TWI276197B - Collet and method of picking up chip member using the same - Google Patents

Collet and method of picking up chip member using the same Download PDF

Info

Publication number
TWI276197B
TWI276197B TW092123407A TW92123407A TWI276197B TW I276197 B TWI276197 B TW I276197B TW 092123407 A TW092123407 A TW 092123407A TW 92123407 A TW92123407 A TW 92123407A TW I276197 B TWI276197 B TW I276197B
Authority
TW
Taiwan
Prior art keywords
tip
wafer
concave portion
protrusion
contact
Prior art date
Application number
TW092123407A
Other languages
English (en)
Chinese (zh)
Other versions
TW200410356A (en
Inventor
Shouji Yamamoto
Tomokazu Takahashi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200410356A publication Critical patent/TW200410356A/zh
Application granted granted Critical
Publication of TWI276197B publication Critical patent/TWI276197B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
TW092123407A 2002-08-26 2003-08-26 Collet and method of picking up chip member using the same TWI276197B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002245212A JP3848606B2 (ja) 2002-08-26 2002-08-26 コレットおよびそれを用いてチップ部品をピックアップする方法

Publications (2)

Publication Number Publication Date
TW200410356A TW200410356A (en) 2004-06-16
TWI276197B true TWI276197B (en) 2007-03-11

Family

ID=32053472

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092123407A TWI276197B (en) 2002-08-26 2003-08-26 Collet and method of picking up chip member using the same

Country Status (3)

Country Link
JP (1) JP3848606B2 (ja)
KR (1) KR20040018958A (ja)
TW (1) TWI276197B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4621595B2 (ja) * 2006-01-11 2011-01-26 株式会社東芝 半導体装置の製造方法
JP4616793B2 (ja) * 2006-05-17 2011-01-19 株式会社新川 多段加圧コレット
JP4397967B1 (ja) * 2009-08-04 2010-01-13 キヤノンマシナリー株式会社 吸着装置
JP2012156517A (ja) * 2012-03-05 2012-08-16 Renesas Electronics Corp 半導体集積回路装置の製造方法
KR101597032B1 (ko) * 2014-05-21 2016-03-07 주식회사 페코텍 반도체 다이 픽업 장치용 콜렛
JP6643197B2 (ja) * 2016-07-13 2020-02-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6685245B2 (ja) * 2017-02-08 2020-04-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
KR102397740B1 (ko) * 2021-05-13 2022-05-13 (주)씨이케이 이종접합 피커

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384950U (ja) * 1986-11-21 1988-06-03
JP2510024B2 (ja) * 1989-04-05 1996-06-26 富士通株式会社 半導体製造装置
JPH04188840A (ja) * 1990-11-22 1992-07-07 Toshiba Corp ダイボンディング方法
JP2585298Y2 (ja) * 1992-08-06 1998-11-18 澁谷工業株式会社 チップボンディング装置におけるワーク吸着部
JPH1140646A (ja) * 1997-07-18 1999-02-12 Fujitsu Ltd ピックアップツール
JPH1167795A (ja) * 1997-08-08 1999-03-09 Nec Corp 半導体チップ搭載装置及び半導体チップ搭載方法並びに半導体装置
JP2000114319A (ja) * 1998-09-30 2000-04-21 Hitachi Chem Co Ltd 半導体装置の製造法
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
KR100521973B1 (ko) * 2000-10-25 2005-10-17 앰코 테크놀로지 코리아 주식회사 반도체 칩 부착용 픽업 툴

Also Published As

Publication number Publication date
JP2004087677A (ja) 2004-03-18
TW200410356A (en) 2004-06-16
KR20040018958A (ko) 2004-03-04
JP3848606B2 (ja) 2006-11-22

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