KR20130004008A - Module bonding apparatus for producing a plate type display - Google Patents

Module bonding apparatus for producing a plate type display Download PDF

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Publication number
KR20130004008A
KR20130004008A KR1020110071763A KR20110071763A KR20130004008A KR 20130004008 A KR20130004008 A KR 20130004008A KR 1020110071763 A KR1020110071763 A KR 1020110071763A KR 20110071763 A KR20110071763 A KR 20110071763A KR 20130004008 A KR20130004008 A KR 20130004008A
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KR
South Korea
Prior art keywords
heating
module
pressurizer
assembly
substrate
Prior art date
Application number
KR1020110071763A
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Korean (ko)
Inventor
박웅기
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박웅기
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 박웅기 filed Critical 박웅기
Priority to KR1020110071763A priority Critical patent/KR20130004008A/en
Publication of KR20130004008A publication Critical patent/KR20130004008A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application

Abstract

PURPOSE: A module bonding apparatus of flat panel display is provided to apply uniform pressure to a substrate in a module pressing process and to implement elaborate module bonding. CONSTITUTION: A substrate(10) is fixed to a worktable(1). A bonding apparatus assembly(3) is installed at one side of a column(2). The bonding apparatus assembly welds a module to the upper part of the substrate under pressure. An elevating apparatus(4) moves up and down the bonding apparatus assembly. The elevating apparatus is installed in one side of the column.

Description

Module bonding apparatus for producing a plate type display}

The present invention is used in various bonding processes such as chip on glass, tape automated bonding (TAB), tape carrier package (TCP), heat seal, and the like during the manufacturing of flat panel displays. A module bonding apparatus for a flat panel display.

In general, a flat panel display is a display device used in various monitors, PDAs, TAB PCs, portable computers, mobile phone terminals, and the like, and the flat panel display uses LCD, PDP, LED, FED, and the like.

The process of manufacturing such a flat panel display necessarily includes a step of bonding a driver IC or FPC (Flexible Printed Circuit) to the side of the substrate, and in the case of such a bonding process, according to the conventional mechanical press method It is configured to press the hot bar by using a pneumatic cylinder in a state in which the substrate to be bonded to the upper portion of the predetermined holder is placed in the correct position, the pressure applied by the pneumatic cylinder is transferred to a part of the hot bar intensively As a result, there is not evenly distributed pressing force over the entire area of the hot bar, but it is biased to one side and has uneven distribution pressure. Consequently, the pressure bonding process of the module on the substrate cannot be made uniformly and evenly. It lowers and becomes a cause of product defect.

In addition, even if the hot bar is precisely processed to match the appearance of the module, there is a problem that cannot solve the above fundamental problems due to structural defects due to mechanical coupling between the pneumatic cylinder and the hot bar.

In addition, as a module to be bonded on the substrate, for example, when various chips are bonded and bonded, the surface of the substrate is not horizontally flat but pressurized when the projections appear irregularly. When the bonding process is performed, the surface on which the hot bar is pressurized is generally flat, so that the surface of the module and the surface of the hot bar on which the press is made are completely different from each other. Since the distribution is maintained in a non-uniform state is causing a fundamental problem that the pressure bonding operation can not be made properly.

In addition, in the conventional process of attaching the anisotropic conductive film on the substrate in the manufacturing process of the flat panel display, the anisotropic conductive film is attached after loading the substrate at a predetermined position and fixing it in position in the stage for attaching the film. Then, the process of hot pressing, peeling off the release paper, and then unloading the substrate on which the anisotropic conductive film is attached are carried out. The process of bonding the chip is performed by dividing the preliminary bonding process and the main bonding process. In the prebonding process of the chip, the anisotropic conductive film is attached in the process of attaching the above anisotropic conductive film, and the unloaded substrates, which have reached the corresponding order, are loaded into the stage for performing the prebonding process of the chip again. Many chips are picked up from the ready tray, flipped over and placed in position for splicing. After performing the preliminary bonding process and repeatedly performing the preliminary bonding on the next chip as necessary, the process of unloading the substrate on which the preliminary bonding of the chip is made is performed. The main bonding process of the chip is performed in the preliminary bonding process. Pre-bonded and unloaded boards are loaded into the stage for performing the main bonding of the chip, and then placed in place. Then, the main bonding process is performed. The process of unloading the substrate is performed.

As such, the process of attaching the anisotropic conductive film to the substrate, the process of pre-bonding the chips, and the process of main bonding of the chips all require loading and unloading for each process. The facilities for performing the loading unloading are required separately, causing inefficient problems.

In addition, these processes are separate and the working lines are configured to have different linear arrangements in the horizontal direction, which requires a relatively large amount of space for the layout of the work space or related equipment required for the joining operation of the entire electronic component. On the whole manufacturing line, the inefficient use of space has been pointed out, but there are no separate measures to solve it separately.

The present invention has been accomplished in order to solve the problems of the prior art, and has the following objectives.

The main object of the present invention is to provide a pressure mechanism that pressurizes various types of modules including a substrate and an anisotropic conductive film or a chip so that the pressure distribution can be uniformly applied throughout the entire area during the pressing operation. The pressure distribution on the uniform distribution is maintained at all times, so that the uniform pressing force is transmitted during the pressure bonding of the module on the substrate, so that accurate and precise bonding is possible, and the quality of the flat panel display product can be significantly improved.

Another object of the present invention is that even though the surface state of the entire electronic component to be pressure-bonded on the substrate is not the same and not flat, even if the surface of the module of various forms arranged on the substrate to maintain a non-flat state as a whole Correspondingly, the pressurization mechanism is set in a balanced manner and the pressurization operation is consistently to exclude the defective factors of the product in advance, so that it can be properly applied to various working conditions difficult to work.

Another object of the present invention is that once the loading of the substrate for the bonding of the module is not unloaded for each process, but instead of attaching the anisotropic conductive film without a separate unloading process in the loading state once, the preparation of the module Bonding and main bonding process are performed in sequence to improve the work efficiency by performing the process of unloading the substrate after the bonding of the module is completed, suitable for mass production, the above several processes are the displacement of the stage by the angular rotation of the turntable It is intended to enable three-dimensional equipment and work arrangements and to make efficient use of installation and work space.

The present invention is a work table for fixing the substrate to be bonded to the module on the surface in the adjacent position of the column in order to achieve the above object, a column which is installed in a fixed position adjacent to one side of the work table, and one side of the column And a lifter assembly installed at the upper portion of the substrate to heat and pressurize the module to the upper portion of the substrate, and a lift drive mechanism installed at the top of the column to move the lifter assembly up and down. The adapter structure assembly may include a heating pressurizer that is positioned inside the lower portion and moves up and down while joining by heating and pressing the module; A heating mechanism provided to heat the heating pressurizer in a state wrapped in a lower portion thereof; A diaphragm mechanism installed to press or raise the heating pressurizer from above; And there is provided a module bonding apparatus comprising a guider for guiding the heating pressurizer during the lowering or raising operation of the heating pressurizer.

Thus, according to the present invention, in the pressurizing mechanism that pressurizes various types of modules including the substrate and the anisotropic conductive film or chip, the pressurizing operation is configured so that the pressure distribution can be made uniformly over the entire part during the pressurizing operation. The pressure distribution in the uniform distribution is maintained at all times, so that even pressure is transmitted during pressure bonding of the module on the substrate, enabling accurate and precise bonding, which can dramatically improve the quality of flat panel display products. Even though the surface state of the entire electronic parts to be made is not the same and not flat, even if the surface of the module of various forms placed on the substrate is not flat as a whole, the pressure mechanism is placed in a balanced position accordingly. While pressing, the pressurized operation is performed regularly, which causes the defect of the product. This is to exclude the problem in advance, and to be able to appropriately apply to various working conditions that are difficult to work with.

1 is a schematic illustration of some omitted as a preferred example of the present invention,
2 is a front view of FIG. 1;
3 is a partially omitted enlarged side view in FIGS. 1 and 2;
4 is a front view of main parts of FIG. 3;
5 is a side view of main parts of FIG. 3;
6 is an operational state diagram of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, referring to the apparatus of the present invention, a worktable 1 for fixing a substrate 10 to be bonded to a surface on a surface in a position adjacent to a column 2 is commonly used, and adjacent to one side of the worktable 1. A column (2) fixed in a fixed position and a joint assembly (3) installed on one side of the column (2) and installed to heat and press the module on top of the substrate (10), and the bonding It includes a lifting drive mechanism (4) installed on one side of the column (2) to raise and lower the instrument assembly (3), wherein the adapter structure assembly (3) is located on the lower inner side and the lifting A heating pressurizer 30 for heating and pressurizing the module; A heating mechanism (32) provided to heat the heating pressurizer (30) in a state wrapped in a lower portion thereof; A diaphragm mechanism (34) installed to pressurize or raise the heating pressurizer (30) from above; And a guider 36 for guiding the heating pressurizer 30 during the lowering or raising operation of the heating pressurizer 30.

At this time, the work table 1 is to fix the position of the substrate 2 to be bonded to the module at a predetermined position and to perform the bonding operation of the module by the adapter assembly 3, the assembly of the assembly 3 It is located in the lower position, the method of fixing the position of the substrate 2 is utilized by selecting the fixing method by the jig or clamp.

In addition, the column 2 is fixedly installed at a position adjacent to the work table 1 to serve as a support pillar for installing the adapter assembly 3, and the elevating drive mechanism with the adapter structure assembly 3 (4) is installed to be coupled to each other, and in some cases the position displacement mechanism of the various forms that the position is directly coupled or installed in the X direction, Y direction or Z direction without interposing the elevating drive mechanism (4) It can be configured by coupling and fixing to each other in the form interposed in the middle.

In addition, the heating presser 30 of the adapter assembly 3 is formed in the form of a plurality of pressurizer units (30-1, 30-2, 30-3) which are separated from each other and move independently, each of these pressurizer units ( 30-1, 30-2, and 30-3 are formed at the upper part in the state where the guide is made in the guider 36 by being fixedly coupled by pressing the main body 30b inside the fixing member 30a located at the upper part. The diaphragm mechanism 34 is configured to enable the pressure operation independently of each other. At this time, the number of pressurizer units 30-1, 30-2, and 30-3 constituting the heating pressurizer 30 can be added or subtracted, depending on the form of the module to which the joining operation is made or other external factors. The fixing member 30a may be configured in various forms, and the fixing member 30a may be made of a ceramic material having high heat insulation and low thermal conductivity to prevent conduction of heat generated from the pressurizing base 30b. This is preferred.

In addition, the heating mechanism 32 of the adapter assembly 3 is formed in the form of a lower position of the guider 36 to surround the pressurized body 30b from the outside, and a heating source 32a is positioned inside to pressurized body ( It is configured to heat 30b) from the outside and the radiator 32b is located outside the heating source 32a to heat the pressurizing body 30b in the heating source 32a and quickly dissipate any remaining heat to the outside. . At this time, the heating source (32a) is configured to operate by using a halogen lamp or by using an electric heater to be heated from the outside or embedded in the inside of the pressurized body (30b), respectively, the direct heating operation is made Can be configured to

In addition, the diaphragm mechanism 34 of the adapter assembly 3 is provided with an air bag 34b having an empty inside in the housing 34a and compressed air into the air bag 34b at the upper portion of the housing 34a. Or the air passage 34c for discharging the compressed air inside the airbag 34b to the outside, and the upper portion of the heating presser 30 is in contact with each other at the lower portion of the airbag 34b. When the airbag 34b expands in response to the supply of compressed air by the compressor through the air passage 34c, the heating presser 30 descends to perform the joining operation by the heat press operation, and the internal compression from the airbag 34b. When the air is discharged to the outside via the air passage 34c to constrict the airbag 34b, the pressurization operation for the heating pressurizer 30 is released.

In addition, the elevating driving mechanism (4) is to raise or lower the adapter assembly 3 in a state where one side is fixedly installed with the column (2) so as to be positioned at an optimal position to be joined, the adapter structure assembly After the heating presser 30 performs the joining operation by the diaphragm mechanism 34 of (3), the joiner assembly 3 is lifted up so as to be positioned at the ready position for the next joining operation. By the reciprocating motion of the pneumatic cylinder (40) installed on one side, the adapter assembly assembly (3) is configured to enable the ascending and descending operation on the assembly guider (42).

In particular, in the present invention, in the case of the structure that constitutes the workbench (1), the column (2), the adapter structure assembly (3) and the elevating drive mechanism (4), in the past, high-strength steel should be used as a material. In the present invention, the diaphragm is made to perform a uniform pressurization operation while conforming and deforming according to the shape of the pressurizer units 30-1, 30-2 and 30-3 which are independently operated and the module to be joined or pressurized. By the characteristics of the mechanism 34, it is possible to utilize the material of the aluminum alloy instead of the existing high-strength steel material.

Next will be described in more detail by dividing the operation relationship of the bonding device made in this way step by step.

Loading stage

As a step of fixing the substrate 10 to be bonded to the module downward to the fixed position on the surface of the work table 1, the operator directly lifts the substrate 10 to fix the position using a jig or clamp Let's go.

Bonding Step

Next, the bonding module prepared in advance in the bonding portion of the substrate 10 and performing the bonding operation by heating and pressing by the assembly assembly 3, the bonding module prepared in advance in the bonding portion of the substrate 10 Pressurizer units (30-1, 30-2, 30-3) forming the heating presser (30) by lowering the adapter assembly (3) to the initial position for the joining operation by the elevating driving mechanism (4). The pressure main body 30b is placed in contact with the upper part of the bonding module, and then the heating operation is performed by the diaphragm mechanism 34 downward from the top to perform the joining operation. 32 pressurizes the pressurized body 30b of the heating pressurizer 30, and the heated pressurized body 30b causes the compressed air to flow into the inside of the airbag 34b via the air passage 34c from the outside and the housing ( From the inside of 34a) While the back bag 34b is inflated, the pressing body 30b is lowered together with the fixing member 30a, and the plurality of pressurizing units 30-1, 30-2, and 30-3 are moved independently, respectively, and the pressing operation is lowered. Different operation is possible, and in particular, the shape of the bonding module is atypical, or in the case of several bonding modules, even if the height is different from each other or one side is inclined in the shape of the flexible nature of the airbag 34b The pressing operation is made by adapting to the appearance and the pressing operation is performed, and the effective pressing operation is achieved. Further, the pressing main body 30b heated by the heating source 32a of the heating mechanism 32 is connected to the module for bonding. While pressurizing the heat transfer by heat conduction is made at the same time heating and pressure bonding operation is made.

In addition, the heat other than the heat transmitted to the pressurizing body 30b during the heating operation as described above is dissipated to the outside through the radiator 32b, and the heat retaining fixing member 30a to the pressurizing body 30b has high thermal insulation. Due to the low thermal conductivity, the amount of heat transferred to the upper part is relatively small, which does not significantly affect the diaphragm mechanism 34 or other peripheral devices including the airbag 34b, thus reducing the service life without adversely affecting the operation of the peripheral devices. In addition, even if the surface of the substrate 10 or the bonding module is uneven or different in height, the pressurizer units 30-1, 30-2, and 30-3 are easily individually adapted to such a non-uniform situation. And the pressurizer units 30-1, 30-2, 30-3 of the heating pressurizer 30 from the airbag 34b of the diaphragm mechanism 34 once the seat is set in such a situation. The pressing force is evenly transmitted over each of them, and the pressing force distribution that pressurizes the substrate 10 and the module is uniform, so that the pressing force is uniformly distributed during the pressing operation so that the pressing force of the module on the substrate 10 is uniform. One pressing force is transmitted and the quality of the bonded substrate product can be improved.

Unloading Step

In the unloading step, after the pressurized heating joining of the module is completed in the bonding step as described above, the heating presser 30 is raised by the lifting mechanism 4, and then the substrate 10 on which the module is bonded is placed on the work table 1. And unloading from the diaphragm mechanism 34, which has been pressurized by the inflation of the airbag 34b, through the air tongue 34c, the compressed air therein from the airbag 34b. By discharging to the outside, the airbag 34b is contracted, the pressurized state of the heating pressurizer 30 is released, and the pneumatic cylinder 40 of the elevating mechanism 4 is used to raise the adapter structure assembly 3 to its original position. The unloading operation of separating and fixing the substrate 10, which is disposed and fixed on the surface of 1), is performed.

As described above, according to the present invention, in pressurizing and bonding various types of modules including a substrate and an anisotropic conductive film or a chip, the pressure distribution is configured so that the pressure distribution can be made uniformly over the entire area during the pressurizing operation. When the pressure distribution on the uniform distribution is always maintained, the uniform pressing force is transmitted during the pressure bonding of the module onto the substrate 3 to enable accurate and precise bonding, thereby significantly improving the quality of the flat panel display product. (3) Even though the surface state of the entire electronic parts to be heated and pressurized on the same is not the same and is not flat, even if the surface of various types of modules arranged on the substrate 3 is not flat, the pressurizer As the 30 is balanced, the pressurized operation is performed constantly, which causes the defect of the product. Excluded in advance and, appropriately in a variety of difficult working conditions, job application to become available will have a favorable advantage.

1: worktable, 2: column,
3: adapter structure assembly, 4: lift and lower drive mechanism,
10: substrate, 30: pressurizer,
30-1, 30-2, 30-3: pressurizer unit, 30a: holding member,
30b: pressurized body, 32: heating mechanism,
32a: heating source, 32b: radiator,
34: diaphragm mechanism, 34a: housing,
34b: air bag, 34c: air passage,
36: guider, 40: pneumatic cylinder,
42: assembly guider

Claims (5)

A worktable 1 for fixing the substrate 10 to which the module is to be bonded to the surface at an adjacent position of the column 2;
A column (2) fixed and installed in a position adjacent to one side of the work table (1),
A joint structure assembly (3) installed at one side of the column (2) and installed to heat and press the module on top of the substrate (10), and
It includes a lifting drive mechanism (4) installed on one side of the column (2) to raise and lower the adapter structure assembly 3,
The adapter structure (3)
A heating pressurizer 30 positioned inside the lower portion and configured to heat and press the module while lifting and lowering;
A heating mechanism (32) provided to heat the heating pressurizer (30) in a state wrapped in a lower portion thereof;
A diaphragm mechanism (34) installed to pressurize or raise the heating pressurizer (30) from above; And
And a guider (36) for guiding the heating pressurizer (30) during the lowering or raising operation of the heating pressurizer (30).
The method of claim 1,
The heating pressurizer 30 of the adapter assembly 3 is formed in the form of a plurality of pressurizer units 30-1, 30-2, 30-3 which are separated from each other and move independently.
Each of the pressurizer units 30-1, 30-2, and 30-3 is formed by pressing the main body 30b into the inner side of the fixing member 30a positioned at the upper portion thereof, thereby guiding the inside of the guider 36. Module bonding apparatus for a flat panel display, characterized in that the configuration is made to enable the pressure operation independently by the diaphragm mechanism 34 located in the upper state.
The method of claim 1,
The heating mechanism 32 of the adapter assembly 3 is formed to surround the pressurized body 30b from the outside as the lower position of the guider 36, and the heating source 32a is positioned inside to pressurized body 30b. Is heated from the outside and the radiator 32b is located on the outside of the heating source 32a to heat the pressurized body 30b in the heating source 32a, and is configured to quickly radiate the remaining heat to the outside quickly. Module bonding apparatus for flat panel displays.

The method of claim 1,
The diaphragm mechanism 34 of the adapter structure assembly 3 is provided with an air bag 34b having an empty inside in the housing 34a, and supplies compressed air into the air bag 34b at the upper portion of the housing 34a. Or it is provided with an air passage (34c) for discharging the compressed air in the air bag (34b) to the outside, the lower portion of the air bag (34b) is characterized in that the configuration is made in contact with each other Module bonding device for flat panel displays.
The method of claim 1,
The lifting and lowering drive mechanism 4 is to raise or lower the adapter assembly 3 in a state in which one side is fixed to the column 2, so that the joining operation can be made,
A module bonding apparatus for a flat panel display, characterized in that the assembly structure assembly (3) is configured to enable the ascending and descending operation of the assembly guider (42) by the reciprocating motion of the pneumatic cylinder (40) installed on one side.
KR1020110071763A 2011-07-20 2011-07-20 Module bonding apparatus for producing a plate type display KR20130004008A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110071763A KR20130004008A (en) 2011-07-20 2011-07-20 Module bonding apparatus for producing a plate type display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110071763A KR20130004008A (en) 2011-07-20 2011-07-20 Module bonding apparatus for producing a plate type display

Publications (1)

Publication Number Publication Date
KR20130004008A true KR20130004008A (en) 2013-01-09

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Application Number Title Priority Date Filing Date
KR1020110071763A KR20130004008A (en) 2011-07-20 2011-07-20 Module bonding apparatus for producing a plate type display

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107577072A (en) * 2017-09-28 2018-01-12 苏州富强加能精机有限公司 It is a kind of with this pressure device of the LCDs of hoistable platform

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107577072A (en) * 2017-09-28 2018-01-12 苏州富强加能精机有限公司 It is a kind of with this pressure device of the LCDs of hoistable platform
CN107577072B (en) * 2017-09-28 2024-02-09 苏州富强加能精机有限公司 Liquid crystal display screen pressing device with lifting platform

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