TWI270895B - Photosensitive conduction paste and conductor pattern formed by using the same - Google Patents

Photosensitive conduction paste and conductor pattern formed by using the same Download PDF

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Publication number
TWI270895B
TWI270895B TW092125213A TW92125213A TWI270895B TW I270895 B TWI270895 B TW I270895B TW 092125213 A TW092125213 A TW 092125213A TW 92125213 A TW92125213 A TW 92125213A TW I270895 B TWI270895 B TW I270895B
Authority
TW
Taiwan
Prior art keywords
mass
parts
conductive paste
silver powder
paste
Prior art date
Application number
TW092125213A
Other languages
English (en)
Chinese (zh)
Other versions
TW200412600A (en
Inventor
Kazunobu Fukushima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200412600A publication Critical patent/TW200412600A/zh
Application granted granted Critical
Publication of TWI270895B publication Critical patent/TWI270895B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
TW092125213A 2002-09-13 2003-09-12 Photosensitive conduction paste and conductor pattern formed by using the same TWI270895B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002268891 2002-09-13

Publications (2)

Publication Number Publication Date
TW200412600A TW200412600A (en) 2004-07-16
TWI270895B true TWI270895B (en) 2007-01-11

Family

ID=34260174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125213A TWI270895B (en) 2002-09-13 2003-09-12 Photosensitive conduction paste and conductor pattern formed by using the same

Country Status (3)

Country Link
KR (1) KR100902729B1 (ko)
CN (1) CN100334654C (ko)
TW (1) TWI270895B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI428064B (zh) * 2010-04-01 2014-02-21 Fujikura Ltd 薄膜電路板

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5236400B2 (ja) * 2008-09-04 2013-07-17 太陽ホールディングス株式会社 導電ペーストおよびそれを用いた電極
JP5837884B2 (ja) 2010-10-27 2015-12-24 協立化学産業株式会社 導電性アンダーコート剤組成物
CN101984494B (zh) * 2010-12-09 2012-05-23 东南大学 防沉降感光性银浆料及其制备方法
CN102157222B (zh) * 2011-04-13 2012-05-23 成都印钞有限公司 低温导电银浆及其制备方法
CN102360586B (zh) * 2011-09-28 2014-06-11 邓水斌 一种触摸屏用低阻值导电银浆的制备方法
CN103515025B (zh) * 2013-09-30 2016-04-06 无锡晶睿光电新材料有限公司 一种低温固化型感光导电浆料及用其制作导电线路的方法
CN109572231B (zh) * 2018-11-16 2020-04-24 潮州三环（集团）股份有限公司 热敏打印头及其制备方法
CN111145935B (zh) * 2019-12-16 2022-07-15 中国人民解放军国防科技大学 一种银电极浆料及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3218767B2 (ja) * 1992-01-24 2001-10-15 東レ株式会社 感光性導電ペースト
JPH06240464A (ja) * 1993-02-19 1994-08-30 Showa Denko Kk 銀被覆銅粉およびこれを用いた導電性組成物
JP3758220B2 (ja) * 1995-11-17 2006-03-22 東レ株式会社 感光性導電ペーストおよび電極の製造方法
JP3520721B2 (ja) * 1997-05-28 2004-04-19 東レ株式会社 感光性導電ペーストおよび電極の製造方法
JPH1166957A (ja) 1997-08-12 1999-03-09 Tanaka Kikinzoku Kogyo Kk 導体組成物。
JP3206581B2 (ja) * 1999-01-25 2001-09-10 日本電気株式会社 復調器
JP2000331535A (ja) * 1999-05-20 2000-11-30 Toray Ind Inc 導体ペースト
JP4789299B2 (ja) * 2000-01-31 2011-10-12 京セラ株式会社 多層基板の製法
JP2001226596A (ja) * 2000-02-14 2001-08-21 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI428064B (zh) * 2010-04-01 2014-02-21 Fujikura Ltd 薄膜電路板
US8993895B2 (en) 2010-04-01 2015-03-31 Fujikura Ltd. Membrane wiring board

Also Published As

Publication number Publication date
KR100902729B1 (ko) 2009-06-15
CN1494090A (zh) 2004-05-05
KR20040032045A (ko) 2004-04-14
CN100334654C (zh) 2007-08-29
TW200412600A (en) 2004-07-16

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