KR100778023B1 - A radiater of memory module having cooling airstream tube - Google Patents

A radiater of memory module having cooling airstream tube Download PDF

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Publication number
KR100778023B1
KR100778023B1 KR1020070053755A KR20070053755A KR100778023B1 KR 100778023 B1 KR100778023 B1 KR 100778023B1 KR 1020070053755 A KR1020070053755 A KR 1020070053755A KR 20070053755 A KR20070053755 A KR 20070053755A KR 100778023 B1 KR100778023 B1 KR 100778023B1
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South Korea
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memory module
heat sink
heat dissipation
flat surface
dissipation device
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KR1020070053755A
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Korean (ko)
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명윤경
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주식회사 일창프리시젼
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Priority to KR1020070053755A priority Critical patent/KR100778023B1/en
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Priority to PCT/KR2008/000941 priority patent/WO2008147018A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A memory module with a heat sink increasing a speed of a cooling airstream is provided to increase a surface area for heat exchange and to increase a speed of the cooling airstream while satisfying an exterior standard for installation in a limited space. A memory module with a heat sink increasing a speed of a cooling airstream comprises a tube type heat sink(10) which has an air flow path(15) for increasing the speed of the cooling airstream and includes a flat surface(11) in contact with the memory module(2). The tube type heat sink(10) forms one pipe path integrated with the air flow path(15) or plural pipe paths where separation walls are installed. The tube type heat sink(10) forms the air flow path(15) at plural positions while an outside surface(12) facing the flat surface(11) is folded to the flat surface(11). Radiating pins are protruded on the outside surface(12).

Description

냉각기류 증속 메모리모듈 방열장치{A RADIATER OF MEMORY MODULE HAVING COOLING AIRSTREAM TUBE} Cooling airflow memory module heat dissipation device {A RADIATER OF MEMORY MODULE HAVING COOLING AIRSTREAM TUBE}

도 1은 본 발명에 따른 일 실시예의 구성을 보이는 사시도1 is a perspective view showing the configuration of an embodiment according to the present invention

도 2는 본 발명에 따른 일 실시예의 설치상태도Figure 2 is an installation state of one embodiment according to the present invention

도 3은 도 2의 종단면도3 is a longitudinal cross-sectional view of FIG.

도 4는 본 발명에 따른 일 실시예의 히트싱크의 구성도4 is a block diagram of a heat sink according to an embodiment of the present invention.

도 5는 본 발명에 따른 일 실시예의 히트싱크의 구성도5 is a configuration diagram of a heat sink of an embodiment according to the present invention;

도 6은 본 발명에 따른 일 실시예의 히트싱크의 구성도6 is a block diagram of a heat sink according to an embodiment of the present invention.

도 7은 본 발명에 따른 일 실시예의 히트싱크의 구성도7 is a configuration diagram of a heat sink according to an embodiment of the present invention.

도 8은 본 발명에 따른 일 실시예의 히트싱크의 구성도8 is a configuration diagram of a heat sink according to an embodiment of the present invention.

도 9는 본 발명에 따른 일 실시예의 히트싱크의 구성도9 is a block diagram of a heat sink according to an embodiment of the present invention.

도 10은 본 발명에 따른 일 실시예의 히트싱크의 구성도10 is a configuration diagram of a heat sink according to an embodiment of the present invention.

도 11은 종래기술에 따른 일 실시예의 구성도 11 is a block diagram of an embodiment according to the prior art

도 12는 종래기술에 따른 일 실시예의 히트싱크의 구성도12 is a block diagram of a heat sink of an embodiment according to the prior art

*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

1: 본 발명의 냉각기류 증속 메모리모듈 방열장치1: Cooling airflow increased memory module heat dissipation device of the present invention

2: 메모리모듈 10: 튜브형 히트싱크 11: 평탄면2: memory module 10: tubular heat sink 11: flat surface

12: 외측면 15: 유로 17: 격벽12: outer side 15: flow path 17: partition wall

19: 방열핀 30: 접착패드19: heat radiation fin 30: adhesive pad

본 발명은 메모리모듈의 방열장치에 관한 것으로서, 특히 히트싱크가 튜브형으로 형성됨으로써 한정된 공간 내에 설치되는 외장규격을 만족시키면서 열교환을 위한 표면적이 배증되고 방열 냉각기류의 속력을 증가시키므로 방열성능이 획기적으로 향상됨과 아울러 생산성도 향상되도록 하는 냉각기류 증속 메모리모듈 방열장치에 관한 것이다.The present invention relates to a heat dissipation device of a memory module, and in particular, since the heat sink is formed in a tubular shape, the heat dissipation performance is remarkably improved since the surface area for heat exchange is doubled and the speed of the heat dissipation cooler is increased while satisfying an external specification installed in a limited space. The present invention relates to a cooling airflow increased memory module heat dissipation device which improves productivity.

반도체 기술의 눈부신 발달로 메모리모듈의 고성능화 및 고속화가 증대됨과 아울러 기판이 경량 박형화되는 한편 이에 비례하여 발열량이 증대됨에 따라 메모리모듈 방열장치의 중요성이 더욱 강조되고 있으며 특히 방열성능 향상에 초점이 모아지고 있다.Due to the remarkable development of semiconductor technology, the high performance and high speed of memory modules are increased, as the substrate is lighter and thinner, and the heat generation proportionally increases, the importance of memory module heat dissipation device is further emphasized, and in particular, the focus is on improving heat dissipation performance. have.

이와 같은 메모리모듈 방열장치의 방열성능은 히트싱크의 표면적 크기와 함께 열교환 냉각기류의 속력에 의하여 좌우된다고 할 수 있으나 한정된 공간 내에 설치되어야 하는 제약으로 어려움이 있었다.The heat dissipation performance of the memory module heat dissipation device depends on the surface area size of the heat sink and the speed of the heat exchange cooling airflow.

종래기술의 메모리모듈 방열장치(100)는 도 11에 도시된 바와 같이, 메모리 모듈(2) 전ㆍ후면에 각각 히트싱크가 열전도 특성을 갖는 접착패드(130)를 통하여 히트싱크(110A)(110B)가 접착되고, 상기 전ㆍ후면의 히트싱크를 고정하는 클립(150)이 부여되어 구성된다.As shown in FIG. 11, the memory module heat dissipation device 100 according to the related art has heat sinks 110A and 110B formed on the front and rear surfaces of the memory module 2 through adhesive pads 130 having heat conduction characteristics. ) Is bonded to each other, and a clip 150 for fixing the front and rear heat sinks is provided.

상기 히트싱크는 평판 플레이트형 외에 평판체에 방열핀(115)이 일정 간격으로 다수 형성된 날개형(110C)(도 12 참조)이 개시되어 있기도 하다.In addition to the flat plate type, the heat sink may include a blade type 110C (see FIG. 12) in which a plurality of heat dissipation fins 115 are formed on the flat plate at regular intervals.

그런데, 종래기술에서는 상기와 같이 히트싱크(110)가 플레이트형태로 형성됨으로써 방열성능 향상에 한계가 있었다.However, in the related art, since the heat sink 110 is formed in the form of a plate as described above, there is a limit in improving the heat dissipation performance.

즉, 상기 히트싱크는 메모리모듈에서 한정된 공간 내에 설치되어야 하므로 공간점유에 따른 크기의 제약이 따르므로 상기 플레이트형은 물론이고 날개형의 경우에도 표면적 확장에 한계가 있을 뿐 만 아니라 냉각기류 속력이 미미하여 열기가 정체되므로 방열성능이 따라주지 못하고 메모리모듈의 고성능화에 부응하지 못하여 반도체 기기의 운용에 지장을 주고 수명을 단축시키는 문제점이 있었다.In other words, since the heat sink must be installed in a limited space in the memory module, the size of the heat sink is limited, and thus, the plate type and the wing type are limited in surface area expansion, and the cooling airflow speed is insignificant. Since the heat is stagnant, the heat dissipation performance cannot be followed and the memory module does not meet the high performance of the memory module.

한편으로 종래기술은 평판체를 소정의 형상으로 타발하고 압입하여 요철을 형성한 후 다시 여러 차례의 절곡공정이 수반되므로 여러 벌의 금형을 필요로 하고 생산성이 오르지 않아 제조비용을 상승시키는 어려움이 있었다.On the other hand, in the prior art, since the plate body is punched into a predetermined shape and press-fitted to form irregularities, then a plurality of bending processes are involved again, a plurality of molds are required and productivity does not rise, thus increasing the manufacturing cost. .

본 발명은 상기한 문제점을 해소하기 위하여 안출된 것으로서,The present invention has been made to solve the above problems,

본 발명의 목적은 한정된 공간 내에 설치되는 외장규격을 만족시키면서 열교환을 위한 표면적이 배증되고 방열 냉각기류의 속력을 증가시키므로 방열성능이 획 기적으로 향상됨과 아울러 생산성도 향상되도록 하는 냉각기류 증속 메모리모듈 방열장치를 제공함에 있다.An object of the present invention is to satisfy the exterior standard installed in a limited space while doubling the surface area for heat exchange and increase the speed of the heat dissipation cooling airflow, so that the heat dissipation performance is significantly improved and productivity is also increased to increase the cooling airflow memory module In providing a device.

상기한 목적을 달성하는 본 발명에 따른 냉각기류 증속 메모리모듈 방열장치는 고정수단을 통하여 메모리모듈의 전ㆍ후면 중 어느 일면 또는 양면에 취부되어 메모리모듈에서 발생되는 열기를 냉각 열교환하는 히트싱크를 포함하는 메모리모듈 방열장치에 있어서,The cooling airflow speed increase memory module heat dissipation device according to the present invention to achieve the above object is attached to any one or both of the front and rear surfaces of the memory module through the fixing means includes a heat sink for cooling heat exchange heat generated from the memory module In the memory module heat dissipation device,

상기 히트싱크는 내부에 냉각기류 증속을 위한 유로를 구비하며 메모리모듈에 접하는 평탄면을 포함하여 형성된 튜브형 히트싱크로 구성됨을 특징으로 한다.The heat sink has a flow path for increasing the cooling air flow therein and is characterized by consisting of a tubular heat sink formed by including a flat surface in contact with the memory module.

이하, 본 발명의 냉각기류 증속 메모리모듈 방열장치에 대한 실시예를 첨부도면을 참조하여 보다 상세히 설명한다.Hereinafter, an embodiment of a cooling airflow increased memory module heat dissipation device of the present invention will be described in more detail with reference to the accompanying drawings.

도 1은 본 발명에 따른 일 실시예의 구성을 보이는 사시도, 도 2는 본 발명에 따른 일 실시예의 설치상태도, 도 3은 도 2의 종단면도이다.1 is a perspective view showing the configuration of an embodiment according to the present invention, Figure 2 is an installation state diagram of an embodiment according to the present invention, Figure 3 is a longitudinal cross-sectional view of FIG.

도 1 내지 도 3에 도시된 바와 같이, 본 발명에 따른 일 실시예의 냉각기류 증속 메모리모듈 방열장치는 고정수단(30)을 통하여 메모리모듈(2)의 전ㆍ후면 중 어느 일면 또는 양면에 취부되어 메모리모듈(2)에서 발생되는 열기를 냉각 열교환하는 히트싱크를 포함하는 메모리모듈 방열장치에 있어서, 상기 히트싱크는 내부에 냉각기류 증속을 위한 유로(15)를 구비하며 메모리모듈(2)에 접하는 평탄면(11)을 포함하여 형성된 튜브형 히트싱크(10)로 구성되는 것이다.As shown in Figures 1 to 3, the cooling airflow speed increase memory module heat dissipation device of one embodiment according to the present invention is mounted on any one surface or both surfaces of the front and rear of the memory module 2 through the fixing means (30) A memory module heat dissipation device comprising a heat sink for cooling and heat-heating heat generated from the memory module (2), wherein the heat sink has a flow path (15) for increasing the cooling airflow therein and is in contact with the memory module (2). The tubular heat sink 10 is formed to include the flat surface 11.

여기서, 상기 튜브형 히트싱크(10)는 판형에 가까운 납작한 형태로 이루어짐이 바람직하다Here, the tubular heat sink 10 is preferably made of a flat shape close to the plate shape.

상기 튜브형 히트싱크(10)는 유로(15)가 하나의 통합된 관로로 형성되거나 도 4에 도시된 바와 같이, 격벽(17)이 구비되어 복수 관로로 형성되어도 무방하다.The tubular heat sink 10 may have a flow path 15 formed as one integrated conduit or as shown in FIG. 4, with a partition 17 provided as a plurality of conduits.

상기 격벽(17)은 소정 간격으로 복수 형성됨이 바람직하다.Preferably, the partition 17 is formed in plural at predetermined intervals.

또한, 도 5 및 도 6에 도시된 바와 같이, 상기 튜브형 히트싱크(10)는 상기 평탄면(11)에 대향하는 외측면(12)이 상기 평탄면(11)에 접하기까지 굴곡형성되면서 유로(15)가 복수 개소에 형성될 수도 있다. 이때, 상기 외측면(12)의 일부는 격벽을 겸하게 된다.In addition, as shown in FIGS. 5 and 6, the tubular heat sink 10 is curved while the outer surface 12 facing the flat surface 11 is bent until the flat surface 11 is in contact with the flat surface 11. 15 may be formed in multiple places. At this time, a part of the outer surface 12 also serves as a partition.

또한, 도 7 내지 도 9에 도시된 바와 같이, 상기 튜브형 히트싱크(10)는 상기 평탄면(11)에 대향하는 외측면(12)에 방열핀(19)이 복수 돌출형성될 수도 있다.In addition, as illustrated in FIGS. 7 to 9, the tubular heat sink 10 may have a plurality of heat dissipation fins 19 protruding from the outer surface 12 opposite to the flat surface 11.

또한, 도 10에 도시된 바와 같이, 상기 튜브형 히트싱크(10)는 상기 평탄면 좌우 측단에 귀(耳)부(11a)가 구비되며 상기 귀부(11a)에 좌우방향 조립 안내를 위한 좌우가이드(11b)(11c)가 절곡 돌출형성되고, 상단에는 메모리모듈(2)에 조립시 상하방향 안내 스토퍼로 기능하기 위하여 절곡 돌출되는 상하방향 가이드(11d)가 일 개소 이상 형성되어도 무방하다.In addition, as shown in Figure 10, the tubular heat sink 10 is provided with an ear portion (11a) at the left and right side ends of the flat surface, and the left and right guides for guiding the left and right directions to the ear portion (11a) 11b) and 11c may be formed to be bent, and at least one top or bottom guide 11d may be formed to be bent and protruded to function as an up and down guide stopper when assembled to the memory module 2.

또한, 상기 튜브형 히트싱크(10)는 상기 평탄면에 대향하는 외측면에 고정수단의 조립을 안내하기 위한 클립가이드부(12a)가 형성될 수 있다(도 10 참조).In addition, the tubular heat sink 10 may be formed with a clip guide portion 12a for guiding the assembly of the fixing means on the outer surface facing the flat surface (see FIG. 10).

상기 귀부(11a), 좌우가이드(11b)(11c), 상하방향가이드(11d), 클립가이드 부(12a) 등의 형성은 튜브형 소재에서 일부를 절취하여 절곡형성되어도 무방하며 메모리모듈에 조립시 정확한 위치에 취부되도록 안내한다.The ear parts 11a, left and right guides 11b and 11c, up and down direction guides 11d, clip guide parts 12a, and the like may be formed by cutting a portion of the tubular material and bending them. Guide it to the location.

한편, 상기 고정수단(30)은 열전도특성이 강한 접착패드(31)만을 이용할 수도 있으며(도 1, 2 참조), 여기에 더하여 다양한 형태의 고정클립(33)이 사용되어도 무방하다.On the other hand, the fixing means 30 may use only the adhesive pad 31 having strong thermal conductivity (see FIGS. 1 and 2), and in addition to this, various types of fixing clips 33 may be used.

이와 같은 본 발명에 따른 튜브형 히트싱크(10) 소재는 알루미늄 또는 알루미늄 합금재를 압출방식으로 제조함이 바람직하다.The tubular heat sink 10 material according to the present invention is preferably manufactured by extrusion method of aluminum or aluminum alloy material.

그리고 압출된 튜브형 소재 원단에 아노다이징 공법 등을 이용하여 표면처리 후 절단하여 사용할 수도 있으며 상기 귀부(11a) 등의 형성을 위한 후속공정이 따를 수 있다.In addition, the extruded tubular material may be cut and used after surface treatment using an anodizing method or the like, and a subsequent process for forming the ear part 11a may be followed.

튜브형 히트싱크의(10) 표면처리는 절단 후에 수행되어도 무방하다.The surface treatment of the tubular heat sink 10 may be performed after cutting.

본 발명에 따른 튜브형 히트싱크(10)는 판체를 판금기법으로 절곡 형성할 수도 있다.The tubular heat sink 10 according to the present invention may be formed by bending the plate body by the sheet metal method.

이와 같은 구성을 지닌 본 발명에 따른 냉각기류 증속 메모리모듈 방열장치(1)의 작용상태를 살펴본다.It looks at the operation state of the cooling airflow speed increase memory module heat dissipation device 1 according to the present invention having such a configuration.

본 발명은 메모리모듈 방열장치의 히트싱크가 튜브형으로 형성됨으로써 한정된 공간을 점유하면서도 열교환을 위한 표면적이 종래기술의 플레이트형에 비하여 배증됨과 아울러 유로(15)가 형성됨으로써 방열 냉각기류를 증속시켜 열교환이 효율적으로 이루어지고 방열성능을 현저히 향상시키게 된다.According to the present invention, the heat sink of the memory module heat dissipation device is formed in a tubular shape, thereby occupying a limited space, while the surface area for heat exchange is doubled as compared with the plate type of the prior art, and the flow path 15 is formed to increase the heat radiation cooling airflow, thereby increasing heat exchange. Efficient and significantly improve heat dissipation performance.

여기에 더하여 튜브형 히트싱크(10)의 유로(15)가 격벽(17)을 통하여 복수의 관로로 형성되거나(도 4 참조) 또는 외측면(12)이 평탄면(11)에 접하기까지 굴곡형성되면서 복수로 형성될 경우(도 6, 7 참조) 열교환면적이 더욱 확장되고, 베르누이의 원리에 의하여 냉각기류의 속력이 더욱 증가된다.In addition, the flow path 15 of the tubular heat sink 10 is formed into a plurality of conduits through the partition wall 17 (see FIG. 4), or the curved surface is formed until the outer surface 12 contacts the flat surface 11. When formed in plurality (see FIGS. 6 and 7), the heat exchange area is further expanded, and the speed of the cooling airflow is further increased by Bernoulli's principle.

즉, 상기 격벽(17)이 형성됨으로써 열교환면적이 확장됨과 아울러 유로(15)의 전체 단면적이 줄어들어 좁은 통로를 흐를 때 열교환 냉각기류의 속력이 증가하는 현상이 나타나게 되는 것이다.That is, as the partition 17 is formed, the heat exchange area is expanded, and the overall cross-sectional area of the flow path 15 is reduced to increase the speed of the heat exchange cooling airflow when flowing through the narrow passage.

이와 같이 냉각기류의 속력이 증가됨에 따라 열교환이 신속하게 이루어져 방열성능이 획기적으로 향상되고 고성능 메모리모듈의 방열을 원활하게 수행하게 된다.As the speed of the cooling airflow is increased, heat exchange is rapidly performed, and the heat dissipation performance is dramatically improved, and the heat dissipation of the high performance memory module is smoothly performed.

또한, 압출방식으로 제조된 튜브형 코일원단을 절단하는 간단한 공정으로 튜브형 히트싱크(10) 완제품 생산이 가능하므로 생산성이 획기적으로 향상된다.In addition, since the tubular heat sink 10 can be produced in a simple process of cutting the tubular coil fabric manufactured by the extrusion method, productivity is dramatically improved.

이상, 본 발명의 바람직한 실시예를 첨부된 도면들을 참조로 설명하였다. 여기서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.In the above, preferred embodiments of the present invention have been described with reference to the accompanying drawings. Here, the terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, but should be interpreted as meanings and concepts corresponding to the technical spirit of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

이상에서 상세히 살펴본 바와 같이, 본 발명에 따른 냉각기류 증속 메모리모듈 방열장치는 히트싱크가 튜브형으로 형성됨으로써 한정된 공간에서 열교환 표면적이 배증됨과 아울러 방열 냉각기류의 속력을 증가시키는 유로가 형성되어 냉각 열교환이 신속하게 이루어지고 방열성능이 획기적으로 향상되어 차세대 고성능 메모리모듈의 방열을 원활하게 수행하는 뛰어난 효과가 있다.As described in detail above, in the cooling airflow speed increasing memory module heat dissipation device according to the present invention, since the heat sink is formed in a tubular shape, the heat exchange surface area is doubled in a limited space, and a flow path is formed to increase the speed of the heat dissipation cooling airflow. It is made quickly and the heat dissipation performance is dramatically improved, which has an excellent effect of smoothly dissipating the next generation of high performance memory modules.

또한, 제조공정이 간단하여 생산성을 현저히 향상시키는 이점이 있다.In addition, there is an advantage that the manufacturing process is simple and the productivity is remarkably improved.

Claims (7)

고정수단(30)을 통하여 메모리모듈(2)의 전ㆍ후면 중 어느 일면 또는 양면에 취부되어 메모리모듈(2)에서 발생되는 열기를 냉각 열교환하는 히트싱크를 포함하는 메모리모듈 방열장치에 있어서,In the memory module heat dissipation device comprising a heat sink which is mounted on any one or both of the front and rear surfaces of the memory module 2 through the fixing means 30 to cool and heat exchange the heat generated in the memory module 2, 상기 히트싱크는 내부에 냉각기류 증속을 위한 유로(15)를 구비하며 메모리모듈(2)에 접하는 평탄면(11)을 포함하여 형성된 튜브형 히트싱크(10)로 구성됨을 특징으로 하는 냉각기류 증속 메모리모듈 방열장치.The heat sink has a flow passage 15 for increasing the speed of the cooling air therein and comprises a tubular heat sink 10 including a flat surface 11 in contact with the memory module 2. Module heat sink. 청구항 1에 있어서,The method according to claim 1, 상기 튜브형 히트싱크(10)는 유로(15)가 하나의 통합된 관로로 형성되거나 격벽(17)이 구비되어 복수 관로로 형성됨을 특징으로 하는 냉각기류 증속 메모리모듈 방열장치.The tubular heat sink (10) is a cooling airflow increased memory module heat dissipation device, characterized in that the flow path (15) is formed in one integrated conduit or the partition 17 is formed in a plurality of conduits. 청구항 1에 있어서,The method according to claim 1, 상기 튜브형 히트싱크(10)는 상기 평탄면(11)에 대향하는 외측면(12)이 상기 평탄면(11)에 접하기까지 굴곡형성되면서 유로(15)가 복수 개소에 형성됨을 특징으로 하는 냉각기류 증속 메모리모듈 방열장치.Cooling, characterized in that the tubular heat sink 10 is formed to be bent in a plurality of places while the outer surface 12 facing the flat surface 11 is bent to contact the flat surface (11) Airflow increasing memory module heat sink. 청구항 1 내지 청구항 3 중 어느 한 항에 있어서,The method according to any one of claims 1 to 3, 상기 튜브형 히트싱크(10)는 상기 평탄면(11)에 대향하는 외측면(12)에 방열핀(19)이 복수 돌출형성됨을 특징으로 하는 냉각기류 증속 메모리모듈 방열장치.The tubular heat sink (10) is a cooling airflow increased memory module heat dissipation device, characterized in that a plurality of heat dissipation fins (19) protrudingly formed on the outer surface (12) facing the flat surface (11). 청구항 1 내지 청구항 3 중 어느 한 항에 있어서,The method according to any one of claims 1 to 3, 상기 튜브형 히트싱크(10)는 상기 평탄면 좌우 측단에 귀(耳)부(11a)가 구비되며 상기 귀부(11a)에 좌우방향 조립 안내를 위한 좌우가이드(11b)(11c)가 절곡 돌출형성되고, 상단에는 메모리모듈(2)에 조립시 상하방향 안내 스토퍼로 기능하기 위하여 절곡 돌출되는 상하방향 가이드(11d)가 일 개소 이상 형성됨을 특징으로 하는 냉각기류 증속 메모리모듈 방열장치.The tubular heat sink 10 is provided with an ear portion 11a at left and right side ends of the flat surface, and left and right guides 11b and 11c are formed to be bent and projected on the ear portion 11a for guiding the left and right directions. Cooling airflow speed increase memory module heat dissipation device, characterized in that the upper and lower guides (11d) bent to protrude in order to function as a vertical guide stopper when assembled to the memory module (2). 청구항 1 내지 청구항 3 중 어느 한 항에 있어서,The method according to any one of claims 1 to 3, 상기 튜브형 히트싱크(10)는 상기 평탄면에 대향하는 외측면에 고정수단의 조립을 안내하기 위한 클립가이드부(12a)가 형성됨을 특징으로 하는 냉각기류 증속 메모리모듈 방열장치.The tubular heat sink (10) is a cooling airflow increased memory module heat dissipation device, characterized in that the clip guide portion (12a) for guiding the assembly of the fixing means on the outer surface facing the flat surface. 청구항 1에 있어서,The method according to claim 1, 상기 튜브형 히트싱크(10)의 소재는 알루미늄 또는 알루미늄 합금재를 압출방식으로 제조하여 됨을 특징으로 하는 냉각기류 증속 메모리모듈 방열장치.The material of the tubular heat sink 10 is a cooling airflow speed increase memory module heat dissipation device, characterized in that the aluminum or aluminum alloy is produced by the extrusion method.
KR1020070053755A 2007-06-01 2007-06-01 A radiater of memory module having cooling airstream tube KR100778023B1 (en)

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