KR20130004012A

KR20130004012A - Module bonding method and apparatus for producing a plate type display

Info

Publication number: KR20130004012A
Application number: KR1020110074103A
Authority: KR
Inventors: 박웅기
Original assignee: 박웅기
Priority date: 2011-07-26
Filing date: 2011-07-26
Publication date: 2013-01-09

Abstract

The present invention provides a method and apparatus for joining flat panel displays used in various bonding processes such as chip on glass, tape automated mounting (TAB), tape carrier package (TCP), heat seal, etc. during the manufacturing process of flat panel displays. It is about.
According to the present invention, a module bonding process in a state in which the substrate is fixedly positioned at a predetermined position of each workbench unit of the polygonal cylindrical work bench that is angularly displaced until the unloading step of unloading the substrate on which the module is bonded after the loading step of the substrate. As a step of bonding the anisotropic conductive film to the surface of the junction portion of the substrate, preliminary bonding of the module, and the main bonding of the module is performed sequentially, each step is horizontal with respect to the central axis of the polygonal cylindrical workbench In each step of angular rotation, the work table unit joining mechanism is installed as a portion adjacent to the substrate mounting portion of the work surface unit surface, and the angular rotation of the work table unit is a fixed position adjacent to the outer periphery of the work bench unit of the polygonal work bench. Each in opposing position Typically the loading mechanism and an unloading mechanism to install each joint incorporating them and the bonding method of the module for the manufacture of flat panel displays this operation consisting of a sequence is provided.

Description

Module bonding method and apparatus for producing a plate type display

The present invention is used in various bonding processes such as chip on glass, tape automated bonding (TAB), tape carrier package (TCP), heat seal, and the like during the manufacturing of flat panel displays. A module bonding method and apparatus for a flat panel display.

In general, a flat panel display is a display device used in various monitors, PDAs, TAB PCs, portable computers, mobile phone terminals, and the like, and the flat panel display uses LCD, PDP, LED, FED, and the like.

The process of manufacturing such a flat panel display necessarily includes a step of bonding a driver IC or FPC (Flexible Printed Circuit) to the side of the substrate, and in the case of such a bonding process, according to the conventional mechanical press method It is configured to press the hot bar by using a pneumatic cylinder in a state in which the substrate to be bonded to the upper portion of the predetermined holder is placed in the correct position, the pressure applied by the pneumatic cylinder is transferred to a part of the hot bar intensively As a result, there is not evenly distributed pressing force over the entire area of the hot bar, but it is biased to one side and has uneven distribution pressure. Consequently, the pressure bonding process of the module on the substrate cannot be made uniformly and evenly. It lowers and becomes a cause of product defect.

In addition, even if the hot bar is precisely processed to match the appearance of the module, there is a problem that cannot solve the above fundamental problems due to structural defects due to mechanical coupling between the pneumatic cylinder and the hot bar.

In addition, as a module to be bonded on the substrate, for example, when various chips are bonded and bonded, the surface of the substrate is not horizontally flat but pressurized when the projections appear irregularly. When the bonding process is performed, the surface on which the hot bar is pressurized is generally flat, so that the surface of the module and the surface of the hot bar on which the press is made are completely different from each other. Since the distribution is maintained in a non-uniform state is causing a fundamental problem that the pressure bonding operation can not be made properly.

In addition, in the conventional process of attaching the anisotropic conductive film on the substrate in the manufacturing process of the flat panel display, the anisotropic conductive film is attached after loading the substrate at a predetermined position and fixing it in position in the stage for attaching the film. Then, the process of hot pressing, peeling off the release paper, and then unloading the substrate on which the anisotropic conductive film is attached are carried out. The process of bonding the chip is performed by dividing the preliminary bonding process and the main bonding process. In the prebonding process of the chip, the anisotropic conductive film is attached in the process of attaching the above anisotropic conductive film, and the unloaded substrates, which have reached the corresponding order, are loaded into the stage for performing the prebonding process of the chip again. Many chips are picked up from the ready tray, flipped over and placed in position for splicing. After performing the preliminary bonding process and repeatedly performing the preliminary bonding on the next chip as necessary, the process of unloading the substrate on which the preliminary bonding of the chip is made is performed. The main bonding process of the chip is performed in the preliminary bonding process. Pre-bonded and unloaded boards are loaded into the stage for performing the main bonding of the chip, and then placed in place. Then, the main bonding process is performed. The process of unloading the substrate is performed.

As such, the process of attaching the anisotropic conductive film to the substrate, the process of pre-bonding the chips, and the process of main bonding of the chips all require loading and unloading for each process. The facilities for performing the loading unloading are required separately, causing inefficient problems.

In addition, these processes are separate and the working lines are configured to have different linear arrangements in the horizontal direction, which requires a relatively large amount of space for the layout of the work space or related equipment required for the joining operation of the entire electronic component. On the whole manufacturing line, the inefficient use of space has been pointed out, but there are no separate measures to solve it separately.

The present invention has been accomplished in order to solve the problems of the prior art, and has the following objectives.

The main object of the present invention is a pressure bonding mechanism for press-bonding various types of modules including a substrate and an anisotropic conductive film or a chip, so that the pressure distribution can be made uniformly over the entire area during the pressing operation. It is intended to improve the quality of flat panel display products by maintaining a uniform distribution of pressure at all times so that a uniform pressing force is transmitted at the time of pressure bonding of the module on the substrate to enable accurate and precise bonding.

Another object of the present invention is that even though the surface state of the entire electronic component to be pressure-bonded on the substrate is not the same and not flat, even if the surface of the module of various forms arranged on the substrate to maintain a non-flat state as a whole Correspondingly, the pressurization mechanism is set in a balanced manner and the pressurization operation is consistently to exclude the defective factors of the product in advance, so that it can be properly applied to various working conditions difficult to work.

Another object of the present invention is that once the loading of the substrate for the bonding of the module is not unloaded for each process, but instead of attaching the anisotropic conductive film without a separate unloading process in the loading state once, the preparation of the module Bonding and main bonding process are performed in sequence to improve the work efficiency by performing the process of unloading the substrate after the bonding of the module is completed, and the above several processes are suitable for mass production by the angular rotation of the radial table. It is intended to enable a three-dimensional facility and work arrangement by enabling displacement, and to enable efficient use of installation and work space.

Another object of the present invention is that when the size of the substrate for bonding is limited or there is a limit to increase the diameter of the table workbench in the manufacturing of the equipment, it can be easily solved and configured for each stage where the work is made while the angular displacement is made. The purpose of the workbench units is to make them identical to each other so that the whole equipment can be easily manufactured and maintenance can be effectively performed.

The present invention, in order to achieve the above object, each platform unit of the polygonal cylindrical workbench in which the angular displacement is made up to the unloading step of unloading the substrate to which the module is bonded after the loading step of the substrate for the bonding of electronic components The process of bonding the modules in a state where the substrate is fixedly positioned at the position, the film bonding step of bonding the anisotropic conductive film to the surface of the bonding substrate, the preliminary bonding step of preliminary bonding of the module, and the main module of the module. The main joining step of joining is made sequentially, the worktable unit surface of the work surface unit respectively provided on the surface at a predetermined angle of the polygonal cylindrical workbench at each step of the angular rotation of each step based on the horizontal center axis of the polygonal workbench The work base as a part adjacent to the substrate mounting portion Of the module for the manufacture of a flat panel display in which the joining mechanisms are respectively installed and the loading mechanism and the unloading mechanism are sequentially installed at fixed opposite positions adjacent to the worktable unit substrate mounting portion of the polygonal cylindrical work bench, respectively. A joining method is provided.

In addition, a horizontal center axis is installed at the center, and each work surface unit is equipped with a board mounting part on each surface that is configured to form a polygon when viewed from both sides, and the polygons can be rotated at an angle about the horizontal center axis. A multi-cylindrical cylindrical workbench installed on the workbench, and each joining mechanism is installed on the workbench unit adjacent to the board mounting parts provided on the surfaces of the workbench units, and the loading mechanism is fixed on the opposite side of the workbench unit. And the unloading mechanisms are arranged and fixed in sequence, respectively, and the joining mechanism is a column that is separately installed and fixed on one side of the workbench unit, and is installed on one side of the column and heat-presses the module on an upper portion of the substrate. Adapter assembly installed to join, and the abutment Jidoe the mechanism assembly W, comprises a seungha taken driving mechanism is installed at one side of the column so as to fall, the joint mechanism assembly is located on the lower inner W, heat press machine that drops are made As the bonding by heating the module pressure and; A heating mechanism provided to heat the heating pressurizer in a state wrapped in a lower portion thereof; A diaphragm mechanism installed to press or raise the heating pressurizer from above; And there is provided a module bonding apparatus for manufacturing a flat panel display comprising a guider for guiding the heating pressurizer during the lowering or raising operation of the heating pressurizer.

Thus, in the case of the present invention, when the substrate is loaded, the unloading is not performed for each process, but the anisotropic conductive film is attached, the preliminary bonding of the module and the main bonding process are performed sequentially without a separate unloading process in the loading state. After the bonding of the module is completed to perform the process of unloading the substrate to improve the work efficiency is suitable for mass production, and the above several processes to enable the displacement of the stage by the angular rotation of the turntable three-dimensional equipment and It is possible to arrange work, install and use the work space efficiently, and pressurization mechanism that pressurizes various types of modules including board, anisotropic conductive film or chip. It is configured so that it can be made uniformly. The pressing force on the phase distribution is maintained, so that even pressing force is transmitted during the pressure bonding of the module on the substrate, so that accurate and precise bonding is possible. Even though the surface state of the entire electronic component is not the same and not flat, even if the surface of the module of various forms placed on the substrate is not flat as a whole, the pressure mechanism is set in a balanced position accordingly. It is pressurized to eliminate the defects of the product in advance and can be applied appropriately to various working conditions that are difficult to work. If there is a limit to increasing It can be solved, and has an advantage such that an angular displacement can be achieved As the operation to the table unit is configured for each stage to be configured identically with each other facilitates the production of the whole equipment and maintenance also be effectively made.

1 is a schematic side view as a preferred example of the present invention;
2 is a schematic front view with a part of FIG. 1 omitted;
FIG. 3 is a schematic front view showing the apparatus commonly used at the site where the bonding step is performed in FIG. 1;
4 is a schematic side view of the adapter assembly of FIG. 3;
5 is a partially cutaway longitudinal sectional view of the front of FIG. 4;
6 is a partially omitted longitudinal cross-sectional view of FIG. 5;
FIG. 7 is a schematic side view showing the bonding method of the present invention corresponding to FIG.

Hereinafter, preferred embodiments of the apparatus of the present invention will be described with reference to the accompanying drawings.

As illustrated in FIGS. 1 to 7, the present invention may be configured in various forms, and these various embodiments are commonly performed as follows.

According to a preferred example of the device of the present invention, the worktable unit 100 is provided with a horizontal center axis 1b at the center thereof and configured to form a polygon when viewed from both sides, and a substrate mounting unit 1a is provided on each surface of the polygon. Each of the workbench unit 100 is installed and constitutes a polygonal cylindrical workbench 1 installed at an angle with the worktable unit 100 installed at a predetermined angle about the horizontal center axis 1b, and the worktable unit 100 is installed. The work unit unit 100 is provided with a joining mechanism 7 as a portion adjacent to the substrate mounting unit 1a provided on the surface, and is loaded on the opposite side fixed portion of the surface substrate mounting unit 1a of the work unit unit 100. The mechanism 5 and the unloading mechanism 9 are respectively arranged in sequence and fixed, and the joining mechanism 7 is installed in a position adjacent to one side of the polygonal cylindrical workbench 1 to be separately installed and fixed in the column 2. And, The column assembly 2 is installed on one side of the column (2) and is installed to heat and press the module on the upper portion of the substrate 10, and the column to raise and lower the adapter structure (3) It comprises a lifting drive mechanism (4) installed on one side of (2), the adapter structure assembly (3) is located inside the lower portion of the heating pressurizer 30 for heating and pressurizing the module while the lifting is made Wow; A heating mechanism (32) provided to heat the heating pressurizer (30) in a state wrapped in a lower portion thereof; A diaphragm mechanism (34) installed to pressurize or raise the heating pressurizer (30) from above; And it comprises a guider 36 for guiding the heating pressurizer 30 during the lowering or raising operation of the heating pressurizer 30 is made.

In this case, the polygonal cylindrical worktable 1 is configured to be displaceable by angular rotation by a drive motor in place about a horizontal center axis 1b, and a substrate provided on the surface of each worktable unit 100. In the case of the mounting portion 1a, the substrate 10 is temporarily fixed to be configured in the form of a jig or a clamp so as not to move during the bonding operation. In addition, in the polygonal cylindrical worktable 1, when the displacement by the angular rotation is configured at four places at the same angle as shown, the worktable unit 100 having the substrate mounting portions 1a is provided at intervals of 90 degrees. In addition, the polygonal cylindrical worktable 1 is configured to have an angular displacement of 90 degrees for each displacement of the position about the horizontal center axis 1b, but in addition, when the worktable unit 100 is provided at five locations, it is spaced at an interval of 72 degrees. When the workbench unit 100 is provided at six places, the polygonal cylindrical workbench 1 is centered on the horizontal center axis 1b at 60-degree intervals when the workbench unit 100 is provided at eight places. The configuration is made so that the angle displacement is made for each displacement of the position.

Next, the loading mechanism 5 is a technical configuration for mounting the substrate 10 by moving it to the substrate mounting portion 1a of the work bench unit 100, which adopts a loader or industrial robot that is being used in the past. It can be used, and in some cases, the operator can perform the loading directly.

In addition, the bonding mechanism 7 is commonly used as a bonding mechanism for film bonding, a bonding mechanism for preliminary bonding, or a bonding apparatus for main bonding. In the case of the bonding mechanism 7, the column ( 2) is separately fixed to a position adjacent to the substrate mounting portion (1a) of the work bench unit 100 in order to serve as a support pillar for installing the adapter structure assembly (3), the assembly structure (3) They are installed to be coupled to each other via the steel driving mechanism 4, and in some cases, the coupling is directly installed without interposing the lifting and lowering driving mechanism 4, or the position is shifted in the X, Y or Z direction. The configuration may be achieved by coupling and fixing the position shifting mechanism in the form of an intermediate portion, and mounting a large substrate 10 or a plurality of substrates 10 simultaneously and with respect to these substrates 10. If you want to perform the joining work at the same time can be utilized by installing a plurality of joining mechanisms 7 in a row or in a row at the same time to accommodate the range required for these joining work at the same time.

At this time, the joining mechanism (7) comprising the column (2), the adapter structure assembly (3) and the elevating drive mechanism (4) is installed in the work bench unit 100, before, on the work bench unit 100, It is installed so that backward movement is possible. In the film joining step, preliminary joining step, and main joining step, the joining mechanism 7 is moved to a position close to the substrate mounting portion 1a as a work by the joining mechanism 7. It is preferable that the operation is performed smoothly, and the bonding operation is not performed. The loading and unloading steps are preferably configured to be moved backward from the substrate mounting portion 1a so as not to interfere. .

In addition, the heating presser 30 of the adapter assembly 3 is formed in the form of a plurality of pressurizer units (30-1, 30-2, 30-3) which are separated from each other and move independently, each of these pressurizer units ( 30-1, 30-2, and 30-3 are formed at the upper part in the state where the guide is made in the guider 36 by being fixedly coupled by pressing the main body 30b inside the fixing member 30a located at the upper part. The diaphragm mechanism 34 is configured to enable the pressure operation independently of each other. At this time, the number of pressurizer units 30-1, 30-2, and 30-3 constituting the heating pressurizer 30 can be added or subtracted, depending on the form of the module to which the joining operation is made or other external factors. The fixing member 30a may be configured in various forms, and the fixing member 30a may be made of a ceramic material having high heat insulation and low thermal conductivity to prevent conduction of heat generated from the pressurizing base 30b. This is preferred.

In addition, the heating mechanism 32 of the adapter assembly 3 is formed in the form of a lower position of the guider 36 to surround the pressurized body 30b from the outside, and a heating source 32a is positioned inside to pressurized body ( It is configured to heat 30b) from the outside and the radiator 32b is located outside the heating source 32a to heat the pressurizing body 30b in the heating source 32a and quickly dissipate any remaining heat to the outside. . At this time, the heating source (32a) is configured to operate by using a halogen lamp or by using an electric heater to be heated from the outside or embedded in the inside of the pressurized body (30b), respectively, the direct heating operation is made Can be configured to

In addition, the diaphragm mechanism 34 of the adapter assembly 3 is provided with an air bag 34b having an empty inside in the housing 34a and compressed air into the air bag 34b at the upper portion of the housing 34a. Or the air passage 34c for discharging the compressed air inside the airbag 34b to the outside, and the upper portion of the heating presser 30 is in contact with each other at the lower portion of the airbag 34b. When the airbag 34b expands in response to the supply of compressed air by the compressor through the air passage 34c, the heating presser 30 descends to perform the joining operation by the heat press operation, and the internal compression from the airbag 34b. When the air is discharged to the outside via the air passage 34c to constrict the airbag 34b, the pressurization operation for the heating pressurizer 30 is released.

In addition, the elevating driving mechanism (4) is to raise or lower the adapter assembly 3 in a state where one side is fixedly installed with the column (2) so as to be positioned at an optimal position to be joined, the adapter structure assembly After the heating presser 30 performs the joining operation by the diaphragm mechanism 34 of (3), the joiner assembly 3 is lifted up so as to be positioned at the ready position for the next joining operation. By the reciprocating motion of the pneumatic cylinder (40) installed on one side, the adapter assembly assembly (3) is configured to enable the ascending and descending operation on the assembly guider (42).

Next, the unloading mechanism 9 is completely bonded until the main bonding of the module to the substrate 10, and then the substrate 10 is separated from the substrate mounting portion 1a of the polygonal cylindrical worktable 1 and then It is a technology configuration to unload to transfer to the place for the process of the process, which can be used by adopting the unloader or industrial robot that is used in the past, and sometimes the operator can perform the unloading work directly. .

In particular, in the present invention, in the case of the structure that constitutes the polygonal cylindrical worktable (1), the column (2), the adapter structure assembly (3) and the elevating drive mechanism (4), conventionally, high-strength steel should be used as a material. In the present invention, the pressurizer units 30-1, 30-2, 30-3, which operate independently, and are deformed in compliance with the shape of the module as the to-be-pressed object are made to be uniformly pressurized. By the characteristics of the diaphragm mechanism 34, it is possible to utilize the material of the aluminum alloy instead of the existing high-strength steel material.

Next will be described in more detail on the basis of the bonding method of the present invention a process in which the operation of the present invention bonding device is made in this way.

That is, each work bench unit 100 of the polygonal cylindrical work bench 1 in which the angular displacement is performed until the unloading step of unloading the substrate 10 on which the module is bonded after the loading step of the substrate 10 for bonding the modules. A process of bonding the modules in a state where the substrate 10 is fixedly positioned at a predetermined position, wherein the anisotropic conductive film is bonded to the surface of the substrate 10 on which the bonding is to be performed. A preliminary splicing step, in which a preliminary splicing is performed, and a main splicing step in which a main splicing of the module is made, are sequentially performed. The polygonal cylindrical workbench 1 at each step in which the angular rotation is made in each step based on the horizontal center axis 1b of the polygonal cylindrical workbench 1 in the step of The work bench unit 100 is provided with a joining mechanism 7 in the work bench unit 100 as a portion adjacent to the substrate mounting unit 1a on the surface of the work bench unit 100 provided on the surface at a predetermined angle, and the work bench unit of the polygonal cylindrical work bench 1 is provided. (100) The loading mechanism 5 and the unloading mechanism 9 are sequentially installed at fixed opposite positions adjacent to the outer circumference, respectively, so that the loading step, the film bonding step, the preliminary bonding step, the main bonding step, and the unloading step are respectively installed. Work is done sequentially.

Loading stage

Mounting the substrate 10 for bonding the module to the corresponding substrate mounting portion (1a) of the workbench unit 100 of the polygonal cylindrical workbench (1), the work is made by the loading mechanism (5). When the loading operation of the substrate 10 is performed as described above, the polygonal cylindrical worktable 1 is displaced by angular rotation by a drive motor, so that the substrate mounting portion 1a on which the substrate 10 is mounted is placed in front of the stage of the film bonding step. Angular displacement is made. In addition, in this step, since no separate bonding operation is required, the joining mechanism 7 installed adjacent to the substrate mounting portion 1a is not operated, and the joining assembly 3 is lifted by the lifting mechanism 4. Position and maintain the standby state without interfering with the aforementioned loading operation.

Film Bonding Step

Next, the anisotropic conductive film is placed on the bonding portion of the substrate 10 by attaching the anisotropic conductive film to the substrate 10 of the substrate mounting portion 1a by the bonding mechanism 7 for the film bonding in the air. In this state, the assembly structure assembly 3 is lowered by the elevating driving mechanism 4, and the film bonding step by the diaphragm mechanism 34, the heating mechanism 32, and the heating presser 30 is performed. After the mounting of the anisotropic conductive film, the polygonal cylindrical worktable 1 is positioned by the elevating drive mechanism 4 to move up and down the adapter structural assembly 3 while the displacement by the angular rotation is made by the driving motor. It is ready to perform the bonding step.

Prebonding Step

Next, at the next stage where the angular displacement is performed, the assembly structure in which the operation for preliminarily bonding various modules including chips or other electronic components requiring mounting on the substrate 10 to which the anisotropic conductive film is bonded is lifted is located. In the preparation state of (3), the bonding mechanism 7 used in the above-described film bonding step is used again in common to perform a preliminary bonding step, and a chip or an electron is placed on the substrate 10 on which the anisotropic conductive film is bonded. With the various modules including the parts in the correct position, the assembly structure 3 is lowered by the elevating driving mechanism 4, and the diaphragm mechanism 34, the heating mechanism 32, and the heating pressurizer 30 are positioned. The preliminary bonding step is performed. After the preliminary bonding of the modules is performed, the polygonal cylindrical worktable 1 is displaced by angular rotation by a drive motor. It is ready to perform the negative main junction step.

Primary bonding stage

Next, the main joining step is continuously performed by the same joining mechanism 7 continuously until the inspection step from the next stage where the angular displacement is made, and the diaphragm mechanism 34 is placed on the prebonded substrate 10. ), The main joining step by the heating mechanism 32 and the heating pressurizer 30 is carried out. This main joining step is performed even in a state where the horizontal cylindrical displacement table 1 is continuously shifted until the inspection step is performed. The main joining operation by the heating press operation by the adapter structure assembly 3 is made. In this way, after the main joining operation is performed, the polygonal cylindrical worktable 1 moves up and down the adapter assembly 3 by the elevating driving mechanism 4 while the displacement is caused by the angular rotation by the driving motor. It remains ready for the loading step.

At this time, the above-described film joining step, preliminary joining step and the main joining step is a joining mechanism of the form including a column (2), the adapter structural body 3 and the elevating driving mechanism (4) as a joining mechanism of the same type. If it is utilized, the work is made based on the following operation sequence, and more specifically, it is as follows.

In common, an anisotropic conductive film or a bonding module prepared in advance is placed on the bonding portion of the substrate 10, and the assembly structure 3 is lowered to the initial position for the bonding operation by the elevating driving mechanism 4, thereby heating the pressurizer ( 30, the pressurizing base body 30b of the pressurizer units 30-1, 30-2, and 30-3 constituting the diaphragm mechanism is placed in contact with the upper part of the anisotropic conductive film or the bonding module, and then the diaphragm mechanism is moved downward from the upper part. A bonding operation is performed by performing an operation of heating and pressurizing by 34. At this time, the pressurizing body 30b of the heating pressurizer 30 is heated by the heating mechanism 32, and the heated pressurizing body 30b is The pressurized body 30b is lowered together with the fixing member 30a while the compressed air passes through the air passage 34c into the inside of the airbag 34b, and the airbag 34b expands inside the housing 34a. , Multiple pressurizer units (30-1, 30-2, 30-3) move independently of each other, the downward pressure operation is also possible to operate differently, in particular, anisotropic conductive film or bonding module in the form of an amorphous or anisotropic conductive film or In the case of several joining modules, even when the height is different from each other or the outer side is inclined on one side, the flexible nature of the airbag 34b allows the deformation to be made to conform to the outer shape and the pressurizing operation to effect effective pressurization operation. In addition, while the pressurized base body 30b heated by the heating source 32a of the above-described heating mechanism 32 pressurizes the anisotropic conductive film or the bonding module, heat transfer by heat conduction is performed, thereby heating and pressurizing the bonding operation. At the same time.

In addition, the heat other than the heat transmitted to the pressurizing body 30b during the heating operation as described above is dissipated to the outside through the radiator 32b, and the heat retaining fixing member 30a to the pressurizing body 30b has high thermal insulation. Due to the low thermal conductivity, the amount of heat transferred to the upper part is relatively small, which does not significantly affect the diaphragm mechanism 34 or other peripheral devices including the airbag 34b, thus reducing the service life without adversely affecting the operation of the peripheral devices. In addition, even if the surface of the substrate 10 to the anisotropic conductive film or the bonding module is uneven or different in height, the pressurizer units 30-1, 30-2, and 30-3 are adapted to such a non-uniform situation. Each of them can be easily located, and once set in such a situation, the pressurizer unit 30-1 of the heating pressurizer 30 from the air bag 34b of the diaphragm mechanism 34 can be located. , 30-2, 30-3) The pressure force is evenly transmitted over the entire top, so that the pressure distribution is uniformly applied to press the substrate 10 and the anisotropic conductive film or module. When pressure bonding the anisotropic conductive film or module onto the substrate 10, a uniform pressing force is transmitted and the quality of the bonded substrate product can be improved.

Unloading Step

Substrate mounting portion provided in the workbench unit 100 of the polygonal cylindrical workbench 1 using the unloading mechanism 9 to the substrate 10 made of the main joining of the module while the main joining step as described above ( Unloading operation is performed to separate it from 1a) and transfer it to the place for the next process, and after the unloading operation of the substrate 10 is performed, the work bench unit 100 of the polygonal work bench 1 is Although the prepared substrate mounting portion 1a is empty, the loading step of mounting the next new substrate 10 by the loading mechanism 5 is sequentially performed, and the polygonal cylindrical worktable 1 is rotated at an angle by the drive motor. Displacement is made by the displacement in front of the stage for the next film bonding step and the sequential work as described above is made continuously.

Of course, the sequence of work described above is divided into stages in which the loading mechanism 5 and the unloading mechanism 9 are installed, respectively, and the technical configuration is made, and the bonding mechanism 7 for film bonding, preliminary bonding, and main bonding. Work is done sequentially by the same bonding mechanism (7).

As described above, according to the present invention, when the substrate 10 is loaded, the unloading is not performed for each process, but the attachment of the anisotropic conductive film without a separate unloading process in the loading state is performed. Pre-bonding and main joining process is performed in sequence to improve the work efficiency by performing the process of unloading the substrate 10 after the bonding of the module is completed, suitable for mass production, the above several process is a polygonal cylindrical workbench (1 It is possible to displace the stage by angular rotation, so that it is possible to make three-dimensional facilities and work arrangements, and to effectively use the installation and work space, and to press various types of modules including substrates and anisotropic conductive films or chips. In the splicer structure assembly 3, the pressure distribution is made uniform during the pressing operation. The pressure distribution on the uniform distribution is maintained at all times during the pressurizing operation, and the uniform pressing force is transmitted during the pressure bonding of the module on the substrate 10, so that accurate and precise bonding is possible, thereby dramatically improving the quality of the flat panel display products. While improving, the surface state of the module to which the pressure bonding is made on the substrate 10 is not the same and is not flat so that the module surface of various types disposed on the substrate 10 can be maintained in a non-flat state as a whole. Even if the pressurization mechanism is properly balanced, the pressurization operation is carried out consistently, thus eliminating defects of the product in advance, and it can be appropriately applied to various working conditions that are difficult to work with. Size of substrate for table or table work table If there is a limit to increase, such a limitation can be easily solved, and the work bench unit 100 configured for each stage in which the work is made as the angular displacement is made can be configured identically with each other to facilitate the manufacture of the entire equipment. Maintenance can also be made effectively.

1: polygonal workbench, 1a: board mounting part,
1b: central axis, 2: column,
3: adapter structure assembly, 4: lift and lower drive mechanism,
5: loading mechanism, 7: splicing mechanism,
9: unloading mechanism, 10: substrate,
30: heating presser,
30-1, 30-2, 30-3: pressurizer unit, 30a: holding member,
30b: pressurized body, 32: heating mechanism,
32a: heating source, 32b: radiator,
34: diaphragm mechanism, 34a: housing,
34b: air bag, 34c: air passage,
36: guider, 40: pneumatic cylinder,
42: assembly guider, 100: work bench unit

Claims

The horizontal center axis 1b is installed at the center and formed to form a polygon when viewed from both sides, and each work surface unit 100 having a substrate mounting unit 1a is installed on each surface of the polygon, and the horizontal center axis 1b is installed. And a substrate mounting unit (1a) provided on the surface of each of the work bench unit (100) constitutes a polygonal cylindrical work bench (1) installed to enable rotation of the angle at a predetermined angle with respect to the work bench unit (100). As a contiguous part, the polygonal cylindrical worktable 1 is provided with a joining mechanism 7 respectively, and the loading mechanism 5 and the unloading part are fixed to the opposite side of the substrate mounting portion 1a located on the surface of the worktable unit 100. It is made by arranging and fixing the mechanism 9 sequentially, respectively,
The joining mechanism (7) is a column (2) which is installed separately and fixed at a position adjacent to one side of the polygonal cylindrical worktable (1), and installed on one side of the column (2) and the module on the substrate 10 And a lifter assembly (4) installed on one side of the column (2) for lifting and lowering the coupler assembly (3) to be joined by heating and pressing. But
The adapter structure assembly (3) is located inside the lower and the heating up and down is made up and down the heating pressurizer (30) for joining by heating and pressing the module;
A heating mechanism (32) provided to heat the heating pressurizer (30) in a state wrapped in a lower portion thereof;
A diaphragm mechanism (34) installed to pressurize or raise the heating pressurizer (30) from above; And
And a guider (36) for guiding the heating presser (30) during the lowering or raising operation of the heating presser (30).

The method of claim 1,
The heating pressurizer 30 of the adapter assembly 3 is formed in the form of a plurality of pressurizer units 30-1, 30-2, 30-3 which are separated from each other and move independently.
Each of the pressurizer units 30-1, 30-2, and 30-3 is formed by pressing the main body 30b into the inner side of the fixing member 30a positioned at the upper portion thereof, thereby guiding the inside of the guider 36. Module bonding apparatus for a flat panel display, characterized in that the configuration is made to enable the pressure operation independently by the diaphragm mechanism 34 located in the upper state.

The method of claim 1,
The heating mechanism 32 of the adapter assembly 3 is formed to surround the pressurized body 30b from the outside as the lower position of the guider 36, and the heating source 32a is positioned inside to pressurized body 30b. Is heated from the outside and the radiator 32b is located on the outside of the heating source 32a to heat the pressurized body 30b in the heating source 32a, and is configured to quickly radiate the remaining heat to the outside quickly. Module bonding apparatus for flat panel displays.

The method of claim 1,
The diaphragm mechanism 34 of the adapter structure assembly 3 is provided with an air bag 34b having an empty inside in the housing 34a, and supplies compressed air into the air bag 34b at the upper portion of the housing 34a. Or it is provided with an air passage (34c) for discharging the compressed air in the air bag (34b) to the outside, the lower portion of the air bag (34b) is characterized in that the configuration is made in contact with each other Module bonding device for flat panel displays.

The method of claim 1,
The elevating drive mechanism (4) is the one side is fixed to the column (2) by the reciprocating movement of the pneumatic cylinder (40) installed on one side of the assembly assembly assembly (3) by the assembly guider (42) Module bonding apparatus for a flat panel display, characterized in that the configuration is made possible to operate.

The method of claim 1,
The joining mechanism (7) is installed on the work bench unit (100), but the module bonding apparatus of the flat panel display, characterized in that the configuration is made so as to enable forward and backward movement on the work bench unit (100).

Predetermined each work unit unit 100 of the polygonal cylindrical worktable 1 in which the angular displacement is performed until the unloading step of unloading the substrate 10 on which the module is bonded after the loading step of the substrate 10 for bonding the module. Bonding of the module is performed in a state where the substrate 10 is fixedly positioned at the position, the film bonding step of bonding the anisotropic conductive film to the surface of the substrate 10 to be bonded, pre-bonding the module This preliminary splicing step, and the main splicing step of the main splicing of the module is made sequentially,
Surface of the work bench unit 100 provided on the surface at each predetermined angle of the polygonal cylindrical workbench 1 at each step in which the angular rotation is performed in each step based on the horizontal center axis 1b of the polygonal cylindrical workbench 1. The work table unit 100 and the joining mechanism 7 are respectively provided as a portion adjacent to the board mounting portion 1a of the workbench, and are fixedly opposed to the board mounting portion 1a of the work bench unit 100 of the polygonal cylindrical work bench 1. The loading mechanism 5 and the unloading mechanism 9 are sequentially installed at positions, respectively, so that the loading step, the film joining step, the preliminary joining step, the main joining step and the unloading step are sequentially performed. Module bonding method of display.