KR101022245B1 - Heat sink method of manufacturing for memory modules - Google Patents
Heat sink method of manufacturing for memory modules Download PDFInfo
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- KR101022245B1 KR101022245B1 KR1020080076305A KR20080076305A KR101022245B1 KR 101022245 B1 KR101022245 B1 KR 101022245B1 KR 1020080076305 A KR1020080076305 A KR 1020080076305A KR 20080076305 A KR20080076305 A KR 20080076305A KR 101022245 B1 KR101022245 B1 KR 101022245B1
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- heat sink
- surface treatment
- manufacturing
- metal plate
- film
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- Chemical & Material Sciences (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
According to the present invention, after the surface treatment process of forming a film on the heat sink of the memory module is performed in the state of fabric sheet metal, the heat sink is press-molded to greatly improve the surface treatment workability, and the products are collectively completed in a single production line. The present invention relates to a memory module heat sink manufacturing method that significantly improves productivity and reduces manufacturing costs.
According to an aspect of the present invention, there is provided a method of manufacturing a heat sink for a memory module including a surface treatment step of forming a film on a surface of a metal plate, the method comprising: a fabric surface treatment step of forming a film in a state of a metal plate; And a press process for press forming a heat sink using a metal plate on which a film is formed through the fabric surface treatment process.
Description
According to the present invention, after the surface treatment process of forming a film on the heat sink of the memory module is performed in the state of fabric sheet metal, the heat sink is press-molded to greatly improve the surface treatment workability, and the products are collectively completed in a single production line. The present invention relates to a memory module heat sink manufacturing method which significantly improves productivity and significantly reduces manufacturing costs.
As the high performance and high speed of the memory module is increased and the heat generation amount is increased in proportion to the memory module, the importance of the memory module heat dissipation device is further emphasized.
Looking at the configuration of the general memory module
In addition, the heat sink has an
The heat sink manufacturing method according to the prior art as shown in Figure 3, the metal sheet fabric coil supplied to the press apparatus is manufactured through a surface treatment process after press-molded in a separate form by a mold.
The surface treatment process is performed by various methods such as anodizing and painting as an important process to improve the corrosion resistance and surface strength and to improve the productability by having a color of the appearance decoration.
However, in the prior art, the surface treatment process is performed after the heat sink is press-molded, that is, the surface treatment process is performed by the heat sink, and then performed in units of units, thereby lowering productivity due to the surface treatment process and increasing the defect rate. There was a problem of raising the manufacturing cost.
For example, when the surface treatment is performed by an anodizing method, many processes such as transferring the heat sink to be treated to the anode of the electrolytic cell, drawing it out again after film formation, and the like are treated as a single unit of heat sink. It is wasted and lowers productivity.
In addition, since the surface treatment process is performed after the press process, the surface treatment process workshop, which is a pollution generating facility, together with the press process workshop must be secured in the manufacturing plant, resulting in a problem of increasing the plant site and facility size and generating environmental pollution.
In addition, since the surface treatment process product separately formed from the press process workshop after the press process has to be moved to the workshop, there is a problem that the production line is not continuous, thereby significantly lowering the productivity.
The present invention has been made to solve the above problems,
SUMMARY OF THE INVENTION An object of the present invention is to provide a memory module heat sink manufacturing method for minimizing defects and greatly improving surface workability by press forming a heat sink after a surface treatment process for forming a film is performed on a metal sheet fabric. In providing.
Another object of the present invention is to provide a memory module heat sink manufacturing method in which a manufacturing process of a product in a heat sink manufacturing plant can be completed in a single production line, thereby dramatically improving productivity and significantly reducing manufacturing costs.
Another object of the present invention is a surface treatment process is performed in a relatively large fabric factory and the heat sink manufacturing plant is excluded from the surface treatment process to simplify the heat sink manufacturing facilities and to minimize environmental pollution heat It is to provide a sink manufacturing method.
Memory module heat sink manufacturing method according to the present invention for achieving the above object,
In the method of manufacturing a heat sink for a memory module comprising a surface treatment step of forming a film on the surface of the metal plate,
A fabric surface treatment step of forming a film in a metal sheet fabric state;
And a press process for press forming a heat sink using a metal plate on which a film is formed through the fabric surface treatment process.
In the method of manufacturing a memory module heat sink according to the present invention, after the surface treatment process for forming a film is performed in a state of fabric of a metal plate, the heat sink is press-molded to minimize the occurrence of defects, and the surface treatment workability is remarkably increased. It works.
In addition, the heat sink manufacturing plant has a remarkable effect of drastically reducing the production cost by drastically improving the productivity by allowing the product manufacturing work to be completed in a single production line in a batch.
In addition, the surface treatment process is made in a relatively large fabric factory, the surface treatment process is excluded in the heat sink manufacturing plant, the heat sink manufacturing facility is simplified and has an excellent effect of minimizing environmental pollution.
Hereinafter, an embodiment of a memory module heat sink manufacturing method of the present invention will be described in detail with reference to the accompanying drawings.
Memory module heat sink manufacturing method according to an embodiment of the present invention, as shown in Figure 1, in the manufacturing method of the heat sink for the memory module comprising a surface treatment step of forming a film on the surface of the metal plate, the metal plate in the original state A fabric surface treatment process for forming a film and a press process for press forming a heat sink using a metal plate on which a film is formed through the fabric surface treatment process.
Here, it is preferable that the fabric surface treatment process is performed in a metal plate fabrication factory so that the metal plate is supplied to the heat sink manufacturing plant in the form of a color metal plate coil.
In addition, the metal plate is preferably made of aluminum.
In the memory module heat sink manufacturing method according to the present invention, the surface treatment process for forming a film on the surface of the heat sink is performed in the original state, and then the heat treatment is formed by pressing to significantly increase the workability of the surface treatment process. .
That is, since hundreds of heat sinks are made from one metal sheet fabric coil, one surface treatment process in the fabric state has an effect such as performing one-touch surface treatment processes of several hundred heat sinks.
In addition, since the surface treatment process is performed at the fabric manufacturing plant, which is a relatively large facility, it is supplied to the heat sink manufacturing plant for memory modules. do.
Therefore, in the manufacturing plant of the heat sink, the colored metal sheet coil supplied by surface treatment enters the press apparatus and is collectively formed in a series of single lines until it is processed, molded and assembled into the heat sink product.
As described above, the memory module heat sink manufacturing method according to the present invention minimizes the occurrence of defects by press-molding the heat sink after the surface treatment process for forming the coating is performed on a metal plate fabric state, and the surface treatment workability is remarkably increased. In the heat sink factory, manufacturing of products can be completed in a single production line in a batch, thereby reducing plant area and dramatically improving productivity, thereby significantly reducing manufacturing costs.
In addition, the surface treatment process is performed in a fabric factory with a relatively large facility, and a heat sink manufacturing process is excluded in a heat sink manufacturing plant, which is relatively small and difficult to equip a pollutant emission gas combustion facility. Is extremely simple and minimizes environmental pollution.
The preferred embodiment of the present invention has been described above. Here, the terms or words used in the present specification and claims should not be construed as being limited to ordinary or dictionary meanings, but should be construed as meanings and concepts corresponding to the technical spirit of the present invention, and embodiments described herein. Since not all represent the technical idea of the present invention, it should be understood that there may be various modifications in the present application.
1 is a flowchart of one embodiment according to the present invention.
Figure 2 is an exploded perspective view showing the configuration of the memory module heat sink
3 is a flow chart according to the prior art
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080076305A KR101022245B1 (en) | 2008-08-05 | 2008-08-05 | Heat sink method of manufacturing for memory modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080076305A KR101022245B1 (en) | 2008-08-05 | 2008-08-05 | Heat sink method of manufacturing for memory modules |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100016714A KR20100016714A (en) | 2010-02-16 |
| KR101022245B1 true KR101022245B1 (en) | 2011-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080076305A KR101022245B1 (en) | 2008-08-05 | 2008-08-05 | Heat sink method of manufacturing for memory modules |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101022245B1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340460A (en) * | 1989-07-07 | 1991-02-21 | Nippon Alum Mfg Co Ltd | Heat sink and manufacture thereof |
| KR100778023B1 (en) * | 2007-06-01 | 2007-11-21 | 주식회사 일창프리시젼 | A radiater of memory module having cooling airstream tube |
| KR100783263B1 (en) * | 2007-01-08 | 2007-12-06 | 권병일 | Press device for making heat sink and its method with the same |
-
2008
- 2008-08-05 KR KR1020080076305A patent/KR101022245B1/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340460A (en) * | 1989-07-07 | 1991-02-21 | Nippon Alum Mfg Co Ltd | Heat sink and manufacture thereof |
| KR100783263B1 (en) * | 2007-01-08 | 2007-12-06 | 권병일 | Press device for making heat sink and its method with the same |
| KR100778023B1 (en) * | 2007-06-01 | 2007-11-21 | 주식회사 일창프리시젼 | A radiater of memory module having cooling airstream tube |
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| Publication number | Publication date |
|---|---|
| KR20100016714A (en) | 2010-02-16 |
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