WO2013027876A1 - Heat radiation apparatus for memory module and method for manufacturing same - Google Patents

Heat radiation apparatus for memory module and method for manufacturing same Download PDF

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Publication number
WO2013027876A1
WO2013027876A1 PCT/KR2011/006270 KR2011006270W WO2013027876A1 WO 2013027876 A1 WO2013027876 A1 WO 2013027876A1 KR 2011006270 W KR2011006270 W KR 2011006270W WO 2013027876 A1 WO2013027876 A1 WO 2013027876A1
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Prior art keywords
plate member
memory module
manufacturing
guide groove
heat sink
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PCT/KR2011/006270
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French (fr)
Korean (ko)
Inventor
김대준
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주식회사 파랑
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Priority to PCT/KR2011/006270 priority Critical patent/WO2013027876A1/en
Publication of WO2013027876A1 publication Critical patent/WO2013027876A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a memory module heat dissipation device and a manufacturing method thereof, and more particularly, to a heat dissipation device of an electronic component.
  • the heat dissipation device is coupled to the side of the memory module.
  • the heat dissipation device is made of metal such as aluminum.
  • Conventional heat dissipation device is composed of a pair of plate members separated, it is a form of fixing through a memory module between a pair of plate members. Therefore, the heat transfer between the separated plates was not smooth.
  • the heat flow should be good and the heat dissipation area should be wide.
  • the heat dissipation device of the conventional memory module is manufactured by the extrusion process, the density of the heat dissipation fins per unit length is low. The extrusion process is performed at a high temperature, and if the distance between the heat radiating fins is narrow, they stick to each other and the extrusion itself is impossible.
  • the present invention is to provide a method for manufacturing a memory module heat dissipation device using the skiving method.
  • Another object of the present invention is to provide a method of manufacturing a memory module heat dissipation device in which a memory module can be easily inserted between side plates by opening a first plate member and a second plate member by using screws.
  • a method of manufacturing a memory module heat dissipation device further comprising attaching a thermally conductive tape to an inner wall of the first plate member and an inner wall of the second plate member.
  • the guide groove is provided with a method of manufacturing a memory module heat dissipation device, characterized in that the inner width is wider than the open side.
  • the first heat sink member is provided with a manufacturing method of the memory module heat sink, characterized in that the aluminum.
  • the present invention provides a method of manufacturing a memory module heat dissipation device using the skiving method.
  • a method of manufacturing a memory module heat dissipation device for guiding the first heat sink member and the second heat sink member is provided.
  • the present invention provides a method of manufacturing a memory module heat dissipation device, in which a screw hole is drilled in one plate member, and a screw is inserted to open a first plate member and a second plate member to easily insert a memory module between the plate members. .
  • FIG. 1 is a flow chart of a manufacturing method of a memory module heat dissipation device according to an embodiment of the present invention.
  • FIG 2 is an exemplary view of a skiving method according to an embodiment of the present invention.
  • 3 to 7 is a process chart of the manufacturing method of the memory module heat dissipation device according to an embodiment of the present invention.
  • FIGS. 8 to 9 are exemplary views illustrating a method of coupling a memory module heat sink to a memory module according to an embodiment of the present invention.
  • FIG. 1 is a flow chart of a manufacturing method of a memory module heat dissipation device according to an embodiment of the present invention
  • Figure 2 is an illustration of a skiving method according to an embodiment of the present invention
  • Figures 3 to 7 of the present invention 8 is a flowchart illustrating a method of manufacturing a memory module heat sink according to an embodiment
  • FIGS. 8 to 9 are views illustrating a method of coupling the memory module heat sink to a memory module according to an embodiment of the present invention.
  • 3 is a perspective view of a first heat sink member
  • FIG. 4 is a perspective view of a second plate member
  • FIGS. 5 to 9 are side views.
  • the manufacturing method of the memory module heat dissipation device of this embodiment uses a skiving method.
  • the skiving method continuously cuts the surface of the metal plate in an inclined form by using a blade of the skiving device, and continuously erects the cut heat dissipation fin so as not to fall off from the body.
  • Figure 2 shows the heat dissipation fin 120 is formed in the body portion 110 by the skiving method.
  • the body and the heat dissipation fins are integrally connected without being separated, so that the heat flows smoothly.
  • S11 includes a body portion 111 having a guide groove 112 formed in a longitudinal direction, and a first heat sink member 11 having a first plate member 113 formed in a length direction on one side of the body portion 111. It is a step of manufacturing by extrusion process.
  • the first heat sink member 11 is formed at a time by an extrusion process.
  • the first heat sink member 11 may be made of aluminum.
  • the body 111 of the first heat sink member 11 is formed with a guide groove 112 in the longitudinal direction.
  • the guide groove 112 is wider in width than the open side. Therefore, when the guide bar 122 corresponding to the guide groove 111 slides to the guide groove 111, the guide bar 122 is not separated from the guide groove 111 in the lateral direction.
  • Body portion 111 is a portion where the heat radiation fin is to be formed later by the skiving method. Therefore, in consideration of this, it is good to secure and extrude the area where the heat radiation fins are to be formed.
  • S12 is a step of manufacturing the second plate member 121 in which the guide bar 122 corresponding to the guide groove 111 is coupled to one side by an extrusion process.
  • the guide bar 122 and the second plate member 121 of the second plate member 121 are formed by one extrusion process.
  • S13 is the step of forming the heat radiation fin 114 continuously by skiving the body portion 111.
  • the skiving method has been described above.
  • the heat radiation fins 114 are formed using the skiving method, the heat radiation fins 114 having a thickness of about 0.2 mm may be closely formed at intervals of about 1 mm, thereby increasing heat dissipation efficiency.
  • S14 is a step of coupling the guide bar 122 to the guide groove 112.
  • the second plate member 121 is fixed to the body portion 111.
  • S15 is a step of forming a screw hole 131 in any one of the first plate member 113 or the second plate member 121. S15 may proceed after the step S11. In addition, it may proceed after the step S15 S14. A screw thread is formed in the screw hole 131.
  • S16 is a step of coupling the screw 132 to the screw hole 131, so as to spread between the first plate member 113 and the second plate member 121.
  • the screw 132 is inserted into the screw hole 131, the first plate member 113 and the second plate member 121 are opened. Therefore, it becomes the form like FIG.
  • step S12 the step of attaching the thermally conductive tape to the first plate member 113 and the second plate member 121 may be further performed.
  • the thermally conductive tape is later coupled with the side surface of the memory module 200 to bridge the heat of the memory module 200 to the first plate member 113 and the second plate member 121.
  • FIG. 8 and 9 illustrate a method of coupling the memory module heat sink of the present embodiment to the memory module 200 (side view).
  • the memory module 200 is interposed between the first plate member 113 and the second plate member 121 of the memory module heat dissipation device 10. Thereafter, when the screw 132 is separated to the outside, the first plate member 121 and the second plate member 121 are narrowed by the elastic force, and are coupled to the outer surface of the memory module 200.
  • the present invention is a device used for heat dissipation of a memory module.

Abstract

Disclosed is a method for manufacturing a heat radiation apparatus for a memory module. Provided is the method for manufacturing a heat radiation apparatus for a memory module, comprising the steps of: (a) manufacturing, using an extrusion process, a first heat sink having a body which defines a guide groove in the lengthwise direction thereof and is connected with a first plate member formed in the lengthwise direction on one side of the body; (b) manufacturing, using an extrusion process, a second plate member having a guide bar connected to one side thereof, the guide bar corresponding to the guide groove; (c) skiving the body to consecutively form heat radiation fins; and (d) connecting the guide bar to the guide groove.

Description

메모리 모듈 방열장치 및 이것의 제조방법Memory module heat sink and manufacturing method thereof
본 발명은 메모리 모듈 방열장치 및 이것의 제조방법에 관한 것으로서, 더욱 상세하게는 전자부품의 방열장치에 관한 것이다.The present invention relates to a memory module heat dissipation device and a manufacturing method thereof, and more particularly, to a heat dissipation device of an electronic component.
컴퓨터의 메모리 모듈이 작동하면 많은 열이 발생된다. 이러한 열이 적시에 방열되지 않으면 메모리 모듈의 작동이 느려져 데이터의 처리속도가 늦어진다. When a computer's memory modules operate, a lot of heat is generated. If this heat does not dissipate in a timely manner, the operation of the memory module slows down and slows down data processing.
원활한 방열을 위하여, 방열장치가 메모리 모듈의 측면에 결합된다. 방열장치는 알루미늄과 같은 금속재질이 사용된다. 종래의 방열장치는 분리된 한 쌍의 판부재로 이루어져 있으며, 한 쌍의 판부재 사이에 메모리 모듈을 개재하여 고정하는 형태다. 따라서, 분리된 판들 간에는 열의 이동이 원활하지 못하였다. To facilitate heat dissipation, the heat dissipation device is coupled to the side of the memory module. The heat dissipation device is made of metal such as aluminum. Conventional heat dissipation device is composed of a pair of plate members separated, it is a form of fixing through a memory module between a pair of plate members. Therefore, the heat transfer between the separated plates was not smooth.
한편, 방열장치의 방열효과를 상승시키기 위해서는 열의 흐름을 좋게 해야하고, 방열면적이 넓어야 한다. 그러나 종래의 메모리 모듈의 방열장치는 압출공정으로 제조되었기 때문에, 단위 길이당 방열핀의 밀도가 낮았다. 압출공정은 고온에서 이루어지는 것으로 방열핀간의 거리가 좁으면 서로 붙어버려, 압출 자체가 불가능하다. On the other hand, in order to increase the heat dissipation effect of the heat dissipation device, the heat flow should be good and the heat dissipation area should be wide. However, since the heat dissipation device of the conventional memory module is manufactured by the extrusion process, the density of the heat dissipation fins per unit length is low. The extrusion process is performed at a high temperature, and if the distance between the heat radiating fins is narrow, they stick to each other and the extrusion itself is impossible.
본 발명은 스카이빙 공법을 이용하여 메모리 모듈 방열장치를 제조하는 방법을 제공하고자 한다.The present invention is to provide a method for manufacturing a memory module heat dissipation device using the skiving method.
또한, 압출공정을 통하여 제1 방열판부재와 제2 방열판부재를 형성한 후, 제1 방열판부재와 제2 방열판부재를 가이드 결합하는 메모리 모듈 방열장치의 제조방법을 제공하고자 한다.In addition, after forming the first heat sink member and the second heat sink member through the extrusion process, to provide a method for manufacturing a memory module heat radiation device for coupling the first heat sink member and the second heat sink member.
또한, 나사를 이용하여 제1 판부재와 제2 판부재를 벌려주어 메모리 모듈을 측면판 사이에 쉽게 삽입할 수 있는 메모리 모듈 방열장치의 제조방법을 제공하고자 한다.Another object of the present invention is to provide a method of manufacturing a memory module heat dissipation device in which a memory module can be easily inserted between side plates by opening a first plate member and a second plate member by using screws.
본 발명의 일측면에 따르면, According to one aspect of the invention,
(a) 길이방향으로 가이드홈이 형성된 몸체부와, 상기 몸체부의 일측에 길이방향으로 일체적으로 형성된 제1 판부재가 결합된 제1 방열판부재를 압출공정으로 제조하는 단계;  (a) manufacturing a first heat sink member having a body portion having a guide groove formed in a longitudinal direction and a first plate member integrally formed in a longitudinal direction on one side of the body portion by an extrusion process;
(b) 상기 가이드홈에 대응하는 가이드바가 일측에 결합된 제2 판부재를 압출공정으로 제조하는 단계; (b) manufacturing a second plate member having a guide bar corresponding to the guide groove to one side thereof by an extrusion process;
(c) 상기 몸체부를 스카이빙하여, 방열핀을 연속적으로 형성하는 단계; 및 (c) skiving the body to form heat dissipation fins continuously; And
(d) 상기 가이드홈에 상기 가이드바를 결합하는 단계를 포함하는 메모리 모듈 방열장치의 제조방법이 제공된다. (d) there is provided a method of manufacturing a memory module heat dissipation device comprising coupling the guide bar to the guide groove.
또한, (e) 상기 제1 판부재 또는 상기 제2 판부재 중 어느 하나에 나사홀을 형성하는 단계; 및 In addition, (e) forming a screw hole in any one of the first plate member or the second plate member; And
(f) 상기 나사홀에 나사를 결합하여, 상기 제1 판부재와 상기 제2 판부재 사이를 벌어지도록 하는 단계를 더 포함하는 메모리 모듈 방열장치의 제조방법이 제공된다. (f) providing a method of manufacturing a memory module heat dissipation device further comprising the step of coupling a screw to the screw hole so as to be spaced between the first plate member and the second plate member.
또한, 제1 판부재의 내벽과 제2 판부재의 내벽에 열전도성 테이프를 부착하는 단계를 더 포함하는 메모리 모듈 방열장치의 제조방법이 제공된다. In addition, there is provided a method of manufacturing a memory module heat dissipation device further comprising attaching a thermally conductive tape to an inner wall of the first plate member and an inner wall of the second plate member.
또한, 상기 가이드홈은 개방된 측면보다 내부의 폭이 더 넓은 것을 특징으로 하는 메모리 모듈 방열장치의 제조방법이 제공된다. In addition, the guide groove is provided with a method of manufacturing a memory module heat dissipation device, characterized in that the inner width is wider than the open side.
또한, 상기 제1 방열판부재는 알루미늄인 것을 특징으로 하는 메모리 모듈 방열장치의 제조방법이 제공된다. In addition, the first heat sink member is provided with a manufacturing method of the memory module heat sink, characterized in that the aluminum.
본 발명은 스카이빙 공법을 이용하여 메모리 모듈 방열장치를 제조하는 방법을 제공한다.The present invention provides a method of manufacturing a memory module heat dissipation device using the skiving method.
또한, 압출공정을 통하여 제1 방열판부재와 제2 방열판부재를 형성한 후, 제1 방열판부재와 제2 방열판부재를 가이드 결합하는 메모리 모듈 방열장치의 제조방법을 제공한다.Further, after the first heat sink member and the second heat sink member are formed through an extrusion process, a method of manufacturing a memory module heat dissipation device for guiding the first heat sink member and the second heat sink member is provided.
또한, 하나의 판부재에 나사홀을 뚫고, 나사를 삽입하여 제1 판부재와 제2 판부재를 벌려주어 메모리 모듈을 판부재 사이에 쉽게 삽입할 수 있는 메모리 모듈 방열장치의 제조방법을 제공한다.In addition, the present invention provides a method of manufacturing a memory module heat dissipation device, in which a screw hole is drilled in one plate member, and a screw is inserted to open a first plate member and a second plate member to easily insert a memory module between the plate members. .
도 1은 본 발명의 일 실시예에 따른 메모리 모듈 방열장치의 제조방법의 순서도.1 is a flow chart of a manufacturing method of a memory module heat dissipation device according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 스카이빙 공법의 예시도.2 is an exemplary view of a skiving method according to an embodiment of the present invention.
도 3 내지 도 7은 본 발명의 일 실시예에 따른 메모리 모듈 방열장치의 제조방법의 공정도.3 to 7 is a process chart of the manufacturing method of the memory module heat dissipation device according to an embodiment of the present invention.
도 8 내지 도 9는 본 발명의 일 실시예에 따른 메모리 모듈 방열장치를 메모리 모듈에 결합하는 방법을 보여주는 예시도. 8 to 9 are exemplary views illustrating a method of coupling a memory module heat sink to a memory module according to an embodiment of the present invention.
본 발명의 일측면에 따르면,According to one aspect of the invention,
(a) 길이방향으로 가이드홈이 형성된 몸체부와, 상기 몸체부의 일측에 길이방향으로 일체적으로 형성된 제1 판부재가 결합된 제1 방열판부재를 압출공정으로 제조하는 단계;  (a) manufacturing a first heat sink member having a body portion having a guide groove formed in a longitudinal direction and a first plate member integrally formed in a longitudinal direction on one side of the body portion by an extrusion process;
(b) 상기 가이드홈에 대응하는 가이드바가 일측에 결합된 제2 판부재를 압출공정으로 제조하는 단계; (b) manufacturing a second plate member having a guide bar corresponding to the guide groove to one side thereof by an extrusion process;
(c) 상기 몸체부를 스카이빙하여, 방열핀을 연속적으로 형성하는 단계; 및 (c) skiving the body to form heat dissipation fins continuously; And
(d) 상기 가이드홈에 상기 가이드바를 결합하는 단계를 포함하는 메모리 모듈 방열장치의 제조방법이 제공된다.(d) there is provided a method of manufacturing a memory module heat dissipation device comprising coupling the guide bar to the guide groove.
이하에는, 본 발명의 바람직한 실시예를 첨부도면을 참조로 상세하게 설명하되, 이는 본 발명에 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 상세하게 설명하기 위한 것이지, 이로써 본 발명의 사상 및 범주가 한정되는 것을 의미하지는 않는다.DETAILED DESCRIPTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, which are intended to explain in detail enough to enable those skilled in the art to easily carry out the present invention. This does not mean that the spirit and scope of the present invention is limited.
도 1은 본 발명의 일 실시예에 따른 메모리 모듈 방열장치의 제조방법의 순서도이며, 도 2는 본 발명의 일 실시예에 따른 스카이빙 공법의 예시도이며, 도 3 내지 도 7은 본 발명의 일 실시예에 따른 메모리 모듈 방열장치의 제조방법의 공정도이며, 도 8 내지 도 9는 본 발명의 일 실시예에 따른 메모리 모듈 방열장치를 메모리 모듈에 결합하는 방법을 보여주는 예시도이다. 한편, 도 3은 제1 방열판부재의 사시도이며, 도 4는 제2 판부재의 사시도이며, 도 5 내지 도 9는 측면도이다.1 is a flow chart of a manufacturing method of a memory module heat dissipation device according to an embodiment of the present invention, Figure 2 is an illustration of a skiving method according to an embodiment of the present invention, Figures 3 to 7 of the present invention 8 is a flowchart illustrating a method of manufacturing a memory module heat sink according to an embodiment, and FIGS. 8 to 9 are views illustrating a method of coupling the memory module heat sink to a memory module according to an embodiment of the present invention. 3 is a perspective view of a first heat sink member, FIG. 4 is a perspective view of a second plate member, and FIGS. 5 to 9 are side views.
본 실시예의 메모리 모듈 방열장치의 제조방법은 스카이빙(skiving) 공법을 이용한다. 스카이빙 공법이란 스카이빙 장치의 칼날을 이용하여 금속판의 표면을 경사진 형태로 절개하고, 몸체부와 떨어지지 않도록 절개된 방열핀을 세우는 공정을 연속적으로 진행한다. 도 2는 스카이빙 공법으로 몸체부(110)에서 방열핀(120)이 형성되는 모습을 보여준다.The manufacturing method of the memory module heat dissipation device of this embodiment uses a skiving method. The skiving method continuously cuts the surface of the metal plate in an inclined form by using a blade of the skiving device, and continuously erects the cut heat dissipation fin so as not to fall off from the body. Figure 2 shows the heat dissipation fin 120 is formed in the body portion 110 by the skiving method.
스카이빙 공법을 이용할 경우, 몸체부와 방열핀이 분리되지 않고 일체적으로 연결되어 열의 흐름이 원활하게 된다. When using the skiving method, the body and the heat dissipation fins are integrally connected without being separated, so that the heat flows smoothly.
S11은 길이방향으로 가이드홈(112)이 형성된 몸체부(111)와, 상기 몸체부(111)의 일측에 길이방향으로 형성된 제1 판부재(113)가 결합된 제1 방열판부재(11)를 압출공정으로 제조하는 단계이다. S11 includes a body portion 111 having a guide groove 112 formed in a longitudinal direction, and a first heat sink member 11 having a first plate member 113 formed in a length direction on one side of the body portion 111. It is a step of manufacturing by extrusion process.
제1 방열판부재(11)는 압출공정으로 한 번에 형성된다. 제1 방열판부재(11)는 알루미늄으로 제조될 수 있다. 제1 방열판부재(11)의 몸체부(111)에는 길이방향으로 가이드홈(112)이 형성되어 있다. 가이드홈(112)은 개방된 측면보다 내부의 폭이 더 넓다. 따라서, 가이드홈(111)과 대응되는 형태인 가이드바(122)가, 가이드홈(111)에 슬라이드 결합하면, 가이드바(122)가 가이드홈(111)으로 부터 측면방향으로는 분리되지 않는다.The first heat sink member 11 is formed at a time by an extrusion process. The first heat sink member 11 may be made of aluminum. The body 111 of the first heat sink member 11 is formed with a guide groove 112 in the longitudinal direction. The guide groove 112 is wider in width than the open side. Therefore, when the guide bar 122 corresponding to the guide groove 111 slides to the guide groove 111, the guide bar 122 is not separated from the guide groove 111 in the lateral direction.
몸체부(111)는 추후 스카이빙 공법으로 방열핀이 형성될 부분이다. 따라서, 이를 고려하여 방열핀이 형성될 영역을 확보하여 압출하는 것이 좋다. Body portion 111 is a portion where the heat radiation fin is to be formed later by the skiving method. Therefore, in consideration of this, it is good to secure and extrude the area where the heat radiation fins are to be formed.
S12는 상기 가이드홈(111)에 대응하는 가이드바(122)가 일측에 결합된 제2 판부재(121)를 압출공정으로 제조하는 단계이다. 제2 판부재(121)의 가이드바(122)와 제2 판부재(121)는 한 번의 압출공정으로 형성된다.S12 is a step of manufacturing the second plate member 121 in which the guide bar 122 corresponding to the guide groove 111 is coupled to one side by an extrusion process. The guide bar 122 and the second plate member 121 of the second plate member 121 are formed by one extrusion process.
S13은 상기 몸체부(111)를 스카이빙하여, 방열핀(114)을 연속적으로 형성하는 단계이다. 스카이빙 공법에 대해서는 앞서 설명한 바이다. 스카이빙 공법을 이용하여 방열핀(114)을 형성하면, 0.2mm 두께 정도의 방열핀(114)을 1mm 정도의 간격으로 촘촘히 형성할 수 있어, 방열효율을 높일 수 있다.S13 is the step of forming the heat radiation fin 114 continuously by skiving the body portion 111. The skiving method has been described above. When the heat radiation fins 114 are formed using the skiving method, the heat radiation fins 114 having a thickness of about 0.2 mm may be closely formed at intervals of about 1 mm, thereby increasing heat dissipation efficiency.
이상의 S11에서 S13의 공정은 반드시 순차적으로 진행할 필요는 없다. S11-S13-S12로 진행할 수도 있고, S12-S11-S13의 순서로 진행할 수도 있다. The above processes from S11 to S13 do not necessarily need to proceed sequentially. The process may proceed to S11-S13-S12, or may proceed in the order of S12-S11-S13.
S14는 상기 가이드홈(112)에 상기 가이드바(122)를 결합하는 단계이다. 가이드홈(112)에 가이드바(122)를 슬라이드 결합을 하면, 제2 판부재(121)가 몸체부(111)에 고정된다. S14 is a step of coupling the guide bar 122 to the guide groove 112. When the guide bar 122 is slide-coupled to the guide groove 112, the second plate member 121 is fixed to the body portion 111.
S15는 상기 제1 판부재(113) 또는 상기 제2 판부재(121) 중 어느 하나에 나사홀(131)을 형성하는 단계이다. S15는 S11 단계 이후에 진행할 수 있다. 또한, S15 S14 단계 이후에 진행할 수도 있다. 나사홀(131)에는 나사산이 형성되어 있다. S15 is a step of forming a screw hole 131 in any one of the first plate member 113 or the second plate member 121. S15 may proceed after the step S11. In addition, it may proceed after the step S15 S14. A screw thread is formed in the screw hole 131.
S16은 상기 나사홀(131)에 나사(132)를 결합하여, 상기 제1 판부재(113)와 상기 제2 판부재(121) 사이를 벌어지도록 하는 단계이다. 나사홀(131)에 나사(132)를 삽입하면, 제1 판부재(113)와 제2 판부재(121)는 벌어지게 된다. 따라서, 도 7과 같은 형태가 된다.S16 is a step of coupling the screw 132 to the screw hole 131, so as to spread between the first plate member 113 and the second plate member 121. When the screw 132 is inserted into the screw hole 131, the first plate member 113 and the second plate member 121 are opened. Therefore, it becomes the form like FIG.
한편, S12단계 이후에, 열전도성 테이프를 제1 판부재(113)와 제2 판부재(121)를 부착하는 단계를 더 진행할 수 있다. 열전도성 테이프는 추후 메모리 모듈(200)의 측면과 결합되어, 메모리 모듈(200)의 열을 제1 판부재(113)와 제2 판부재(121)로 원활하게 이동하도록 가교 역할을 한다.Meanwhile, after step S12, the step of attaching the thermally conductive tape to the first plate member 113 and the second plate member 121 may be further performed. The thermally conductive tape is later coupled with the side surface of the memory module 200 to bridge the heat of the memory module 200 to the first plate member 113 and the second plate member 121.
도 8와 도 9는 본 실시예의 메모리 모듈 방열장치를 메모리 모듈(200)에 결합시키는 방법을 예시(측면도)한다. 도 8과 같이, 메모리 모듈 방열장치(10)의 제1 판부재(113)와 제2 판부재(121) 사이에 메모리 모듈(200)이 개재되도록 한다. 이후, 나사(132)를 외부로 분리해 내면, 탄성력에 의해서 제1 판부재(121)와 제2 판부재(121)가 좁혀지게 되고, 메모리 모듈(200)의 외측면과 결합하게 된다. 8 and 9 illustrate a method of coupling the memory module heat sink of the present embodiment to the memory module 200 (side view). As shown in FIG. 8, the memory module 200 is interposed between the first plate member 113 and the second plate member 121 of the memory module heat dissipation device 10. Thereafter, when the screw 132 is separated to the outside, the first plate member 121 and the second plate member 121 are narrowed by the elastic force, and are coupled to the outer surface of the memory module 200.
이상에서 본 발명의 실시예에 대해서 상세히 설명하였으나, 이는 하나의 실시예에 불과하며, 이로써 본 발명의 특허청구범위를 한정하는 것은 아니다. 본 실시예를 바탕으로 균등한 범위까지 당업자가 변형 및 추가하는 범위도 본 발명의 권리범위에 속한다 할 것이다.Although the embodiment of the present invention has been described in detail above, this is only one embodiment, and thus, does not limit the claims of the present invention. Based on the present embodiment, modifications and additions made by those skilled in the art to the equivalent range will also belong to the scope of the present invention.
본 발명은 메모리 모듈의 방열에 사용되는 장치이다.The present invention is a device used for heat dissipation of a memory module.

Claims (5)

  1. (a) 길이방향으로 가이드홈이 형성된 몸체부와, 상기 몸체부의 일측에 길이방향으로 일체적으로 형성된 제1 판부재가 결합된 제1 방열판부재를 압출공정으로 제조하는 단계;  (a) manufacturing a first heat sink member having a body portion having a guide groove formed in a longitudinal direction and a first plate member integrally formed in a longitudinal direction on one side of the body portion by an extrusion process;
    (b) 상기 가이드홈에 대응하는 가이드바가 일측에 결합된 제2 판부재를 압출공정으로 제조하는 단계; (b) manufacturing a second plate member having a guide bar corresponding to the guide groove to one side thereof by an extrusion process;
    (c) 상기 몸체부를 스카이빙하여, 방열핀을 연속적으로 형성하는 단계; (c) skiving the body to form heat dissipation fins continuously;
    (d) 상기 가이드홈에 상기 가이드바를 결합하는 단계를 포함하는 메모리 모듈 방열장치의 제조방법.and (d) coupling the guide bar to the guide groove.
  2. 제1항에 있어서,The method of claim 1,
    (e) 상기 제1 판부재 또는 상기 제2 판부재 중 어느 하나에 나사홀을 형성하는 단계; 및 (e) forming a screw hole in one of the first plate member and the second plate member; And
    (f) 상기 나사홀에 나사를 결합하여, 상기 제1 판부재와 상기 제2 판부재 사이를 벌어지도록 하는 단계를 더 포함하는 메모리 모듈 방열장치의 제조방법. and (f) coupling a screw to the screw hole to open the gap between the first plate member and the second plate member.
  3. 제1항에 있어서,The method of claim 1,
    제1 판부재의 내벽과 제2 판부재의 내벽에 열전도성 테이프를 부착하는 단계를 더 포함하는 메모리 모듈 방열장치의 제조방법. And attaching a thermally conductive tape to an inner wall of the first plate member and an inner wall of the second plate member.
  4. 제3항에 있어서,The method of claim 3,
    상기 가이드홈은 개방된 측면보다 내부의 폭이 더 넓은 것을 특징으로 하는 메모리 모듈 방열장치의 제조방법. The guide groove is a method of manufacturing a memory module heat sink, characterized in that the inner width is wider than the open side.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 제1 방열판부재는 알루미늄인 것을 특징으로 하는 메모리 모듈 방열장치의 제조방법. The first heat sink member is a manufacturing method of the memory module heat sink, characterized in that the aluminum.
PCT/KR2011/006270 2011-08-25 2011-08-25 Heat radiation apparatus for memory module and method for manufacturing same WO2013027876A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257297A (en) * 2000-03-10 2001-09-21 Showa Denko Kk Heat sink
JP2005340740A (en) * 2004-05-31 2005-12-08 Fujitsu Ltd Heat sink for module board
KR20060090205A (en) * 2006-07-14 2006-08-10 주식회사 일창프리시젼 Manufacturing method for memory module radiator and there of memory module radiator
KR100817794B1 (en) * 2006-09-28 2008-03-31 세광테크놀러지 (주) Heating apparatus of having one heating body
WO2008147018A1 (en) * 2007-06-01 2008-12-04 Il Chang Precision Co., Ltd Heat dissipating device for memory modules capable of increasing cooling air current velocity

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257297A (en) * 2000-03-10 2001-09-21 Showa Denko Kk Heat sink
JP2005340740A (en) * 2004-05-31 2005-12-08 Fujitsu Ltd Heat sink for module board
KR20060090205A (en) * 2006-07-14 2006-08-10 주식회사 일창프리시젼 Manufacturing method for memory module radiator and there of memory module radiator
KR100817794B1 (en) * 2006-09-28 2008-03-31 세광테크놀러지 (주) Heating apparatus of having one heating body
WO2008147018A1 (en) * 2007-06-01 2008-12-04 Il Chang Precision Co., Ltd Heat dissipating device for memory modules capable of increasing cooling air current velocity

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