding the substrates S1 and S2 together. Like the first plate 20, the second plate 30 has a rectangular shape (square, rectangular shape) in plan view, but is not limited to this shape. There may be. The second plate 30 is set to have dimensions larger than those of the substrates S1 and S2 in the X direction and the Y direction. The dimensions of the second plate 30 in the X direction and the Y direction are the same as those of the first plate 20, but are not limited to this form. For example, the second plate 30 may have larger or smaller dimensions in the X and Y directions than the first plate 20 .

The second plate 30 has a load plate 31 , a heater (heating section) 32 and a press plate 33 . The load plate 31, heater 32, and press plate 33 are stacked in this order from the top. The second plate 30 is held at the lower end of a load shaft 51 of a pressing mechanism 50, which will be described later, and moves up and down as the load shaft 51 moves up and down. The load plate 31 and the heater 32 and the heater 32 and the press plate 33 are fixed by fastening members such as bolts, for example.

Since the load plate 31 receives a pressing force from the load shaft 51 of the pressing mechanism 50, it is preferably formed with a predetermined strength. The load plate 31 is made of, for example, metal, resin, ceramics, or the like. Like the heater 22 of the first plate 20, the heater 32 is, for example, a hot plate having a heating mechanism (heat source) such as a heating wire inside. The heater 32 heats the substrate S1 via the press plate 33 . As with the heater 22, the heater 32 may be a laminated structure in which a sheet-like heat source is sandwiched. In this embodiment, both the first plate 20 and the second plate 30 are provided with heaters 22 and 32, respectively, but the present invention is not limited to this form. For example, one of the first plate 20 and the second plate 30 may be provided with the heater 22 (32). A heating unit for heating the inside of the chamber 10 may be provided separately from the heaters 22 and 32 .

The press plate 33 has a pressing surface 33a for pressing the substrate S1 toward the substrate S2 on the lower surface on the -Z side. The press plate 33 is, for example, a plate-like body made of ceramics, but may be made of metal, resin, or the like. A pressing surface 33a of the press plate 33 serves as a contact surface with the substrate S1. Therefore, it is preferable that the pressing surface 33a has high flatness and small surface roughness (or is a mirror surface).

The press plate 33 has a plurality of spring pins 34 on the side of the pressing surface 33a. Each of the plurality of spring pins 34 is protruded downward from the pressing surface 33a by a spring (not shown) or the like, and receives an upward force to move upward and retract from the pressing surface 33a. Each spring pin 34 abuts on the upper surface of the substrate S1 and applies downward force to the substrate S1. It is optional whether the press plate 33 (second plate 30) is provided with the spring pin 34 or not. For example, the press plate 33 (second plate 30) without the spring pin 34 may be used.

The lift portion 40 is provided below the first plate 20 . The lift unit 40 supports the substrates S1, S2 and S above the first plate 20 and lifts and lowers the substrates S1, S2 and S. The lift section 40 has a plurality of lift pins 41, a moving section 42 that is connected to the lower ends of the lift pins 41 and moves up and down in the Z direction, and a lift pin drive section 43 that moves the moving section 42 up and down.

The lift pins 41 are arranged to pass through the plurality of through holes 20 a provided in the first plate 20 . Although two lift pins 41 are shown in FIG. 1, at least three or more lift pins 41 are arranged at predetermined intervals in order to support the substrates S1, S2, and S. The heights of the upper ends of the plurality of lift pins 41 are the same or substantially the same. The lift pins 41 may be made of, for example, a non-conductive material (eg, resin, metal, ceramics, etc.). The moving part 42 moves up and down by driving the lift pin driving part 43 , and simultaneously moves up and down the plurality of lift pins 41 as the moving part 42 moves up and down. An electric rotary motor, linear motor, air cylinder device, hydraulic cylinder device, or the like is used as the lift pin drive unit 43 , and driving force is transmitted to the moving unit 42 by a transmission mechanism (not shown).

The pressing mechanism 50 lowers the second plate 30 and presses the substrate S1 toward the substrate S2 side (the first plate 20 side) when the substrates S1 and S2 are attached. The pressing mechanism 50 includes multiple load shafts 51 and multiple drive units 52 that individually drive the multiple load shafts 51 .

The plurality of load shafts 51 includes a first load shaft 51A as a central load shaft and a plurality of peripheral load shafts as a second load shaft 51B, a third load shaft 51C, a fourth load shaft 51D and a fifth load shaft 51E. , have The first load shaft 51A is arranged in the central portion of the load plate 31 in plan view, and applies a load (pressing force) to the central portion of the load plate 31 . The second load shaft 51B, the third load shaft 51C, the fourth load shaft 51D, and the fifth load shaft 51E are arranged at four corners of the load plate 31, respectively, and apply loads to the corners of the load plate 31, respectively. . Each load shaft 51 is inserted into the chamber 10 via the through portion 10a. The first load shaft 51A is arranged corresponding to the central portion of the substrate S1 to be attached. The second load shaft 51B, the third load shaft 51C, the fourth load shaft 51D, and the fifth load shaft 51E are arranged so as to correspond to the four corners of the substrate S1 to be attached. The lower ends of the load shafts 51 are aligned at the same height so that the second plate 30 held by the lower ends of the load shafts 51 is parallel to the horizontal plane.

Although five load shafts 51 are used in this embodiment, the present invention is not limited to this form. For example, a configuration using three load shafts 51 or six or more load shafts 51 may be used. For example, when three load shafts 51 are used, for example, the central load shaft may be arranged in the central portion of the load plate 31, and the peripheral load shafts may be arranged in the peripheral portions on both sides thereof. Each load shaft 51 is a rod-shaped body with a circular cross section, and is formed of an outer diameter and a material (for example, metal, resin, ceramics, etc.) that is not deformed or deformed by the applied load. Each load shaft 51 may have the same shape or may have a different shape. For example, the first load shaft 51A may have a circular cross section with a larger outer diameter than the other load shafts 51 . Further, each load shaft 51 is not limited to having a circular cross section, and may have, for example, an elliptical cross section, an elliptical polygonal cross section, or the like.

The drive portions 52 are provided corresponding to the respective load shafts 51, and include a first drive portion 52A that drives the first load shaft 51A, a second drive portion 52B that drives the second load shaft 51B, and a third drive portion 52B that drives the second load shaft 51B. It has a third drive section 52C that drives the load shaft 51C, a fourth drive section 52D that drives the fourth load shaft 51D, and a fifth drive section 52E that drives the fifth load shaft 51E. These plurality of drive units 52 individually drive the first load shaft 51A to the fifth load shaft 51E. For each drive unit 52, for example, an air cylinder device, a hydraulic cylinder device, a ball screw mechanism using an electric rotating motor, or the like is used. Different loads can be applied to the load shafts 51 at different drive timings by the plurality of drive units 52 .

The drive unit 52 is controlled by the control unit C. As shown in FIG. The load applied to each load shaft 51 by each drive unit 52 and the drive timing for applying the load are collectively controlled by the control unit C based on a preset program or the like. Also, part or all of the operation of the drive unit 52 may be performed by an operator's operation. In this manner, the substrates S1 and S2 are attached according to the loads and drive timings set on the plurality of load axes 51. Therefore, when the load is applied by one load axis, the same load is applied by the plurality of load axes. The substrate S1 and the substrate S2 can be properly attached in a short time as compared with the case of applying at the same driving timing.

The alignment mechanism 60 positions the substrates S<b>1 and S<b>2 with respect to the first plate 20 and the second plate 30 . The alignment mechanism 60 includes a plurality of alignment driving units 61 and a plurality of alignment blocks 62A or a plurality of alignment blocks 62B. The alignment blocks 62A and 62B are used by replacing them with brackets or the like provided in the alignment mechanism 60 . The alignment block 62A is a single alignment block used to align the substrates S1 and S2 independently. Alignment block 62B is a simultaneous alignment block used to simultaneously align substrates S1 and S2. The alignment block 62A is shorter in the height direction (Z direction) than the alignment block 62B. A plurality of alignment driving units 61 are provided in a block 80 provided inside the chamber 10 . The alignment driving section 61 moves the alignment blocks 62A (62B) in the X direction or the Y direction. The alignment drive unit 61 has, for example, a drive source such as a cylinder device or an electric motor, and a transmission mechanism that transmits the drive force generated by the drive source to the alignment block 62A (62B).

The alignment block 62A (62B) is movable in the X direction or the Y direction by a guide (not shown). As shown in FIG. 2, the two alignment blocks 62A (62B) on the -Y side move forward and backward in the +Y direction, and the two alignment blocks 62A (62B) on the +Y side move in the -Y direction. Advance and retreat. The two alignment blocks 62A (62B) on the -X side advance and retreat in the +X direction, and the two alignment blocks 62A (62B) on the +X side advance and retreat in the -X direction. The alignment block 62A (62B) is made of a material having a hardness lower than that of the substrates S1 and S2, for example, in order to prevent damage to the substrates S1 and S2. Also, the alignment block 62A (62B) is preferably made of a conductive material to prevent the substrates S1 and S2 from being charged.

The alignment mechanism 60 advances the alignment block 62A (62B) by driving the alignment drive unit 61, and pushes the sides of the substrates S1 and S2 to move the substrates S1 and S2 to the first plate 20 and the second plate 30. position against. A controller C controls the operation of the alignment mechanism 60 . When the alignment block 62A is used, the controller C, for example, reads the shapes of the substrates S1 and S2 acquired by another unit (not shown), determines the respective alignment positions for the substrates S1 and S2, and then performs the alignment. Operate block 62A. Further, when the alignment block 62B is used, the controller C operates the alignment block 62B so as to align the substrate S1 at the same time when aligning the substrate S2. Although both the alignment block 62A and the alignment block 62B are shown in FIG. 1, either one of them is attached when the substrate bonding apparatus 100 is in operation.

4A and 4B show an example of the alignment operation by the alignment mechanism 60. FIG. 4A shows the state before positioning the substrate S1 or S2, and FIG. 4B shows the state after positioning the substrates S1 and S2. be. As shown in FIG. 4A, after the substrate S1 (substrate S2) is placed on the lift pins 41 (see FIG. 1) in the chamber 10, the alignment drive unit 61 is driven to move the alignment block 62A (62B). advance. As a result, as shown in FIG. 4B, the substrates S1 and S2 are positioned by being pushed by the plurality of alignment blocks 62A (62B) (by being sandwiched between the alignment blocks 62A (62B)). It is arranged substantially in the center of the first plate 20 and the second plate 30 in plan view. After the positioning of the substrates S1 and S2 is completed, the alignment block 62A (62B) is retracted to its original position and separated from the substrates S1 and S2.

Note that the alignment mechanism 60 is not limited to the form described above. For example, two alignment blocks 62A (62B) on the -Y side and two alignment blocks 62A (62B) on the -X side are fixed, and two alignment blocks 62A (62B) on the +Y side and +X side alignment blocks 62A (62B) are fixed. A form in which the two alignment blocks 62A (62B) can move back and forth may be used. In this form, the alignment drive unit 61 and the like for moving the -Y side alignment block 62A (62B) and the -X side alignment block 62A (62B) forward and backward are not required.

Spacer mechanism 70 receives and supports substrate S1 from lift pins 41 . The spacer mechanism 70 includes a plurality of spacer drive portions 71 and a plurality of spacers 72 . A plurality of spacer driving units 71 are provided in a block 80 provided inside the chamber 10 . The spacer driving section 71 moves the spacer 72 in the X direction or the Y direction. The spacer drive unit 71 has, for example, a drive source such as a cylinder device or an electric motor, and a transmission mechanism that transmits the drive force generated by the drive source to the spacer 72 .

The spacer 72 is movable in the X direction or the Y direction by a guide (not shown). As shown in FIG. 2, the two spacers 72 on the -Y side advance and retreat in the +Y direction, and the two spacers 72 on the +Y side advance and retreat in the -Y direction. The two spacers 72 on the -X side advance and retreat in the +X direction, and the two spacers 72 on the +X side advance and retreat in the -X direction. The spacers 72 are preferably made of a conductive material to prevent the substrates S1 and S2 from being charged. The spacer mechanism 70 advances the spacers 72 by driving the spacer drive unit 71 and positions the spacers 72 below the sides of the substrate S1 to support the substrate S1 placed on the lift pins 41 . A controller C controls the operation of the spacer mechanism 70 .

5A and 5B show an example of the operation of the spacer 72. FIG. 5A shows a state in which the spacer 72 stands by, and FIG. 5B shows a state in which the spacer 72 supports the substrate. As shown in FIG. 5A, in a state where the substrate S1 is placed on the lift pins 41, the spacer drive section 71 is driven to advance the spacers 72. As shown in FIG. As a result, as shown in FIG. 5B, the spacers 72 are arranged below the substrate S1, and the substrate S1 is supported by the spacers 72 by lowering the lift pins 41 in this state. When the substrates S1 and S2 are attached together, the spacers 72 are retracted to their original positions and separated from the substrates S1 and S2.

Note that the spacer mechanism 70 is not limited to the form described above. The number and arrangement of the spacers 72 can be arbitrarily set as long as the substrate S1 can be supported. For example, one spacer 72 may be arranged on each of the +Y side, -Y side, +X side, and -X side. In this form, the number of spacers 72 and spacer drive portions 71 can be reduced.

As shown in FIGS. 1 and 2, the block 80 supports the alignment driving section 61 and the spacer driving section 71 and cools the heat generated when they are driven. The block 80 is provided along the side surface inside the chamber 10 and has a flow path for circulating cooling water or the like. Cooling water flows into the block 80 from the supply port 81 and is discharged from the discharge port 82 after passing through the block 80 . Note that the block 80 is not limited to a form in which cooling water is circulated. For example, it may be used as a member that supports the alignment drive section 61 and the spacer drive section 71 without circulating cooling water.

<Board attachment method>
Next, a method for attaching substrates according to the present embodiment will be described. 6 and 7 are flow charts showing an example of the substrate bonding method according to this embodiment. This substrate bonding method is executed by an instruction from the controller C, for example. 8 to 14 and 16 are process diagrams showing an example of the operation of the substrate bonding apparatus 100. FIG. In these process diagrams, the description is simplified so that the movement of each part can be easily understood. Hereinafter, description will be made along the flow charts of FIGS. 6 and 7. FIG.

First, the gate valve 12 of the chamber 10 is opened (step S01). As shown in FIG. 8A, the control unit C drives the drive unit (not shown) to lower the gate valve 12 and open the opening 11 . Subsequently, the substrate S1 (upper substrate) is loaded into the chamber 10 (step S02). At this time, as shown in FIG. 8B, the controller C raises the lift pins 41 to the transfer height of the substrate S1. The arm 91 of the transfer device 90 enters the chamber 10 through the opening 11 while holding the substrate S1 on the lower surface side, and places the substrate S1 above the lift pins 41 . The arm 91 sucks and holds the substrate S1 by means of a suction pad or the like (not shown) provided on the lower surface. After that, the controller C lowers the arm 91 and transfers the substrate S1 from the arm 91 to the lift pins 41 . Arm 91 then exits chamber 10 . The adhesive layer F of the substrate S1 faces downward when it is carried into the chamber 10. As shown in FIG.

Subsequently, an alignment operation is performed on the substrate S1 (step S03). Below, the case where the alignment block 62A for single use is used is mentioned as an example, and it demonstrates. This alignment operation may be referred to as a single alignment operation. As shown in FIG. 9A, after the arm 91 is withdrawn, the lift pins 41 are raised to place the substrate S1 at a height for alignment operation. After that, the control unit C drives the alignment driving unit 61 to advance the alignment blocks 62A, and positions the substrate S1 by sandwiching the substrate between the plurality of alignment blocks 62A. After the alignment operation, as shown in FIG. 9B, the controller C retracts the alignment block 62A and lifts the lift pins 41 to place the substrate S1 above the spacers 72. As shown in FIG.

Subsequently, the substrate S1 is supported by the spacers 72 (step S04). As shown in FIG. 10A, the control unit C drives the spacer driving unit 71 to advance the spacers 72 and arrange the spacers 72 on the lower surface side of the substrate S1. After that, the substrate S1 is supported by the spacers 72 by lowering the lift pins 41 . Subsequently, the substrate S2 (lower substrate) is loaded into the chamber 10 (step S05). As shown in FIG. 10B, the controller C lowers the lift pins 41 to the transfer height of the substrate S2. Thereafter, as shown in FIG. 10B, the substrate S2 is carried into the chamber 10 by the arm 91 and placed above the lift pins 41. Then, as shown in FIG. The arm 91 sucks and holds the substrate S2 on the lower surface side. After that, the controller C lowers the arm 91 and transfers the substrate S2 from the arm 91 to the lift pins 41 . Arm 91 then exits chamber 10 . The adhesive layer F of the substrate S2 faces upward when it is carried into the chamber 10. As shown in FIG.

Subsequently, the gate valve 12 is closed, and a warp suppression baking process is performed to suppress warping of the substrate S2 (step S06). As shown in FIG. 11A, after the gate valve 12 is closed, while the inside of the chamber 10 is evacuated by a suction device (not shown), the substrate S2 is heated by the heaters 22 and 32, for example, to perform a warpage suppressing baking process. . By baking the substrate S2, the shape of the substrate S2 can be stabilized and the warp of the substrate S2 can be suppressed. This warpage suppression baking process is performed while maintaining the temperature in the chamber 10 at, for example, 150.degree. C. to 250.degree. It should be noted that the warpage suppression baking process can be performed with the gate valve 12 opened (that is, open to the atmosphere).

Subsequently, the inside of the chamber 10 is made into a vacuum atmosphere (step S07). The inside of the chamber 10 is made into a vacuum atmosphere by evacuating the inside of the chamber 10 with a suction device (not shown). Thereafter, as shown in FIG. 11B, the lift pins 41 are lowered to mount the substrate S2 on the first plate 20. Then, as shown in FIG. After that, the substrate S2 may be heated by the heater 22 to perform a warpage suppression baking process in a vacuum atmosphere. This warpage suppression baking process is performed by setting the temperature of the heater 22 to 150° C. to 250° C., for example.

Subsequently, an alignment operation is performed on the substrate S2 (step S08). As shown in FIG. 12A, the controller C raises the lift pins 41 and places the substrate S2 at a height for alignment operation. The control unit C drives the alignment driving unit 61 to advance the alignment block 62A and position the substrate S2 by sandwiching the substrate S2 between the alignment blocks 62A. The alignment operation in step S08 is the same as the alignment operation in step S03. Therefore, the substrates S1 and S2 are positioned at substantially the same position in plan view. Thereafter, as shown in FIG. 12B, the controller C retracts the alignment block 62A to its original position. In the above description, the substrates S1 and S2 are individually aligned, but the present invention is not limited to this form. For example, when the alignment block 62B is used, the substrate S1 may be aligned simultaneously with the substrate S2 in step S08 without performing the single alignment operation in step S03. The operation of aligning the substrates S1 and S2 at the same time may be referred to as a simultaneous alignment operation. When the simultaneous alignment operation is performed, as indicated by the dotted line in FIG. 12A, the controller C drives the alignment drive unit 61 to move the alignment block 62B forward, thereby simultaneously moving the substrates S1 and S2 into the alignment block 62B. Both of the substrates S1 and S2 are positioned by sandwiching them.

Subsequently, the substrate S2 is raised, and the substrate S1 is pressed downward by the spring pins 34 (step S09). As shown in FIG. 13A, the controller C raises the lift pins 41 to bring the substrate S2 into contact with the lower surface of the spacer 72. As shown in FIG. In this state, the spacer 72 is sandwiched between the substrates S1 and S2. Further, the control unit C drives the driving unit 52 to lower the second plate 30 together with the load shaft 51, and presses the substrate S1 downward with the spring pins . By pressing the substrate S1, the spring pin 34 is in a state of being retracted into the pressing surface 33a against the elastic force of a spring (not shown). Note that the substrate S1 and the substrate S2 may be in contact with each other at a portion where the spacers 72 are not provided.

Subsequently, the spacer 72 is retracted to its original position (step S10). As shown in FIG. 13B, the controller C retracts the spacer 72 sandwiched between the substrates S1 and S2 to its original position. Due to the retraction of the spacer 72, the substrate S1 is pushed downward by the spring pin 34 and comes into contact with the substrate S2. That is, the adhesive layer F of the substrate S1 and the adhesive layer F of the substrate S2 are in contact with each other.

Subsequently, the controller C lowers the lift pins 41 supporting the substrates S1 and S2, and performs preheating processing on the substrates S1 and S2 (step S11). As shown in FIG. 14A, after lowering the lift pins 41, the control section C drives the drive section 52 to lower the second plate 30 together with the load shaft 51. As shown in FIG. After that, in a state where the substrates S1 and S2 are mounted on the mounting surface 23a of the first plate 20 and the upper surface of the substrate S1 is pressed by the spring pins 34 of the second plate 30, the controller C controls the heater 22 and the heater. 32 heats the substrates S1 and S2 for a predetermined time to perform a preheating process. The preheating process is performed for the next step of attaching the substrates S1 and S2. The preheating process is performed by setting the temperatures of the heaters 22 and 32 to 150° C. to 250° C., for example.

Subsequently, the substrate S1 and the substrate S2 are attached (step S12). As shown in FIG. 14B, the control unit C drives the driving unit 52 to lower the second plate 30 together with the load shaft 51 in a vacuum atmosphere, thereby causing the first plate 20 and the second plate 30 to move downward. The substrate S1 and the substrate S2 are attached between them. At this time, the heating by the heater 22 and the heater 32 may be continued to keep the first plate 20 and the second plate 30 at a predetermined temperature. The adhesive layers F of the substrates S1 and S2 are melt-bonded by heat, and furthermore, the substrates S1 and S2 are firmly bonded together by pressing from the substrate S1 side by the second plate 30 .

In the affixing process of step S12, the load applied to the second plate 30 is individually set by the first driving section 52A to the fifth driving section 52E via the first load shaft 51A to the fifth load shaft 51E. be done. Further, the driving timings for applying the load are also individually set by the first driving section 52A to the fifth driving section 52E. The values of the loads applied by the first load shafts 51A to the fifth load shafts 51E, the driving timings for applying the loads, and the times are appropriately set according to the types and sizes of the substrates S1 and S2.

FIG. 15 is a graph showing the applied loads and their driving timings for the first load axis 51A, which is the central load axis, and the second to fifth load axes 51B to 51E, which are the plurality of peripheral load axes. In the graph of FIG. 15, the vertical axis indicates load (unit: Kgf) and the horizontal axis indicates time (unit: seconds). In the graph of FIG. 15, the first load axis 51A, which is the central load axis, is represented by black circles, and the second to fifth load axes 51B to 51E, which are peripheral load axes, are represented by black squares.

As shown in FIG. 15, the first load shaft 51A starts applying a load at time T1, and the load is P1. The second load shaft 51B to the fifth load shaft 51E start applying load at time T2, and the load is P1. Next, the first load shaft 51A maintains the load P1 until time T3, and then increases the load to a load P2. The second load shaft 51B to the fifth load shaft 51E maintain the load P1 until time T4, and then increase the load to the load P2. Next, the first load shaft 51A maintains the load P2 until time T5, and then increases the load to a load P3. The second load shaft 51B to the fifth load shaft 51E maintain the load P2 until time T6, and then increase the load to the load P3. Next, the first load shaft 51A maintains the load P3 until time T7, and then increases the load to a load P4. The second load shaft 51B to the fifth load shaft 51E maintain the load P3 until time T8, and then increase the load to the load P4. Next, the first load shaft 51A maintains the load P4 until time T9, and then increases the load to a load P5. The second load shaft 51B to the fifth load shaft 51E maintain the load P4 until time T10 and then increase the load to the load P5. In this way, the first load shaft 51A to the fifth load shaft 51E increase the load in five stages up to the target load P5, and the first load shaft 51A is divided into the second load shaft 51B to the fifth load shaft 51E. In contrast, the load is increased in advance. In addition, in the operation of applying the load, the load P1 to the target load P5 are set in five stages, but the number of stages can be changed under the control of the control section C. Further, as described above, the first load shaft 51A increases the load prior to the second load shaft 51B to the fifth load shaft 51E. can be changed by the control of

After the first load shaft 51A to the fifth load shaft 51E reach the target load P5, the second load shaft 51B to the fifth load shaft 51E maintain the load P5 until time T11 and then decrease the load until time T12. to set the load to 0. The first load shaft 51A maintains the load P5 until time T13, then decreases the load, and reaches 0 at time T14. When the load on the first load shaft 51A to the fifth load shaft 51E is released (set to 0), the second load shaft 51B to the fifth load shaft 51E are released first, and finally the first load shaft 51A is released. have released. When the load is released, the stepwise release is not performed, but when the above-described first driving section 52A to the fifth driving section 52E adopt a configuration that enables the stepwise release of the load. , the load may be released in stages under the control of the control section C.

As shown in the graph of FIG. 15, the time during which the first load axis 51A applies the target load P5 is longer than the time during which the second load axis 51B to the fifth load axis 51E apply the target load P5. too long. The first load shaft 51A reaches the target load P5 earlier than the second load shaft 51B to the fifth load shaft 51E, and the first load shaft 51A reaches the target load P5 earlier than the second load shaft 51B to the fifth load shaft 51E. Slower than the fifth load shaft 51E. Further, the second load axis 51B has a load reduction rate from the target load P5 that is larger than those of the second load axis 51B to the fifth load axis 51E.

By the operation shown in the graph of FIG. 15, the substrate S1 and the substrate S2 can be appropriately attached in a short time. In the example shown in the graph of FIG. 15, the operation of applying the loads on the first load axis 51A to the fifth load axis 51E is performed in five stages from the load P1 to the target load P5, but this form is limited. not. For example, the number of steps is variable, such as the operation of the first load shaft 51A to the fifth load shaft 51E to the target load P5 in two steps, three steps, or six steps or more. When the target load P5 is reached in two stages, for example, the load P1 may be applied first, and then the target load P5 may be applied. Further, although the second load shaft 51B to the fifth load shaft 51E are driven at the same drive timing, the present invention is not limited to this embodiment. For example, the second load shaft 51B to the fifth load shaft 51E are driven at different drive timings. may be driven. Further, the operation of applying the loads from the first load shaft 51A to the fifth load shaft 51E may be performed steplessly up to the load P5. In this case, the amount of load increase per time on the first load axis 51A to the fifth load axis 51E may be the same or may be different.

After the affixing process of step S12, the second plate 30 is lifted, and then the lift pins 41 are lifted (step S13). After heat treatment is performed for a predetermined time by the heaters 22 and 32, the controller C drives the driver 52 to raise the second plate 30 together with the load shaft 51, as shown in FIG. 16(A). Note that the controller C does not stop the temperature control of the heaters 22 and 32, for example. That is, the heaters 22 and 32 are kept constant at the set temperature. After that, the controller C raises the lift pins 41 to arrange the substrate S, which has been attached, at a height for unloading. The substrate S is separated from both the first plate 20 and the second plate 30 by this step S13. After that, the chamber 10 is purged by opening a valve or the like (not shown) to open the chamber 10 to the atmosphere, or by supplying a predetermined gas into the chamber 10 (step S14). Nitrogen gas, dry air, or the like, for example, is used as the predetermined gas.

Subsequently, the gate valve 12 is opened to unload the substrate S from the chamber 10 (step S15). After the gate valve 12 is lowered to open the opening 11 , the arm 91 of the transfer device 90 is moved into the chamber 10 through the opening 11 and arranged below the substrate S supported by the lift pins 41 . After that, as shown in FIG. 16B, the control unit C raises the arm 91 to suck and hold the substrate S on the upper surface of the arm 91 , thereby transferring the substrate S from the lift pins 41 to the arm 91 . It should be noted that the arm 91 may have a configuration in which the substrate S is placed on the upper surface of the arm 91 and held instead of holding the substrate S by suction. After that, the substrate S is carried out of the chamber 10 by the arm 91 withdrawing from the chamber 10 . After that, the controller C closes the gate valve 12 to end the series of processes.

<Modification>
In the above-described embodiment, the second plate 30 is joined to the lower ends of the plurality of load shafts 51 as an example, but it is not limited to this form. FIG. 17 is a diagram showing an example of a second plate 30A according to a modification. It should be noted that members similar to those of the above-described embodiment are denoted by the same reference numerals, and descriptions thereof are omitted or simplified. As shown in FIG. 17, a support 35 is provided on the top side of the load plate 31 . The support 35 is attached to the upper surface 31a of the load plate 31 by attachment portions 35a. The support 35 is provided so as to cover the upper surface side of the load plate 31 . The support 35 has five holes 35b into which the first to fifth load shafts 51A to 51E are inserted. Each hole 35b has a circular shape in plan view, and its inner diameter is slightly larger than the outer diameter of the first load shaft 51A and the like.

A flange portion 510 is provided at the lower end of each of the first load shaft 51A to the fifth load shaft 51E. The outer diameter of the flange portion 510 is larger than the inner diameter of the hole portion 35b. Therefore, the support 35 is locked by the flange portion 510 and suspended. That is, the second plate 30A is held in a state of being suspended by the first to fifth load shafts 51A to 51E. At this time, a gap V is formed between the upper surface 31 a of the load plate 31 and the lower surface 510 a of the flange portion 510 .

FIG. 18 is a diagram showing a state in which the second plate 30A shown in FIG. 17 presses the substrate S1. When the substrates S1 and S2 are attached, the first load shaft 51A to the fifth load shaft 51E are lowered. First, the lower ends of the spring pins 34 come into contact with the substrate S1. Furthermore, when the first load shaft 51A to the fifth load shaft 51E are lowered, the second plate 30A does not descend, and the first load shaft 51A to the fifth load shaft 51E descend relative to the second plate 30A. do. That is, the gap V gradually becomes smaller. When the lower surface 510a of the flange portion 510 contacts the upper surface 31a of the load plate 31, the second plate 30A descends together with the first load shaft 51A to the fifth load shaft 51E, causing the spring pin 34 to enter. By lowering the first load shaft 51A to the fifth load shaft 51E after the spring pin 34 is retracted, the substrate S1 is pressed by the second plate 30A.

Further, when the second plate 30A is lifted after pressing the substrate S1, the state shown in FIG. 17 is restored by the operation opposite to that described above. In this manner, by separating the first load shaft 51A to the fifth load shaft 51E from the load plate 31 when the second plate 30A is not pressing the substrate S1, the heat of the heater 32 is dissipated when the substrate S1 is not pressed. It is possible to suppress transmission to the first load shaft 51A to the fifth load shaft 51E. In the above description, the attachment portion 35a of the support 35 is attached to the upper surface 31a of the load plate 31, but the configuration is not limited to this. For example, the attachment portion 35 a may extend below the press plate 33 and engage the lower surface side of the press plate 33 .

Although the embodiments and modifications have been described above, the present invention is not limited to the above description, and various modifications can be made without departing from the gist of the present invention. In the above-described embodiment, a mode in which two substrates S1 and S2 are attached is described as an example, but the present invention is not limited to this mode. For example, another substrate may be attached to the substrate S to which the substrates S1 and S2 are attached.

Further, in the present embodiment described above, the first plate 20 is fixed in the chamber 10 and the second plate 30 is lowered from the pressing mechanism 50, but the configuration is not limited to this. For example, the second plate 30 may be fixed in the chamber 10 and the first plate 20 may be raised by the pressing mechanism 50, or the second plate 30 may be lowered by the pressing mechanism 50 and the first plate 20 may be It may be raised by another pressing mechanism 50 .

C: control units S, S1, S2: substrate 10: chamber 11: opening 12: gate valve 20: first plate 22: heater (heating unit)
30, 30A... second plate 32... heater (heating unit)
40 Lift portion 41 Lift pin 50 Pressing mechanism 51 Load shaft 51A First load shaft (central load shaft)
51B: Second load axis (peripheral load axis)
51C: Third load axis (peripheral load axis)
51D: Fourth load axis (peripheral load axis)
51E Fifth load axis (peripheral load axis)
52... drive unit 51A... first load shaft (central load shaft)
51B: Second load axis (peripheral load axis)
51C: Third load axis (peripheral load axis)
51D: Fourth load axis (peripheral load axis)
51E Fifth load axis (peripheral load axis)
60... Alignment mechanism 70... Spacer mechanism 100... Substrate bonding device

Claims (13)

a first plate and a second plate sandwiching a plurality of substrates in an overlapping state;
a pressing mechanism for pressing one of the first plate and the second plate against the other;
The pressing mechanism is
a central load shaft arranged corresponding to central portions of the plurality of substrates;
a plurality of peripheral load axes arranged corresponding to peripheral portions of the plurality of substrates excluding the central portion;
and a plurality of driving units for individually driving the central load shaft and the plurality of peripheral load shafts. 2. The substrate bonding apparatus according to claim 1, wherein each of said plurality of peripheral load axes has the same distance from said central load axis. each of the plurality of substrates has a rectangular shape in plan view,
3. The substrate bonding apparatus according to claim 2, wherein said plurality of peripheral load axes are arranged corresponding to four corners of said substrate. The first plate is provided in a fixed state and can support the plurality of substrates on top of it,
The second plate can be raised and lowered above the first plate,
The substrate bonding apparatus according to any one of claims 1 to 3, wherein the pressing mechanism lowers the second plate and presses it toward the first plate. 5. The substrate bonding apparatus according to claim 4, wherein said first plate is fixed by being supported by upper ends of a plurality of legs. The central load shaft and the plurality of peripheral load shafts are spaced apart from the second plate and abut against the second plate when the plurality of substrates are sandwiched between the first plate and the second plate. 6. The substrate bonding apparatus according to claim 5. 7. The substrate according to any one of claims 4 to 6, further comprising a lift pin that penetrates the first plate and raises and lowers the plurality of substrates or one substrate with respect to the second plate. pasting device. 8. The substrate bonding apparatus according to claim 1, wherein one or both of said first plate and said second plate comprise a heating unit for heating said plurality of substrates. 9. The substrate bonding apparatus according to any one of claims 1 to 8, comprising a chamber that accommodates said first plate and said second plate. A control unit that controls the plurality of driving units,
10. The substrate sticking apparatus according to claim 1, wherein the controller individually controls one or both of drive timing and load for each of the central load axis and the plurality of peripheral load axes. attachment device. A method of attaching a plurality of substrates by sandwiching the plurality of substrates in a stacked state between a first plate and a second plate, comprising:
When one of the first plate and the second plate is pressed against the other, pressing the portion corresponding to the central portion of the plurality of substrates and the periphery of the plurality of substrates excluding the central portion A method of attaching a substrate, comprising individually setting each pressure applied to a plurality of portions corresponding to a portion. 12. The pressing to the portion corresponding to the central portion and the pressing to the plurality of portions corresponding to the peripheral portion are performed so as to increase the load stepwise until each target load is reached. board pasting method. 13. The method of attaching substrates according to claim 11, wherein the pressing to the portion corresponding to the central portion and the pressing to the plurality of portions corresponding to the peripheral portion are driven at different timings.

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