WO2008147018A1

WO2008147018A1 - Heat dissipating device for memory modules capable of increasing cooling air current velocity

Info

Publication number: WO2008147018A1
Application number: PCT/KR2008/000941
Authority: WO
Inventors: Yun Kyung Myung
Original assignee: Il Chang Precision Co., Ltd
Priority date: 2007-06-01
Filing date: 2008-02-18
Publication date: 2008-12-04
Also published as: KR100778023B1

Abstract

Disclosed herein is a heat dissipating device for memory modules, capable of increasing cooling air flow velocity. The heat dissipating device includes a heat sink, which is mounted to at least one of the front and rear surfaces of a memory module. The heat sink is constructed using a tube type heat sink having cooling air flow paths. The first side walls of the flow paths form an endothermic surface that comes into contact with the memory module.

Description

HEAT DISSIPATING DEVICE FOR MEMORY MODULES CAPABLE OF INCREASING COOLING AIR CURRENT

VELOCITY

Technical Field

[1] The present invention relates to a heat dissipating device for memory modules and, more particularly, to a heat dissipating device for memory modules, capable of increasing cooling air flow velocity, in which heat sinks are each formed to have a tube structure, thus notably improving the heat dissipation performance by doubling the surface area for heat exchange and increasing the flow velocity of cooling air for dissipating heat while satisfying the requirements for the external dimensions of the device, which is mounted in a limited space. Background Art

[2] Due to the remarkable development of semiconductor technology, the performance and speed of a memory module have increased, and a board has been manufactured to be light and thin. Meanwhile, as the amount of dissipated heat is increased in proportion to the decrease in size of the board, the importance of a heat dissipating device for memory modules is further increased and, in particular, attention is paid to the improvement of heat dissipation performance.

[3] Although the heat dissipation performance of such a heat dissipating device for memory modules depends in part on the flow velocity of heat exchange cooling air and on the surface area of a heat sink, difficulties arise from the limitation that such heat sinks must occupy a limited space.

[4] As shown in FIG. 14, a conventional heat dissipating device 100 for memory modules is configured such that heat sinks 110 are respectively bonded to the front and rear surfaces of a memory module 2 using bonding means 130, each having a heat conduction characteristic, and clamps 150 for fastening the front and rear heat sinks are provided.

[5] As to the heat sinks, a wing type 11OC, in which a plurality of heat dissipating pins

115 is formed on a flat plate at regular intervals, in addition to a flat plate type, have been disclosed (refer to FIG. 15).

[6] However, in the conventional heat dissipating device, the heat sinks 110 are each formed to have a plate structure, as described above, and thus there are limitations on the improvement of the heat dissipation performance.

[7] That is, there is a spatial limitation such that the heat sinks must be mounted in a limited space. Accordingly, in the case of the wing type, as well as in the case of the plate type, there is a limitation to the increase in the surface area and, in addition, hot air remains due to the low cooling air velocity, so that the desired heating dissipation performance cannot be obtained, and high performance memory modules cannot be realized. As a result, a problem occurs in that operation of a semiconductor device is interrupted and, thus, the lifespan of the semiconductor device is reduced. Disclosure of Invention Technical Problem

[8] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a heat dissipating device for memory modules, capable of increasing cooling air flow velocity, which can notably improve the heat dissipation performance by doubling the surface area for heat exchange and increasing the flow velocity of cooling air for dissipating heat while satisfying the requirements for the external dimensions of the device, which is mounted in a limited space. Technical Solution

[9] In order to accomplish the above object, the present invention provides a heat dissipating device for memory modules, capable of increasing cooling air flow velocity, the heat dissipating device including: a heat sink, which is mounted to at least one of the front and rear surfaces of a memory module, wherein the heat sink is constructed using a tube type heat sink having cooling air flow paths, and the first side walls of the flow paths form an endothermic surface that comes into contact with the memory module.

Advantageous Effects

[10] In the heat dissipating device for memory modules, capable of increasing cooling air flow velocity, according to the present invention, which is constructed as described above, heat sinks are each formed to have a tube structure, so that flow paths, which double the surface area for heat exchange and increase the flow velocity of cooling air for dissipating heat, are formed in a limited space, and the heat dissipation performance is notably improved, with the result that heat can be uninterruptedly dissipated from next-generation high performance memory modules. Brief Description of the Drawings

[11] FIG. 1 is a perspective view showing the construction of a heat dissipating device for memory modules, according to an embodiment of the present invention;

[12] FIG. 2 is a view showing the installation of the heat dissipating device according to the embodiment of the present invention;

[13] FIG. 3 is a longitudinal sectional view of FIG. 2;

[14] FIG. 4 is a view showing the construction of a heat sink according to an embodiment of the present invention; [15] FIG. 5 is a view showing the construction of a heat sink according to another embodiment of the present invention; [16] FIG. 6 is a view showing the construction of a heat sink according to another embodiment of the present invention; [17] FIG. 7 is a view showing the construction of a heat sink according to another embodiment of the present invention; [18] FIG. 8 is a view showing the construction of a heat sink according to another embodiment of the present invention; [19] FIG. 9 is a view showing the construction of a heat sink according to another embodiment of the present invention; [20] FIG. 10 is a view showing the construction of heat sinks according to another embodiment of the present invention; [21] FIG. 11 is a view showing the construction of a heat sink according to another embodiment of the present invention; [22] FIG. 12 is a development view of FIG. 11 ;

[23] FIG. 13 is a view showing the construction of heat sinks according to an embodiment of the present invention; [24] FIG. 14 is a view showing the construction of a conventional heat dissipating device for memory modules; and [25] FIG. 15 is a view showing the construction of a heat sink of the conventional heat dissipating device for memory modules. [26] *Description of characters of principle elements

[27] 1: heat dissipating device for memory modules, capable of increasing cooling air flow velocity, according to the present invention [28] 2: memory module 10,10A: tube type heat sinks

[29] 11: endothermic surfaces 12: outer surfaces

[30] 15: flow paths 17: partition walls

[31] 19: heat dissipating pins 30: bonding means

[32] 50: clamp

Mode for the Invention [33] A heat dissipating device for memory modules, capable of increasing cooling air flow velocity, according to the present invention, is described in detail with reference to the accompanying drawings. [34] FIG. 1 is a perspective view showing the construction of a heat dissipating device for memory modules, according to an embodiment of the present invention, FIG. 2 is a view showing the installation of the heat dissipating device according to the embodiment of the present invention, and FIG. 3 is a longitudinal sectional view of FIG. 2.

[35] As shown in FIGS. 1 to 3, the heat dissipating device for memory modules, capable of increasing cooling air flow velocity, according to an embodiment of the present invention, includes a heat sink, which is mounted to at least one of the front and rear surfaces of a memory module 2, in which the heat sink is constructed using a tube type heat sink 10 having cooling air flow paths 15, and the first side walls of the flow paths 15 form an endothermic surface 11, which comes into contact with the memory module.

[36] In this case, it is preferred that the tube type heat sink 10 be formed of slim tube having a structure similar to that of a plate, and that it be mounted to the memory module using a bonding means 30, such as a bonding pad, having a heat conduction characteristic.

[37] The tube type heat sink 10 may be configured such that the flow paths 15 are integrated into a single path, or such that partition walls 17 are provided therein, as shown in FIG. 4.

[38] It is preferred that the partition walls 17 be formed at predetermined intervals and that the number of partitions 17 be greater than one.

[39] Furthermore, as shown in FIGS. 5 and 6, the tube type heat sink 10 may be configured such that the flow paths 15 are formed in such as way that an outer surface, which is opposite the endothermic surface 11, is curved up to a point at which the outer surface abuts the endothermic surface 11. In this case, portions of the outer surface 12 are used as the partition walls.

[40] Furthermore, as shown in FIGS. 7 to 9, the tube type heat sink 10 may be configured such that a plurality of heat dissipating pins 19 is formed to protrude from the outer surface 12, which is opposite the endothermic surface 11 with respect to the flow paths.

[41] Furthermore, as shown in FIG. 10, the tube type heat sink 10 may be configured such that respective lug protrusions 11a are provided on the left and right ends of the endothermic surface 11, lateral guides 1 Ib and 1 Ic, which are used to laterally guide assembly, are formed to be bent in the lug protrusions 1 Ia or to protrude from the lug protrusions 11a, and one or more vertical guides 1 Id, which have a bent or protruding structure so as to function as vertical guide stoppers when assembled with the memory module 2, are formed in the upper end of the heat sink 10.

[42] Furthermore, the tube type heat sink 10 may be configured such that clamp locking depressions 12a for assembling clamps 50 are formed in the outer surface 12, which is opposite the endothermic surface 11 (refer to FIG. 10).

[43] The lug protrusions 1 Ia, the lateral guides 1 Ib and 1 Ic and the vertical guides 1 Id, may be formed in such a way as to cut and bend portions of a tube type material, and guide the heat sink such that the heat sink can be accurately mounted at a predetermined location when assembled with the memory module.

[44] It is preferred that the tube type heat sink 10 according to the present invention be made of aluminum or an aluminum alloy material through extrusion.

[45] Furthermore, the extruded original tube type material may be cut after surface treatment is performed thereon using an anodizing method for the use thereof, and a post process of forming the lug protrusions 11a may subsequently be conducted.

[46] The surface treatment for the tube type heat sink 10 may be performed after cutting.

[47] In an embodiment according to the present invention, the tube type heat sink 1OA is made of an aluminum or aluminum alloy plate 10Aa through sheet metal working, as shown in FIGS. 11 and 12.

[48] It is preferred that the tube type heat sink 1OA be configured such that a seaming portion 13, in which two leading ends of the plate 10Aa overlap each other, is formed to protrude upwards from the plate 10Aa, and that one or more bent locking pieces 14 for locking the seaming portion 13 be formed.

[49] Furthermore, it is preferred that the tube type heat sink 1OA be configured such that one or more clamp assembly grooves 18 are formed in the seaming portion 13 to couple the clamp 50.

[50] Furthermore, the tube type heat sink 1OA may be configured such that one or more stoppers 16 for preventing the clamp 50 from being released are formed to protrude from the outer surface 12, which does not come into contact with the memory module 2.

[51] Furthermore, as shown in FIG. 13, the tube type heat sink 1OA may be configured such that respective lug protrusions 11a are provided on the left and right ends of the endothermic surface 11, lateral guides 1 Ib and 1 Ic for laterally guiding assembly are formed to be bent in the lug protrusions 1 Ia or to protrude from the lug protrusions 11a, and one or more vertical guides are formed to be bent in the seaming portion 13 or to protrude from the seaming portion 13.

[52] The operation of the heat dissipating device 1 for memory modules, capable of increasing cooling air flow velocity, according to the present invention, which is constructed as described above, is described below.

[53] In the present invention, the heat sink of the heat dissipating device for memory modules is formed to have a tube structure, in which the surface area for heat exchange in a limited space is doubled compared with the conventional plate type heat sinks and, in addition, the flow velocity of the cooling air for heat dissipation is increased thanks to the flow paths 15, and thus the heat dissipation performance can be remarkably improved. [54] The manufacture of the above-described tube type heat sink enables a completed product to be produced through a simple process of cutting an extruded original tube type coil, so that productivity can be notably improved.

[55] However, when an extrusion process is performed, it is difficult for the slim tube type heat sink to withstand the extrusion pressure if the partition walls 17 are not formed.

[56] In contrast, in the tube type heat sinks 1OA, which are formed of the plate 10Aa through sheet metal working, the partition walls for the flow paths 15 may be removed. Accordingly, the cross sectional area of a flow path 15 is can be maximized, and thus the flow amount and velocity of cooling air can be maximized.

[57] As described above, in the tube type heat sink according to the present invention, flow paths are formed, so that the cooling air velocity is increased and the surface area is doubled, and thus heat exchange is rapidly performed, with the result that heat dissipation performance can be notably improved and uninterrupted heat dissipation can be performed on high performance memory modules.

[58] The preferred embodiments of the present invention have been described above with reference to the accompanying drawings. Here, it must be understood that the terms or words used in the specification and claims of the present invention should not necessarily be understood according to their general meanings or dictionary definitions, but should be understood to have meanings and to represent concepts that conform to the technical spirit of the present invention. Accordingly, the embodiments, which have been described in the present specification, and the constructions, which are shown in the drawings, are merely the most preferred embodiments of the present invention, but do not express the entire technical scope of the present invention, so that it should be understood that there may be various equivalents and modifications that can replace the embodiments when the present invention is implemented. Industrial Applicability

[59] As described above, in the heat dissipating device for memory modules, capable of increasing cooling air flow velocity, according to the present invention, heat sinks are each formed to have a tube structure, so that flow paths, which double the surface area for heat exchange and increase the flow velocity of cooling air for dissipating heat, are formed in a limited space, and the heat dissipation performance is notably improved, with the result that heat can be uninterruptedly dissipated from next-generation high performance memory modules.

Claims

[1] A heat dissipating device for memory modules, capable of increasing cooling air flow velocity, the heat dissipating device comprising: a heat sink, which is mounted to at least one of front and rear surfaces of a memory module (2), wherein the heat sink is constructed using a tube type heat sink (10) having cooling air flow paths (15), and first side walls of the flow paths (15) form an en- dothermic surface (11) that comes into contact with the memory module.

[2] The heat dissipating device according to claim 1, wherein the tube type heat sink

10 is configured such that the flow paths (15) are integrated into a single path, or configured such that partition walls (17) are provided therein.

[3] The heat dissipating device according to claim 2, wherein the tube type heat sink

(10) is configured such that the flow paths (15) are formed in such as way that an outer surface, which is opposite the endothermic surface (11), is curved up to a point at which the outer surface abuts the endothermic surface (11).

[4] The heat dissipating device according to claim 1, wherein the tube type heat sink

(10) is configured such that a plurality of heat dissipating pins (19) is formed to protrude from an outer surface (12), which is opposite the endothermic surface

(11) with respect to the flow paths.

[5] The heat dissipating device according to claim 1, wherein the tube type heat sink

(10) is configured such that respective lug protrusions (1 Ia) are provided on left and right ends of the endothermic surface (11), lateral guides (Hb)(I Ic), which are used to laterally guide assembly, are formed to be bent in the lug protrusions (1 Ia) or to protrude from the lug protrusions (1 Ia), and one or more vertical guides (l id), which have a bent or protruding structure so as to function as vertical guide stoppers when assembly with the memory module (2) is performed, are formed in an upper end of the heat sink (10).

[6] The heat dissipating device according to claim 2, wherein the tube type heat sink

(10) is configured such that clamp locking depressions (12a) for assembling clamps (50) are formed in an outer surfaces (12), which is opposite the endothermic surface (11).

[7] The heat dissipating device according to claim 1, wherein the tube type heat sink

(10) is made of aluminum or an aluminum alloy material through extrusion.

[8] The heat dissipating device according to claim 1, wherein the tube type heat sink

(10A) is made of an aluminum or aluminum alloy plate (10Aa) through sheet metal working.

[9] The heat dissipating device according to claim 8, wherein the tube type heat sink (10A) is configured such that a seaming portion (13), in which two leading ends of the plate (10Aa) overlap each other, is formed to protrude upwards from the plate (10Aa), and one or more bent locking pieces (14) for locking the seaming portion (13) are formed.

[10] The heat dissipating device according to claim 8, wherein the tube type heat sink

(10A) is configured such that one or more clamp assembly grooves (18) are formed in the seaming portion (13) to couple the clamp (50).

[11] The heat dissipating device according to claim 8, wherein the tube type heat sink

(10A) is configured such that one or more stoppers (16) for preventing the clamp (50) from being released are formed to protrude from an outer surface (12), which does not come into contact with the memory module (2).

[12] The heat dissipating device according to claim 8, wherein the tube type heat sink

(10A) is configured such that respective lug protrusions (1 Ia) are provided on left and right ends of the endothermic surface (11), lateral guides (Hb)(I Ic) for laterally guiding assembly are formed to be bent in the lug protrusions (1 Ia) or to protrude from the lug protrusions (1 Ia), and one or more vertical guides are formed to be bent in a seaming portion (13) or to protrude from the seaming portion (13).