TWI400422B - - Google Patents

Info

Publication number
TWI400422B
TWI400422B TW99144503A TW99144503A TWI400422B TW I400422 B TWI400422 B TW I400422B TW 99144503 A TW99144503 A TW 99144503A TW 99144503 A TW99144503 A TW 99144503A TW I400422 B TWI400422 B TW I400422B
Authority
TW
Taiwan
Application number
TW99144503A
Other versions
TW201226824A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW99144503A priority Critical patent/TWI400422B/zh
Publication of TW201226824A publication Critical patent/TW201226824A/en
Application granted granted Critical
Publication of TWI400422B publication Critical patent/TWI400422B/zh

Links

TW99144503A 2010-12-17 2010-12-17 TWI400422B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99144503A TWI400422B (en) 2010-12-17 2010-12-17

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW99144503A TWI400422B (en) 2010-12-17 2010-12-17
JP2011002682U JP3169367U (en) 2010-12-17 2011-05-16 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW201226824A TW201226824A (en) 2012-07-01
TWI400422B true TWI400422B (en) 2013-07-01

Family

ID=46932984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99144503A TWI400422B (en) 2010-12-17 2010-12-17

Country Status (2)

Country Link
JP (1) JP3169367U (en)
TW (1) TWI400422B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176304B1 (en) * 1998-11-24 2001-01-23 Hon Hai Precision Ind. Co., Ltd. Heat sink
TWM257090U (en) * 2004-04-30 2005-02-11 Hon Hai Prec Ind Co Ltd Heat dissipating device
TWM261972U (en) * 2003-12-05 2005-04-11 Yi-Ming Liou Cooling fin
TWI269018B (en) * 2005-06-03 2006-12-21 Foxconn Tech Co Ltd Heat dissipating device
JP2007281504A (en) * 2007-06-04 2007-10-25 Fujikura Ltd Heat sink and fin module
TWM360551U (en) * 2009-03-09 2009-07-01 Thermasol Technology Co Ltd Heat dissipater structure enclosed by circular rod
TWI313153B (en) * 2006-07-07 2009-08-01 Heat sink clip and assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176304B1 (en) * 1998-11-24 2001-01-23 Hon Hai Precision Ind. Co., Ltd. Heat sink
TWM261972U (en) * 2003-12-05 2005-04-11 Yi-Ming Liou Cooling fin
TWM257090U (en) * 2004-04-30 2005-02-11 Hon Hai Prec Ind Co Ltd Heat dissipating device
TWI269018B (en) * 2005-06-03 2006-12-21 Foxconn Tech Co Ltd Heat dissipating device
TWI313153B (en) * 2006-07-07 2009-08-01 Heat sink clip and assembly
JP2007281504A (en) * 2007-06-04 2007-10-25 Fujikura Ltd Heat sink and fin module
TWM360551U (en) * 2009-03-09 2009-07-01 Thermasol Technology Co Ltd Heat dissipater structure enclosed by circular rod

Also Published As

Publication number Publication date
JP3169367U (en) 2011-07-28
TW201226824A (en) 2012-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees