TWI286351B - Semiconductor wafer and process for producing the semiconductor wafer - Google Patents

Semiconductor wafer and process for producing the semiconductor wafer Download PDF

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Publication number
TWI286351B
TWI286351B TW92122298A TW92122298A TWI286351B TW I286351 B TWI286351 B TW I286351B TW 92122298 A TW92122298 A TW 92122298A TW 92122298 A TW92122298 A TW 92122298A TW I286351 B TWI286351 B TW I286351B
Authority
TW
Taiwan
Prior art keywords
wire
semiconductor wafer
semiconductor
wafer
saw
Prior art date
Application number
TW92122298A
Other languages
English (en)
Chinese (zh)
Other versions
TW200402787A (en
Inventor
Gerhard Palme
Maximilian Kaeser
Manfred Grundner
Johann Steiner
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of TW200402787A publication Critical patent/TW200402787A/zh
Application granted granted Critical
Publication of TWI286351B publication Critical patent/TWI286351B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
TW92122298A 2002-08-14 2003-08-13 Semiconductor wafer and process for producing the semiconductor wafer TWI286351B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2002137247 DE10237247B4 (de) 2002-08-14 2002-08-14 Verfahren zur Herstellung einer Halbleiterscheibe aus Silicium

Publications (2)

Publication Number Publication Date
TW200402787A TW200402787A (en) 2004-02-16
TWI286351B true TWI286351B (en) 2007-09-01

Family

ID=31197011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92122298A TWI286351B (en) 2002-08-14 2003-08-13 Semiconductor wafer and process for producing the semiconductor wafer

Country Status (3)

Country Link
JP (1) JP2004074792A (de)
DE (1) DE10237247B4 (de)
TW (1) TWI286351B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007118581A (ja) * 2005-09-28 2007-05-17 Hiroshi Ishizuka 硬脆性材料の薄板及びその製造方法
DE102005046726B4 (de) 2005-09-29 2012-02-02 Siltronic Ag Nichtpolierte monokristalline Siliziumscheibe und Verfahren zu ihrer Herstellung
JP2009094156A (ja) * 2007-10-04 2009-04-30 Tohoku Univ 半導体基板および半導体装置
JP5256910B2 (ja) * 2008-07-30 2013-08-07 株式会社Ｓｕｍｃｏ グルーブローラの構造
CN101659089B (zh) * 2008-08-28 2012-02-15 上海九晶电子材料股份有限公司 一种多线切割机导轮开槽方法
DE102010005718B4 (de) * 2010-01-26 2011-09-22 Schott Solar Ag Drahtführungsrolle zur Verwendung in Drahtsägen
CN102950660B (zh) * 2011-08-26 2015-04-08 昆山中辰矽晶有限公司 线切割装置的主轮结构、其制作方法及线切割装置
DE102015200198B4 (de) * 2014-04-04 2020-01-16 Siltronic Ag Verfahren zum Abtrennen von Halbleiterscheiben von einem Werkstück mit einem Sägedraht
DE102017202314A1 (de) 2017-02-14 2018-08-16 Siltronic Ag Drahtsäge, Drahtführungsrolle und Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Stab
EP3943265A1 (de) * 2020-07-21 2022-01-26 Siltronic AG Verfahren und vorrichtung zum gleichzeitigen abtrennen einer vielzahl von scheiben von einem werkstück

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3273163B2 (ja) * 1996-09-06 2002-04-08 シャープ株式会社 マルチワイヤソー
DE19841492A1 (de) * 1998-09-10 2000-03-23 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Abtrennen einer Vielzahl von Scheiben von einem sprödharten Werkstück
DE19936834A1 (de) * 1999-08-05 2001-02-15 Wacker Siltronic Halbleitermat Sägedraht und Verfahren zum Trennläppen von sprödharten Werkstücken
DE10014445C2 (de) * 2000-03-23 2002-01-24 Wacker Siltronic Halbleitermat Verfahren zum Zerteilen eines Halbleiterstabes
DE10054165B4 (de) * 2000-11-02 2005-07-28 Siltronic Ag Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück

Also Published As

Publication number Publication date
DE10237247B4 (de) 2004-09-09
JP2004074792A (ja) 2004-03-11
TW200402787A (en) 2004-02-16
DE10237247A1 (de) 2004-03-04

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