WO2012070874A2 - Complex heat sink for an led light, and led light comprising same - Google Patents

Complex heat sink for an led light, and led light comprising same Download PDF

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Publication number
WO2012070874A2
WO2012070874A2 PCT/KR2011/008997 KR2011008997W WO2012070874A2 WO 2012070874 A2 WO2012070874 A2 WO 2012070874A2 KR 2011008997 W KR2011008997 W KR 2011008997W WO 2012070874 A2 WO2012070874 A2 WO 2012070874A2
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WO
WIPO (PCT)
Prior art keywords
heat sink
attached
led
heat dissipation
led module
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PCT/KR2011/008997
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French (fr)
Korean (ko)
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WO2012070874A3 (en
Inventor
김영철
Original Assignee
소닉스자펜 주식회사
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Publication of WO2012070874A2 publication Critical patent/WO2012070874A2/en
Publication of WO2012070874A3 publication Critical patent/WO2012070874A3/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a composite heat dissipating plate for an LED lamp and an LED lamp including the same, and more particularly, to maximize the heat dissipation area in a small space to increase the heat dissipation efficiency, improve the heat dissipation speed, and at the same time the LED can be lightened product
  • the present invention relates to a composite heat dissipating plate for a lighting lamp and an LED lighting lamp including the same.
  • heat sinks 2a and 2b having various types of heat dissipation structures are used on the LED module 1, but heat sinks of such a structure are limited in heat dissipation in a limited space. When it reaches, it indicates a structural defect in which heat radiation and heat absorption occur simultaneously.
  • the heat dissipation plate of this structure has a large heat dissipation area, but the heat dissipation rate and heat retention phenomenon is large, causing the temperature rise in the device easily, and further, the weight of the product becomes heavy due to the weight of the heat dissipation plate. Accordingly, the heat dissipation efficiency and heat dissipation speed can be improved by maximizing the heat dissipation area in a small space, and at the same time, it is required to develop a heat dissipation plate which is light in weight.
  • the present invention has been made to solve the problems of the prior art as described above, the object is to maximize the heat dissipation area in a small space to increase the heat dissipation efficiency, improve the heat dissipation speed, and at the same time it is possible to lighten the product
  • the present invention provides a composite heat sink for LED lighting and an LED lighting including the same.
  • a composite heat dissipation plate for an LED lamp including a flat heat dissipation plate attached to a lower part of the LED module, and an uneven heat dissipation plate attached to an upper surface of the flat heat dissipation plate.
  • Composite heat sink for LED lighting characterized in that the copper layer is formed on at least one surface of both sides of the planar heat sink.
  • Composite radiator for LED lighting characterized in that the carbon is deposited on the top surface of the uneven heat sink.
  • Composite heat sink for LED lighting characterized in that the copper layer is formed on the bottom surface of the uneven heat sink.
  • LED composite lamps characterized in that the recess is filled with ceramic.
  • LED lighting characterized in that the copper wiring is formed on one surface to which the LED module of the planar heat sink is attached, and the LED module is directly attached thereto.
  • the heat sink for the LED lighting lamp characterized in that the copper layer is formed on one surface to which the LED module of the planar heat sink is attached, and the LED module is attached by attaching a thermal conductive tape thereto.
  • the heat sink for the LED lighting lamp characterized in that the rail is formed so that the LED module is coupled to the lower end of the planar heat sink, the LED module is inserted into the groove of the rail.
  • a composite heat dissipation plate for an LED lamp and an LED lamp including the same which can maximize heat dissipation area in a small space, increase heat dissipation efficiency, improve heat dissipation speed, and at the same time reduce the weight of the product.
  • FIG. 1 is a structural diagram of a heat sink attached to a conventional LED module.
  • Figure 2 is a block diagram of a composite heat sink for LED lighting according to the present invention.
  • Figure 4 is a perspective view of the LED module attached to the lower portion of the composite heat sink for LED lighting according to the present invention.
  • FIG 5 is an exemplary view of an LED module.
  • Figure 6 is a state attached to the LED module on the rail-type heat sink according to the invention.
  • the present invention provides a composite heat dissipation plate for an LED lamp including a flat heat dissipation plate attached to the bottom of the LED module, and an uneven heat dissipation plate attached to the top surface of the flat heat dissipation plate.
  • the present invention LED module; A flat heat dissipation plate to which the LED module is attached; And an LED lighting lamp including an uneven heat sink attached to an upper surface of the planar heat sink.
  • Figure 2 shows the configuration of the composite heat sink for the LED lamp according to the invention.
  • the LED lighting composite heat dissipation plate includes a flat heat dissipation plate 10 and the uneven heat dissipation plate 20 attached to the upper portion.
  • the planar heat sink 10 is formed by stacking a metal layer 10b, preferably a copper layer, having excellent thermal conductivity on at least one of the upper and lower surfaces of the rectangular substrate 10a, preferably on both surfaces.
  • the substrate 10a may be made of an aluminum material that is light and has excellent heat dissipation characteristics.
  • the copper layer 10b minimizes the thermal resistance of the substrate and transfers high temperature heat generated from the LED module to the uneven heat sink 20 attached to the upper surface at high speed.
  • the thickness of the substrate 10a is, for example, 0.4 ⁇ 0.6mm, preferably about 0.5mm
  • the thickness of the copper layer 10b deposited on one side or both sides is 0.1 ⁇ 0.2mm, preferably about 0.1mm can maximize heat dissipation effect and heat dissipation rate more.
  • the uneven heat dissipation plate 20 is formed of a plurality of protrusions 20a having an upper end surface and a recess 20b having a lower end corresponding to the protrusion 20a of the upper end surface.
  • the heat sink is formed of the uneven structure in order to increase the heat dissipation area in a small volume and improve the heat dissipation speed.
  • the uneven heat dissipation plate 20 may be made of a light aluminum material having excellent heat dissipation characteristics.
  • carbon is deposited on the top surface of the uneven heat dissipation plate 20 so that heat dissipation can occur more effectively.
  • the bottom surface of the uneven heat dissipation plate 20 has a metal layer having excellent thermal conductivity to minimize heat resistance in order to effectively transfer the high temperature heat transmitted from the lower flat heat dissipation plate 10 to the uneven heat dissipation plate 20,
  • a copper layer is deposited.
  • the ceramic material is filled in the groove 20b formed on the bottom surface of the uneven heat sink 20 to maximize heat dissipation to the outside.
  • the thickness of the uneven heat sink 20 is, for example, 0.4 ⁇ 0.6mm, preferably about 0.5mm, the height including the uneven shape is 4 ⁇ 6mm, preferably about 5mm, the bottom surface 20b
  • the thickness of the copper layer formed in the 0.1 ⁇ 0.2mm, preferably about 0.1mm can be more maximized the heat radiation effect and the heat radiation rate.
  • FIG 3 shows a process of attaching the planar heat sink 10 and the uneven heat sink 20 of the present invention.
  • the top surface having the protrusions 20a of the uneven heat-dissipating plate 20 is disposed to face upward, and after removing impurities on the surface, carbon is deposited using a known method, for example, high temperature deposition.
  • the lower surface is disposed upward, and the ceramic powder is filled in the recess 20b without depositing copper thereon.
  • the composite heat sink 100 according to the present invention can be obtained.
  • Attachment of the planar heat sink 10 and the uneven heat sink 20 may be a chemical method, or a method such as electrolytic welding may be used.
  • a method such as electrolytic welding may be used.
  • electrolytic welding by attaching by using electrolytic welding, not only the strength of the adhesive but also the productivity and In terms of management, it was excellent.
  • Figure 4 shows a perspective view of a state in which the LED module 30 is attached to the lower portion of the composite heat-dissipating plate 100 for LED lighting according to the present invention.
  • the LED module is typically arranged in a state in which a plurality of LEDs 30b are attached to the rectangular substrate 30a as illustrated in FIG. 5.
  • the LED module having a variety of patterns can be used.
  • the LED module 30 is attached to the bottom surface of the planar heat sink 10 of the composite heat sink 100, the deposition method by depositing a copper layer on the bottom surface of the planar heat sink 10 to form a circuit directly attached Alternatively, the thermally conductive tape may be indirectly adhered to the deposited copper surface.
  • Composite heat dissipation plate for LED lighting of the present invention having the configuration as described above to maximize the heat dissipation area in a small space to improve the heat dissipation efficiency and heat dissipation speed, and at the same time provides a LED light lamp with a lightweight product.
  • a composite heat dissipation plate for an LED lamp and an LED lamp including the same which can maximize heat dissipation area in a small space, increase heat dissipation efficiency, improve heat dissipation speed, and at the same time reduce the weight of the product.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to a complex heat sink comprising a planar heat sink having a lower portion to which an LED module is attached, and a convex-concave heat sink attached to an upper surface of the planar heat sink. The present invention also relates to an LED light comprising the complex heat sink. According to the above-described configuration, an LED light, in which a heat-dissipating area is maximized in a narrow space to improve heat-dissipating efficiency and heat-dissipating speed and which is lightweight, may be obtained.

Description

엘이디 조명등용 복합방열판 및 이를 포함하는 엘이디 조명등Composite heat sink for LED lighting and LED lighting including the same
본 발명은 엘이디 조명등용 복합방열판 및 이를 포함하는 엘이디 조명등에 관한 것으로, 보다 상세하게는 적은 공간에 방열면적을 극대화하여 방열효율을 증가시키고, 방열속도를 개선하며, 동시에 제품을 경량화하는 것이 가능한 엘이디 조명등용 복합방열판 및 이를 포함하는 엘이디 조명등에 관한 것이다.The present invention relates to a composite heat dissipating plate for an LED lamp and an LED lamp including the same, and more particularly, to maximize the heat dissipation area in a small space to increase the heat dissipation efficiency, improve the heat dissipation speed, and at the same time the LED can be lightened product The present invention relates to a composite heat dissipating plate for a lighting lamp and an LED lighting lamp including the same.
종래 엘이디모듈에 부착되는 방열판은 도 1에 도시된 바와 같이 엘이디모듈(1) 상에 다양한 형태의 방열구조를 가진 방열판(2a, 2b)이 사용되었으나, 이러한 구조의 방열판은 한정된 공간에서 방열의 한계에 도달하면 방열과 열흡수가 병행되는 현상이 발생하는 구조적인 결함을 나타낸다. In the conventional heat sink attached to the LED module, as shown in FIG. 1, heat sinks 2a and 2b having various types of heat dissipation structures are used on the LED module 1, but heat sinks of such a structure are limited in heat dissipation in a limited space. When it reaches, it indicates a structural defect in which heat radiation and heat absorption occur simultaneously.
또한, 이러한 구조의 방열판은 방열면적은 넓으나 방열속도 및 열체류현상이 많아 쉽게 장치내 온도상승을 초래하고, 나아가 방열판의 무게로 인하여 제품의 중량이 무거워지는 단점을 갖는다. 이에 따라 적은 공간에 방열면적을 극대화하여 방열효율 및 방열속도를 개선할 수 있고, 동시에 제품을 경량화한 방열판의 개발이 요구되어진다.In addition, the heat dissipation plate of this structure has a large heat dissipation area, but the heat dissipation rate and heat retention phenomenon is large, causing the temperature rise in the device easily, and further, the weight of the product becomes heavy due to the weight of the heat dissipation plate. Accordingly, the heat dissipation efficiency and heat dissipation speed can be improved by maximizing the heat dissipation area in a small space, and at the same time, it is required to develop a heat dissipation plate which is light in weight.
본 발명은 상기한 바와 같은 종래기술이 가지는 문제를 해결하기 위해 안출된 것으로, 그 목적은 적은 공간에 방열면적을 극대화하여 방열효율을 증가시키고, 방열속도를 개선하며, 동시에 제품을 경량화하는 것이 가능한 엘이디 조명등용 복합방열판 및 이를 포함하는 엘이디 조명등을 제공함에 있다.The present invention has been made to solve the problems of the prior art as described above, the object is to maximize the heat dissipation area in a small space to increase the heat dissipation efficiency, improve the heat dissipation speed, and at the same time it is possible to lighten the product The present invention provides a composite heat sink for LED lighting and an LED lighting including the same.
상기한 바와 같은 본 발명의 기술적 과제는 다음과 같은 수단에 의해 달성되어진다.The technical problem of the present invention as described above is achieved by the following means.
(1) 엘이디모듈이 하부에 부착되는 평면방열판, 및 상기 평면방열판의 상면에 부착된 요철방열판을 포함하는 엘이디 조명등용 복합방열판.(1) a composite heat dissipation plate for an LED lamp including a flat heat dissipation plate attached to a lower part of the LED module, and an uneven heat dissipation plate attached to an upper surface of the flat heat dissipation plate.
(2) 제 1항에 있어서,(2) The method according to 1,
상기 평면방열판의 양면 중 적어도 어느 하나의 면에 구리층이 형성된 것을 특징으로 하는 엘이디 조명등용 복합방열판.Composite heat sink for LED lighting, characterized in that the copper layer is formed on at least one surface of both sides of the planar heat sink.
(3) 제 1항 또는 제 2항에 있어서,(3) The method according to 1 or 2,
상기 요철방열판의 상단면에 카본이 증착된 것을 특징으로 하는 엘이디 조명등용 복합방열판.Composite radiator for LED lighting, characterized in that the carbon is deposited on the top surface of the uneven heat sink.
(4) 제 1항 또는 제 2항에 있어서,(4) The method according to 1 or 2,
상기 요철방열판의 하단면에 구리층이 형성된 것을 특징으로 하는 엘이디 조명등용 복합방열판.Composite heat sink for LED lighting, characterized in that the copper layer is formed on the bottom surface of the uneven heat sink.
(5) 제 1항 또는 제 2항에 있어서,(5) The method according to claim 1 or 2,
상기 요홈부에 세라믹이 충전된 것을 특징으로 하는 엘이디 조명등용 복합방열판.LED composite lamps characterized in that the recess is filled with ceramic.
(6) 엘이디모듈; 상기 엘이디모듈이 하부에 부착되는 평면방열판; 및 상기 평면방열판의 상면에 부착된 요철방열판을 포함하는 엘이디 조명등.(6) LED module; A flat heat dissipation plate to which the LED module is attached; And an uneven heat sink attached to an upper surface of the planar heat sink.
(7) 제 6항에 있어서,(7) the method of paragraph 6,
상기 평면방열판의 엘이디모듈이 부착되는 일면에 구리배선을 형성하고, 여기에 엘이디모듈을 직접 부착한 것을 특징으로 하는 엘이디 조명등.LED lighting, characterized in that the copper wiring is formed on one surface to which the LED module of the planar heat sink is attached, and the LED module is directly attached thereto.
(8) 제 6항에 있어서,(8) the method of item 6,
상기 평면방열판의 엘이디모듈이 부착되는 일면에 구리층을 형성하고, 여기에 열전도성 테이프를 부착하여 엘이디모듈을 부착한 것을 특징으로 하는 엘이디 조명등용 방열판.The heat sink for the LED lighting lamp, characterized in that the copper layer is formed on one surface to which the LED module of the planar heat sink is attached, and the LED module is attached by attaching a thermal conductive tape thereto.
(9) 제 6항에 있어서,(9) The method according to 6,
상기 평면방열판의 하단에 엘이디모듈이 결합될 수 있도록 레일이 형성되고, 상기 레일의 홈에 엘이디모듈이 삽입고정된 것을 특징으로 하는 엘이디 조명등용 방열판.The heat sink for the LED lighting lamp, characterized in that the rail is formed so that the LED module is coupled to the lower end of the planar heat sink, the LED module is inserted into the groove of the rail.
본 발명에 의하면, 적은 공간에 방열면적을 극대화하여 방열효율을 증가시키고, 방열속도를 개선하며, 동시에 제품을 경량화하는 것이 가능한 엘이디 조명등용 복합방열판 및 이를 포함하는 엘이디 조명등을 제공할 수 있다.According to the present invention, it is possible to provide a composite heat dissipation plate for an LED lamp and an LED lamp including the same, which can maximize heat dissipation area in a small space, increase heat dissipation efficiency, improve heat dissipation speed, and at the same time reduce the weight of the product.
도 1은 종래 엘이디모듈에 부착되는 방열판의 구조도.1 is a structural diagram of a heat sink attached to a conventional LED module.
도 2는 본 발명에 따른 엘이디 조명등용 복합방열판의 구성도.Figure 2 is a block diagram of a composite heat sink for LED lighting according to the present invention.
도 3은 본 발명에 따른 평면방열판과 요철방열판의 조립과정.3 is an assembly process of the flat heat sink and the uneven heat sink according to the invention.
도 4는 본 발명에 따른 엘이디 조명등용 복합방열판의 하부에 엘이디모듈을 부착한 상태의 사시도.Figure 4 is a perspective view of the LED module attached to the lower portion of the composite heat sink for LED lighting according to the present invention.
도 5는 엘이디모듈의 예시도.5 is an exemplary view of an LED module.
도 6은 본 발명에 따른 레일식 평면방열판에 엘이디모듈이 부착된 상태도.Figure 6 is a state attached to the LED module on the rail-type heat sink according to the invention.
<도면의 주요부분의 부호의 설명><Description of Symbols of Major Parts of Drawings>
10: 평면방열판10: flat heat sink
10a: 알루미늄기판10a: aluminum substrate
10b: 구리층10b: copper layer
10c: 레일10c: rail
20: 요철방열판20: uneven heat sink
20a: 돌출부20a: protrusion
20b: 요홈부20b: groove
30: 엘이디모듈30: LED module
100: 복합방열판100: composite heat sink
본 발명은 엘이디모듈이 하부에 부착되는 평면방열판, 및 상기 평면방열판의 상면에 부착된 요철방열판을 포함하는 엘이디 조명등용 복합방열판을 제공한다.The present invention provides a composite heat dissipation plate for an LED lamp including a flat heat dissipation plate attached to the bottom of the LED module, and an uneven heat dissipation plate attached to the top surface of the flat heat dissipation plate.
또한, 본 발명은 엘이디모듈; 상기 엘이디모듈이 하부에 부착되는 평면방열판; 및 상기 평면방열판의 상면에 부착된 요철방열판을 포함하는 엘이디 조명등을 제공한다.In addition, the present invention LED module; A flat heat dissipation plate to which the LED module is attached; And an LED lighting lamp including an uneven heat sink attached to an upper surface of the planar heat sink.
이하 본 발명의 내용을 도면을 참조하여 보다 상세하게 설명하도록 한다.Hereinafter, the content of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 엘이디 조명등용 복합방열판의 구성도를 나타낸다.Figure 2 shows the configuration of the composite heat sink for the LED lamp according to the invention.
상기 엘이디 조명등용 복합방열판은 평면방열판(10)과 그 상부에 부착되는 요철방열판(20)을 포함한다.The LED lighting composite heat dissipation plate includes a flat heat dissipation plate 10 and the uneven heat dissipation plate 20 attached to the upper portion.
평면방열판(10)은 장방형의 기판(10a)의 상하면 중 적어도 어느 하나, 바람직하게는 양쪽면에 열전도특성이 우수한 금속층(10b), 바람직하게는 구리층을 적층한다. 상기 기판(10a)은 가벼우면서 열방출특성이 우수한 알루미늄 재질이 사용될 수 있다. 구리층(10b)은 상기 기판의 열저항을 극소화하여 엘이디모듈에서 발생하는 고온의 열을 고속으로 상면에 부착되는 요철방열판(20)으로 전달한다. 이때 상기 기판(10a)의 두께는 예를 들어, 0.4~0.6mm, 바람직하게는 약 0.5mm로 하고, 일면 혹은 양면에 증착되는 구리층(10b)의 두께는 0.1~0.2mm, 바람직하게는 약 0.1mm로 하는 것이 방열효과 및 방열속도를 보다 극대화할 수 있다. The planar heat sink 10 is formed by stacking a metal layer 10b, preferably a copper layer, having excellent thermal conductivity on at least one of the upper and lower surfaces of the rectangular substrate 10a, preferably on both surfaces. The substrate 10a may be made of an aluminum material that is light and has excellent heat dissipation characteristics. The copper layer 10b minimizes the thermal resistance of the substrate and transfers high temperature heat generated from the LED module to the uneven heat sink 20 attached to the upper surface at high speed. At this time, the thickness of the substrate 10a is, for example, 0.4 ~ 0.6mm, preferably about 0.5mm, the thickness of the copper layer 10b deposited on one side or both sides is 0.1 ~ 0.2mm, preferably about 0.1mm can maximize heat dissipation effect and heat dissipation rate more.
상기 요철방열판(20)은 상단면이 복수개의 돌출부(20a)로 이루어지고, 하단면이 상기 상단면의 돌출부(20a)에 대응되어지는 요홈부(20b)로 이루어진다. 이와 같은 방열판을 요철구조로 형성한 것은 적은 용적에 방열면적을 증가시키고 방열속도를 개선하기 위해서이다. 상기 요철방열판(20)은 가벼우면서 열방출특성이 우수한 알루미늄 재질이 사용될 수 있다. 바람직하게는 상기 요철방열판(20)의 상단면에 열방출이 보다 효과적으로 일어날 수 있도록 카본을 증착한다. 이와 함께 바람직하게는 상기 요철방열판(20)의 하단면에는 하부의 평면방열판(10)에서 전달되는 고온의 열을 효과적으로 요철방열판(20)에 전달하기 위해 열저항을 극소화하는 열전도특성이 우수한 금속층, 바람직하게는 구리층이 증착된다. 가장 바람직하게는 상기 요철방열판(20)의 하단면에 형성된 요홈부(20b)에 외부로 열방출을 극대화시키기 위해 세라믹재질을 충전시킨다. 이때 상기 요철방열판(20)의 두께는 예를 들어, 0.4~0.6mm, 바람직하게는 약 0.5mm로 하고, 요철모양을 포함한 높이는 4~6mm, 바람직하게는 약 5mm로 하며, 하단면(20b)에 형성되는 구리층의 두께는 0.1~0.2mm, 바람직하게는 약 0.1mm로 하는 것이 방열효과 및 방열속도를 보다 극대화할 수 있다.The uneven heat dissipation plate 20 is formed of a plurality of protrusions 20a having an upper end surface and a recess 20b having a lower end corresponding to the protrusion 20a of the upper end surface. The heat sink is formed of the uneven structure in order to increase the heat dissipation area in a small volume and improve the heat dissipation speed. The uneven heat dissipation plate 20 may be made of a light aluminum material having excellent heat dissipation characteristics. Preferably, carbon is deposited on the top surface of the uneven heat dissipation plate 20 so that heat dissipation can occur more effectively. Along with this, preferably, the bottom surface of the uneven heat dissipation plate 20 has a metal layer having excellent thermal conductivity to minimize heat resistance in order to effectively transfer the high temperature heat transmitted from the lower flat heat dissipation plate 10 to the uneven heat dissipation plate 20, Preferably a copper layer is deposited. Most preferably, the ceramic material is filled in the groove 20b formed on the bottom surface of the uneven heat sink 20 to maximize heat dissipation to the outside. At this time, the thickness of the uneven heat sink 20 is, for example, 0.4 ~ 0.6mm, preferably about 0.5mm, the height including the uneven shape is 4 ~ 6mm, preferably about 5mm, the bottom surface 20b The thickness of the copper layer formed in the 0.1 ~ 0.2mm, preferably about 0.1mm can be more maximized the heat radiation effect and the heat radiation rate.
도 3은 상기 본 발명의 평면방열판(10)과 요철방열판(20)을 부착하는 과정을 나타낸다.3 shows a process of attaching the planar heat sink 10 and the uneven heat sink 20 of the present invention.
먼저 요철방열판(20)의 돌출부(20a)를 갖는 상단면을 상부를 향하도록 배치하고, 표면의 불순물을 제거한 후 공지의 방법, 예를 들어 고온증착 등을 이용하여 카본을 증착한다. 상단면에 카본이 증착된 요철방열판(20)을 뒤집어 하단면이 상부를 향하도록 배치한 후, 그 위에 구리를 증착하거나 하지 않은 상태에서 요홈부(20b)에 세라믹 파우더를 충전시킨다.First, the top surface having the protrusions 20a of the uneven heat-dissipating plate 20 is disposed to face upward, and after removing impurities on the surface, carbon is deposited using a known method, for example, high temperature deposition. After placing the concave-and-convex heat dissipation plate 20 on which carbon is deposited on the upper surface, the lower surface is disposed upward, and the ceramic powder is filled in the recess 20b without depositing copper thereon.
이와 같이 준비된 요철방열판(20)의 하단면의 위에서 평면방열판(10)을 부착시키면 본 발명에 따른 복합방열판(100)을 얻을 수 있다. 평면방열판(10)과 요철방열판(20)의 부착은 화학적인 방법, 혹은 전기분해용접과 같은 방법들이 이용될 수 있으며, 바람직하게는 전기분해용접을 이용하여 부착하는 것이 부착의 강도 뿐만 아니라 생산성 및 관리적인 측면에서도 우수한 것으로 나타났다. When the planar heat sink 10 is attached on the bottom surface of the uneven heat sink 20 prepared as described above, the composite heat sink 100 according to the present invention can be obtained. Attachment of the planar heat sink 10 and the uneven heat sink 20 may be a chemical method, or a method such as electrolytic welding may be used. Preferably, by attaching by using electrolytic welding, not only the strength of the adhesive but also the productivity and In terms of management, it was excellent.
도 4는 상기 본 발명에 따른 엘이디 조명등용 복합방열판(100)의 하부에 엘이디모듈(30)을 부착한 상태의 사시도를 나타낸다.Figure 4 shows a perspective view of a state in which the LED module 30 is attached to the lower portion of the composite heat-dissipating plate 100 for LED lighting according to the present invention.
엘이디모듈은 도 5에 예시된 바와 같이 통상적으로 장방형의 기판(30a) 상에 엘이디(30b)를 다수 부착한 상태의 것으로 도시된 형태의 배열은 본 발명의 이해를 돕기 위해 제시된 예시일 뿐 이 이외의 다양한 패턴을 갖는 엘이디모듈이 사용되어질 수 있음은 물론이다.The LED module is typically arranged in a state in which a plurality of LEDs 30b are attached to the rectangular substrate 30a as illustrated in FIG. 5. Of course, the LED module having a variety of patterns can be used.
엘이디모듈(30)은 복합방열판(100)의 평면방열판(10) 하단면에 부착되어지며, 부착방법으로는 평면방열판(10)의 하단면에 구리층을 증착한 후 회로를 형성하여 직접 부착하는 방법이나, 증착된 구리면에 열전도성 테이프를 사용하여 간접적으로 접착할 수도 있다.The LED module 30 is attached to the bottom surface of the planar heat sink 10 of the composite heat sink 100, the deposition method by depositing a copper layer on the bottom surface of the planar heat sink 10 to form a circuit directly attached Alternatively, the thermally conductive tape may be indirectly adhered to the deposited copper surface.
또한, 도 6에 도시된 바와 같이 평면방열판(10)의 하단면에 레일(10c)을 구성하여 레일홈에 엘이디모듈을 삽입하여 고정하는 것도 가능하다.In addition, as shown in Figure 6 it is possible to configure the rail (10c) on the bottom surface of the flat heat sink 10 to insert the LED module in the rail groove to be fixed.
상기와 같은 구성을 갖는 본 발명의 엘이디 조명등용 복합방열판은 적은 공간에도 방열면적을 극대화하여 방열효율 및 방열속도를 개선하며, 동시에 제품을 경량화한 엘이디 조명등을 제공한다. Composite heat dissipation plate for LED lighting of the present invention having the configuration as described above to maximize the heat dissipation area in a small space to improve the heat dissipation efficiency and heat dissipation speed, and at the same time provides a LED light lamp with a lightweight product.
상기와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.As described above, it has been described with reference to a preferred embodiment of the present invention, but those skilled in the art various modifications and changes of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.
본 발명에 의하면, 적은 공간에 방열면적을 극대화하여 방열효율을 증가시키고, 방열속도를 개선하며, 동시에 제품을 경량화하는 것이 가능한 엘이디 조명등용 복합방열판 및 이를 포함하는 엘이디 조명등을 제공할 수 있다.According to the present invention, it is possible to provide a composite heat dissipation plate for an LED lamp and an LED lamp including the same, which can maximize heat dissipation area in a small space, increase heat dissipation efficiency, improve heat dissipation speed, and at the same time reduce the weight of the product.

Claims (9)

  1. 엘이디모듈이 하부에 부착되는 평면방열판, 및 상기 평면방열판의 상면에 부착된 요철방열판을 포함하는 엘이디 조명등용 복합방열판.LED heat sink is attached to the bottom of the heat sink, and a heat sink for LED lighting including a heat dissipation plate attached to the upper surface of the plane heat sink.
  2. 제 1항에 있어서,The method of claim 1,
    상기 평면방열판의 양면 중 적어도 어느 하나의 면에 구리층이 형성된 것을 특징으로 하는 엘이디 조명등용 복합방열판.Composite heat sink for LED lighting, characterized in that the copper layer is formed on at least one surface of both sides of the planar heat sink.
  3. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2,
    상기 요철방열판의 상단면에 카본이 증착된 것을 특징으로 하는 엘이디 조명등용 복합방열판.Composite radiator for LED lighting, characterized in that the carbon is deposited on the top surface of the uneven heat sink.
  4. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2,
    상기 요철방열판의 하단면에 구리층이 형성된 것을 특징으로 하는 엘이디 조명등용 복합방열판.Composite heat sink for LED lighting, characterized in that the copper layer is formed on the bottom surface of the uneven heat sink.
  5. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2,
    상기 요홈부에 세라믹이 충전된 것을 특징으로 하는 엘이디 조명등용 복합방열판.LED composite lamps characterized in that the recess is filled with ceramic.
  6. 엘이디모듈; 상기 엘이디모듈이 하부에 부착되는 평면방열판; 및 상기 평면방열판의 상면에 부착된 요철방열판을 포함하는 엘이디 조명등.LED module; A flat heat dissipation plate to which the LED module is attached; And an uneven heat sink attached to an upper surface of the planar heat sink.
  7. 제 6항에 있어서,The method of claim 6,
    상기 평면방열판의 엘이디모듈이 부착되는 일면에 구리배선을 형성하고, 여기에 엘이디모듈을 직접 부착한 것을 특징으로 하는 엘이디 조명등.LED lighting, characterized in that the copper wiring is formed on one surface to which the LED module of the planar heat sink is attached, and the LED module is directly attached thereto.
  8. 제 6항에 있어서,The method of claim 6,
    상기 평면방열판의 엘이디모듈이 부착되는 일면에 구리층을 형성하고, 여기에 열전도성 테이프를 부착하여 엘이디모듈을 부착한 것을 특징으로 하는 엘이디 조명등용 방열판.The heat sink for the LED lighting lamp, characterized in that the copper layer is formed on one surface to which the LED module of the planar heat sink is attached, and the LED module is attached by attaching a thermal conductive tape thereto.
  9. 제 6항에 있어서,The method of claim 6,
    상기 평면방열판의 하단에 엘이디모듈이 결합될 수 있도록 레일이 형성되고, 상기 레일의 홈에 엘이디모듈이 삽입고정된 것을 특징으로 하는 엘이디 조명등용 방열판.The heat sink for the LED lighting lamp, characterized in that the rail is formed so that the LED module is coupled to the lower end of the planar heat sink, the LED module is inserted into the groove of the rail.
PCT/KR2011/008997 2010-11-24 2011-11-23 Complex heat sink for an led light, and led light comprising same WO2012070874A2 (en)

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