TWI278963B - Copper silicide passivation for improved reliability - Google Patents

Copper silicide passivation for improved reliability Download PDF

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Publication number
TWI278963B
TWI278963B TW092109732A TW92109732A TWI278963B TW I278963 B TWI278963 B TW I278963B TW 092109732 A TW092109732 A TW 092109732A TW 92109732 A TW92109732 A TW 92109732A TW I278963 B TWI278963 B TW I278963B
Authority
TW
Taiwan
Prior art keywords
copper
interconnect structure
forming
interconnect
exposed
Prior art date
Application number
TW092109732A
Other languages
English (en)
Chinese (zh)
Other versions
TW200408055A (en
Inventor
Robert Wayne Bradshaw
Deepak A Ramappa
Daniele Contestable
Kurt George Steiner
Sailesh Mansinh Merchant
Original Assignee
Agere Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agere Systems Inc filed Critical Agere Systems Inc
Publication of TW200408055A publication Critical patent/TW200408055A/zh
Application granted granted Critical
Publication of TWI278963B publication Critical patent/TWI278963B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/037—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics the barrier, adhesion or liner layers being on top of a main fill metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/047—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by introducing additional elements therein
    • H10W20/048—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by introducing additional elements therein by using plasmas or gaseous environments, e.g. by nitriding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/052—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by treatments not introducing additional elements therein
    • H10W20/0526—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by treatments not introducing additional elements therein by thermal treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/055—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by formation methods other than physical vapour deposition [PVD], chemical vapour deposition [CVD] or liquid deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/064—Manufacture or treatment of conductive parts of the interconnections by modifying the conductivity of conductive parts, e.g. by alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW092109732A 2002-04-26 2003-04-25 Copper silicide passivation for improved reliability TWI278963B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13378202A 2002-04-26 2002-04-26

Publications (2)

Publication Number Publication Date
TW200408055A TW200408055A (en) 2004-05-16
TWI278963B true TWI278963B (en) 2007-04-11

Family

ID=22460275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092109732A TWI278963B (en) 2002-04-26 2003-04-25 Copper silicide passivation for improved reliability

Country Status (4)

Country Link
JP (2) JP2003347302A (https=)
KR (1) KR101005434B1 (https=)
GB (1) GB2390742B (https=)
TW (1) TWI278963B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101028811B1 (ko) * 2003-12-29 2011-04-12 매그나칩 반도체 유한회사 반도체 소자의 듀얼 다마신 패턴 형성 방법
US7229911B2 (en) 2004-04-19 2007-06-12 Applied Materials, Inc. Adhesion improvement for low k dielectrics to conductive materials
US20050233555A1 (en) * 2004-04-19 2005-10-20 Nagarajan Rajagopalan Adhesion improvement for low k dielectrics to conductive materials
JP2007109736A (ja) * 2005-10-11 2007-04-26 Nec Electronics Corp 半導体装置およびその製造方法
JP5582727B2 (ja) 2009-01-19 2014-09-03 株式会社東芝 半導体装置の製造方法及び半導体装置
US8884441B2 (en) 2013-02-18 2014-11-11 Taiwan Semiconductor Manufacturing Co., Ltd. Process of ultra thick trench etch with multi-slope profile
CN115295722B (zh) * 2022-06-07 2025-12-12 昕原半导体(杭州)有限公司 Rram下电极结构及其形成方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01103840A (ja) * 1987-10-16 1989-04-20 Sanyo Electric Co Ltd ドライエツチング方法
JPH04192527A (ja) * 1990-11-27 1992-07-10 Toshiba Corp 半導体装置
US5447887A (en) * 1994-04-01 1995-09-05 Motorola, Inc. Method for capping copper in semiconductor devices
JP3661366B2 (ja) * 1997-09-04 2005-06-15 ソニー株式会社 半導体装置及びその製造方法
JPH11191556A (ja) * 1997-12-26 1999-07-13 Sony Corp 半導体装置の製造方法および銅または銅合金パターンの形成方法
US6303505B1 (en) * 1998-07-09 2001-10-16 Advanced Micro Devices, Inc. Copper interconnect with improved electromigration resistance
JP2000058544A (ja) * 1998-08-04 2000-02-25 Matsushita Electron Corp 半導体装置及びその製造方法
JP2000195820A (ja) * 1998-12-25 2000-07-14 Sony Corp 金属窒化物膜の形成方法およびこれを用いた電子装置
JP2001185549A (ja) * 1999-12-24 2001-07-06 Toshiba Corp 半導体装置の製造方法
JP3643540B2 (ja) * 2000-02-21 2005-04-27 株式会社日立製作所 プラズマ処理装置
US6406996B1 (en) * 2000-09-30 2002-06-18 Advanced Micro Devices, Inc. Sub-cap and method of manufacture therefor in integrated circuit capping layers
JP4535629B2 (ja) * 2001-02-21 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2003045960A (ja) * 2001-08-01 2003-02-14 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2010232676A (ja) 2010-10-14
JP2003347302A (ja) 2003-12-05
GB2390742B (en) 2006-07-19
KR20030084761A (ko) 2003-11-01
GB2390742A (en) 2004-01-14
GB0309476D0 (en) 2003-06-04
KR101005434B1 (ko) 2011-01-05
TW200408055A (en) 2004-05-16

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