SG139511A1 - Substrate assembling method and assembling apparatus - Google Patents
Substrate assembling method and assembling apparatusInfo
- Publication number
- SG139511A1 SG139511A1 SG200201048-6A SG2002010486A SG139511A1 SG 139511 A1 SG139511 A1 SG 139511A1 SG 2002010486 A SG2002010486 A SG 2002010486A SG 139511 A1 SG139511 A1 SG 139511A1
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- substrates
- assembling
- assembling apparatus
- clearance
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
Abstract
SUBSTRATE ASSEMBLING METHOD AND ASSEMBLING APPARATUS With conventional assembling apparatus, it has been difficult in a vacuum to laminate two substrates properly at the required clearance and within a short time when the substrates are large in area. A new assembling apparatus has therefore been realized that ensures an almost uniform substrate-tc-substrate clearance by providing pressurizing mechanisms for applying pressure to the vicinity of the four corners of one rectangular substrate when two substrates are to be assembled by mechanical application of pressure, then monitoring the clearance between the substrates after the required pressure has been applied, and adjusting the pressurizing force of each pressurizing mechanism according to monitoring results.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001118361A JP3458145B2 (en) | 2001-04-17 | 2001-04-17 | Substrate bonding method and apparatus |
JP2001125764A JP3487833B2 (en) | 2001-04-24 | 2001-04-24 | Substrate bonding method and bonding device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG139511A1 true SG139511A1 (en) | 2008-02-29 |
Family
ID=32737640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200201048-6A SG139511A1 (en) | 2001-04-17 | 2002-02-22 | Substrate assembling method and assembling apparatus |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100489855B1 (en) |
SG (1) | SG139511A1 (en) |
TW (1) | TW574575B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100685923B1 (en) * | 2002-03-25 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | Bonding devise and method for manufacturing liquid crystal display device using the same |
JP4245138B2 (en) * | 2003-03-11 | 2009-03-25 | 富士通株式会社 | Substrate laminating apparatus and substrate laminating method |
KR101248278B1 (en) * | 2011-05-11 | 2013-03-27 | 박웅기 | Manufacturing method and apparatus of the panel for an electronic components |
KR102000792B1 (en) * | 2012-03-13 | 2019-07-16 | 시바우라 메카트로닉스 가부시끼가이샤 | Substrate bonding apparatus and substrate bonding method |
CN107086275B (en) * | 2017-05-12 | 2018-10-23 | 京东方科技集团股份有限公司 | Substrate is to box device and to cassette method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5231923A (en) * | 1991-07-12 | 1993-08-03 | Sintogokio Ltd. | Press apparatus used for manufacturing a liquid crystal panel |
US6190488B1 (en) * | 1998-06-16 | 2001-02-20 | Advanced Display Inc. | Apparatus for manufacturing liquid crystal panel and method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0519223A (en) * | 1991-07-12 | 1993-01-29 | Sintokogio Ltd | Press equipment for manufacturing liquid crystal panel |
JP2604090B2 (en) * | 1992-06-30 | 1997-04-23 | 信越エンジニアリング株式会社 | Glass substrate bonding equipment for liquid crystal display panels |
JP3094827B2 (en) * | 1995-02-14 | 2000-10-03 | ウシオ電機株式会社 | Method and apparatus for bonding liquid crystal panels |
JP3535044B2 (en) * | 1999-06-18 | 2004-06-07 | 株式会社 日立インダストリイズ | Substrate assembling apparatus and method, and liquid crystal panel manufacturing method |
JP3486862B2 (en) * | 1999-06-21 | 2004-01-13 | 株式会社 日立インダストリイズ | Substrate assembly method and apparatus |
-
2002
- 2002-02-22 SG SG200201048-6A patent/SG139511A1/en unknown
- 2002-02-25 TW TW91103319A patent/TW574575B/en not_active IP Right Cessation
- 2002-02-27 KR KR10-2002-0010530A patent/KR100489855B1/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5231923A (en) * | 1991-07-12 | 1993-08-03 | Sintogokio Ltd. | Press apparatus used for manufacturing a liquid crystal panel |
US6190488B1 (en) * | 1998-06-16 | 2001-02-20 | Advanced Display Inc. | Apparatus for manufacturing liquid crystal panel and method thereof |
Also Published As
Publication number | Publication date |
---|---|
KR100489855B1 (en) | 2005-05-17 |
TW574575B (en) | 2004-02-01 |
KR20020081543A (en) | 2002-10-28 |
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