CN106019646A - Substrate assembling apparatus and substrate assembling method using the same - Google Patents

Substrate assembling apparatus and substrate assembling method using the same Download PDF

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Publication number
CN106019646A
CN106019646A CN201610090266.9A CN201610090266A CN106019646A CN 106019646 A CN106019646 A CN 106019646A CN 201610090266 A CN201610090266 A CN 201610090266A CN 106019646 A CN106019646 A CN 106019646A
Authority
CN
China
Prior art keywords
upper substrate
displacement
adhesive dowel
infrabasal plate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610090266.9A
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Chinese (zh)
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CN106019646B (en
Inventor
市村久
真锅仁志
齐藤正行
海津拓哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ai Meike Technology Co Ltd
Original Assignee
Hitachi Ltd
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Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to CN201910268239.XA priority Critical patent/CN109839766B/en
Publication of CN106019646A publication Critical patent/CN106019646A/en
Application granted granted Critical
Publication of CN106019646B publication Critical patent/CN106019646B/en
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Abstract

The inventino relates to a substrate assembling apparatus and a substrate asesmbling method using the same. The apparatus can eliminate lamination error due to size error of an upper and a lower substrates and achieve high-precision lamination of hte upper and a lower substrates. The apparatus includes a lower bench (4) for maintaining the lower substrate (k2); an upper bench (3) having a plurality of cut driving parts (31); a plurality of bonding pins (7) which can be moved upwardly along with a bonding pin plate (8a) to maintain the upper substrate (K1); a vertical movement mechanism (80) vertically moves the bonding pin plate (8a); an actuator (32) which moves the cut driving parts (31), so that the upper substrate maintained on the bodning pins is laminated onto the lower substrate which is maintained on the lower bench on the basis of the replacements of the bonding pin plate and hte cut driving parts at hte equal displacement, thus pressing the upper and hte lower sbustrates with the cut driving part with displacement.

Description

Base panel assembly apparatus and the substrate assembly method of this device of use
Technical field
The present invention relates to base panel assembly apparatus and use the substrate assembling side of this base panel assembly apparatus Method.
Background technology
In patent documentation 1, describe " in the present invention, with the docking of control portion from driving Portion and handling drive division carry out action control, make under reduced pressure atmosphere the first holding member or One party in person's adhesive dowel or two sides relative to the second holding member relatively close to movement, Thus the first workpiece and second workpiece are fitted.After this laminating, at the first holding member Under the state of rigidity bearing surface and the first absorption surface, make adhesive dowel to from the first work-piece isolation Direction move, thus with adhesive dowel stripping and in the first workpiece with the bonding guarantor of adhesive dowel The peripheral part at the position held contacts with rigidity bearing surface and with the side along rigidity bearing surface Formula is kept shape.Therefore, utilize the first holding member to first workpiece pressurization time and from When adhesive dowel peeled off by first workpiece, it is possible to the deformation of the first workpiece is suppressed as Min. " (with reference to the 0007th section).
Patent documentation 1: No. 5654155 publications of Japanese Patent No.
Summary of the invention
Patent documentation 1 record workpiece laminating apparatus (base panel assembly apparatus) be configured to suppress from First holding member (upper mounting plate) pull down by the first workpiece (upper substrate) and second workpiece (under Substrate) fit abutted equipment time the deformation of the first workpiece.
But, in order to make the first workpiece and second workpiece fit accurately, need to fit The first workpiece before and the para-position of second workpiece.
In patent documentation 1, describe " preferably at the first workpiece W1 and second workpiece Before W2 just to fit, make in the first holding member 1 or the second holding member 2 is a certain Side is adjusted mobile on XY θ direction relative to the opposing party, thus carries out the first workpiece W1 Para-position (alignment) with second workpiece W2 " (with reference to the 0020th section), but do not record tool The method of the para-position of body.
It addition, in the adjustment in XY θ direction is moved, it is possible to regulate the first workpiece and the second work The position skew of part, but due to the scale error that produces when production etc., the laminating that produces is by mistake Difference (spacing skew) cannot eliminate.
The problem of the present invention is to provide a kind of chi that can eliminate due to upper substrate and infrabasal plate Very little error and the laminating error that produces and the base making upper substrate and infrabasal plate fit accurately Panel assembly apparatus and the substrate assembly method of this device of use.
In order to solve described problem, the present invention provides a kind of base panel assembly apparatus and uses this device Substrate assembly method, this base panel assembly apparatus has: lower platform, has and keeps infrabasal plate Lower basal plate face；Upper mounting plate, has and is formed with the segmentation plane opposed with described lower basal plate face Multiple division driving portions in portion；Multiple adhesive dowels, configure accordingly with described segmentation plane portion, Can keep at the enterprising line displacement in direction vertical relative to corresponding described segmentation plane portion Upper substrate；Vacuum chamber, it is possible to receive under vacuum conditions described lower platform, described upper mounting plate with And described adhesive dowel；1st drive mechanism, makes described adhesive dowel and described upper mounting plate towards described Lower platform is advanced；Multiple matrix parts, install the described adhesive dowel of more than 1；2nd drives machine Structure, makes multiple described matrix parts the most described segmentation plane portion carry out vertically-acting；The 3 drive mechanisms, make multiple described division driving portion carry out towards described lower basal plate face independently Displacement；1st attracts unit, is connected with the vacuum absorption holes dug in described adhesive dowel；And 2nd attracts unit, is connected with the suction hole being formed at described lower basal plate face, described adhesive dowel With the displacement that sets for each described matrix part together with this matrix part displacement and keep institute State upper substrate, and then, described division driving portion is respectively with corresponding with the displacement of described matrix part Displacement carry out displacement, described matrix part be provided with the described segmentation with this division driving portion put down The described adhesive dowel that face configures accordingly, under the vacuum environment in described vacuum chamber, by institute State lower platform and keep described infrabasal plate, and described 1st drive mechanism is driven and makes described Adhesive dowel keep described upper substrate fit to described infrabasal plate, described infrabasal plate and described on Under the time point that substrate has been fitted, described 2nd drive mechanism is driven and described adhesive dowel Introduced from described segmentation plane portion, and described 1st drive mechanism is driven, by entering Having gone described division driving portion under the state of displacement presses described upper substrate and described lower base Plate.
In accordance with the invention it is possible to provide a kind of size that can eliminate due to upper substrate and infrabasal plate Error and the laminating error that produces and the substrate making upper substrate and infrabasal plate fit accurately Assembling device and the substrate assembly method of this device of use.Thereby, it is possible to effectively correct due to Upper substrate and the scale error of infrabasal plate and the marker spacing skew that produces is fitted.
Accompanying drawing explanation
Fig. 1 is the figure illustrating base panel assembly apparatus.
Fig. 2 is the figure illustrating anchor.
Fig. 3 is the figure of the structure illustrating upper mounting plate.
Fig. 4 is the figure in the upper substrate face illustrating upper mounting plate.
Fig. 5 is the figure illustrating adhesive dowel.
Fig. 6 is the figure in the upper substrate face illustrating upper mounting plate, is the one of the configuration illustrating adhesive dowel The figure of individual example.
Fig. 7 (a) is the figure illustrating lower platform, and (b) is the profile under Sec1-Sec1.
Fig. 8 is the figure being shown through the operation that base panel assembly apparatus makes baseplate-laminating.
Fig. 9 is the figure of the mark illustrating the bonding position for adjusting upper substrate and infrabasal plate, A () is the figure illustrating the upper mark being additional to upper substrate, (b) is to illustrate to be additional to infrabasal plate The figure of lower mark.
Figure 10 is the shape of the skew of the lower mark of upper mark and the infrabasal plate illustrating and adjusting upper substrate The figure of state, (a) is the figure illustrating the axial skew of XY, and (b) is to illustrate have adjusted The figure of the state of the axial skew of XY.
Figure 11 is the shape of the skew of the lower mark of upper mark and the infrabasal plate illustrating and adjusting upper substrate The figure of state, (a) is the figure illustrating skew about the z axis, and (b) is to illustrate to have adjusted around Z The figure of the state of the skew of axle.
Figure 12 is to illustrate that on the 1st, the skew of mark and the 1st time mark is in prescribed limit The figure of state, (a) is to illustrate that on the 1st, mark is in the state at the center of the 1st time mark Figure, (b) is the figure illustrating the state indicating the off-centring from the 1st mark on the 1st.
Figure 13 is to illustrate that the displacement changing adhesive dowel flat board is to reduce upper substrate and infrabasal plate The figure of the state of skew, (a) is to illustrate mark and the shape that the 1st time mark offset by the 1st The figure of state, (b) is to illustrate the state that on the 1st, the skew of mark and the 1st time mark reduces The figure of (correcting the state of the marker spacing skew of upper substrate and infrabasal plate).
Figure 14 (a) is to illustrate that division driving portion has carried out position with being consistent with the shape of upper substrate The figure of the state moved, Figure 14 (b) is to illustrate upper mounting plate pressing upper substrate and the state of infrabasal plate Figure.
Figure 15 is the figure illustrating design alteration example, and (a) is to be shown mounted to 1 adhesive dowel put down The figure of the state that the displacement of the adhesive dowel of plate is different, (b) is to illustrate 1 division driving portion Figure corresponding to the structure of 1 adhesive dowel.
Figure 16 is the figure illustrating other design alteration examples, and (a) is to illustrate 4 division driving portions Corresponding to the figure of the state of 1 adhesive dowel flat board, (b) is to illustrate 1 division driving portion pair Should be in the figure of the state of 3 adhesive dowel flat boards.
Figure 17 is the figure illustrating other design alteration example, and (a) is to illustrate that all adhesive dowels are pacified Being loaded on the figure of the design alteration example of 1 adhesive dowel flat board, (b) is illustrate Construction integration upper The figure of the design alteration example that platform possesses.
Symbol description
1: base panel assembly apparatus；3: upper mounting plate；3a: upper substrate face；4: lower platform； 4a: lower basal plate face；5: vacuum chamber；5a: epicoele；5b: cavity of resorption；8: adhesive dowel；8a: Adhesive dowel flat board (matrix part)；8b: adhesive portion；8c: vacuum absorption holes；8d: gas supplies To unit；10: camera head；20:Z axle drive mechanism (the 1st drive mechanism)；31: Division driving portion；31a: segmentation plane portion；32: actuator (the 3rd drive mechanism)；41: Travel mechanism；43: suction hole；80: knee-action mechanism (the 2nd drive mechanism)；100: Control device；K1: upper substrate；K2: infrabasal plate；(upper mark) is indicated on Mk1: the 1； Mk2: the 1 time mark (lower mark)；P2: vacuum pump (the 1st attracts unit)；P3: Vacuum pump (the 2nd attracts unit).
Detailed description of the invention
Hereinafter, the most referring to the drawings, the substrate assembling dress of embodiments of the invention is described in detail Put and substrate assembly method.It addition, in each accompanying drawing shown below, to common parts Additional same symbol and suitably the repetitive description thereof will be omitted.
[embodiment]
Fig. 1 is the figure illustrating base panel assembly apparatus.
Base panel assembly apparatus 1 is the upper substrate being transported into by the conveyer devices such as robot arm 200 K1 (glass substrate) and infrabasal plate K2 (glass substrate) fits in a vacuum and assembles liquid crystal The device of the substrate of panel etc..Base panel assembly apparatus 1 is controlled by controlling device 100.
Base panel assembly apparatus 1 possesses stand 1a and upper frame 2.Stand 1a is placed in the face of setting (ground etc.).Upper frame 2 can be arranged above stand 1a knee-action.
Upper frame 2 is installed on stand 1a the 1st driving machine installed via ergometer 20d Structure (Z axis drive mechanism 20).
In base panel assembly apparatus 1, possess upper mounting plate 3 and lower platform 4.Lower platform 4 via Mobile parts (XY θ moves parts 40) are installed on stand 1a.XY θ moves parts 40 and constitutes For movable relative to stand 1a independence on mutually orthogonal 2 axles (X-axis, Y-axis) direction. It is configured to can rotate about the z axis relative to stand 1a it addition, XY θ moves parts 40.As XY θ moves parts 40, it is possible to utilize use fixing in the Z-axis direction and can be at XY axle The parts of the ball bearing etc. moved freely on direction.
It addition, in the base panel assembly apparatus 1 of the present embodiment, by relative for upper frame 2 stand The direction of 1a is set to Z-direction (above-below direction).It addition, by orthogonal for relative Z axis 1 The direction of axle is set to X-direction (laterally), by 1 axle orthogonal with Z axis and X-axis Direction is set to Y direction (longitudinally).
It addition, upper mounting plate 3 and lower platform 4 are for be set to Y direction and X-direction Vertical and horizontal rectangle.It addition, the plane of upper mounting plate 3 (upper substrate face 3a) and lower platform 4 Plane (lower basal plate face 4a) opposed.
Upper frame 2 is installed on stand 1a via Z axis drive mechanism 20.Z axis drive mechanism 20 Have and make to move up and down at the upper extended ball screw axle 20a of Z-direction (above-below direction) The ball screw mechanism 20b made.Ball screw axle 20a is rotated by electro-motor 20c, The knee-action by ball screw mechanism 20b.
Electro-motor 20c is controlled by controlling device 100, and upper frame 2 is according to controlling device 100 Computing and carry out displacement (knee-action).
Upper mounting plate 3 is fixed on upper frame 2, upper frame 2 and upper mounting plate 3 via multiple upper shaft 2a Knee-action integratedly.Around upper mounting plate 3, it is configured with epicoele 5a.Epicoele 5a is joined It is set to lower section (side of stand 1a) opening and covers top and the side of upper mounting plate 3.
Epicoele 5a is installed on upper frame 2 via hitch 6.Hitch 6 has from upper Support shaft 6a that framework 2 extends downward and the bottom of support shaft 6a are according to Flange-shaped Parts The fastener 6b extended and formed.
It addition, possess hook 6c at epicoele 5a.Hook 6c around support shaft 6a freely Knee-action.It addition, hook 6c engages with fastener 6b in the lower end of support shaft 6a.
The through epicoele of upper shaft 2a 5.It is vacuum sealed portion between upper shaft 2a and epicoele 5 (not scheme Show) seal.
If upper frame 2 is moved upward (up moving), then hook 6c and support shaft 6a Fastener 6b engages and epicoele 5a up moves together with upper frame 2.If it addition, upper ledge Frame 2 moves downwards (moving down), then hook 6c moves down due to deadweight, with it Concomitantly epicoele 5a moves down.
It addition, be configured with cavity of resorption 5b around lower platform 4.Cavity of resorption 5b is by stand The multiple lower axle 1b being mounted with on 1a supports.Lower axle 1b is prominent in cavity of resorption 5b.Cavity of resorption 5b And it is vacuum sealed portion (not shown) between lower axle 1b to seal.
Cavity of resorption 5b is configured to top (side of upper frame 2) opening and covers lower platform 4 Lower section and side.
XY θ moves parts 40 and is installed on lower axle 1b prominent in cavity of resorption 5b and supports lower flat Platform 4.
About epicoele 5a and cavity of resorption 5b, opening portion each other closes and forms vacuum chamber 5. That is, the epicoele 5a being configured to move down is engaged to cavity of resorption 5b from top, and cavity of resorption 5b opens Mouth is clogged by epicoele 5a.It addition, the connecting portion of epicoele 5a and cavity of resorption 5b is by sealing (not Diagram) seal, it is ensured that the air-tightness of vacuum chamber 5.
It addition, upper frame 2 can to compare epicoele 5a the most past with the state that cavity of resorption 5b connects Lower movement.Thus, from the state limited by cavity of resorption 5b that moves down of epicoele 5a, on Framework 2 moves down, and fastener 6b and the engaging of hook 6c in hitch 6 eliminate.On Chamber 5a becomes the state being placed in cavity of resorption 5b due to deadweight.It addition, in vacuum chamber 5 Side arranges upper mounting plate 3 and lower platform 4.
In base panel assembly apparatus 1, possesses vacuum pump P0.Vacuum pump P0 is with vacuum chamber 5 even Connect, in the air in vacuum chamber 5 being exhausted and making vacuum chamber 5, become vacuum.That is, as Really vacuum pump P0 is driven, then the inside of vacuum chamber 5 becomes vacuum environment.Vacuum pump P0 Controlled by controlling device 100.
Toward moving down together with the upper frame 2 that upper mounting plate 3 moves down with the inner side at vacuum chamber 5 Dynamic.By moving down of such upper mounting plate 3, it is held in the upper substrate K1 of upper mounting plate 3 Fitted with the infrabasal plate K2 kept by lower platform 4 and pressurizeed.If being true in vacuum chamber 5 Dummy status, then upper substrate K1 and infrabasal plate K2 is fitted by vacuum.
It addition, as it has been described above, upper mounting plate 3 is fixed on upper frame 2 via multiple upper shaft 2a. Therefore, ergometer 20d detection by upper mounting plate 3, upper substrate K1 and infrabasal plate K2 is added Load during pressure.The detection signal of ergometer 20d is imported into control device 100.
Fig. 2 is the figure illustrating anchor.
As in figure 2 it is shown, possess multiple anchor 7 at upper frame 2.Anchor 7 is upper Lower section upwardly extends the tubular part of setting, is equipped to move the most up and down with upper mounting plate 3 Make.All anchors 7 are installed on 1 support matrices 7a, and all anchors 7 move simultaneously up and down Make.Support matrices 7a is configured between epicoele 5a and upper mounting plate 3.Support matrices 7a passes through Not shown knee-action mechanism (ball screw mechanism etc.) and knee-action.This knee-action Mechanism is controlled by controlling device 100.
Anchor 7 is compared the upper substrate face 3a of upper mounting plate 3 and is more disposed above, relatively Highlight downwards from upper substrate face 3a when upper mounting plate 3 moves down.
It addition, anchor 7 presents the tubulose of hollow, its hollow bulb 7a1 and support matrices 7a Hollow bulb 7a1 connection.The hollow bulb 7a1 of support matrices 7a is connected vacuum pump P1.As Really vacuum pump P1 is driven, then hollow bulb 7a1 becomes vacuum, and upper substrate K1 is inhaled by vacuum It is attached to anchor 7.Vacuum pump P1 is controlled by controlling device 100.That is, according to controlling device The instruction of 100, vacuum pump P1 be driven and upper substrate K1 by vac sorb to anchor 7.
Fig. 3 is the figure of the structure illustrating upper mounting plate.Fig. 4 is the upper substrate face illustrating upper mounting plate Figure.
As it is shown on figure 3, upper mounting plate 3 possesses backboard 30 and division driving portion 31.
Backboard 30 is installed on upper shaft 2a, with upper frame 2 knee-action integratedly.Backboard 30 It is the parts of the tabular that lower basal plate face 4a (with reference to Fig. 1) with lower platform 4 configures abreast. It addition, backboard 30 is opposed with lower basal plate face 4a.
Upper substrate face 3a is split in division driving portion 31.In other words, by with lower platform 4 The opposed mode in lower basal plate face 4a (with reference to Fig. 1) be formed at the flat of division driving portion 31 Face (segmentation plane portion 31a) and form upper substrate face 3a.It addition, division driving portion 31 It is adapted to segmentation plane portion 31a in 4a side, lower basal plate face.As shown in Figure 4, at this In embodiment, upper substrate face 3a is divided into 9.That is, upper mounting plate 3 is by 9 segmentations Drive division 31 is constituted.It addition, upper substrate face 3a is divided into 9 segmentation plane portion 31a.
As it is shown on figure 3, be mounted with actuator 32 (the 3rd drive mechanism) at backboard 30. Actuator 32 makes the relative backboard 30 in division driving portion 31 carry out displacement (knee-action).Cause Dynamic device 32 has at the upper bar 32a extended in the direction (above-below direction) that relative backboard 30 is orthogonal. Actuator 32 is built-in with such as motor (not shown), makes bar 32a by ball screw mechanism At axis direction (above-below direction) enterprising line displacement.Actuator 32 is by controlling device 100 (ginseng According to Fig. 1) control.
Division driving portion 31 is installed on the bar 32a of actuator 32.
Such as, as shown in Figure 4, the division driving portion 31 of rectangle 4 corners (or The vicinity in 4 corners) mounting rod 32a.It addition, between bar 32a and division driving portion 31 It is situated between and has not shown bearing, opposite segment drive division 31 rotatably mounting rod 32a.
If bar 32a is knee-action by actuator 32, then division driving portion 31 is according to bar The displacement of 32a is relative to the enterprising line displacement of the vertical direction of backboard 30 (knee-action).Respectively Division driving portion 31 non-interference and can knee-action independently.
It addition, backboard 30 is opposed with lower basal plate face 4a (with reference to Fig. 1), so actuator 32 opposing lower portions real estate 4a make division driving portion 31 carry out displacement (up and down in vertical direction Action).In other words, actuator 32 makes division driving portion 31 enter towards lower basal plate face 4a Line displacement.
So, the base panel assembly apparatus 1 of the present embodiment have can independently knee-action 9 Individual division driving portion 31.It addition, formed by the segmentation plane portion 31a in each division driving portion 31 The 3a deformable of upper substrate face.
Fig. 5 is the figure illustrating adhesive dowel.
As it is shown in figure 5, possess multiple adhesive dowel 8 at upper frame 2.Adhesive dowel 8 is upper Lower section upwardly extends the tubular part of setting, and being equipped to can be with upper mounting plate 3 and anchor 7 Knee-action independently.The knee-action of adhesive dowel 8 is the vertical of opposite upper parts real estate 3a Action.
Adhesive dowel 8 is compared upper substrate face 3a and is more disposed above, past at relative upper mounting plate 3 Lower mobile time highlight downwards from upper substrate face 3a.It addition, adhesive dowel 8 up move and Introduced from upper substrate face 3a.In the present embodiment, by adhesive dowel 8 not from upper substrate Prominent for face 3a (the segmentation plane portion 31a shown in Fig. 3) state, i.e. adhesive dowel 8 is prominent Amount is that the state of zero (or it is following) is set to introduce adhesive dowel 8 from upper substrate face 3a State.Then, adhesive dowel 8 moves down and highlights from upper substrate face 3a.It addition, The overhang of adhesive dowel 8 represents that adhesive dowel 8 is from upper substrate face 3a (segmentation plane portion 31a) The overhang (following identical) risen.
Adhesive dowel 8 is installed on multiple adhesive dowel flat board 8a (matrix part).At adhesive dowel flat board The adhesive dowel 8 of more than 1 is installed at 8a.Each adhesive dowel flat board 8a can be carried out the most solely Vertical knee-action (relative to the vertically-acting of upper substrate face 3a).
Adhesive dowel 8 has adhesive portion 8b in front end.
It addition, adhesive dowel 8 presents the tubulose of hollow, dig vacuum absorption holes 8c at center. Vacuum absorption holes 8c and the negative pressure chamber 8a1 formed as the hollow bulb of adhesive dowel flat board 8a is even Logical.The negative pressure chamber 8a1 of adhesive dowel flat board 8a is connected the 1st attraction unit (vacuum pump P2). Therefore, the vacuum absorption holes 8c of adhesive dowel 8 is connected the 1st attraction list via negative pressure chamber 8a1 Unit (vacuum pump P2).
Adhesive dowel 8 is time vacuum pump P2 is driven, vacuum absorption holes 8c becomes vacuum state Upper substrate K1 is carried out vacuum attraction, and then the upper substrate K1 by vacuum attraction fits to Adhesive portion 8b also keeps (bonding holding).Adhesive dowel 8 is highlighting from upper substrate face 3a State time keep upper substrate K1.
Vacuum pump P2 is controlled by controlling device 100.Upper substrate K1 is according to controlling device 100 Instruction and be attracted by vacuum adhesive dowel 8 and paste adhesive portion 8b.
The negative pressure chamber 8a1 of adhesive dowel flat board 8a is connected gas feed unit 8d.Gas supplies Unit 8d is controlled by controlling device 100.Gas feed unit 8d is according to controlling device 100 The gas (air, nitrogen etc.) that instruction is driven and specifies negative pressure chamber 8a1 supply.Logical Cross the gas from gas feed unit 8d supply, negative pressure chamber 8a1 and vacuum absorption holes 8c to boost, The upper substrate K1 being pasted on adhesive portion 8b peels off from adhesive portion 8b.
At each adhesive dowel flat board 8a, possesses the 2nd drive mechanism (knee-action mechanism 80). Knee-action mechanism 80 has and is rotatably supported on installation portion 80a and in Z-direction The most extended upper ball screw axle 81, the electro-motor 83 making ball screw axle 81 rotate with And by rotate ball screw axle 81 and the ball screw mechanism 82 of knee-action.Installation portion 80a is fixed in upper frame 2.Ball screw axle 81 is rotated by electro-motor 83, makes Ball screw mechanism 82 knee-action.Put down it addition, ball screw mechanism 82 is installed on adhesive dowel Plate 8a.With the rotation by ball screw axle 81 and the ball screw mechanism 82 1 of knee-action Body ground, adhesive dowel flat board 8a knee-action.
Knee-action mechanism 80 is controlled by controlling device 100, according to the finger controlling device 100 Order, adhesive dowel flat board 8a and adhesive dowel 8 carry out knee-action.
Installation portion 80a is installed on upper frame 2, with upper frame 2 knee-action integratedly.It addition, As it has been described above, upper mounting plate 3 and upper frame 2 knee-action integratedly.Upper frame 2 passes through Z axis Drive mechanism 20 (with reference to Fig. 1) carries out knee-action, if upper frame 2 moves down, then Upper mounting plate 3 and installation portion 80a advance towards lower platform 4 (with reference to Fig. 1).Knee-action machine Structure 80 is installed on installation portion 80a, according to the knee-action of installation portion 80a and adhesive dowel flat board 8a (adhesive dowel 8) carries out knee-action.Therefore, (the 1st drives machine to Z axis drive mechanism 20 Structure) there is the function making adhesive dowel 8 and upper mounting plate 3 advance towards lower platform 4.
Fig. 6 is the figure in the upper substrate face illustrating upper mounting plate, is the one of the configuration illustrating adhesive dowel The figure of individual example.
As an example, as shown in Figure 6, at upper mounting plate 3, possess 81 adhesive dowels 8 The present embodiment in, 9 adhesive dowels 8 are installed on 1 adhesive dowel flat board 8a.It addition, this reality The base panel assembly apparatus 1 (with reference to Fig. 1) executing example has 9 adhesive dowel flat board 8a.
It addition, in the present embodiment, at 1 division driving portion 31,1 is configured accordingly Adhesive dowel flat board 8a.Such as, corresponding with the segmentation plane portion 31a in 1 division driving portion 31 Ground arranges 9 adhesive dowels 8.It addition, in 1 division driving portion 31 (segmentation plane portion 31a) 9 adhesive dowels 8 that place arranges are installed on 1 possessed accordingly with this division driving portion 31 Adhesive dowel flat board 8a.
It addition, possess 4 knee-action mechanisms 80 at 1 adhesive dowel flat board 8a.Such as, Knee-action mechanism 80 is possessed in the corner of rectangular adhesive dowel flat board 8a.9 adhesive dowels Flat board 8a passes through knee-action mechanism 80, it is possible to knee-action independently of each other.
Adhesive dowel flat board 8a is not arranged intrusively with division driving portion 31, it is possible to opposite segment drives Dynamic portion 31 knee-action independently.Thus, be mounted with at 1 adhesive dowel flat board 8a is viscous Pin 8 can carry out displacement in vertical direction relative to corresponding segmentation plane portion 31a.
So, the knee-action mechanism 80 (the 2nd drive mechanism) of the present embodiment is configured to Multiple (9) adhesive dowel flat board 8a is enough made separately to carry out knee-action (opposite upper parts The vertically-acting of real estate 3a).
It addition, knee-action mechanism 80 can be according to setting for each adhesive dowel flat board 8a Displacement, makes adhesive dowel flat board 8a carry out displacement.Thus, adhesive dowel 8 can be according to pin The displacement setting each adhesive dowel flat board 8a has carried out displacement together with adhesive dowel flat board 8a State under keep upper substrate K1 (with reference to Fig. 1).
(a) of Fig. 7 is the figure illustrating lower platform, and (b) is the profile under Sec1-Sec1.
As shown in (a) of Fig. 7, lower platform 4 is contained in the interior of the cavity of resorption 5b of upper opening Side.Lower section and the side of lower platform 4 are surrounded by cavity of resorption 5b.Lower platform 4 and cavity of resorption 5b it Between, laterally (X-direction) and longitudinal direction (Y direction) are formed respectively clearance G x, Gy.Support it addition, parts 40 are moved by multiple XY θ in the lower section of lower platform 4.Fig. 7's In (a), it is illustrated that moved, by 9 XY θ, the lower platform 4 that parts 40 support, but support The XY θ of lower platform 4 moves the quantity of parts 40 and is not defined.
XY θ moves parts 40 and can support in X-direction and Y direction free displacement Lower platform 4.By such structure, the relative cavity of resorption 5b of lower platform 4 is at X-direction and Y Can arrange on free displacement ground on direction of principal axis.
It addition, at lower platform 4, install travel mechanism 41.Travel mechanism 41 have under Axle portion 41b that the end edge of platform 4 links and make axle portion 41b carry out displacement in the axial direction Drive division 41a.Drive division 41a makes axle portion 41b in axis side by such as ball screw mechanism Upwards carry out displacement.
As shown in (a) of Fig. 7, lower platform 4 is linked 3 travel mechanisms 41.1 The axle portion 41b of travel mechanism 41 is the most extended, 2 travel mechanisms 41 41b is the most extended in axle portion.
The most extended axle portion 41b is attached in the end edge of lower platform 4 Near the portion of centre.By the displacement of the most extended axle portion 41b, lower platform 4 At X-direction (laterally) enterprising line displacement.
It addition, the most extended 2 axle portion 41b are attached at lower platform 4 Phase the same side end edge end near.2 the most extended axle portions In the case of the displacement of 41b is equal, lower platform 4 is in Y direction (longitudinally) enterprising line position Move.It addition, the feelings that the displacement of the most extended 2 axle portion 41b is different Under condition, about lower platform 4, a side big due to the displacement of axle portion 41b is less than displacement One side carries out displacement the most in the Y-axis direction, so rotating about the z axis.
So, the lower platform 4 connecting 3 travel mechanisms 41 can carry out X-direction (horizontal stroke To) displacement, the displacement of Y direction (longitudinally) and rotation about the z axis.
3 travel mechanisms 41 are controlled by controlling device 100.Control device 100 to 3 shiftings Motivation structure 41 provides instruction to make axle portion 41b suitably carry out displacement, makes lower platform 4 carry out position Move.
It addition, possess elevator 42 at lower platform 4.Elevator 42 is with in such as X-axis The mode crossing lower platform 42 on direction is extended.Elevator 42 is by ball screw machine The lowering or hoisting gear 42a such as structure, as in (b) of Fig. 7 with knee-action shown in black arrow.Rise Falling unit 42a is controlled by controlling device 100.Control device 100 by conveyer device 200 Drive elevator 42 during (with reference to Fig. 1) conveying infrabasal plate K2 (with reference to Fig. 1) and by lower base Plate K2 is placed on lower platform 4.
It addition, in the corner of rectangular lower platform 4, define para-position window 4b.Such as Fig. 7 (b) shown in, para-position window 4b is the plane (lower basal plate face 4a) of through lower platform 4 Through hole.Image pickup part receiving cartridge 10a enters into para-position window 4b from below.House about image pickup part Cylinder 10a, the lower surface of cavity of resorption 5b upward according to tubular protruding formed, embedding in leading section Enter transparent component 10b.In image pickup part receiving cartridge 10a, house and keep by lower platform 4 Infrabasal plate K2 (with reference to Fig. 1) carry out the camera head 10 that images.
Possessing 4 camera heads 10 at lower platform 4, the shooting of each camera head 10 obtains Data (view data) be imported into control device 100.It addition, have at lower platform 4 The quantity of standby camera head 10 is not defined.
The lower basal plate face 4a of lower platform 4 is to maintain the plane of infrabasal plate K2 (with reference to Fig. 1). It addition, travel mechanism 41 makes lower platform 4 along lower basal plate face 4a in X-direction, Y-axis On direction and carry out displacement about the z axis.
Near 2 para-position window 4b, form camera window 4c.Camera window 4c be according to The shape of para-position window 4b equivalent is formed.2nd image pickup part receiving cartridge (not shown) is from below Enter into camera window 4c.2nd image pickup part receiving cartridge is to be equal to landform with image pickup part receiving cartridge 10a Become.In the 2nd image pickup part receiving cartridge, house the 2nd camera head (not shown).2nd The infrabasal plate K2 (with reference to Fig. 1) kept by lower platform 4 is imaged by camera head, its figure As data are imported into control device 100.It addition, in (a) of Fig. 7, it is illustrated that under Possess the structure of 2 the 2nd camera heads at platform 4, but the quantity of the 2nd camera head not by Limit.
At the lower basal plate face 4a of lower platform 4, dig multiple suction hole 43.Suction hole 43 Unit (vacuum pump P3) is attracted to be connected with the 2nd.If vacuum pump P3 is driven, then institute The infrabasal plate K2 (with reference to Fig. 1) of mounting is adsorbed and is kept (lower basal plate face by lower platform 4 4a).Vacuum pump P3 is controlled by controlling device 100.
Fig. 8 is the figure being shown through the operation that base panel assembly apparatus makes baseplate-laminating.Suitably L.Lucidus Turcz. According to Fig. 1～7, illustrate that base panel assembly apparatus 1 makes the operation of baseplate-laminating.
1st operation (step 1) is that upper substrate moves into operation.
In upper substrate moves into operation, control device 100 and make upper frame 2 up move and make Chamber 5a and upper mounting plate 3 up move.Thus, vacuum chamber 5 is opened.
When by conveyer device 200 upper substrate K1 is transported to upper mounting plate 3 and lower platform 4 it Between time, control device 100 make anchor 7 move down until abutting to upper substrate K1, drive Dynamic vacuum pump P1.Upper substrate K1 is attracted by vacuum anchor 7.
When conveyer device 200 exits, control device 100 and make anchor 7 up move and make Upper substrate K1 clings to the upper substrate face 3a of upper mounting plate 3.
Then, control device 100 provides instruction to make adhesive dowel put down to knee-action mechanism 80 Plate 8a moves down and drives vacuum pump P2.Upper substrate K1 by with adhesive dowel flat board 8a mono- Acting adhesive dowel 8 vacuum attraction moved down, adhesive portion 8b of front end pastes upper substrate K1. Afterwards, the adhesive dowel under the state that device 100 makes upper substrate K1 paste adhesive dowel 8 is controlled Flat board 8a moves down, and makes upper substrate K1 deviate from from upper substrate face 3a.
Now, device 100 is controlled so that the displacement of adhesive dowel flat board 8a becomes for each The mode of the displacement that adhesive dowel flat board 8a sets, makes each adhesive dowel flat board 8a move down. The details of the displacement of adhesive dowel flat board 8a is described below.
And then, control device 100 and make and each division driving portion 31 corresponding for adhesive dowel flat board 8a Backboard 30 relatively enters according to the displacement identical with the displacement setting this adhesive dowel flat board 8a Line displacement (moves down).
2nd operation (step 2) is that infrabasal plate moves into operation.
When by conveyer device 200 infrabasal plate K2 is moved to upper mounting plate 3 and lower platform 4 it Between time, control device 100 make elevator 42 up move and accept infrabasal plate K2.Work as conveying When device 200 exits, control device 100 make elevator 42 move down and by infrabasal plate K2 It is placed on the lower basal plate face 4a of lower platform 4.It addition, control device 100 to drive vacuum pump P3 and make infrabasal plate K2 adsorb and be held in the lower basal plate face 4a of lower platform 4.
Afterwards, controlling device 100 drives Z axis drive mechanism 20 to make upper frame 2 toward moving down Dynamic, make epicoele 5a and upper mounting plate 3 move down.Epicoele 5a and cavity of resorption 5b engaging and true Cavity 5 closes.In the inner side of vacuum chamber 5, configure upper mounting plate 3, lower platform 4, anchor 7 And adhesive dowel 8.
In controlling device 100, when vacuum chamber 5 closes, vacuum pump P0 is driven to make true Vacuum is become in cavity 5.By the driving of vacuum pump P0, in vacuum chamber 5, become vacuum, So vacuum chamber 5 receive under vacuum conditions upper mounting plate 3, lower platform 4, anchor 7 and Adhesive dowel 8.
It addition, infrabasal plate K2 is being moved to base panel assembly apparatus 1, (upper mounting plate 3 is flat with lower Between platform 4) before, other operations are applied sealant, liquid crystal, spacing body and cream material The material that material etc. are necessary.
3rd operation (step 3) is that bonding position adjusts operation.
In bonding position adjusts operation, control device 100 and drive travel mechanism 41 to make down Platform 4 carries out displacement to adjust bonding position.Bonding position adjusts the details of operation rear Face describes.
4th operation (step 4) is the laminating work making upper substrate K1 and infrabasal plate K2 laminating Sequence.The details of bonding process is described below.
5th operation (step 5) is to take out of operation.
In taking out of operation, control device 100 in the inside of the vacuum chamber 5 being in vacuum state The gases such as nitrogen injection and boost to atmospheric pressure in making vacuum chamber 5.Inside due to vacuum chamber 5 Boost to atmospheric pressure, thus upper substrate K1 and infrabasal plate K2 is by (the pressurization punching of pressing equably Pressure), until becoming according to being coated on the spacing body of substrate (infrabasal plate K2), liquid crystal in advance The space (unit space) measured and determine.Control device 100 and drive gas feed unit 8d And to vacuum absorption holes 8c supply gas.At this time point, adhesive dowel 8 does not keeps upper substrate K1, so being fed in vacuum chamber 5 gas of vacuum absorption holes 8c supply.Control dress Put 100 and measure the air pressure in vacuum chamber 5 by not shown baroceptor, at vacuum chamber 5 Interior air pressure boosts to the time point of atmospheric pressure, stops gas feed unit 8d.Then, control Device 100 makes upper frame 2 up move.Thus, vacuum chamber 5 is opened.
Afterwards, by the upper substrate K1 fitted and infrabasal plate K2 by supply unit 200 from Base panel assembly apparatus 1 takes out of.
The base panel assembly apparatus 1 of the present embodiment is with 5 shown in Fig. 8 operation (step 1～step Rapid 5) it is main operation, makes upper substrate K1 and infrabasal plate K2 laminating.
Control device 100 to adjust in the bonding position shown in Fig. 8 adjusts operation (step 3) Upper substrate K1 and the bonding position of infrabasal plate K2.Illustrate that the bonding position in the present embodiment is adjusted Whole operation (step 3).
Fig. 9 is the figure of the mark illustrating the bonding position for adjusting upper substrate and infrabasal plate, A () is the figure illustrating the upper mark being additional to upper substrate, (b) is to illustrate to be additional to infrabasal plate The figure of lower mark.It addition, Figure 10,11 be to illustrate to adjust the upper mark of upper substrate and lower base The figure of the state of the skew of the lower mark of plate, (a) of Figure 10 is to illustrate that XY is axial partially The figure moved, (b) is the figure illustrating the state that have adjusted the axial skew of XY.It addition, (a) of Figure 11 is the figure illustrating skew about the z axis, and (b) is to illustrate to have adjusted about the z axis The figure of state of skew.
It is additional to the mark (upper mark and lower mark) of upper substrate K1 and infrabasal plate K2 Shape does not limit.Such as, about upper mark, as shown in (a) of Fig. 9, at upper substrate The reference position of K1 adds mark Mk1 on the 1st of black tetragon, indicates Mk1 on the 1st Vicinity, the 2nd of additional black tetragon indicates Mk1a.It addition, about lower mark, as Shown in (b) of Fig. 9, add the 1st of four frame shapes the in the reference position of infrabasal plate K2 Lower mark Mk2, near the 1st time mark Mk2, the 2nd time of additional four frame shapes Mark Mk2a.
Indicate on 2nd that Mk1a is that size indicates the little black tetragon of Mk1 on the 1st.Separately Outward, the 2nd time mark Mk2a or size ratio 1st identical with the 1st time mark Mk2 that be size Lower four big for mark Mk2 frame shapes.
It addition, according to such as distance from the end edge of upper substrate K1, set and be attached the 1st The reference position of the upper substrate K1 of upper mark Mk1.As an example, from upper substrate The end edge of K1 have left the position of specific length, indicates Mk1 on the additional 1st.Similarly, The position of specific length is have left, additional 1st time mark Mk2 in the end edge from infrabasal plate K2.
On the 1st, indicate that Mk1 is black tetragon, the 1st time mark as shown in (a) of Fig. 9 In the case of Mk2 is four frame shapes as shown in (b) of Fig. 9, control device 100 (ginseng According to Fig. 1) on the 1st, indicate that Mk1 (black tetragon) is in the 1st time mark Mk2 (four limits Frame) frame in time, it is determined that for the skew of upper substrate K1 and infrabasal plate K2 in prescribed limit.
It addition, the para-position window 4b of the lower platform 4 shown in (a) of Fig. 7 is and upper substrate K1 And the reference position of infrabasal plate K2 is correspondingly formed.
It addition, indicate on the 2nd Mk1a as shown in (a) of Fig. 9 be black tetragon, the In the case of 2 times mark Mk2a is four frame shapes as shown in (b) of Fig. 9, control device 100 (with reference to Fig. 1) indicate that on the 2nd Mk1a (black tetragon) is in the 2nd time mark Time in the frame of Mk2a (four frames), it is determined that for the infrabasal plate K2 position relative to upper substrate K1 Coarse regulation terminate.
It addition, camera window 4c of the lower platform 4 shown in (a) of Fig. 7 is and is additional to upper base Indicate Mk1a on the 2nd of plate K1 and be additional to the 2nd time mark Mk2a of infrabasal plate K2 Position be correspondingly formed.
Control device 100 (with reference to Fig. 1) to press in the bonding position shown in Fig. 8 adjusts operation Upper substrate K1 and the bonding position of infrabasal plate K2 is adjusted according to 2 stages.
Control device 100 is in bonding position adjusts operation, initially, so that indicating on the 2nd Mk1a is configured at the mode in the frame of the 2nd time mark Mk2a, makes lower platform 4 carry out displacement. Now, control device 100 according to the view data from not shown 2nd camera head input, Make lower platform 4 carry out displacement, will indicate on 2 the 2nd that Mk1a is respectively arranged at the 2nd subscript In the frame of will Mk2a.Control device 100 on 2 the 2nd, indicate that Mk1a enters into the 2nd Time in the frame of lower mark Mk2a, it is determined that for the infrabasal plate K2 position relative to upper substrate K1 Coarse regulation terminates.
Control device 100 (with reference to Fig. 1) and be judged to that infrabasal plate K2 is relative to upper substrate K1 The coarse regulation of position terminate after, as shown in (a) of Figure 10, at the of upper substrate K1 Indicate on 1 that Mk1 (black tetragon) is in the 1st time mark Mk2 (four limits of infrabasal plate K2 Frame) frame outer in the case of, control device 100 and be judged to upper substrate K1 and infrabasal plate K2 Skew be in outside prescribed limit.Then, control device 100 and infrabasal plate K2 is gone up base relatively The position of plate K1 is finely adjusted whole.
Control the device 100 (with reference to Fig. 1) travel mechanism 41 to lower platform 4 (with reference to Fig. 7 (a)) provide instruction and make lower platform 4 carry out displacement.Control device 100 to lower platform 4 Travel mechanism 41 instruction is provided, make lower platform 4 (with reference to (a) of Fig. 7) in X-axis side Upper mobile to (Dx) and Y direction (Dy).Then, as shown in (b) of Figure 10, 4 the 1st indicate the time point that Mk1 is all configured in the frame of the 1st time mark Mk2, Control device 100 and be judged to upper mark (indicating Mk1 on the 1st) and lower mark (the 1st subscript Will Mk2) it is at the position relationship of regulation and the skew of upper substrate K1 and infrabasal plate K2 In prescribed limit, terminate inching.
It addition, as shown in (a) of Figure 11, the 1st time mark Mk2 relative to the 1st on In the case of mark Mk1 offset by the direction that have rotated about the z axis, control device 100 There is provided instruction to the travel mechanism 41 (with reference to (a) of Fig. 7) of lower platform 4, make lower platform 4 (with reference to (a) of Fig. 7) (Rz) about the z axis rotates.Then, such as (b) institute of Figure 11 Show, on 4 the 1st indicate Mk1 be all configured at the 1st time mark Mk2 frame in time Between point, control device 100 and be judged to upper mark (on the 1st indicate Mk1) and lower mark (the 1 time mark Mk2) it is in the position relationship of regulation and upper substrate K1 and infrabasal plate K2 Skew is in prescribed limit, terminates inching.
So, control device 100 (with reference to Fig. 1) and adjust work in the bonding position shown in Fig. 8 In sequence, by based on indicate on the 2nd Mk1a and the coarse regulation of the 2nd time mark Mk2a and On the 1st, indicate Mk1 and the inching of the 1st time mark Mk2, adjust upper substrate K1 Bonding position with infrabasal plate K2.
Then, the control device 100 of the present embodiment indicates that on the 1st Mk1 is configured at the 1st During state in the frame of lower mark Mk2, it is determined that be to indicate Mk1 and the 1st time mark on the 1st Mk2 is in the position relationship of regulation.
It addition, adjust in operation in bonding position, control device 100 (with reference to Fig. 1) to from The view data that camera head 10 (with reference to (b) of Fig. 7) inputs carries out image procossing and carries Take and on the 1st, indicate Mk1 and the position of the 1st time mark Mk2 and shape, so that the 1st subscript Will Mk1 is towards the mode of movement in the frame of the 1st time mark Mk2, to travel mechanism 41 (ginseng (a) according to Fig. 7) instruction is provided.
Control device 100, in the image procossing such as intermediate process, extracts and indicates Mk1 on the 1st With the 1st time the mark position of Mk2, shape.
Figure 12 is to illustrate that on the 1st, the skew of mark and the 1st time mark is in prescribed limit The figure of state, (a) is to illustrate that on the 1st, mark is in the state at the center of the 1st time mark Figure, (b) is the figure illustrating the state indicating the off-centring from the 1st mark on the 1st.
The control device 100 (with reference to Fig. 1) of the present embodiment is such as (b) and Figure 11 of Figure 10 (b) shown in, on the 1st indicate Mk1 (black tetragon) be configured at the 1st time mark Time in the frame of Mk2 (four frames), it is determined that at the skew for upper substrate K1 and infrabasal plate K2 In prescribed limit.
Indicate on 1st that Mk1 and the 1st time mark Mk2 is additional to upper substrate K1 respectively And the reference position of infrabasal plate K2.Therefore, it is configured to as shown in (a) of Figure 12 upper Time in substrate K1 and infrabasal plate K2 without difference in size (scale error), 4 the 1st indicate Mk1 is all configured at the center of the 1st time mark Mk2.
But, if produce error (size when the production of upper substrate K1 and infrabasal plate K2 Error etc.), then the reference position of upper substrate K1 and infrabasal plate K2 produces error.Then, If the reference position of upper substrate K1 and infrabasal plate K2 produces error, then 4 the 1st subscripts Will Mk1 is not the most configured at the center of the 1st time mark Mk2.So, will indicate on the 1st Mk1 be not configured at the state at center of the 1st time mark Mk2 be referred to as marker spacing skew (on The marker spacing skew of substrate K1 and infrabasal plate K2).
In the control device 100 (with reference to Fig. 1) of the present embodiment, such as (b) institute of Figure 12 Show, even if indicating on 4 the 1st that Mk1 is not the most the center, i.e. of the 1st time mark Mk2 Even if under the state that upper substrate K1 and infrabasal plate K2 creates marker spacing skew, at 4 On 1st indicate Mk1 be all configured at the 1st time mark Mk2 frame in time, be still judged on The skew of substrate K1 and infrabasal plate K2 is in prescribed limit.
But, if upper substrate K1 and infrabasal plate K2 laminating in this condition, then at upper base Small skew is produced between plate K1 and infrabasal plate K2.
Therefore, the control device 100 (with reference to Fig. 1) of the base panel assembly apparatus 1 of the present embodiment When making adhesive dowel 8 move down in moving into operation (step 1) at the upper substrate shown in Fig. 8, Change, for each adhesive dowel flat board 8a, the displacement that moves down and reduce upper substrate K1 and under The skew of substrate K2.Thus, the marker spacing skew of upper substrate K1 and infrabasal plate K2 is had The correction of effect ground.
Figure 13 is to illustrate that the displacement changing adhesive dowel flat board is to reduce upper substrate and infrabasal plate The figure of the state of skew, (a) is to illustrate mark and the shape that the 1st time mark offset by the 1st The figure of state, (b) is to illustrate the state that on the 1st, the skew of mark and the 1st time mark reduces The figure of (marker spacing of upper substrate and infrabasal plate offsets the state being corrected by).
It addition, in (a), (b) of Figure 13,1st time mark Mk2 is represented by dashed line Position.
As shown in (a) of Figure 13, the feelings that displacement at all adhesive dowel flat board 8a is equal Under condition, the overhang of all adhesive dowels 8 is equal, so glued pin 8 adsorbs (holding) Upper substrate K1 becomes plane.That is, upper substrate K1 is at the shape parallel with upper substrate face 3a Adhesive dowel 8 it is held under state.Now, if owing to the size produced when production etc. is missed Difference waits and upper substrate K1, infrabasal plate K2 produce scale error, the most sometimes mark Mk1 on the 1st Become the position of off-centring from the 1st mark Mk2.I.e., sometimes upper substrate K1 and Infrabasal plate K2 produces marker spacing skew.
Such as, as shown in (b) of Figure 13, if being attached on the 1st mark Mk1's The displacement quantitative change of end side adhesive dowel flat board 8a is many, then upper substrate K1 is with central authorities than end side more The state slight curving close to upper mounting plate 3 ground is held in adhesive dowel 8.
If upper substrate K1 so bends, then the end of upper substrate K1 is slightly close to center, So being additional on the 1st near end mark Mk1 slightly close to center.Therefore, the 1st Under the state that upper mark Mk1 indicates the center of Mk2 close to the 1st time, upper substrate K1 is protected It is held in adhesive dowel 8.
So, if indicating the Mk1 shape close to the center of the 1st time mark Mk2 on the 1st Under state, upper substrate K1 is held in adhesive dowel 8, then adjusted by the bonding position shown in Fig. 8 Inching in operation, as shown in (b) of Figure 13, indicates Mk1 accurately on the 1st Center close to the 1st time mark Mk2.Then, in upper substrate K1 and the patch of infrabasal plate K2 The small skew produced in conjunction reduces, thus, and correction upper substrate K1's and infrabasal plate K2 Marker spacing offsets, and marker spacing skew alleviates.
The error (scale error etc.) produced when producing upper substrate K1, infrabasal plate K2 exists Same production batch approximates.That is, the 1st time relative to infrabasal plate K2 of Mk1 is indicated on the 1st Mark Mk2 skew size upper substrate K1, infrabasal plate K2 each production batch in Approximation.
Therefore, if each production batch for upper substrate K1, infrabasal plate K2 sets viscous The displacement of pin flat board 8a, as long as then production batch does not changes, it becomes possible to make the 1st subscript Will Mk1 is close to the center of the 1st time mark Mk2.It addition, control device 100 (with reference to figure 1) make and make adhesive dowel flat board 8a carry out the structure of displacement with displacement set in advance.
Such as, manager of base panel assembly apparatus 1 (with reference to Fig. 1) wait for upper substrate K1, Each production batch of infrabasal plate K2, sets the displacement of adhesive dowel flat board 8a.The present embodiment Base panel assembly apparatus 1 there are 9 adhesive dowel flat board 8a, so for each adhesive dowel flat board 8a sets displacement.
When the displacement so set is imported into control device 100 (with reference to Fig. 1), Control device 100 is in upper substrate moves into operation (with reference to Fig. 8), by set displacement Each adhesive dowel flat board 8a is made to carry out displacement relative to backboard 30 (with reference to Fig. 3).Each adhesive dowel is put down Plate 8a moves down by set displacement.
It addition, (b) of Figure 13 illustrates the displacement of the adhesive dowel flat board 8a being configured at central authorities The state of the amount displacement less than the adhesive dowel flat board 8a being configured at end edge side, but can also set For being configured at the displacement of the adhesive dowel flat board 8a of central authorities more than the adhesive dowel being configured at end edge side The state of the displacement of flat board 8a.
It addition, in (b) of Figure 13, in the X-axis direction, the position of adhesive dowel flat board 8a Shifting amount changes, but can also be set to the displacement change of adhesive dowel flat board 8a in the Y-axis direction State.
Control device 100 (with reference to Fig. 1) and adjust operation (step in the bonding position shown in Fig. 8 Rapid 3), after have adjusted the bonding position of upper substrate K1 and infrabasal plate K2 in, Fig. 8 is performed Shown bonding process (step 4) and make upper substrate K1 and infrabasal plate K2 laminating.This is described Bonding process (step 4) in embodiment.
(a) of Figure 14 is to illustrate that division driving portion is carried out with the shape of upper substrate with being consistent The figure of the state of displacement, (b) is to illustrate upper mounting plate pressing upper substrate and the state of infrabasal plate Figure.
As it has been described above, the control device 100 (with reference to Fig. 1) of the present embodiment is shown in Fig. 8 Upper substrate is moved into and is made the displacement of adhesive dowel flat board 8a change in operation (step 1), such as figure Shown in (b) of 13, make upper substrate K1 slight curving.
Then, control device 100 (with reference to Fig. 1) to have adjusted in bonding position adjusts operation After bonding position, perform the bonding process (step 4) shown in Fig. 8.
Control device 100 in bonding process, according to and with each division driving portion 31 point What cutting plane portion 31a was corresponding is provided with the displacement correspondence of the adhesive dowel flat board 8a of adhesive dowel 8 Displacement, make each division driving portion 31 carry out displacement.In the present embodiment, dress is controlled Put 100 according to and with segmentation plane portion corresponding being provided with of 31a in each division driving portion 31 The displacement that the displacement of the adhesive dowel flat board 8a of adhesive dowel 8 is identical, makes each division driving Portion 31 carries out displacement.
Controlling device 100 (with reference to Fig. 1) control actuator 32 (with reference to Fig. 3) makes segmentation drive Dynamic portion 31 moves down and deviates from from backboard 30.Now, device 100 is controlled by with corresponding The displacement that the displacement of adhesive dowel flat board 8a is identical, makes division driving portion 31 move down. Therefore, as shown in (a) of Figure 14, become adhesive dowel flat board 8a and with this adhesive dowel flat board Division driving portion 31 displacement corresponding for 8a (has moved down) state of identical amount.Segmentation Drive division 31 carries out displacement according to the deformation of upper substrate K1, the upper substrate face of upper mounting plate 3 3a is deformed into the shape of the upper substrate K1 kept by adhesive dowel 8.
Afterwards, controlling device 100 (with reference to Fig. 1) drives Z axis drive mechanism 20 (with reference to figure 1), make upper frame 2 (with reference to Fig. 1) move down further, make shown in (a) of Figure 14 Upper mounting plate 3 and adhesive dowel flat board 8a (adhesive dowel 8) move down.Thus, such as Figure 14 (b) shown in, adhesive dowel 8 the upper substrate K1 kept and the lower base kept by lower platform 4 Plate K2 is fitted.
Control device 100, as shown in (a) of Figure 14, has carried out position in division driving portion 31 Under the state moved, drive Z axis drive mechanism 20 (with reference to Fig. 1).Upper mounting plate 3 (backboard 30, Division driving portion 31) move down together with upper frame 2 (with reference to Fig. 1).Then, as Shown in (b) of Figure 14, adhesive dowel 8 the upper substrate K1 that keeps and being kept by lower platform 4 Infrabasal plate K2 pressed by upper mounting plate 3 (division driving portion 31) and lower platform 4 and fit. Now, division driving portion 31 presses upper substrate K1 and lower base when having carried out displacement Plate K2.
Therefore, the 1st of upper substrate K1 indicates Mk1 is close to the 1st of infrabasal plate K2 Under the state (shape) at the center of lower mark Mk2, upper substrate K1 and infrabasal plate K2 is pasted Close.Thus, the marker spacing skew quilt of the upper substrate K1 in bonding process and infrabasal plate K2 Suppression, the error produced in the laminating of upper substrate K1 and infrabasal plate K2 diminishes.
It addition, in (a), (b) of Figure 14, for explanation easy to understand, significantly Illustrate the deflection of upper substrate K1.The deflection of actual upper substrate K1 is small, and point The displacement cutting drive division 31 is the most small.Therefore, even if having carried out position in division driving portion 31 Upper substrate K1 and infrabasal plate K2 the state (state moved down from backboard 30) moved Being fitted, the deflection of upper substrate K1 is the most small, and upper substrate K1 and infrabasal plate K2 does not produces Fitted accurately in the ground such as gap.
If controlling device 100 to be believed by the detection inputted from ergometer 20d (with reference to Fig. 1) Number detect upper substrate K1 and infrabasal plate K2 and fitted, then at this time point, drive up and down Actuating mechanism 80 and from upper substrate face 3a introduce adhesive dowel 8.Now, device 100 is controlled Stop vacuum pump P2 (with reference to Fig. 5) and drive gas feed unit 8d and to vac sorb Hole 8c supply gas, makes upper substrate K1 peel off from adhesive portion 8b.Then, device 100 is controlled Z axis drive mechanism 20 is driven to make upper frame 2 move down further, by upper mounting plate 3 Pressing upper substrate K1 and infrabasal plate K2.Control device 100 according to from ergometer 20d Input detects signal and is judged to create the load of regulation between upper mounting plate 3 and lower platform 4 During lotus, stop moving down of upper frame 2.
The inside of vacuum chamber 5 is vacuum, and upper substrate K1 and infrabasal plate K2 is in vacuum chamber 5 Vacuum environment under by regulation load fit.By pressurization now, at infrabasal plate The sealant coated in advance on K2 is suitably pressed, and is coated with in being maintained at the frame with sealant encirclement The vacuum of the lcd segment covered.
Afterwards, in order to make the position of upper substrate K1 and infrabasal plate K2 not offset, by never The ultraviolet that UV (ultraviolet) irradiation unit of diagram irradiates, makes sealant temporarily harden.
It addition, as it has been described above, the scale error of upper substrate K1, infrabasal plate K2 is with all one's life Produce in batch and approximate, for upper substrate K1, each production batch of infrabasal plate K2, set viscous The displacement of pin flat board 8a.Accordingly it is also possible to be configured at upper substrate K1, infrabasal plate In the production batch indeclinable period of K2, maintain division driving portion 31 according to adhesive dowel The displacement that the displacement of flat board 8a setting is equal has carried out the state of displacement.Such as, it is possible to To be configured to all not change at the production batch of upper substrate K1 and the production batch of infrabasal plate K2 During, control device 100 (with reference to Fig. 1) be maintained at make division driving portion 31 according to The displacement that the displacement of the adhesive dowel flat board 8a corresponding with each production batch is equal is carried out The state of displacement.
If such structure, as long as then upper substrate K1 and the production batch of infrabasal plate K2 Do not change, then control device 100 (with reference to Fig. 1) without making point whenever the execution bonding process Cut drive division 31 and carry out displacement.
As described above, the base panel assembly apparatus 1 (with reference to Fig. 1) of the present embodiment is by protecting When holding the upper substrate K1 being moved to, change for each adhesive dowel flat board 8a (with reference to Fig. 5) The displacement of the pin that becomes sticky 8 (with reference to Fig. 5), it is possible to reduce and producing upper substrate K1 and lower base (marker spacing is inclined in the small skew that the scale error etc. produced when plate K2 etc. is caused Move).Thus, it is possible to the marker spacing skew of correction upper substrate K1 and infrabasal plate K2, subtract Light marker spacing skew.
It addition, in the base panel assembly apparatus 1 of the present embodiment, division driving portion 31 (reference Fig. 3) change according to in order to correct the marker spacing skew of upper substrate K1 and infrabasal plate K2 The identical displacement of the displacement of adhesive dowel 8 (with reference to Fig. 5) carry out displacement.Thus, The shape in upper substrate face 3a (with reference to Fig. 3) of upper mounting plate 3 is upper with kept by adhesive dowel 8 The shape of substrate K1 is equal.Then, in bonding process (with reference to Fig. 8), upper substrate K1 The upper substrate face 3a identical by shape is pressed against infrabasal plate K2, so at bonding process In will not produce marker spacing skew, upper substrate K1 and infrabasal plate K2 is fitted accurately.
It addition, the invention is not restricted to above-described embodiment.Such as, above-described embodiment is in order to easily Understand the ground explanation present invention and the embodiment that describes in detail, it is not necessary to be limited to possess illustrated institute There is structure.
In addition it is possible to a part for the structure of certain embodiment is replaced into other embodiments Structure, and, additionally it is possible to the structure of certain embodiment plus the structure of other embodiments.
It addition, the invention is not restricted to above-described embodiment, it is possible at the model of the purport without departing from invention Suitably design for change in enclosing.
Figure 15 is the figure illustrating design alteration example, and (a) is to be shown mounted to 1 adhesive dowel put down The figure of the state that the displacement of the adhesive dowel of plate is different, (b) is to illustrate 1 division driving portion Figure corresponding to the structure of 1 adhesive dowel.It addition, Figure 16 is to illustrate other design alteration examples Figure, (a) is to illustrate that 4 division driving portions are corresponding to the state of 1 adhesive dowel flat board Figure, (b) is the figure illustrating 1 division driving portion corresponding to the state of 3 adhesive dowel flat boards.
As shown in Figure 6,1 adhesive dowel flat board 8a is driven by 4 knee-action mechanisms 80. It addition, as shown in Figure 4,1 division driving portion 31 passes through 4 bar 32a (shown in Fig. 3 Actuator 32) support.
Therefore, it is possible to 4 knee-action mechanisms 80 at 1 adhesive dowel flat board 8a of change Actuating quantity.Similarly, it is possible to for each actuator supporting 1 division driving portion 31 32, change the displacement of bar 32a.
It addition, as shown in (a) of Figure 15, it is possible to it is set as being installed on 1 adhesive dowel flat board The state that the displacement of the adhesive dowel 8 of 8a is different.In this case, it is possible to make by adhesive dowel 8 The upper substrate K1 kept diversely deforms (bending).And then, additionally it is possible to 1 adhesive dowel The displacement of 8 with being consistent, makes division driving portion 31 from backboard 30 displacement.
Therefore, as shown in (a) of Figure 15, it is possible to make division driving portion 31 from backboard 30 Suitably displacement and make segmentation plane portion 31a tilt relative to backboard 30, make upper substrate face 3a Shape be consistent with the shape of upper substrate K1.Thereby, it is possible to more effectively reduce at upper base The small skew produced in the laminating of plate K1 and infrabasal plate K2.And then, upper substrate K1 Offset with the marker spacing of infrabasal plate K2 and more effectively corrected.
It addition, as shown in (b) of Figure 15, additionally it is possible to make and possess at 1 adhesive dowel 8 The structure of 1 knee-action mechanism 80.I.e., additionally it is possible to make at 1 adhesive dowel flat board 8a The structure of 1 adhesive dowel 8 is installed at place.And then, additionally it is possible to make 1 division driving portion 31 Corresponding to 1 adhesive dowel 8, at 1 division driving portion 31, possesses 1 actuator 32 Structure.In the case of such a construction, it is possible to be set to different displacements for each adhesive dowel 8, The more sample plot deformation of the upper substrate K1 (bending) kept by adhesive dowel 8 can be made.And then, Control device 100 (with reference to Fig. 1) and can be made each with being consistent with the displacement of adhesive dowel 8 Division driving portion 31 carries out displacement, makes the upper substrate face 3a (with reference to Fig. 5) of upper mounting plate 3 Shape be consistent with the shape of upper substrate K1.
In this case, if doing each adhesive dowel 8 in pairs to connect vacuum pump P2 (ginseng respectively According to Fig. 5) structure, then by each adhesive dowel 8, upper substrate K1 can be carried out vacuum attraction.
It addition, the present embodiment makes the structure possessing 9 adhesive dowel flat board 8a, but adhesive dowel The quantity of flat board 8a is not defined.The quantity of adhesive dowel flat board 8a can be according to such as adhesive dowel The reasonable quantity ground change of 8.It addition, the shape of adhesive dowel flat board 8a, 1 adhesive dowel flat board The configuration of the adhesive dowel 8 at 8a does not limits yet.
For example, it is also possible to be configured to upper extended in X-direction (or Y direction) Elongated shape adhesive dowel flat board 8a at string ground configuration adhesive dowel 8.
It addition, the quantity of the adhesive dowel 8 possessed at 1 adhesive dowel flat board 8a does not limits yet. The adhesive dowel 8 possessing varying number for each adhesive dowel flat board 8a can also be configured to.
It addition, in the present embodiment, as shown in Figure 6,1 division driving portion 31 is corresponding to 1 Individual adhesive dowel flat board 8a.It is not limited to this structure, it is also possible to as shown in (a) at Figure 16 One example is such, is configured to multiple (in an example of (a) of Figure 16,4) Division driving portion 31 is corresponding to 1 adhesive dowel flat board 8a.Alternatively, it is also possible to as at Figure 16 B shown in () a example is such, be configured to 1 division driving portion 31 corresponding to multiple (in an example of (b) of Figure 16,3) adhesive dowel flat board 8a.
It addition, the shape in 1 division driving portion 31 is also not limited to rectangle (square, length Square).Although it is not shown, can also be combined with central part opening frame-type shape point Cut the upper mounting plate 3 (with reference to Fig. 1) of drive division.Alternatively, it is also possible to be triangle, trapezoidal etc. Variously-shaped division driving portion (not shown).
It addition, make the Z axis drive mechanism 20 (with reference to Fig. 1) of upper frame 2 knee-action, Drive the knee-action mechanism 80 (with reference to Fig. 5) of adhesive dowel flat board 8a, drive lower platform 4 Travel mechanism 41 (with reference to (a) of Fig. 7), actuator 32 (with reference to Fig. 3) etc. drives Mechanism is not limited to ball screw mechanism.The all or part of these drive mechanisms can also be by Other mechanisms such as cylinder or linear motor are constituted.
It addition, the upper substrate K1 (reference fitted by base panel assembly apparatus 1 (with reference to Fig. 1) Fig. 1) and infrabasal plate K2 (with reference to Fig. 1) mainly glass substrate, easily produce and surrounding The error of the change correspondence of temperature.Such as, in order to reduce due to vacuum chamber 5 (with reference to Fig. 1) Inside variations in temperature when becoming vacuum and error that upper substrate K1, infrabasal plate K2 produce, Can also be configured to possess to upper mounting plate 3 (with reference to Fig. 1) and lower platform 4 (with reference to Fig. 1) The heater that the temperature carrying out heating suppressing upper substrate K1 and infrabasal plate K2 reduces (adds Hot device).Peltier element etc. can be used to suppress upper substrate on the contrary, can also make The structure that the temperature of K1 and infrabasal plate K2 rises.If such structure, then alleviate by The error that upper substrate K1 and infrabasal plate K2 produce in variations in temperature, upper substrate K1 and under The Anawgy accuracy of substrate K2 improves.Send out thus, it is possible to effectively alleviate due to variations in temperature The situation of the marker spacing skew of raw upper substrate K1 and infrabasal plate K2.
Figure 17 is the figure illustrating other design alteration example, and (a) is to be shown in 1 adhesive dowel Installing the figure of the design alteration example of all adhesive dowels at flat board, (b) illustrates Construction integration The figure of the design alteration example that upper mounting plate possesses.
As shown in Figure 6, the base panel assembly apparatus 1 (with reference to Fig. 1) of the present embodiment has 9 Adhesive dowel flat board 8a.It addition, install 9 adhesive dowels 8 at 1 adhesive dowel flat board 8a. It is not limited to this structure, it is also possible to such as shown in (a) of Figure 17, makes at 1 adhesive dowel The structure of all adhesive dowels 8 is installed at flat board 8a.
Alternatively, it is also possible to as shown in (a) of Figure 17, make at rectangular adhesive dowel flat board 4 corners of 8a possess the structure of knee-action mechanism 80.
If this structure, then can be set to by changing the dynamic of 4 knee-action mechanisms 80 Measure and the different state of the displacement of adhesive dowel 8.And then, it is possible to the displacement of adhesive dowel 8 Amount is consistent ground, make each division driving portion 31 from backboard 30 (with reference to Fig. 3) displacement, Upper substrate K1 (with reference to Fig. 1) and infrabasal plate K2 (with reference to Fig. 1) laminating is made under this state.
It addition, as shown in Figure 4, at the base panel assembly apparatus 1 (with reference to Fig. 1) of the present embodiment Upper mounting plate 3 at possess 9 division driving portions 31.It is not limited to this structure, it is also possible to such as figure Shown in (b) of 17, upper mounting plate 3 is Construction integration.I.e., it is also possible at upper mounting plate 3 not Possess division driving portion 31, and constitute upper mounting plate 3 by 1 steel plate etc..In this case, If made, actuator 32 (with reference to Fig. 3) is installed in 4 corners of rectangular upper mounting plate 3 The structure of bar 32a, then can make upper mounting plate 3 by changing the displacement of 4 bar 32a Suitably tilt.Therefore, it is possible to make upper mounting plate 3 fit with being consistent with the displacement of adhesive dowel 8 Local inclination, makes upper substrate K1 (with reference to Fig. 1) and infrabasal plate K2 (reference in this condition Fig. 1) laminating.

Claims (8)

1. a base panel assembly apparatus, it is characterised in that have:
Lower platform, has the lower basal plate face keeping infrabasal plate；
Upper mounting plate, has and is formed with the multiple of the segmentation plane portion opposed with described lower basal plate face Division driving portion；
Multiple adhesive dowels, configure with described segmentation plane portion, it is possible to accordingly relative to correspondence The vertical enterprising line displacement in direction in described segmentation plane portion and keep upper substrate；
Vacuum chamber, it is possible to receive described lower platform, described upper mounting plate and institute under vacuum conditions State adhesive dowel；
1st drive mechanism, makes described adhesive dowel and described upper mounting plate towards described lower platform row Enter；
Multiple matrix parts, install the described adhesive dowel of more than 1；
2nd drive mechanism, makes multiple described matrix parts the most described segmentation plane portion enter Row vertically-acting；
3rd drive mechanism, makes multiple described division driving portion independently towards described lower basal plate Face carries out displacement；
1st attracts unit, is connected with the vacuum absorption holes dug in described adhesive dowel；And
2nd attracts unit, is connected with the suction hole being formed at described lower basal plate face,
Described adhesive dowel is with the displacement set for each described matrix part and this matrix part one Play displacement and keep described upper substrate,
And then, described division driving portion is respectively with the displacement corresponding with the displacement of described matrix part Amount carries out displacement, and described matrix part is provided with the described segmentation plane portion pair with this division driving portion Answer the described adhesive dowel of ground configuration,
Under vacuum environment in described vacuum chamber, described lower platform keep described infrabasal plate, And the described upper substrate patch that described 1st drive mechanism is driven and makes described adhesive dowel keep Close described infrabasal plate, under the time point that described infrabasal plate and described upper substrate have been fitted, Described 2nd drive mechanism is driven and described adhesive dowel is introduced from described segmentation plane portion, And described 1st drive mechanism is driven, by described under the state that carries out displacement point Cut drive division and press described upper substrate and described infrabasal plate.
Base panel assembly apparatus the most according to claim 1, it is characterised in that
Described division driving portion is being carried out with the displacement identical with the displacement of described matrix part Pressing described upper substrate and described infrabasal plate under the state of displacement, described matrix part is provided with The described adhesive dowel corresponding with the described segmentation plane portion in this division driving portion.
3. according to the base panel assembly apparatus described in claims 1 or 2, it is characterised in that
When by described adhesive dowel keep described upper substrate, adjust described upper substrate and The bonding position of described infrabasal plate.
Base panel assembly apparatus the most according to claim 3, it is characterised in that possess:
Travel mechanism, makes described lower platform carry out displacement along described lower basal plate face；
Camera head, to being additional to the upper mark of described upper substrate and being additional to described infrabasal plate Lower mark images；And
Control device, the view data inputted from described camera head is carried out image procossing and carries Take described upper mark and described lower mark,
Described control device is according to the described upper mark extracted and the position of described lower mark There is provided instruction to described travel mechanism, make described lower platform carry out displacement so that described upper mark With the position relationship that described lower mark becomes regulation, and then, set by for each described matrix part Fixed displacement makes described matrix part carry out displacement, adjusts described upper substrate and described infrabasal plate Bonding position.
5., according to the base panel assembly apparatus described in any one in Claims 1-4, it is special Levy and be,
Described adhesive dowel is the tubular part having dug described vacuum absorption holes, has viscous in front end Meet portion, described upper substrate is carried out vacuum attraction and pastes described adhesive portion and keep.
Base panel assembly apparatus the most according to claim 5, it is characterised in that
Possesses the gas feed unit to the gas that the supply of described vacuum absorption holes specifies.
7. a substrate assembly method, is the substrate dress controlling device execution of base panel assembly apparatus Method of completing the square, described substrate assembly method is characterised by, including:
Upper substrate moves into operation, makes multiple adhesive dowel be separated into epicoele and cavity of resorption towards at vacuum chamber State under the upper substrate that is moved between upper mounting plate and lower platform carry out displacement, and drive Dynamic the 1st attraction unit being connected with the vacuum absorption holes of described adhesive dowel, by multiple described viscous Pin carries out vacuum attraction to described upper substrate, pastes described upper substrate at described adhesive dowel The adhesive portion that possesses of front end, wherein, described vacuum chamber can be received under vacuum conditions to be had Press the described upper mounting plate in multiple division driving portions of described upper substrate and infrabasal plate and keep institute State the described lower platform of infrabasal plate；
Infrabasal plate moves into operation, drives and be formed at the attraction in the lower basal plate face of described lower platform The 2nd attraction unit that hole connects, makes to be moved between described upper mounting plate and described lower platform Described infrabasal plate is adsorbed onto described lower basal plate face, afterwards, by described epicoele and described cavity of resorption card Close and make described vacuum chamber close, in making this vacuum chamber, become vacuum；
Bonding position adjusts operation, makes described lower platform carry out position along described lower basal plate face Move, so that the institute under the state being additional to the described adhesive portion pasting multiple described adhesive dowel State the upper mark of upper substrate and be additional under the state being adsorbed onto described lower basal plate face described The lower mark of infrabasal plate becomes the position relationship of regulation；
Bonding process, the described adhesive dowel when making to have pasted described upper substrate is towards guarantor The described lower platform holding described infrabasal plate is advanced and is made described upper substrate and the laminating of described infrabasal plate Afterwards, described adhesive dowel is introduced from described segmentation plane portion, so make described upper mounting plate towards Described lower platform is advanced, and presses described upper substrate and described infrabasal plate by described upper mounting plate； And
Take out of operation, boost to atmospheric pressure in making described vacuum chamber and make described vacuum chamber open wide,
Move in operation at described upper substrate, make described adhesive dowel multiple of installation more than 1 Matrix part respectively with the displacement that sets for each matrix part in this matrix part relative to Described segmentation plane portion carries out vertically-acting independently, is pasted and described base by described upper substrate The described adhesive portion of the described adhesive dowel of body displacement together,
In described bonding process, by make described division driving portion respectively with described matrix part Displacement corresponding to displacement carry out the described upper mounting plate after displacement to press described upper base Plate and described infrabasal plate, described matrix part is provided with the described segmentation with this division driving portion and puts down The described adhesive dowel that face configures accordingly.
Substrate assembly method the most according to claim 7, it is characterised in that
Described bonding process be described control device by make described division driving portion respectively with The displacement that the displacement of described matrix part is equal carry out the described upper mounting plate after displacement come by Pressing described upper substrate and the operation of described infrabasal plate, wherein said matrix part is provided with and this point Cut the described adhesive dowel that the described segmentation plane portion of drive division is corresponding.
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CN109839766A (en) 2019-06-04
TW201635411A (en) 2016-10-01
KR20160117175A (en) 2016-10-10
CN109839766B (en) 2022-05-10
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CN106019646B (en) 2019-04-23
JP5837247B1 (en) 2015-12-24

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