TWI272371B - Multipoint thickness measurement system - Google Patents

Multipoint thickness measurement system Download PDF

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Publication number
TWI272371B
TWI272371B TW091103292A TW91103292A TWI272371B TW I272371 B TWI272371 B TW I272371B TW 091103292 A TW091103292 A TW 091103292A TW 91103292 A TW91103292 A TW 91103292A TW I272371 B TWI272371 B TW I272371B
Authority
TW
Taiwan
Prior art keywords
measured
thickness
ionization chamber
ionization
patent application
Prior art date
Application number
TW091103292A
Other languages
English (en)
Chinese (zh)
Inventor
Takeshi Kagawa
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TWI272371B publication Critical patent/TWI272371B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/06—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring the deformation in a solid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/08—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring roughness or irregularity of surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW091103292A 2001-03-01 2002-02-25 Multipoint thickness measurement system TWI272371B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001056817 2001-03-01
JP2002013937A JP3948965B2 (ja) 2001-03-01 2002-01-23 多点計測厚み計

Publications (1)

Publication Number Publication Date
TWI272371B true TWI272371B (en) 2007-02-01

Family

ID=26610434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091103292A TWI272371B (en) 2001-03-01 2002-02-25 Multipoint thickness measurement system

Country Status (4)

Country Link
JP (1) JP3948965B2 (ja)
KR (1) KR100491019B1 (ja)
CN (1) CN1223827C (ja)
TW (1) TWI272371B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10307356A1 (de) * 2003-02-21 2004-09-16 Sikora Ag Verfahren und Vorrichtung zur Bestimmung der Dicke der Isolation eines Flachkabels in Bereichen der metallischen Leiterbahnen
JP2006170883A (ja) * 2004-12-17 2006-06-29 Toshiba Corp 厚さプロファイル測定装置
JP2009098095A (ja) * 2007-10-19 2009-05-07 Yasuto Ioka 電離箱型ｘ線異物検出装置および筒状電離箱
KR100921417B1 (ko) * 2007-12-17 2009-10-14 한국원자력연구원 단일 지점 동위원소 방사선원을 이용한 다면적 두께 측정장치 및 측정 방법
JP5847674B2 (ja) * 2012-09-10 2016-01-27 株式会社東芝 Ｘ線厚さ計

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5890112A (ja) * 1981-11-26 1983-05-28 Toshiba Corp 放射線厚さ計
JPS60230008A (ja) * 1984-04-28 1985-11-15 Toshiba Corp 放射線厚さ計
FR2704643B1 (fr) * 1993-04-26 1995-06-23 Lorraine Laminage Procede et dispositf d'etalonnage pour un ensemble de mesure du profil transversal d'epaisseur d'un produit plat.

Also Published As

Publication number Publication date
KR100491019B1 (ko) 2005-05-24
JP2002328016A (ja) 2002-11-15
CN1378067A (zh) 2002-11-06
JP3948965B2 (ja) 2007-07-25
CN1223827C (zh) 2005-10-19
KR20020070824A (ko) 2002-09-11

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MM4A Annulment or lapse of patent due to non-payment of fees