1269018 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種具有防迴流效果之散熱裝置。 【先前技術】 者電子產紐術之迅猛發展，電子元件之運行速度不斷提升， 其產生之熱量亦隨之增多，如果不及時將其產生之熱量排出，將導致 其溫度不斷升高’進而嚴重影響其運行性能，為確保電子元件能正常 運行通¥在其表面安裝__散熱器以將熱量快速地散發出去。 傳統域，散熱器由於開模f用底、技術要求不高等優點受到廣 泛應用，然’隨著電子元件錢度之提高，電子元件所產生之熱量亦 與日俱增’而轉型散熱器之散熱則係—體漏成型，因受限於模 具技術散_片之高寬比受到限制，因而其有效散熱面積有限，日漸 不能滿足電子元件對散熱之需求。故業界對上述傳統轉舰熱器進 灯改良利用複數金屬散熱韓片組合形成堆疊式散熱器，該種散熱器 之散熱鰭片由金屬薄片預先成型，其有效散熱面積可得到明顯提高。 然而散細在配合風扇使料，風紐生之氣流在通過散熱韓 片門之k道時4易產生迴流，從而影響散熱效果，尤其在散熱器利用 π統風扇it仃細餘時，風扇並未正對健純道，鱗迴流現象 更為嚴重。 【發明内容】 為解决上錢流在散熱則間產生迴流之問題，有必要提供一種 可防止於散熱轉片間產生迴流之散熱裝置。 忒散熱裝置包括一基座，複數相互堆疊之散熱鰭片及連接基座與 散熱鰭片之熱管，相鄰兩散熱鰭片之間形成一通道，該通道内設有分 流結構將it道分隔成若干區域，靠近基座之散錢#之分流結構與基 座直接接觸。 相較於習用技術，該散熱裝置之通道内設有分流結構將通道分隔 成若干區域，從而可有效防止氣流流經通道時產生迴流。而且，基座 吸收之熱量一部分可通過熱管傳至散熱鰭片，而另一部分可通過相鄰 兩散熱鰭片間之分流結構傳至散熱㈣，從啸高散歸置之散熱效 率0 【實施方式】 下面參照附圖，結合實施例對本發明作進一步說明。 第一圖所示為本發明第一實施例散熱裝置10之示意圖，該散熱裝 置10包括|座60 ’複數散細片2G及連接基座6G與散熱H >； 20之複 數熱管40。 請-並參閱第二圖及第三圖，該基細包括_底面62，一與底面 相對之頂面64，底面62上開設有複數開傷6。基細通常由熱傳導率 較南且質量較輕之材質如鋁等製成。 3熱& 40為U形，可以理解地，該熱管之形狀並不局限於卿，還 可乂為其他七狀’如L形等，為方便描述，在本實施例中將以u形為例 =仃说明。雜⑽包括-吸熱部42及從賴部42兩端延伸出之放熱 部44，吸熱部42通過焊接或其他方式固定收容於基座⑻之開槽_。v 一吸熱板68貼附於基細之底面62從而將鮮觀吸熱部42爽設 1269018 於基座60與吸熱板68之間。該吸熱板68用於與_發熱元件（圖未示） 一 接觸’其通常由熱傳導率較基座6〇南之材質如鋼等製成。可以理解地， 一 本發明也可以不使用吸熱板68，而使得基座6〇之底面62及熱管40之吸 〜 熱部42直接與發熱元件接觸。 - 請芩閱第四圖及第五圖，每一散熱鰭片20包括一本體22，本體22 之一側向另一側一體沖壓從而在本體22之一側形成一 u形凹槽26，而在 本肢22之另側形成一大肋28，§亥突肋28包括從本體22延伸之兩側壁 28a，連接兩側壁28a之一底壁28b，可以理解地，突肋28之橫截面還可 為其他形狀，如三角形，半圓形等。散熱鰭片2〇之四角處各設有一折 • 邊3〇，折邊30之一端斜向延伸設有一卡扣結構，在本實施例中該卡扣 結構包括從折邊30斜向延伸之一連接片32及形成於連接片32末端之一 卡梢34 ’散熱鰭片20本體22對應卡扣結構處開設有開槽36。散熱鰭片 20之未肢22上更進一步設有複數通孔3g以供熱管4〇之放熱部糾穿設。 後位散熱鰭片20之突肋28對應卡設於前位散熱鰭片2〇之凹槽26中，後 位散熱·鰭片2G之折邊30抵靠於前位散鱗㈣之本體22之後側，後位 散熱鰭片20之卡扣結構分別跨過前位散蘭片2()之本體22之開槽％。 田所有政熱鰭片20疊好之後，再利用治具將卡梢34進行折彎，使之抵 錢對應散減# 2G之本體22之前嫩祕散細# 2G在前後方向上 籲 進行疋位。相鄰散熱韓片20之間形成-沿整個散熱鰭片2〇長度方向之 . 通道近基座60的頂面64之散熱·讀片20之突肋28的底壁28b與基座60 . 之頂面64直接接觸（請參第一圖）。 ' 在本實施例巾，後位散熱則2Q之突臟對應切於前位散錢 20之凹槽26中’相鄰兩散熱韓片2〇之突肋28之側壁孤相互抵接，形 成-分流結構將兩相鄰散熱鰭片2〇間之通道分隔成若干互不相通之區 域。讀，舍系統風| (圖未示）產生之氣流通過散熱裝置_寺，氣 流在互不相通之區域中流動’從而可避免氣流在通道内產生迴流。熱 管40連接基座60與散熱鰭片20，從而形成第二傳熱齊徑；靠近基座6〇 頂面64之散熱鰭片20之突肋28的底壁28b與基座60的頂面64直接接 觸’且相鄰兩散熱鰭片20之突肋28之側壁28a相互抵接，從而在基座6〇 與散熱鰭片20之間形成第二傳熱路徑。這樣，基座6〇吸收之熱量一部 分可通過熱管40傳至散熱鰭片20，而另一部分可通過相鄰兩散熱鰭片 20之突肋28之側壁28a相互抵接傳至散熱鰭片2〇，從而提高散熱裝置1〇 之散熱效率。 β 第六圖所示為本發明散熱裝置1〇之散熱鰭片2〇，之第二實施例的示 意圖，其與第—實施例之散熱鰭㈣之結構基本相同，不同之處在於 分流結構。在第二實施例中，從散熱鰭片2〇，之本體22，一側向另一側一 體沖壓設有複數擔片26,，後位散熱韓片2〇,之擋片26，抵接於前位散熱 •、，、s片20之本體22之後側從而形成分流結構，該分流結構將散熱籍片 20’間之通道分隔成若干區域，從而可避免氣流在通道内產生迴流。後 位散熱缝片20,之擔片26,抵接於前位散熱結片2〇,之本體泣之後側，靠 近基細的頂面64之散熱鰭片2G，的糾26,與基細之頂面料直接接 觸4基座60吸收之熱量一部分可通過熱管4〇傳至散熱韓片如，之 外’另-部分可通過散錢―，之㈣26，與本相互抵接而順次 從基座60傳至複數散熱鰭片20,。 依據上述的_已清賴述本發_重要特徵、操作方法及盆實 咖’謝得喊分了解其優點，但在此並無意盡舉所有的可能、， 或將本發明㈣於所公開的細節與轉巾，因為根據 ==::各樣的修改_^^ 明的精神且涵餘帽專利範圍的對等宣告中。 【圖式簡單說明】 1269018 第一圖為本發明第一實施例散熱裝置之組裝圖； 第二圖為第一圖之立體分解圖； 第三圖為第二圖中基座及熱管之另一角度視圖； 第四圖為本發明第一實施例散熱裝置之散熱鰭片之組裝示意圖 第五圖為第四圖中圈v部分之放大圖；及 第六圖為本發明第二實施例散熱裝置之散熱鰭片之組裝示意圖 【主要元件符號說明】 散熱裝置 10 開槽 散熱鰭片 20、20， 通孔 本體 22、22， 熱管 凹槽 26 吸熱部 擋片 26， 放熱部 突肋 28 基座 側壁 28a 底面 底壁 28b 頂面 折邊 30 開槽 連接片 32 吸熱板 卡梢 34 101269018 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink having an anti-backflow effect. [Prior Art] The rapid development of electronic production technology, the speed of electronic components continues to increase, and the heat generated by it increases. If the heat generated by it is not discharged in time, it will cause its temperature to rise continuously. Affect the running performance, in order to ensure the normal operation of the electronic components, the __ heat sink is installed on the surface to dissipate the heat quickly. In the traditional domain, the heat sink is widely used due to the advantages of the bottom of the mold, the technical requirements are not high, but as the electronic components increase the amount of heat generated by the electronic components, the heat generated by the electronic components is increasing. Body-to-drain molding is limited by the mold technology. The aspect ratio of the film is limited, so its effective heat dissipation area is limited, and it is unable to meet the demand for heat dissipation of electronic components. Therefore, the industry has improved the use of a plurality of metal heat sinks to form a stacked heat sink. The heat sink fins of the heat sink are pre-formed by metal foils, and the effective heat dissipation area can be significantly improved. However, the fineness is matched with the fan to make the material, and the airflow of the wind and the new air is likely to generate reflow when passing through the k-channel of the heat-dissipating Korean door, thereby affecting the heat dissipation effect, especially when the radiator uses the π-system fan to reduce the amount of the fan. The phenomenon of scale backflow is more serious. SUMMARY OF THE INVENTION In order to solve the problem that the flow of money flows back during heat dissipation, it is necessary to provide a heat sink that prevents backflow between the heat transfer fins. The heat sink comprises a base, a plurality of heat radiating fins stacked on each other, and a heat pipe connecting the base and the heat sink fin, and a channel is formed between the adjacent heat radiating fins, and a shunt structure is arranged in the channel to divide the it road into In several areas, the split structure of the loose money near the pedestal is in direct contact with the pedestal. Compared with the conventional technology, the heat dissipating device has a shunting structure in the channel to divide the channel into a plurality of regions, thereby effectively preventing backflow when the airflow flows through the channel. Moreover, part of the heat absorbed by the pedestal can be transmitted to the heat dissipating fin through the heat pipe, and the other part can be transmitted to the heat dissipating through the shunt structure between the adjacent two heat dissipating fins (4), and the heat dissipating efficiency from the stagnation of the sag is 0. The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings. The first figure shows a schematic diagram of a heat dissipating device 10 according to a first embodiment of the present invention. The heat dissipating device 10 includes a plurality of heat sinks 2G and a plurality of heat pipes 40 connected to the base 6G and the heat sink H > Please refer to the second and third figures, which include a bottom surface 62, a top surface 64 opposite the bottom surface, and a plurality of open wounds 6 on the bottom surface 62. The base is usually made of a material having a relatively low thermal conductivity and a light weight such as aluminum. 3The heat & 40 is U-shaped. It can be understood that the shape of the heat pipe is not limited to the shape of the heat pipe, and may be other seven-shaped 'such as L-shaped, etc., for convenience of description, in the present embodiment, the shape of the u will be Example = 仃 Description. The miscellaneous (10) includes a heat absorbing portion 42 and a heat releasing portion 44 extending from both ends of the lap portion 42, and the heat absorbing portion 42 is fixed to the groove _ received in the susceptor (8) by welding or the like. v A heat absorbing plate 68 is attached to the bottom surface 62 of the base to thereby cool the fresh heat absorbing portion 42 between the base 60 and the heat absorbing plate 68. The heat absorbing plate 68 is used to be in contact with a heat generating component (not shown). It is usually made of a material having a thermal conductivity lower than that of the base 6 such as steel. It will be understood that the present invention may also eliminate the use of the heat absorbing plate 68 such that the bottom surface 62 of the base 6 and the heat sink 42 of the heat pipe 40 are in direct contact with the heat generating component. - Referring to the fourth and fifth figures, each of the heat dissipation fins 20 includes a body 22, one side of which is integrally stamped laterally to the other side to form a U-shaped groove 26 on one side of the body 22, and A large rib 28 is formed on the other side of the limb 22, and the ridge 14 includes two side walls 28a extending from the body 22, connecting one of the bottom walls 28b of the two side walls 28a. It is understood that the cross section of the rib 28 can also be For other shapes, such as triangles, semi-circles, etc. Each of the four corners of the heat dissipating fins is provided with a fold/edge 3〇, and one end of the folded edge 30 is obliquely extended to provide a snap structure. In the embodiment, the snap structure includes one of obliquely extending from the flange 30. The connecting piece 32 and one of the ends of the connecting piece 32 are formed. The main body 22 of the heat dissipating fin 20 is provided with a slot 36 corresponding to the buckle structure. The plurality of through holes 3g are further provided on the limbs 22 of the heat radiating fins 20 for the heat radiating portion of the heat pipe 4 to be entangled. The protruding ribs 28 of the rear heat dissipating fins 20 are correspondingly disposed in the recesses 26 of the front heat radiating fins 2, and the folded edges 30 of the rear heat radiating fins 2G abut against the body 22 of the front scattered scales (4). The latching structure of the side and rear fins 20 respectively spans the slot % of the body 22 of the front loose strip 2 (). After all the hot fins 20 in the field are stacked, use the jig to bend the card tip 34 to make it correspond to the money. # 2G The body 22 before the tender secrets # 2G in the front and rear direction . The adjacent heat-dissipating Korean sheets 20 are formed along the length direction of the entire heat-dissipating fins 2 . The heat-dissipating surface of the top surface 64 of the substrate 60 is adjacent to the bottom wall 28 b of the protruding rib 28 of the reading sheet 20 and the base 60 . The top surface 64 is in direct contact (see the first figure). In the towel of this embodiment, the heat dissipation of the rear position is 2Q, and the side wall of the protruding rib 28 of the adjacent two heat-dissipating springs 2 is abutted against each other in the groove 26 of the front-level loose money 20, forming - The shunting structure divides the channel between two adjacent fins 2 into a plurality of mutually non-intersecting regions. Reading, the wind of the system system (the air generated by the figure is not shown) through the heat sink _ temple, the air flows in the areas that do not communicate with each other' to avoid the flow of air in the channel. The heat pipe 40 connects the base 60 and the heat dissipation fins 20 to form a second heat transfer parallel; the bottom wall 28b of the protruding rib 28 of the heat dissipation fin 20 near the top surface 64 of the base 6 and the top surface 64 of the base 60 The side walls 28a of the protruding ribs 28 of the adjacent two heat radiating fins 20 abut each other to form a second heat transfer path between the pedestal 6 〇 and the heat radiating fins 20. In this way, part of the heat absorbed by the pedestal 6 可 can be transmitted to the heat dissipation fins 20 through the heat pipe 40, and the other part can be transmitted to the heat dissipation fins 2 through the side walls 28a of the protruding ribs 28 of the adjacent two heat dissipation fins 20. Therefore, the heat dissipation efficiency of the heat sink 1 is improved. The sixth embodiment shows a heat dissipating fin 2 of the heat dissipating device of the present invention. The second embodiment is similar in structure to the heat dissipating fin (four) of the first embodiment, except for the shunting structure. In the second embodiment, a plurality of struts 26 are integrally stamped from the side of the main body 22 of the heat dissipating fins 2 to the other side, and the slab 26 of the rear heat dissipating film 2 is abutted. The front side heats the front side of the body 22 of the slab 20 to form a shunt structure which divides the passage between the heat radiating sheets 20' into a plurality of regions, thereby preventing the airflow from generating backflow in the passage. The rear heat dissipation slit 20, the support piece 26, abuts against the front heat dissipation film 2〇, the body behind the weeping side, and the heat dissipation fin 2G near the base top surface 64, the correction 26, and the base The top fabric directly contacts the heat absorbed by the 4 pedestal 60. A part of the heat absorbed by the susceptor 60 can be transmitted to the heat-dissipating Korean film through the heat pipe 4, and the other part can pass through the loose money, and the (four) 26, which abuts against the present, sequentially passes from the pedestal 60. Passed to the plurality of heat sink fins 20,. According to the above-mentioned _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Details and the towel, because according to the ==:: various modifications _ ^ ^ Ming spirit and the scope of the patent coverage of the cap. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1269018 is a perspective view of a heat dissipating device according to a first embodiment of the present invention; the second drawing is an exploded perspective view of the first drawing; and the third drawing is another of the base and the heat pipe in the second drawing. 4 is an enlarged view of a heat dissipating fin of a heat dissipating device according to a first embodiment of the present invention; FIG. 5 is an enlarged view of a portion of the ring v in the fourth embodiment; and FIG. 6 is a heat dissipating device according to a second embodiment of the present invention. Schematic diagram of the heat sink fins [Description of main components] Heat sink 10 slotted heat sink fins 20, 20, through hole body 22, 22, heat pipe recess 26 heat sink block 26, heat radiating rib 28 base side wall 28a bottom bottom wall 28b top fold 30 slotted tab 32 heat sink tab 34 10