TW201635411A - Substrate assembly apparatus and substrate assembly method using the same - Google Patents

Abstract

Topics are to provide resolution of an adhesive error caused by a dimensional error between an upper substrate and a lower substrate. Provided are a substrate assembly apparatus capable of making the upper substrate and the lower substrate adhere to each other precisely, and a substrate assembly method using the same. The substrate assembly apparatus has: a lower stand (4) for holding the lower substrate (K2); an upper stand (3) having a plurality of cutting driving parts (31); a plurality of adhesive pins (8) which move in a perpendicular direction with an adhesive pin plate (8a) for holding the upper substrate (K1); an up and down driving mechanism causing the adhesive pin plate (8a) to perform the vertical motion; and an actuator (32) causing displacement of the cutting driving parts (31). In the state of both the adhesive pin plate (8a) and the cutting driving parts (31) being displaced by identical displacement quantity, the upper substrate (K1) held at the adhesive pins (8) adheres to the lower substrate (K2) held by the lower stand (4). Furthermore, the upper substrate (K1) and the lower substrate (K2) are pressed by the cutting driving parts (31) under the state of displacement.

Description

Substrate assembly device and substrate assembly method using same

The present invention relates to a substrate assembly apparatus and a substrate assembly method using the substrate assembly apparatus.

According to Patent Document 1, the present invention relates to that the drive unit for separation and the drive unit for loading and unloading are controlled by the control unit, and one or both of the first holding member or the adhesive pin are opposed to each other in a reduced pressure environment. Moving relatively close to the second holding member, so that the first workpiece and the second workpiece are attached. After the bonding, in a state where the rigid abutting surface of the first holding member contacts the first workpiece, The adhesive pin moves in a direction separating from the first workpiece such that the peripheral portion of the portion of the first workpiece adhered by the adhesive pin is held in contact with the rigid abutting surface to be along the rigid shape as the adhesive pin is peeled off Abutting the surface. Therefore, the deformation of the first workpiece can be suppressed to a minimum when the first workpiece holding the first holding member is pressed and when the adhesive pin of the first workpiece is removed." (Refer to paragraph 0007 ).

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent No. 5654155

The workpiece bonding apparatus (substrate assembly apparatus) described in Patent Document 1 is configured to suppress the bonding device for bonding the first workpiece (upper substrate) and the second workpiece (lower substrate) from the first holding member (on the stage) The deformation of the first workpiece at the time of removal.

However, to accurately fit the first workpiece and the second workpiece, it is necessary to align the position of the first workpiece and the second workpiece before the fitting.

Patent Document 1 describes that "the first holding member 1 or the second holding member 2 is adjusted to be moved relative to the other before the bonding of the first workpiece W1 and the second workpiece W2. In the XYθ direction, it is preferable to perform alignment (alignment) of the first workpiece W1 and the second workpiece W2. (Refer to paragraph 0020), but a method for specific alignment is not described.

Further, in the adjustment movement of the XYθ direction, the positional deviation between the first workpiece and the second workpiece can be adjusted, but the fitting error (pitch deviation) which occurs due to the dimensional error generated during production or the like cannot be eliminated.

An object of the present invention is to provide a substrate assembly apparatus that can accurately bond a top substrate and a lower substrate, and a substrate assembly method using the same, which can eliminate the bonding error caused by the dimensional error between the upper substrate and the lower substrate.

In order to solve the above problems, the present invention provides a substrate assembly apparatus and a substrate assembly method using the same, comprising: a lower stage having a lower substrate surface for holding the lower substrate; and a divided planar portion formed to face the lower substrate surface The upper stage of the plurality of divided drive units; the plurality of adhesive pins disposed corresponding to the divided plane portion and displaced in the vertical direction with respect to the corresponding divided plane portions; and capable of holding the upper substrate in a vacuum environment; a vacuum chamber for accommodating the lower stage and the upper stage and the adhesion pin; a first driving mechanism for moving the adhesion pin and the upper stage toward the lower stage; and a plurality of base parts of the one or more adhesion pins; a second driving mechanism that is vertically movable with respect to the dividing plane portion; a third driving mechanism that disperses a plurality of the divided driving portions toward the lower substrate surface; and is connected to a vacuum suction opening to the adhesion pin a first attraction means for the hole; and a second connection to the suction hole formed on the lower substrate surface The adhesion means is configured to hold the upper substrate by displacement of the base portion with a displacement amount set for each of the base portions, and further, each of the division drive units corresponds to an attachment Displacement of the amount of displacement of the base portion of the adhesive pin disposed in the dividing plane portion of the split driving portion, and holding the lower substrate while driving the first substrate while the lower stage is in a vacuum environment in the vacuum chamber a driving mechanism that bonds the upper substrate held by the adhesive pin to the lower substrate, and drives the second driving mechanism at a time when the lower substrate is bonded to the upper substrate such that the adhesive pin is introduced from the dividing plane portion Simultaneously driving the first drive mechanism, and pressing the upper base in the divided drive unit in a displaced state The board and the aforementioned lower substrate.

According to the present invention, it is possible to provide a substrate assembly apparatus and a substrate assembly method using the same, which can eliminate the bonding error caused by the dimensional error of the upper substrate and the lower substrate, and can accurately bond the upper substrate and the lower substrate. Thereby, it is possible to effectively correct the difference in the mark pitch due to the dimensional error of the upper substrate and the lower substrate, and to perform the bonding.

1‧‧‧Substrate assembly device

3‧‧‧ going on stage

3a‧‧‧Upper substrate surface

4‧‧‧ step down

4a‧‧‧ Lower substrate surface

5‧‧‧vacuum room

5a‧‧‧Upper chamber

5b‧‧‧ lower chamber

8‧‧‧Adhesive pin

8a‧‧‧Adhesive pin plate (base part)

8b‧‧‧Adhesive

8c‧‧‧vacuum adsorption hole

8d‧‧‧ gas supply means

10‧‧‧ camera

20‧‧‧Z-axis drive mechanism (first drive mechanism)

31‧‧‧Divided drive department

31a‧‧‧Divided plane

32‧‧‧Actuator (3rd drive mechanism)

41‧‧‧Mobile agencies

43‧‧‧Attraction hole

80‧‧‧Up and down moving mechanism (2nd drive mechanism)

100‧‧‧Control device

K1‧‧‧Upper substrate

K2‧‧‧lower substrate

Mk1‧‧‧1st mark (upper mark)

Mk2‧‧‧1st mark (below mark)

P2‧‧‧vacuum pumping (first attraction means)

P3‧‧‧vacuum pumping (second attraction means)

FIG. 1 is a view showing a substrate assembly apparatus.

[Fig. 2] A diagram showing a support pin.

FIG. 3 is a view showing the configuration of the upper stage.

Fig. 4 is a view showing the upper substrate surface of the upper stage.

[Fig. 5] A view showing an adhesive pin.

Fig. 6 is a view showing an upper substrate surface of the upper stage, showing an example of the arrangement of the adhesive pins.

Fig. 7 (a) is a diagram showing a lower stage, and (b) is a cross-sectional view of Sec1-Sec1.

FIG. 8 is a view showing a procedure of bonding a substrate by a substrate assembly apparatus. FIG.

9] FIG. 9 is a view showing a mark for adjusting a bonding position of an upper substrate and a lower substrate, and (a) shows an upper mark attached to an upper substrate. (b) is a diagram showing a lower mark attached to the lower substrate.

FIG. 10 is a view showing a state in which the deviation between the upper mark of the upper substrate and the lower mark of the lower substrate is adjusted, (a) shows a deviation in the XY-axis direction, and (b) shows the adjusted XY axis. The state of the deviation of the direction is plotted.

[Fig. 11] A diagram showing a state in which the deviation between the upper mark of the upper substrate and the lower mark of the lower substrate is adjusted, (a) is a diagram showing the deviation around the Z-axis, and (b) is for the adjusted winding Z. The state of the deviation of the axis is plotted.

[Fig. 12] A diagram showing a state in which the deviation between the first upper mark and the first lower mark is within a predetermined range, and (a) is a state in which the first upper mark is at the center of the first lower mark. (b) is a diagram showing a state in which the first upper mark is shifted from the center of the first lower mark.

FIG. 13 is a view showing a state in which the amount of displacement of the adhesive pin plate is changed to reduce the deviation between the upper substrate and the lower substrate, and (a) is a state in which the first upper mark and the first lower mark are deviated. (b) is a diagram showing a state in which the deviation between the first upper mark and the first lower mark is reduced (a state in which the mark pitch of the upper substrate and the lower substrate is corrected).

[Fig. 14] (a) is a view showing a state in which the split driving unit is displaced in accordance with the shape of the upper substrate, and (b) is a view showing a state in which the upper substrate and the lower substrate are pressed by the upper stage.

Fig. 15 is a view showing a modification of the design, wherein (a) is a view showing a state in which displacement amounts of the adhesive pins attached to one of the adhesive pin plates are different, and (b) is directed to one divided drive unit. Corresponding to the structure of one adhesive pin Into the diagram shown.

FIG. 16 is a view showing another design modification example, wherein (a) is a diagram in which four divided drive units correspond to one adhesive pin plate, and (b) is directed to one divided drive unit. A diagram corresponding to the state of the three adhesive pin plates.

Fig. 17 is a view showing still another design modification example, wherein (a) is a diagram showing a design modification example in which all the adhesive pins are attached to one adhesive pin plate, and (b) is an integral one. A diagram showing a design change of the structure of the structure is shown.

Hereinafter, the substrate assembly apparatus and the substrate assembly method according to the embodiments of the present invention will be described in detail with reference to the drawings. In the following drawings, the same reference numerals are given to the common members, and the overlapping description will be omitted as appropriate.

[Examples]

FIG. 1 is a view showing a substrate assembly apparatus.

In the substrate assembly apparatus 1, the upper substrate K1 (glass substrate) and the lower substrate K2 (glass substrate) carried by the transfer device 200 such as a robot arm are bonded in a vacuum to assemble a substrate such as a liquid crystal panel. Device. The substrate assembly apparatus 1 is controlled by the control device 100.

The substrate assembly apparatus 1 has a gantry 1a and an upper frame 2. The gantry 1a is placed on the installation surface (ground, etc.). The upper frame 2 can be mounted up and down Above the stand 1a.

The upper frame 2 is attached to the first drive mechanism (Z-axis drive mechanism 20) attached to the gantry 1a via the load cell 20d.

In the substrate assembly apparatus 1, the upper stage 3 and the lower stage 4 are provided. The lower stage 4 is attached to the gantry 1a via a moving unit (XYθ moving unit 40). The XYθ moving unit 40 is configured to be independently movable in a two-axis (X-axis, Y-axis) direction orthogonal to each other with respect to the gantry 1a. Further, the XYθ moving unit 40 is configured to be rotatable about the Z axis with respect to the gantry 1a. In the XY θ moving unit 40, a ball bearing that is fixed in the Z-axis direction and freely movable in the XY-axis direction can be used.

Further, in the substrate assembly apparatus 1 of the present embodiment, the direction with respect to the upper frame 2 of the gantry 1a is the Z-axis direction (vertical direction). Further, the direction of one axis orthogonal to the Z axis is the X-axis direction (lateral direction), and the direction perpendicular to the one axis of the Z-axis and the X-axis is the Y-axis direction (longitudinal direction).

Further, the upper stage 3 and the lower stage 4 have a rectangular shape in which the Y-axis direction and the X-axis direction are vertical and horizontal directions. Further, the plane (upper substrate surface 3a) of the upper stage 3 faces the plane of the lower stage 4 (lower substrate surface 4a).

The upper frame 2 is attached to the gantry 1a via the Z-axis drive mechanism 20. The Z-axis drive mechanism 20 has a ball screw mechanism 20b that moves the ball screw shaft 20a extending in the Z-axis direction (up-and-down direction) up and down. The ball screw shaft 20a is rotated by the electric motor 20c, and is moved up and down by the ball screw mechanism 20b.

The electric motor 20c is controlled by the control device 100, and the upper frame 2 is Displacement (up and down) based on the calculation of the control device 100.

The upper stage 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a, and the upper frame 2 and the upper stage 3 are integrally moved up and down. An upper chamber 5a is disposed around the upper stage 3. The upper chamber 5a is disposed below the opening (on the side of the gantry 1a) to cover the upper side and the side of the upper stage 3.

The upper chamber 5a is attached to the upper frame 2 via the hanging mechanism 6. The hanging mechanism 6 has a support shaft 6a extending downward from the upper frame 2, and a locking portion 6b formed by expanding a lower end portion of the support shaft 6a in a flange shape.

Further, a hook 6c is provided in the upper chamber 5a. The hook 6c is freely movable up and down around the support shaft 6a. Further, the hook 6c is engaged with the locking portion 6b at the lower end of the support shaft 6a.

The upper shaft 2a penetrates the upper chamber 5. The upper shaft 2a and the upper chamber 5 are sealed by a vacuum seal (not shown).

When the upper frame 2 is moved upward (upward), the hook 6c is engaged with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves up together with the upper frame 2. Further, when the upper frame 2 is moved downward (downward), the hook 6c is moved downward by its own weight, and the upper chamber 5a is moved downward.

Further, a lower chamber 5b is disposed around the lower stage 4. The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the gantry 1a. The lower shaft 1b protrudes toward the inside of the lower chamber 5b. The lower chamber 5b and the lower shaft 1b are sealed by a vacuum seal (not shown).

The lower chamber 5b is disposed so as to open upward (on the side of the upper frame 2) to cover the lower side and the side of the lower stage 4.

The XYθ moving unit 40 is attached to the lower stage 1b that is protruded toward the lower chamber 5b to support the lower stage 4.

The upper chamber 5a and the lower chamber 5b are closed to each other to form a vacuum chamber 5. That is, the lower moving upper chamber 5a is engaged with the lower chamber 5b from above, and the opening of the lower chamber 5b is blocked by the upper chamber 5a. Further, the connection portion between the upper chamber 5a and the lower chamber 5b is sealed by a seal ring (not shown) to ensure the airtightness of the vacuum chamber 5.

Further, the upper frame 2 is further lowered in a state in which the upper chamber 5a is connected to the lower chamber 5b. Thereby, the upper frame 2 is moved downward from the downward movement of the upper chamber 5a by the lower chamber 5b, and the engagement between the locking portion 6b of the hanging mechanism 6 and the hook 6c is eliminated. The upper chamber 5a is placed in the lower chamber 5b by its own weight. Further, the upper stage 3 and the lower stage 4 are disposed inside the vacuum chamber 5.

The substrate assembly apparatus 1 is provided with a vacuum pump P0. The vacuum pump P0 is connected to the vacuum chamber 5, and exhausts the air in the vacuum chamber 5 to make the inside of the vacuum chamber 5 a vacuum. That is, when the vacuum pump P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment. The vacuum pump P0 is controlled by the control device 100.

The upper stage 3 is moved downward together with the lower moving upper frame 2 inside the vacuum chamber 5. As a result of the downward movement of the upper stage 3, the upper substrate K1 held by the upper stage 3 and the lower substrate K2 held by the lower stage 4 are bonded together and pressurized. When the inside of the vacuum chamber 5 is in a vacuum state, the upper substrate K1 and the lower substrate K2 are bonded under vacuum.

In addition, as mentioned above, the upper platform 3 is fixed by a plurality of upper shafts 2a. It is set in box 2. For this reason, the load when the upper substrate K1 and the lower substrate K2 are pressurized by the upper stage 3 is detected by the load cell 20d. The detection signal of the load cell 20d is input to the control device 100.

Figure 2 is a diagram showing a support pin.

As shown in Fig. 2, a plurality of support pins 7 are provided in the upper frame 2. The support pin 7 is a tubular member that is provided to extend in the vertical direction, and is provided separately from the upper stage 3 and up and down. All the support pins 7 are attached to one support base 7a, and all the support pins 7 are simultaneously moved up and down. The support base 7a is disposed between the upper chamber 5a and the upper stage 3. The support base 7a is moved up and down by an up-and-down mechanism (such as a ball screw mechanism) (not shown). This up and down mechanism is controlled by the control device 100.

The support pin 7 is disposed above the upper substrate surface 3a of the upper stage 3, and protrudes downward from the upper substrate surface 3a when moving downward with respect to the upper stage 3.

Further, the support pin 7 has a hollow tubular shape in which the hollow portion 7a1 is in communication with the hollow portion 7a1 of the support base 7a. The vacuum pump P1 is connected to the hollow portion 7a1 of the support base 7a. When the vacuum pump P1 is driven, the hollow portion 7a1 becomes a vacuum, and the upper substrate K1 is vacuum-adsorbed to the support pin 7. The vacuum pump P1 is controlled by the control device 100. That is, the vacuum pump P1 is driven in accordance with an instruction from the control device 100, and the upper substrate K1 is vacuum-adsorbed on the support pin 7.

Fig. 3 is a view showing the configuration of the upper stage. Fig. 4 is a view showing the upper substrate surface of the upper stage.

As shown in FIG. 3, the upper platform 3 has a back plate 30 and a split drive unit. 31.

The back plate 30 is attached to the upper shaft 2a, and moves up and down integrally with the upper frame 2. The back plate 30 is a plate-shaped member that is disposed in parallel with the lower substrate surface 4a (see FIG. 1) of the lower stage 4. Further, the back plate 30 is opposed to the lower substrate surface 4a.

The division drive unit 31 divides the upper substrate surface 3a. In other words, the upper substrate surface 3a is formed by forming a flat portion (divided flat portion 31a) of the split drive unit 31 so as to face the lower substrate surface 4a (see FIG. 1) of the lower stage 4. Further, the division drive unit 31 is disposed such that the division plane portion 31a is on the side of the lower substrate surface 4a. As shown in Fig. 4, in the present embodiment, the upper substrate surface 3a is divided into nine. In other words, the upper stage 3 is configured by nine divided drive units 31. Further, the upper substrate surface 3a is divided into nine divided plane portions 31a.

As shown in Fig. 3, an actuator 32 (third drive mechanism) is attached to the back plate 30. The actuator 32 displaces the split drive unit 31 with respect to the back plate 30 (up and down). The actuator 32 has a rod 32a extending in a direction orthogonal to the back plate 30 (up and down direction). The actuator 32 is provided with, for example, a motor (not shown), and the rod 32a is displaced in the axial direction (up-and-down direction) by a ball screw mechanism. The actuator 32 is controlled by the control device 100 (refer to Figure 1).

The split drive unit 31 is attached to the rod 32a of the actuator 32.

For example, as shown in FIG. 4, the rod 32a is attached to the four corners (or the vicinity of the four corners) of the rectangular divided drive portion 31. Further, a rod (not shown) is interposed between the rod 32a and the split drive unit 31, and the rod 32a is interposed therebetween. It is rotatably attached to the division drive unit 31.

When the lever 32a moves up and down by the actuator 32, the split drive unit 31 is displaced (up and down) in the vertical direction with respect to the back plate 30 in response to the displacement of the lever 32a. Each of the division drive units 31 can perform independent up and down movement without interfering with each other.

Further, since the back plate 30 is opposed to the lower substrate surface 4a (see FIG. 1), the actuator 32 displaces (vertes up and down) the vertical drive unit 31 in the vertical direction with respect to the lower substrate surface 4a. In other words, the actuator 32 displaces the split drive unit 31 toward the lower substrate surface 4a.

As described above, the substrate assembly apparatus 1 of the present embodiment has nine divided drive units 31 that can be moved up and down independently. Further, the upper substrate surface 3a formed by the divided plane portion 31a of each divided drive portion 31 is deformable.

Figure 5 is a diagram showing the adhesive pin.

As shown in Fig. 5, the upper frame 2 is provided with a plurality of adhesive pins 8. The adhesive pin 8 is a tubular member that is extended in the vertical direction, and is provided to be vertically movable independently of the upper stage 3 and the support pin 7. The vertical movement of the adhesive pin 8 is a vertical movement with respect to the upper substrate surface 3a.

The adhesive pin 8 is disposed above the upper substrate surface 3a, and protrudes downward from the upper substrate surface 3a when moving downward with respect to the upper stage 3. Further, the adhesive pin 8 is moved upward and introduced from the upper substrate surface 3a. In the present embodiment, the adhesive pin 8 is not protruded from the upper substrate surface 3a (shown in the divided plane portion 31a of FIG. 3), and even if the amount of protrusion of the adhesive pin 8 is zero (or less), The adhesive pin 8 is guided from the upper substrate surface 3a The status of the entry. Further, the adhesive pin 8 is moved downward to protrude from the upper substrate surface 3a. In addition, the amount of protrusion of the adhesive pin 8 indicates the amount of protrusion of the adhesive pin 8 from the upper substrate surface 3a (divided plane portion 31a) (hereinafter, the same applies).

The adhesive pin 8 is attached to a plurality of adhesive pin plates 8a (base portion). One or more adhesive pins 8 are attached to the adhesive pin plate 8a. Each of the adhesive pin plates 8a is vertically movable independently of each other (vertical movement with respect to the upper substrate surface 3a).

The adhesive pin 8 has an adhesive portion 8b at the front end.

Further, the adhesive pin 8 has a hollow tubular shape, and the vacuum suction hole 8c is open at the center. The vacuum suction hole 8c communicates with the negative pressure chamber 8a1 formed as a hollow portion of the adhesion pin plate 8a. The first suction means (vacuum pump P2) is connected to the negative pressure chamber 8a1 of the adhesive pin plate 8a. Therefore, the first suction means (vacuum pump P2) is connected to the vacuum suction hole 8c of the adhesion pin 8 via the negative pressure chamber 8a1.

When the vacuum pump P2 is driven and the vacuum suction hole 8c is in a vacuum state, the upper surface K1 is vacuum-sucked, and the upper substrate K1 sucked by the vacuum is attached to the adhesive portion 8b to be held (adhered and held). The adhesive pin 8 holds the upper substrate K1 in a state of being protruded from the upper substrate surface 3a.

The vacuum pump P2 is controlled by the control device 100. The upper substrate K1 is vacuum-sucked by the adhesive pin 8 in response to an instruction from the control device 100, and is attached to the adhesive portion 8b.

The gas is supplied to the negative pressure chamber 8a1 of the adhesive pin plate 8a. Should be means 8d. The gas supply means 8d is controlled by the control device 100. The gas supply means 8d is driven in response to an instruction from the control device 100 to supply a predetermined gas (air, nitrogen, etc.) to the negative pressure chamber 8a1. Since the negative pressure chamber 8a1 and the vacuum suction hole 8c are pressurized by the gas supplied from the gas supply means 8d, the upper substrate K1 attached to the adhesive portion 8b is peeled off from the adhesive portion 8b.

Each of the adhesive pin plates 8a is provided with a second drive mechanism (up and down movement mechanism 80). The vertical movement mechanism 80 includes a ball screw shaft 81 that is rotatably supported by the attachment portion 80a and extends in the Z-axis direction, an electric motor 83 that rotates the ball screw shaft 81, and a rotating ball screw shaft 81. A ball screw mechanism 82 that moves up and down. The mounting portion 80a is fixed to the upper frame 2. The ball screw shaft 81 is rotated by the electric motor 83 to move the ball screw mechanism 82 up and down. Further, the ball screw mechanism 82 is attached to the adhesive pin plate 8a. The adhesive pin plate 8a is moved up and down integrally with the ball screw mechanism 82 that moves up and down by the rotation of the ball screw shaft 81.

The vertical movement mechanism 80 is controlled by the control device 100, and the adhesion pin plate 8a and the adhesion pin 8 move up and down in response to an instruction from the control device 100.

The mounting portion 80a is attached to the upper frame 2, and moves up and down integrally with the upper frame 2. Further, the upper stage 3 is moved up and down integrally with the upper frame 2 as described above. The upper frame 2 is moved up and down by the Z-axis drive mechanism 20 (refer to FIG. 1), and when the upper frame 2 is moved downward, the upper stage 3 and the attachment portion 80a travel toward the lower stage 4 (see FIG. 1). The vertical movement mechanism 80 is attached to the attachment portion 80a, and the adhesion pin plate 8a (adhesion pin 8) moves up and down in response to the vertical movement of the attachment portion 80a. Therefore, the Z-axis drive mechanism 20 (first drive mechanism) has adhesion The function of the pin 8 and the upper stage 3 traveling toward the lower stage 4.

Fig. 6 is a view showing the upper substrate surface of the upper stage, and showing an example of the arrangement of the adhesive pins.

As an example, as shown in Fig. 6, in the present embodiment in which the upper stage 3 is provided with 81 adhesive pins 8, nine adhesive pins 8 are attached to one adhesive pin plate 8a. Further, the substrate assembly apparatus 1 (refer to FIG. 1) of the present embodiment has nine adhesive pin plates 8a.

Further, in the present embodiment, one of the adhesive pin plates 8a is disposed corresponding to one divided drive portion 31. For example, nine adhesive pins 8 are disposed corresponding to the divided plane portion 31a of one divided drive unit 31. Further, the nine adhesive pins 8 disposed in the one divided drive unit 31 (the divided flat portion 31a) are attached to one of the adhesive pin plates 8a provided in correspondence with the divided drive unit 31.

Moreover, four up-and-down motion mechanisms 80 are provided in one adhesive pin board 8a. For example, the vertical movement mechanism 80 is provided at the four corners of the rectangular adhesive pin plate 8a. The nine adhesive pin plates 8a can be moved up and down independently of each other by the vertical movement mechanism 80.

The adhesive pin plate 8a is not provided to interfere with the division drive unit 31, and can be independently moved up and down with respect to the division drive unit 31. Thereby, the adhesion pin 8 attached to one adhesive pin plate 8a can be displaced in the vertical direction with respect to the corresponding divided plane part 31a.

As described above, the vertical movement mechanism 80 (second drive mechanism) of the present embodiment is configured such that a plurality of (9) adhesive pin plates 8a can be moved up and down independently (vertical operation with respect to the upper substrate surface 3a).

Further, the vertical movement mechanism 80 can displace the adhesion pin plate 8a by the displacement amount set for each of the adhesion pin plates 8a. Thereby, the adhesive pin 8 can hold the upper substrate K1 in a state of being displaced together with the adhesive pin plate 8a by the displacement amount set for each of the adhesive pin plates 8a (refer to FIG. 1).

Fig. 7(a) is a diagram showing the lower stage, and Fig. 7(b) is a cross-sectional view taken along Sec1-Sec1.

As shown in FIG. 7(a), the lower stage 4 is housed inside the lower chamber 5b that is open above. The lower side and the side surface of the lower stage 4 are surrounded by the following chamber 5b. Between the lower stage 4 and the lower chamber 5b, gaps Gx and Gy are formed in each of the lateral direction (X-axis direction) and the longitudinal direction (Y-axis direction). Further, the lower stage 4 is supported by a plurality of XYθ moving units 40. Although (a) of FIG. 7 illustrates the lower stage 4 supported by the nine XYθ moving units 40, the number of the XYθ moving units 40 that support the lower stage 4 is not limited.

The XYθ moving unit 40 is detachably supported by the lower stage 4 in the X-axis direction and the Y-axis direction. With such a configuration, the lower stage 4 can be displaced from the lower chamber 5b so as to be displaceable in the X-axis direction and the Y-axis direction.

Further, the moving mechanism 41 is attached to the lower stage 4 system. The moving mechanism 41 has a shaft portion 41b that is coupled to the end side of the lower stage 4, and a driving portion 41a that displaces the shaft portion 41b in the axial direction. The drive unit 41a displaces the shaft portion 41b in the axial direction by, for example, a ball screw mechanism.

As shown in Fig. 7 (a), three moving mechanisms 41 are coupled to the lower stage 4. One moving mechanism 41 is formed by extending the shaft portion 41b in the X-axis direction, and the two moving mechanisms 41 are the shaft portion 41b. Extended to the Y axis Set in the direction.

The shaft portion 41b extending in the X-axis direction is coupled to the vicinity of the center portion of the end side of the lower stage 4. The lower stage 4 is displaced in the X-axis direction (lateral direction) by the displacement of the shaft portion 41b extending in the X-axis direction.

Further, the two shaft portions 41b extending in the Y-axis direction are arranged in the vicinity of the end portion of the lower end 4 connected to the same side end. When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are equal, the lower stage 4 is displaced in the Y-axis direction (longitudinal direction). In addition, when the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are different, the larger displacement amount of the lower shaft 4 and the shaft portion 41b is displaced more significantly in the Y-axis direction than the smaller displacement amount. Will rotate around the Z axis.

In this manner, the lower stage 4 to which the three moving mechanisms 41 are connected can perform displacement in the X-axis direction (lateral direction), displacement in the Y-axis direction (longitudinal direction), and rotation about the Z-axis.

The three moving mechanisms 41 are controlled by the control device 100. The control device 100 gives an instruction to the three moving mechanisms 41 to appropriately displace the shaft portion 41b and to displace the lower table 4.

In addition, the tappet 42 is provided in the lower stage 4 system. The tappet 42 is extended to lie, for example, across the lower table 42 in the X-axis direction. The tappet 42 is a lifting device 42a such as a ball screw mechanism, and is moved up and down as shown by a black arrow in Fig. 7(b). The lifting device 42a is controlled by the control device 100. The control device 100 drives the tappet 42 when the lower substrate K2 (refer to FIG. 1) is transported by the transport device 200 (refer to FIG. 1), and the lower substrate K2 is placed on the lower stage 4.

Further, a positional alignment window 4b is formed at four corners of the rectangular lower stage 4. As shown in FIG. 7(b), the alignment window 4b is a through hole that penetrates the plane (lower substrate surface 4a) of the lower stage 4. The position alignment window 4b is an imaging unit housing tube 10a that enters from below. The imaging unit housing tube 10a is formed by projecting a lower surface of the lower chamber 5b toward the upper cylindrical shape, and the transparent member 10b is fitted into the distal end portion. In the imaging unit housing tube 10a, the imaging device 10 that images the lower substrate K2 (refer to FIG. 1) held by the lower table 4 is housed.

Four imaging devices 10 are provided in the lower stage 4, and data (image data) captured by each imaging device 10 is input to the control device 100. In addition, the number of the imaging devices 10 provided in the lower stage 4 is not limited.

The lower substrate surface 4a of the lower stage 4 holds a plane of the lower substrate K2 (refer to FIG. 1). Further, the moving mechanism 41 displaces the lower stage 4 along the lower substrate surface 4a in the X-axis direction, the Y-axis direction, and the Z-axis.

An imaging window 4c is formed in the vicinity of the two position alignment windows 4b. The imaging window 4c is formed in the same shape as the alignment window 4b. The imaging window 4c is a second imaging unit housing tube (not shown) that enters from below. The second imaging unit housing cylinder is formed to be equivalent to the imaging unit housing tube 10a. The second imaging unit housing the cartridge accommodates a second imaging device (not shown). In the second imaging device, the lower substrate K2 (refer to FIG. 1) held by the lower stage 4 is imaged, and the image data is input to the control device 100. In addition, in FIG. 7(a), although the configuration in which the second stage 4 includes two second imaging devices is shown, the number of the second imaging devices is not limited. set.

A plurality of suction holes 43 are formed in the lower substrate surface 4a of the lower stage 4. The suction hole 43 is connected to the second suction means (vacuum pump P3). When the vacuum pump P3 is driven, the lower substrate K2 (refer to FIG. 1) placed thereon is adsorbed and held by the lower stage 4 (lower substrate surface 4a). The vacuum pump P3 is controlled by the control device 100.

Fig. 8 is a view showing a procedure of bonding a substrate by a substrate assembly device. A procedure for bonding the substrates by the substrate assembly apparatus 1 will be described with reference to FIGS. 1 to 7 as appropriate.

The first program (step 1) is a substrate loading program.

In the upper substrate loading program, the control device 100 moves the upper frame 2 to move the upper chamber 5a and the upper table 3. Thereby the vacuum chamber 5 is opened.

When the transfer device 200 causes the upper substrate K1 to be transported between the upper stage 3 and the lower stage 4, the control device 100 lowers the support pin 7 until it touches the upper substrate K1 to drive the vacuum pump P1. The upper substrate K1 is vacuum-drawn by the support pins 7.

When the conveyance device 200 is withdrawn, the control device 100 moves the support pin 7 to close the upper substrate K1 to the upper substrate surface 3a of the upper stage 3.

Further, the control device 100 gives an instruction to the vertical movement mechanism 80 to move the adhesion pin plate 8a downward while driving the vacuum pump P2. The upper substrate K1 is vacuum-sucked by the adhesive pin 8 that is moved down together with the adhesive pin plate 8a, and the adhesive portion 8b at the front end is attached to the upper substrate K1. After that, the control device 100 moves the adhesive pin plate 8a in a state where the adhesive pin 8 is attached to the upper substrate K1, and the upper substrate K1 is separated from the upper substrate surface 3a.

At this time, the control device 100 causes the displacement amount of each of the adhesive pin plates 8a to be moved to the adhesive pin plate 8a to be the displacement amount set for each of the adhesive pin plates 8a. The details of the displacement amount of the adhesive pin plate 8a will be described later.

Further, the control device 100 displaces (downward) the divided drive unit 31 corresponding to each of the adhesive pin plates 8a with respect to the back plate 30 with the same displacement amount as that set for the adhesive pin plate 8a.

The second program (step 2) is a lower substrate loading program.

When the transfer device 200 causes the lower substrate K2 to be carried between the upper stage 3 and the lower stage 4, the control device 100 moves the tappet 42 to receive the lower substrate K2. When the conveying device 200 is withdrawn, the control device 100 lowers the tappet 42 to place the lower substrate K2 on the lower substrate surface 4a of the lower stage 4. Further, the control device 100 drives the vacuum pump P3 to adsorb and hold the lower substrate K2 on the lower substrate surface 4a of the lower stage 4.

Thereafter, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 downward, and the upper chamber 5a and the upper table 3 are moved downward. The upper chamber 5a is engaged with the lower chamber 5b and the vacuum chamber 5 is closed. On the inner side of the vacuum chamber 5, the upper stage 3, the lower stage 4, the support pin 7, and the adhesion pin 8 are arranged.

The control device 100 drives the vacuum pump P0 when the vacuum chamber 5 is closed to make the inside of the vacuum chamber 5 a vacuum. Since the vacuum chamber 5 is vacuumed by the driving of the vacuum pump P0, the vacuum chamber 5 accommodates the upper stage 3, the lower stage 4, the support pin 7, and the adhesive pin 8 in a vacuum environment.

Further, the lower substrate K2 is coated with a necessary substance such as a sealant, a liquid crystal, a spacer, and a paste by another procedure before being carried into the substrate assembly apparatus 1 (between the upper stage 3 and the lower stage 4).

The third program (step 3) is a fitting position adjustment program.

In the bonding position adjustment program, the control device 100 drives the moving mechanism 41 to displace the lower table 4 to adjust the bonding position. The details of the fitting position adjustment program will be described later.

The fourth program (step 4) is a bonding procedure in which the upper substrate K1 and the lower substrate K2 are bonded together. The details of the fitting procedure are described later.

In the fifth program (step 5), the program is moved out.

In the unloading program, the control device 100 injects a gas such as nitrogen into the vacuum chamber 5 in a vacuum state to raise the pressure inside the vacuum chamber 5 to atmospheric pressure. The inside of the vacuum chamber 5 is pressurized to the atmospheric pressure, and the upper substrate K1 and the lower substrate K2 are uniformly pressed (pressed) until the gap is determined by the amount of the spacer and the liquid crystal which are previously applied to the substrate (the lower substrate K2). Intercellular space). The control device 100 drives the gas supply means 8d to supply the gas to the vacuum suction holes 8c. At this point of time, the adhesive pin 8 does not hold the upper substrate K1, so the gas system supplied to the vacuum adsorption hole 8c is supplied into the vacuum chamber 5. The control device 100 measures the air pressure in the vacuum chamber 5 by a pneumatic sensor (not shown), and stops the gas supply means 8d when the air pressure in the vacuum chamber 5 is raised to the atmospheric pressure. Further, the control device 100 moves the upper frame 2 upward. Thereby the vacuum chamber 5 is opened.

Thereafter, the bonded upper substrate K1 and lower substrate K2 are carried out from the substrate assembly apparatus 1 by the transporting means 200.

In the substrate assembly apparatus 1 of the present embodiment, the upper substrate K1 and the lower substrate K2 are bonded together with the fifth program (steps 1 to 5) shown in FIG. 8 as a main program.

The control device 100 adjusts the bonding position of the upper substrate K1 and the lower substrate K2 by the bonding position adjustment program (step 3) shown in FIG. The fitting position adjustment program (step 3) in the present embodiment will be described.

FIG. 9 is a view showing a mark for adjusting a bonding position of the upper substrate and the lower substrate, wherein (a) is a diagram showing an upper mark attached to the upper substrate, and (b) is attached to the lower side. A diagram of the underlying mark of the substrate. 10 and 11 are diagrams showing a state in which the deviation between the upper mark of the upper substrate and the lower mark of the lower substrate is adjusted, and (a) of FIG. 10 is a view showing the deviation in the XY-axis direction, (b) A diagram showing a state in which the deviation in the XY-axis direction is adjusted. Further, (a) of FIG. 11 is a view showing a deviation around the Z axis, and (b) is a view showing a state in which the deviation around the Z axis is adjusted.

The shape of the marks (upper mark and lower mark) attached to the upper substrate K1 and the lower substrate K2 is not limited. For example, the upper mark is as shown in (a) of FIG. 9, and the first upper mark Mk1 of the black square is added to the reference position of the upper substrate K1, and the second upper mark Mk1a of the black square is added to the vicinity of the first upper mark Mk1. . In addition, the lower mark is as shown in FIG. 9(b), and the first lower mark Mk2 having a square frame shape is added to the reference position of the lower substrate K2, and the second lower frame shape is added to the vicinity of the first lower mark Mk2. Mark Mk2a.

The second upper mark Mk1a is a black square having a smaller size than the first upper mark Mk1. Further, the second lower mark Mk2a is in the shape of a square frame having the same size as the first lower mark Mk2 or larger than the first lower mark Mk2.

In addition, the upper substrate K1 of the first upper mark Mk1 is added The reference position is set, for example, by a distance from the end side of the upper substrate K1. As an example, the first upper mark Mk1 is added to a position separated from the end side of the upper substrate K1 by a predetermined length. Similarly, the first lower mark Mk2 is added to a position separated from the end side of the lower substrate K2 by a predetermined length.

The first upper mark Mk1 is a black square shape as shown in FIG. 9(a), and the first lower mark Mk2 is a square frame shape as shown in FIG. 9(b), and the control device 100 (refer to FIG. 1) is the first When the upper mark Mk1 (black square) is in the frame of the first lower mark Mk2 (square frame), it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within a predetermined range.

Further, the alignment window 4b of the lower stage 4 shown in (a) of FIG. 7 is formed corresponding to the reference positions of the upper substrate K1 and the lower substrate K2.

Further, the second upper mark Mk1a is a black square shape as shown in FIG. 9(a), and the second lower mark Mk2a is a square frame shape as shown in FIG. 9(b), and the control device 100 (refer to FIG. 1) When the second upper mark Mk1a (black square) is in the frame of the second lower mark Mk2a (square frame), it is determined that the coarse adjustment of the position of the substrate K2 below the upper substrate K1 has ended.

Further, the imaging window 4c of the lower stage 4 shown in (a) of FIG. 7 is formed corresponding to the position of the second upper mark Mk1a added to the upper substrate K1 and the second lower mark Mk2a added to the lower substrate K2. .

The control device 100 (refer to FIG. 1) adjusts the bonding position of the upper substrate K1 and the lower substrate K2 in two stages in the bonding position adjustment program shown in FIG.

The control device 100 is in the fitting position adjustment program, firstly, The lower stage 4 is displaced such that the second upper mark Mk1a is placed in the frame of the second lower mark Mk2a. At this time, the control device 100 shifts the lower stage 4 based on the video data input from the second imaging device (not shown), and arranges the two second upper marks Mk1a in the frame of the second lower mark Mk2a. When the two second upper marks Mk1a enter the frame of the second lower mark Mk2a, the control device 100 determines that the coarse adjustment of the position of the substrate K2 below the upper substrate K1 has ended.

The control device 100 (refer to FIG. 1) is the first upper mark Mk1 of the upper substrate K1 as shown in (a) of FIG. 10 after it is determined that the coarse adjustment of the position of the substrate K2 below the upper substrate K1 has been completed. When the black square shape is outside the frame of the first lower mark Mk2 (square frame) of the lower substrate K2, the control device 100 determines that the deviation between the upper substrate K1 and the lower substrate K2 is outside the predetermined range. Further, the control device 100 finely adjusts the position of the lower substrate K2 with respect to the upper substrate K1.

The control device 100 (refer to FIG. 1) commands the moving mechanism 41 of the lower stage 4 (refer to (a) of FIG. 7) to displace the lower stage 4. The control device 100 gives a command to the moving mechanism 41 of the lower stage 4 to move the lower stage 4 (refer to (a) of FIG. 7) in the X-axis direction (Dx) and the Y-axis direction (Dy). Further, as shown in (b) of FIG. 10, when all of the four first upper marks Mk1 are arranged in the frame of the first lower mark Mk2, the control device 100 determines that the upper mark (the first upper mark Mk1) is present. The lower mark (the first lower mark Mk2) is in a predetermined positional relationship, and the deviation between the upper substrate K1 and the lower substrate K2 is within a predetermined range, and the fine adjustment is ended.

Further, as shown in (a) of FIG. 11, when the first lower mark Mk2 is shifted from the first upper mark Mk1 by the direction about the Z axis, the control device 100 is the moving mechanism 41 of the lower stage 4 ( Reference numeral (a) of Fig. 7 is given a command to rotate the lower stage 4 (refer to (a) of Fig. 7) about the Z axis (Rz). Further, as shown in (b) of FIG. 11, when all of the four first upper marks Mk1 are arranged in the frame of the first lower mark Mk2, the control device 100 determines that the upper mark (the first upper mark Mk1) is present. The lower mark (the first lower mark Mk2) is in a predetermined positional relationship, and the deviation between the upper substrate K1 and the lower substrate K2 is within a predetermined range, and the fine adjustment is ended.

As described above, the control device 100 (refer to FIG. 1) is based on the coarse adjustment of the second upper mark Mk1a and the second lower mark Mk2a and the first upper mark Mk1 and the first in the bonding position adjustment program shown in FIG. The fine adjustment of the mark Mk2 is performed under one direction, and the bonding position of the upper substrate K1 and the lower substrate K2 is adjusted.

In the control device 100 of the present embodiment, when the first upper mark Mk1 is placed in the frame of the first lower mark Mk2, it is determined that the first upper mark Mk1 and the first lower mark Mk2 are in a predetermined positional relationship.

Further, in the bonding position adjustment program, the control device 100 (refer to FIG. 1) extracts the first upper mark Mk1 and the first image by performing image processing on the image data input from the imaging device 10 (refer to FIG. 7(b)). The position and shape of the lower mark Mk2 are moved in order to move the first upper mark Mk1 toward the inside of the first lower mark Mk2, and the moving mechanism 41 (refer to (a) of FIG. 7) is given a command.

The control device 100 extracts the position, shape, and the like of the first upper mark Mk1 and the first lower mark Mk2 by image processing such as multi-value processing.

FIG. 12 is a view showing a state in which the deviation between the first upper mark and the first lower mark is within a predetermined range, and (a) is a view showing a state in which the first upper mark is at the center of the first lower mark. (b) is a diagram in which the first upper mark is shifted from the center of the first lower mark.

The control device 100 (refer to FIG. 1) of the present embodiment is shown in FIG. 10(b) and FIG. 11(b), and the first upper mark Mk1 (black square) is placed on the first lower mark Mk2 (four corners). When the frame is in the frame, it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within a predetermined range.

The first upper mark Mk1 and the first lower mark Mk2 are added to the reference positions of the upper substrate K1 and the lower substrate K2, respectively. Therefore, as shown in (a) of FIG. 12, when there is no size difference (size error) between the upper substrate K1 and the lower substrate K2, all of the four first upper marks Mk1 are disposed on the first lower mark Mk2. center.

However, when an error (a dimensional error or the like) occurs in the production of the upper substrate K1 and the lower substrate K2, an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2. When an error occurs in the reference position of the upper substrate K1 and the lower substrate K2, all of the four first upper marks Mk1 cannot be placed at the center of the first lower mark Mk2. In this manner, a state in which the first upper mark Mk1 is not disposed at the center of the first lower mark Mk2 is referred to as a mark pitch deviation (the mark pitch deviation between the upper substrate K1 and the lower substrate K2).

The control device 100 (refer to FIG. 1) of this embodiment is as shown in the figure. (b) of 12, even if all of the four first upper marks Mk1 are not at the center of the first lower mark Mk2, that is, even if the mark pitch deviation occurs in the upper substrate K1 and the lower substrate K2, there are still four When all of the first upper marks Mk1 are arranged in the frame of the first lower mark Mk2, it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within a predetermined range.

However, when the upper substrate K1 and the lower substrate K2 are bonded in this state, a slight error occurs between the upper substrate K1 and the lower substrate K2.

Therefore, the control device 100 (refer to FIG. 1) of the substrate assembly apparatus 1 of the present embodiment is attached to each of the adhesive pin plates 8a when the upper substrate loading process (step 1) shown in FIG. 8 causes the adhesive pin 8 to move downward. The amount of displacement of the lower movement is changed to reduce the deviation between the upper substrate K1 and the lower substrate K2. Thereby, the deviation of the mark pitch of the upper substrate K1 and the lower substrate K2 is effectively corrected.

FIG. 13 is a view showing a state in which the deviation between the upper substrate and the lower substrate is reduced by changing the displacement amount of the adhesive pin plate, and (a) is a view showing a state in which the first upper mark and the first lower mark are deviated. (b) is a diagram showing a state in which the deviation between the first upper mark and the first lower mark is reduced (a state in which the mark pitch of the upper substrate and the lower substrate is corrected).

In addition, in (a) and (b) of FIG. 13, the position of the 1st lower mark Mk2 is shown by the broken line.

As shown in (a) of Fig. 13, when the displacement amounts of all the adhesive pin plates 8a are equal, the amount of protrusion of all the adhesive pins 8 becomes equal, so that the upper substrate K1 which is adsorbed (held) on the adhesive pin 8 becomes Flat. In other words, the upper substrate K1 is held by the adhesive pin 8 in a state parallel to the upper substrate surface 3a. In this case, when a dimensional error occurs in the upper substrate K1, the lower substrate K2, or the like, the first upper mark Mk1 may be displaced from the center of the first lower mark Mk2. That is, the mark pitch deviation sometimes occurs on the upper substrate K1 and the lower substrate K2.

For example, as shown in FIG. 13(b), when the displacement amount of the adhesive pin plate 8a is increased at the end side where the first upper mark Mk1 is added, the upper substrate K1 is closer to the upper stage 3 than the end side by the center. The adhesive pin 8 is held in a slightly curved state.

When the upper substrate K1 is bent in this way, the end portion of the upper substrate K1 is slightly close to the center, so that the first upper mark Mk1 attached to the vicinity of the end portion is slightly close to the center. Therefore, the upper substrate K1 is held by the adhesive pin 8 in a state where the first upper mark Mk1 is close to the center of the first lower mark Mk2.

When the upper substrate K1 is held by the adhesive pin 8 in a state where the first upper mark Mk1 is close to the center of the first lower mark Mk2, the fine adjustment of the bonding position adjustment program shown in FIG. 8 is performed as shown in the figure. (b) of 13, the first upper mark Mk1 is preferably close to the center of the first lower mark Mk2. Further, the slight variation caused by the bonding of the upper substrate K1 and the lower substrate K2 is reduced, whereby the deviation of the mark pitch between the upper substrate K1 and the lower substrate K2 is corrected, and the mark pitch deviation is reduced.

The errors (size errors, etc.) generated during the production of the upper substrate K1 and the lower substrate K2 are approximated in the same production lot. That is, the first upper mark Mk1 of the lower substrate K2 with respect to the first lower mark Mk2 The magnitude of the deviation is approximated for each production lot of the upper substrate K1, the lower substrate K2, and the like.

Therefore, when the displacement amount of the adhesive pin plate 8a is set for each production batch of the upper substrate K1, the lower substrate K2, and the like, the first upper mark Mk1 can be brought closer to the first lower mark Mk2 as long as the production lot is unchanged. center of. Further, the control device 100 (refer to FIG. 1) may be configured such that the adhesive pin plate 8a is displaced by a predetermined displacement amount.

For example, the amount of displacement of the adhesive pin plate 8a by the manager or the like of the substrate assembly apparatus 1 (refer to FIG. 1) is set for each production lot such as the upper substrate K1 and the lower substrate K2. Since the substrate assembly apparatus 1 of the present embodiment has nine adhesive pin plates 8a, the displacement amount is set for each of the adhesive pin plates 8a.

When the displacement amount thus set is input to the control device 100 (refer to FIG. 1), the control device 100 is attached to the upper substrate loading program (see FIG. 8), and the respective adhesive pin plates 8a are opposed to the back plate 30 by the set displacement amount. (referenced in Figure 3) and displaced. Each of the adhesive pin plates 8a is moved downward by the set displacement amount.

In addition, (b) of FIG. 13 is a state in which the displacement amount of the adhesive pin plate 8a disposed at the center is smaller than the displacement amount of the adhesive pin plate 8a disposed on the end side, but may be configured. The displacement amount of the adhesive pin plate 8a at the center is larger than the displacement amount of the adhesive pin plate 8a disposed on the end side.

Further, in Fig. 13, (b), although the displacement amount of the adhesive pin plate 8a is changed in the X-axis direction, the displacement amount of the adhesive pin plate 8a may be made on the Y-axis side. The state of the upward change.

The control device 100 (refer to FIG. 1) performs the bonding procedure shown in FIG. 8 after adjusting the bonding position of the upper substrate K1 and the lower substrate K2 by the bonding position adjustment program (step 3) shown in FIG. 4) The upper substrate K1 and the lower substrate K2 are bonded together. The bonding procedure in the present embodiment will be described (step 4).

(a) of FIG. 14 is a view showing a state in which the split driving unit is displaced in accordance with the shape of the upper substrate, and (b) is a view showing a state in which the upper substrate and the lower substrate are pressed by the upper stage.

As described above, the control device 100 (refer to FIG. 1) of the present embodiment changes the displacement amount of the adhesive pin plate 8a in the upper substrate loading program (step 1) shown in FIG. 8, as shown in FIG. (b), the upper substrate K1 is slightly bent.

Further, the control device 100 (refer to FIG. 1) executes the bonding procedure shown in FIG. 8 after the bonding position adjustment program adjusts the bonding position (step 4).

In the bonding apparatus, the control device 100 causes the respective divided driving units 31 to correspond to the displacement amount of the displacement amount of the adhesive pin plate 8a of the adhesive pin 8 corresponding to the divided flat portion 31a of each divided drive unit 31. Displacement. In the present embodiment, the control device 100 displaces the divided drive portions 31 by the same displacement amount as the displacement amount of the adhesive pin plate 8a of the adhesive pin 8 corresponding to the divided flat portion 31a of each divided drive portion 31. .

The control device 100 (refer to FIG. 1) controls the actuator 32 (refer to FIG. 3) to move the split drive unit 31 downward from the back plate 30. from. At this time, the control device 100 lowers the divided drive unit 31 by the same displacement amount as the displacement amount of the corresponding adhesive pin plate 8a. Therefore, as shown in Fig. 14 (a), the adhesive pin plate 8a is displaced by the same amount as the divided drive portion 31 corresponding to the adhesive pin plate 8a. The division drive unit 31 is displaced in response to deformation of the upper substrate K1, and the upper substrate surface 3a of the upper stage 3 is deformed into a shape of the upper substrate K1 held by the adhesion pin 8.

Thereafter, the control device 100 (refer to FIG. 1) drives the Z-axis drive mechanism 20 (refer to FIG. 1), and further moves the upper frame 2 (see FIG. 1) downward, thereby causing the upper stage 3 shown in (a) of FIG. The adhesive pin plate 8a (adhesive pin 8) is moved downward. Thereby, as shown in FIG. 14(b), the upper substrate K1 held by the adhesive pin 8 and the lower substrate K2 held by the lower stage 4 are bonded together.

The control device 100 drives the Z-axis drive mechanism 20 (see FIG. 1) in a state where the split drive unit 31 is displaced as shown in FIG. 14(a). The upper stage 3 (the back board 30 and the split drive unit 31) is moved down together with the upper frame 2 (refer to FIG. 1). Further, as shown in FIG. 14(b), the upper substrate K1 held by the adhesive pin 8 and the lower substrate K2 held by the lower stage 4 are pressed by the upper stage 3 (divided drive unit 31) and the lower stage 4 Hehe. At this time, the division drive unit 31 presses the upper substrate K1 and the lower substrate K2 in a state of being displaced.

For this reason, the upper substrate K1 and the lower substrate K2 are bonded together in a state (shape) in which the first upper mark Mk1 of the upper substrate K1 is close to the center of the first lower mark Mk2 of the lower substrate K2. Thereby, in the fitting process The deviation of the mark pitch between the substrate K1 and the lower substrate K2 is suppressed, and the error caused by the bonding of the upper substrate K1 and the lower substrate K2 becomes small.

In addition, (a) and (b) of FIG. 14 are enlarged to show the amount of deformation of the upper substrate K1 in order to make the explanation easy to understand. The actual amount of deformation of the upper substrate K1 is small and the amount of displacement of the divided drive unit 31 is also small. Therefore, even if the upper substrate K1 and the lower substrate K2 are attached in a state in which the division driving portion 31 is displaced (a state in which the backing plate 30 is moved downward), the amount of deformation of the upper substrate K1 is minute, and the upper substrate K1 and the lower substrate are small. K2 is bonded with high precision without causing a gap or the like.

The control device 100 detects that the upper substrate K1 and the lower substrate K2 are bonded together based on the detection signal input from the load cell 20d (refer to FIG. 1), and drives the vertical movement mechanism 80 at this time to make the adhesion pin. 8 is introduced from the upper substrate surface 3a. At this time, the control device 100 stops the vacuum pump P2 (refer to FIG. 5) while driving the gas supply means 8d to supply gas to the vacuum suction holes 8c, and peels the upper substrate K1 from the adhesive portion 8b. Further, the control device 100 drives the Z-axis drive mechanism 20 to further lower the upper frame 2, and the upper table 3 presses the upper substrate K1 and the lower substrate K2. The control device 100 determines that the lower movement of the upper frame 2 is stopped when a predetermined load is generated between the upper stage 3 and the lower stage 4 based on the detection signal input from the load cell 20d.

The inside of the vacuum chamber 5 is evacuated, and the upper substrate K1 and the lower substrate K2 are attached to each other under a vacuum in the vacuum chamber 5 with a predetermined load. By the pressurization at this time, the sealant previously applied to the lower substrate K2 is appropriately pressed, and the vacuum applied to the liquid crystal portion in the frame surrounded by the sealant is maintain.

Thereafter, in order to prevent the positions of the upper substrate K1 and the lower substrate K2 from deviating, the sealing agent is temporarily cured by ultraviolet rays irradiated from a UV (ultraviolet) irradiation device (not shown).

Further, as described above, the dimensional errors of the upper substrate K1, the lower substrate K2, and the like are approximated in the same production lot, and the adhesive pin plate 8a is set for each production batch of the upper substrate K1, the lower substrate K2, and the like. The amount of displacement. Therefore, in a period in which the production lot of the upper substrate K1, the lower substrate K2, and the like are not changed, the divided drive unit 31 is maintained in a state of being displaced by a displacement amount equal to the displacement amount set by the adhesive pin plate 8a. . For example, during a period in which the production lot of the upper substrate K1 and the production lot of the lower substrate K2 are not changed in common, the control device 100 (refer to FIG. 1) may be configured to be maintained in the division drive unit 31 to correspond to each production. A state in which the displacement amount of the plurality of the adhesive pin plates 8a is displaced by the displacement amount equal to each other.

In such a configuration, as long as the production lot of the upper substrate K1 and the lower substrate K2 does not change, the control device 100 (refer to FIG. 1) does not need to perform the bonding process every time to displace the split driving unit 31.

As described above, in the substrate assembly apparatus 1 (see FIG. 1) of the present embodiment, when the loaded upper substrate K1 is held, the displacement amount of the adhesive pin 8 (refer to FIG. 5) is set to each of the adhesive pin plates 8a (FIG. 5). With reference to the change, it is possible to reduce a slight variation (marking pitch deviation) due to a dimensional error or the like occurring at the time of production of the upper substrate K1 and the lower substrate K2. Further, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 can be corrected, and the mark pitch deviation can be reduced.

Further, in the substrate assembly apparatus 1 of the present embodiment, the displacement amount of the adhesion pin 8 (refer to FIG. 5) which is changed in order to correct the deviation of the mark pitch of the upper substrate K1 and the lower substrate K2 is defined by the division drive unit 31 (refer to FIG. 3). Displaced with the same amount of displacement. Thereby, the shape of the upper substrate surface 3a (refer to FIG. 3) of the upper stage 3 is changed to be equal to the shape of the upper substrate K1 held by the adhesion pin 8. Further, in the bonding process (refer to FIG. 8), the upper substrate K1 is pressed against the lower substrate K2 by the upper substrate surface 3a having the same shape. Therefore, when the mark pitch deviation does not occur in the bonding process, the upper substrate K1 is used. It is bonded to the lower substrate K2 with high precision.

Further, the present invention is not limited to the embodiments described above. For example, the above-described embodiments are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all of the described components.

Further, a part of the configuration of a certain embodiment may be replaced with a configuration of another embodiment, and a configuration of another embodiment may be added to the configuration of a certain embodiment.

In addition, the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the scope of the invention.

Fig. 15 is a view showing a modification of the design, wherein (a) is a view showing a state in which displacement amounts of the adhesion pins attached to one of the adhesive pin plates are different, and (b) is for one division drive unit corresponding to one. A diagram showing the composition of one adhesive pin. FIG. 16 is a view showing another design modification example, wherein (a) is a diagram in which four divided drive units correspond to one adhesive pin plate, and (b) is directed to one divided drive unit. A diagram corresponding to the state of the three adhesive pin plates.

As shown in Fig. 6, one of the adhesive pin plates 8a is driven by four vertical movement mechanisms 80. Further, as shown in Fig. 4, one split drive unit 31 is supported by four rods 32a (actuator 32 shown in Fig. 3).

Therefore, the amount of movement of the four vertical movement mechanisms 80 of one of the adhesive pin plates 8a can be changed. Similarly, the amount of displacement of the rod 32a can be changed for each of the actuators 32 that support the one divided drive portion 31.

Further, as shown in Fig. 15 (a), the amount of displacement of the adhesive pin 8 attached to one of the adhesive pin plates 8a can be made different. In this case, the upper substrate K1 held by the adhesive pin 8 can be variously deformed (bent). Further, the split drive unit 31 can be displaced from the back plate 30 by the displacement amount of one of the adhesive pins 8.

Therefore, as shown in (a) of FIG. 15, the division drive unit 31 is appropriately displaced from the back plate 30 to incline the division flat portion 31a with respect to the back plate 30, and the shape of the upper substrate surface 3a and the shape of the upper substrate K1 can be made. match. Thereby, it is possible to more effectively reduce the slight variation caused by the bonding of the upper substrate K1 and the lower substrate K2. Further, the deviation of the mark pitch between the upper substrate K1 and the lower substrate K2 is more effectively corrected.

Further, as shown in FIG. 15(b), the one adhesive pin 8 may be provided with one vertical movement mechanism 80. In other words, one adhesive pin 8 may be attached to one of the adhesive pin plates 8a. Further, it is also possible that one split drive unit 31 corresponds to one adhesive pin 8 and one actuator drive unit 31 has one actuator 32. In the case of this configuration, it is possible to set the displacement amount different for each of the adhesive pins 8 so that the upper substrate K1 held by the adhesive pin 8 can be deformed more (bend) song). Further, the control device 100 (refer to FIG. 1) can displace the divided drive portions 31 in accordance with the displacement amount of the adhesive pin 8, and match the shape of the upper substrate surface 3a (refer to FIG. 5) of the upper stage 3 to the upper substrate. The shape of the K1.

In this case, as long as each of the adhesive pins 8 is connected to the vacuum pump P2 (refer to FIG. 5), the upper substrate K1 can be vacuum-absorbed by the respective adhesive pins 8.

Further, in the present embodiment, the configuration is such that the nine adhesive pin plates 8a are provided, but the number of the adhesive pin plates 8a is not limited. The number of the adhesive pin plates 8a can be appropriately changed depending on the number of the adhesive pins 8, for example. Further, the shape of the adhesive pin plate 8a, the arrangement of the adhesive pins 8 of the one adhesive pin plate 8a, and the like are not limited.

For example, a long-sized adhesive pin plate 8a extending in the X-axis direction (or the Y-axis direction) may be disposed, and a single row of the adhesive pins 8 may be disposed.

Further, the number of the adhesive pins 8 provided in one of the adhesive pin plates 8a is not limited. It is also possible to provide a different number of the adhesive pins 8 for each of the adhesive pin plates 8a.

Further, in the present embodiment, as shown in Fig. 6, one divided drive unit 31 corresponds to one adhesive pin plate 8a. The configuration is not limited to this, and as shown in (a) of FIG. 16 , a plurality of (four in the example of (a) of FIG. 16 ) divided drive unit 31 may correspond to one adhesive pin plate 8 a . In addition, as an example shown in (b) of FIG. 16, one division drive unit 31 may correspond to a plurality of (the example of FIG. 16(b) is 3) Adhesive pin plate 8a.

Further, the shape of one split drive unit 31 is not limited to a rectangular shape (square, rectangular, or the like). Although not shown, it is also possible to combine the upper stage 3 (see FIG. 1) of the divided drive unit having a frame shape in which the center portion is opened. Further, it may be a divided drive unit (not shown) of various shapes such as a triangle or a trapezoid.

Further, the Z-axis drive mechanism 20 (refer to FIG. 1) for moving the upper frame 2 up and down, the vertical movement mechanism 80 for driving the adhesion pin plate 8a (refer to FIG. 5), and the movement mechanism 41 for driving the lower stage 4 ((a) of FIG. 7 The drive mechanism such as the reference to the actuator 32 (refer to FIG. 3) is not limited to the ball screw mechanism. All or part of these drive mechanisms may be configured by a cylinder or a linear motor or the like.

In addition, the upper substrate K1 (refer to FIG. 1) and the lower substrate K2 (refer to FIG. 1) which are bonded together by the substrate assembly apparatus 1 (refer to FIG. 1) are mainly glass substrates, and an error due to a change in ambient temperature is likely to occur. For example, it is also possible to reduce the error caused by the temperature change in the inside of the vacuum chamber 5 (refer to FIG. 1) when the vacuum is changed to the upper substrate K1, the lower substrate K2, etc., and to provide the upper stage 3 (see FIG. 1) and the lower stage. 4 (refer to FIG. 1) A heating device (heater) that suppresses the temperature drop of the upper substrate K1 and the lower substrate K2 by heating. On the other hand, it is also possible to suppress the temperature rise of the upper substrate K1 and the lower substrate K2 by using a Peltier element or the like. In such a configuration, the errors caused by the temperature change on the upper substrate K1 and the lower substrate K2 are reduced, and the bonding accuracy between the upper substrate K1 and the lower substrate K2 is improved. Moreover, the upper substrate K1 due to temperature change can be effectively alleviated The occurrence of the mark pitch deviation of the lower substrate K2.

Fig. 17 is a view showing still another design modification example, wherein (a) is a view showing a design modification example in which all the adhesive pins are attached to one adhesive pin plate, and (b) is for an integrated structure. A diagram showing the design change of the stage.

As shown in Fig. 6, the substrate assembly apparatus 1 (refer to Fig. 1) of the present embodiment has nine adhesive pin plates 8a. Further, nine adhesive pins 8 are attached to one of the adhesive pin plates 8a. The present invention is not limited to this configuration, and may be configured such that all of the adhesive pins 8 are attached to one of the adhesive pin plates 8a as shown in Fig. 17 (a).

Further, as shown in FIG. 17(a), the vertical movement mechanism 80 may be provided at four corner portions of the rectangular adhesive pin plate 8a.

In this configuration, the amount of movement of the four up-and-down moving mechanisms 80 can be changed to make the displacement amount of the adhesive pin 8 different. Further, the divided drive unit 31 can be displaced from the back plate 30 (refer to FIG. 3) in accordance with the displacement amount of the adhesive pin 8, and the upper substrate K1 (refer to FIG. 1) and the lower substrate K2 are referred to in this state (see FIG. 1 for reference). )fit.

Further, as shown in FIG. 4, the upper stage 3 of the substrate assembly apparatus 1 (refer to FIG. 1) of the present embodiment includes nine divided drive units 31. The configuration is not limited to this, and the upper stage 3 may have an integral structure as shown in FIG. 17(b). In other words, the upper stage 3 may not include the split drive unit 31, and the upper stage 3 may be formed of one steel plate or the like. In this case, when the rod 32a of the actuator 32 (refer to FIG. 3) is attached to the four corners of the rectangular upper stage 3, the amount of displacement of the four rods 32a can be changed to appropriately tilt the upper stage 3. Therefore, the upper stage 3 can be appropriately tilted in accordance with the displacement amount of the adhesive pin 8. In this state, the upper substrate K1 (refer to FIG. 1) is bonded to the lower substrate K2 (see FIG. 1).

3‧‧‧ going on stage

3a‧‧‧Upper substrate surface

4‧‧‧ step down

8‧‧‧Adhesive pin

8a‧‧‧Adhesive pin plate (base part)

30‧‧‧ Backplane

31‧‧‧Divided drive department

31a‧‧‧Divided plane

32‧‧‧Actuator (3rd drive mechanism)

32a‧‧‧ rod

80‧‧‧Up and down moving mechanism (2nd drive mechanism)

K1‧‧‧Upper substrate

K2‧‧‧lower substrate

Mk1‧‧‧1st mark (upper mark)

Mk2‧‧‧1st mark (below mark)

Claims (8)

A substrate assembly apparatus comprising: a lower stage having a lower substrate surface for holding the lower substrate; and a top plate having a plurality of divided drive units formed to face the divided plane portion of the lower substrate surface; a plurality of adhesive pins that are disposed to divide the plane portion and are displaced in the vertical direction with respect to the corresponding divided plane portion to hold the upper substrate; and the vacuum chamber that accommodates the lower stage and the upper stage and the adhesive pin in a vacuum environment a first driving mechanism that advances the adhesion pin and the upper stage toward the lower stage; a plurality of base portions that are one or more of the adhesion pins are attached; and the plurality of base portions are independent of each other and vertically move with respect to the division plane portion a second drive mechanism that drives the plurality of split drive units independently toward the lower substrate surface; a first suction means that is connected to the vacuum suction hole that is opened to the adhesive pin; and is connected to the first suction means a second suction means for the suction hole of the lower substrate surface; the adhesion pin is for each of the base portions Setting the displacement amount of displacement together with the base portion and will be held on the substrate, Further, each of the division drive units is displaced in a displacement amount corresponding to a displacement amount of the base portion of the adhesion pin disposed corresponding to the division plane portion of the division drive unit, in the vacuum chamber. In the vacuum environment, the first substrate is driven while the lower substrate is held, and the upper substrate held by the adhesive pin is bonded to the lower substrate, and the lower substrate is driven at a time when the lower substrate is bonded to the upper substrate. The second drive mechanism causes the adhesion pin to be introduced from the division plane portion while driving the first drive mechanism, and the divided drive unit in the displaced state presses the upper substrate and the lower substrate. The substrate assembly apparatus according to claim 1, wherein the division drive unit is displaced by a displacement amount equal to a displacement amount of the base portion of the adhesion pin corresponding to the divided plane portion of the division drive unit. The state of the upper substrate and the lower substrate is pressed. The substrate assembly apparatus according to claim 1 or 2, wherein the bonding position of the upper substrate and the lower substrate is adjusted in a state in which the upper substrate is held by the adhesive pin. The substrate assembly apparatus according to claim 3, further comprising: a moving mechanism that displaces the lower stage along the lower substrate surface; and an upper mark attached to the upper substrate and a lower mark attached to the lower substrate An imaging device; and a control device for performing image processing on the image data input from the imaging device to extract the upper mark and the lower mark; The control device gives a command to the moving mechanism based on the extracted upper mark and the position of the lower mark, and shifts the lower stage so that the upper mark and the lower mark have a predetermined positional relationship, and further The displacement amount set by the base portion displaces the base portion to adjust the bonding position between the upper substrate and the lower substrate. The substrate assembly device according to any one of claims 1 to 4, wherein the adhesive pin is a tubular member having the vacuum suction hole opened, and has an adhesive portion at a tip end, and vacuum-sucks the upper substrate to be attached. It is held by the aforementioned adhesive portion. A substrate assembly apparatus according to claim 5, further comprising a gas supply means for supplying a predetermined gas to the vacuum adsorption hole. A substrate assembly method is carried out by a control device for a substrate assembly apparatus, comprising: a stage for accommodating a plurality of divided driving portions for pressing an upper substrate and a lower substrate in a vacuum environment, and a lower stage for holding the lower substrate The vacuum chamber is separated into the upper chamber and the lower chamber, and the upper substrate is moved between the upper stage and the lower stage, and the plurality of adhesive pins are displaced, and the first suction of the vacuum adsorption hole connected to the adhesive pin is driven. Preferably, the upper substrate is vacuum-sucked by a plurality of the adhesive pins, and the upper substrate is attached to an upper substrate carrying program having an adhesive portion at a tip end of the adhesive pin, and is driven to be connected to a lower substrate surface formed on the lower stage. a second suction means for sucking the hole, and the aforementioned between the upper stage and the lower stage After the lower substrate is adsorbed on the lower substrate surface, the upper chamber is engaged with the lower chamber to close the vacuum chamber, and the vacuum chamber is vacuumed. The lower substrate is loaded into the program; and attached to the plurality of adhesives. The upper mark of the upper substrate in the state of the adhesive portion of the pin and the lower mark of the lower substrate added to the lower substrate surface are in a predetermined positional relationship, and the lower stage is along the lower substrate. a bonding position adjustment program for surface displacement; the adhesion pin in a state in which the upper substrate is attached is moved toward the lower stage holding the lower substrate, and the upper substrate and the lower substrate are bonded together, and the adhesion pin is removed from the front side a step of introducing the dividing plane portion and further moving the upper stage toward the lower stage, and pressing the upper substrate and the lower substrate by the upper stage; and moving out the vacuum chamber by increasing the vacuum chamber to atmospheric pressure In the above-described upper substrate loading process, each of the plurality of base portions of the one or more adhesion pins is attached The above-mentioned adhesive portion of the above-mentioned divided flat portion is vertically operated with respect to the divided flat portion, and the upper substrate is attached to the adhesive portion of the adhesive pin displaced together with the base portion, The bonding process is performed by displacing each of the division drive units by a displacement amount corresponding to a displacement amount of the base portion of the adhesion pin disposed corresponding to the division plane portion of the division drive unit. The upper stage presses the upper substrate and the lower substrate. The substrate assembly method according to the seventh aspect of the invention, wherein the bonding device is configured to: the control device is configured such that each of the divided driving units is mounted on the divided plane portion corresponding to the divided driving unit The displacement of the base portion of the adhesive pin is equal to the displacement amount, and the displaced upper surface presses the upper substrate and the lower substrate.