KR100817794B1 - Heating apparatus of having one heating body - Google Patents

Abstract

A heating apparatus having one heating body is provided to prevent a thermistor from being broken by absorbing stress applied from the outside through plural stone guides and a concave-convex joint. A heating apparatus includes a heating unit(100), an insulating buffer layer, and a first plate electrode. The heat unit includes a heating body(120) and a heating plate(140). The heating body has a curved shape to the inside of the body. The heating body is equipped with an inner space(160). Left and right terminals of the heating body are joined to a first holder(200) and a second holder(300). The heating body is made of a metal having high heat conductivity. The heating body is preferably made of aluminum, an aluminum alloy, or a copper alloy. The insulating buffer layer electrically intercepts the heating body and the first plate electrode of the heating body from each other. The first plate electrode is made of a conductive metallic material.

Description

Integrated heat dissipation unit {Heating Apparatus of having one heating body}

1 is a perspective view of a heat dissipation device that is integrally provided according to a preferred embodiment of the present invention.

2A is a plan view of the heat dissipation device in a first direction in FIG. 1, and FIG. 2B is a plan view of the heat dissipation device in a second direction in FIG. 1.

Figure 3a is an exploded perspective view showing a heat dissipation device formed integrally in accordance with a preferred embodiment of the present invention, Figure 3b is a perspective view showing the elements inserted into the interior space of the heat dissipation device in Figure 3a.

4A and 4B are cross-sectional views illustrating a method of accommodating a plurality of components in an inner space of a heat dissipation device.

5 is a perspective view illustrating stone guides provided in the heat dissipation device according to the preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: heat dissipation unit 120: heat dissipation body

140: heat sink 160: internal space

200: first holder 300: second holder

400: insulating buffer layer 410: first plate electrode

420: stone guide 430: thermistor

440: second plate electrode

The present invention relates to a heat dissipation device using a thermistor, and more particularly, to a heat dissipation device having a heat dissipation member formed integrally.

The heat dissipation device is used for various purposes such as a vehicle preheater, a heater of a system air conditioner or a drying heater of a washing machine. Such a heat dissipation device converts electrical energy supplied to supply heat heated in a predetermined space into thermal energy.

Various uses of the heat dissipation device generate heat by using electrical energy, and take the structure in which the air is heated and the heated air is supplied to a predetermined space while the air passes through the space between the heat sinks of the heat dissipation device.

In order to convert electrical energy into thermal energy, the heat dissipation device uses a positive thermistor inside. That is, a positive temperature thermistor (PTC) is used as a heating element, and a heat dissipation device is formed by mounting it on a predetermined structure.

A heat dissipation device using a static thermistor is disclosed in Korean Patent No. 245793 and Korean Patent No. 515551.

Korean Patent No. 245793 has a shape in which a heat dissipation tube is inserted into an U-shaped opening, and the thermistor is adjacent to a side of the heat dissipation tube to transfer heat. The structure is characterized in that the air inside has a uniform temperature distribution by the heat dissipation tube.

In addition, the Republic of Korea Patent No. 515551 relates to the structure of the pre-heater is an improvement of the patent of the German Berusa and the United States Patent No. 5198640, which was published internationally on August 28, 2003. In Patent No. 57571, PTC, which is a heating element, is seated in a predetermined container, and a plurality of receptors have a shape penetrating through the stacked heat radiating members.

The Republic of Korea Patent No. 245793 has a structure that is suitable for transferring heat in a narrow space using an insulating case, etc., has a disadvantage that can not supply heat to a large area.

In addition, the Republic of Korea Patent No. 515551 has the advantage that can supply heat to a relatively large space. However, since the heat dissipation member having the function of dissipating heat is assembled, there is a disadvantage that the heat efficiency transmitted from the heat generator to the heat dissipation member is low.

In order to overcome the above-mentioned problems, a positive thermal thermistor is housed therein, and a heat sink is integrally formed with a housing accommodating the static thermistor, and the two heat dissipating plates and the housing are integrally formed with two structures. A heat dissipation device using a thermistor to be assembled has been developed. However, in the case of the heat dissipation device, there is a certain limit to increase the size of the heat dissipation device due to the thermistor having a brittle property. In addition, in order to heat a large space, there is a need to connect a plurality of independent heat dissipation devices in parallel or in series. In particular, manufacturers of vehicles, system air conditioners or washing machines that need to heat a large space in a short time have been a factor to increase the manufacturing cost because they use a plurality of heat dissipation devices.

Accordingly, it is an object of the present invention to provide a heat dissipation device that is improved in heat dissipation efficiency and suitable for heating a large area of space.

The present invention for achieving the above object of the present invention, the heat dissipation unit having a heat dissipation body and a heat sink having an inner space; An insulation buffer layer provided in an inner space of the heat dissipation unit; A first plate electrode provided in the inner space and formed on the insulating buffer layer; A stone guide provided in the inner space and provided on the first plate electrode to receive thermistors; A second plate electrode provided in the inner space and provided on the stone guide; A first holder provided to fasten the heat dissipation unit; And a second holder provided opposite to the first holder and provided to fasten the heat dissipating part, wherein the heat dissipating part is integrally formed by cutting one ingot.

In addition, the above object of the present invention, in the heat dissipation device using a thermistor which is heated by the applied electric power and a heat dissipation unit for dissipating heat generated by the thermistor to the outside, the heat dissipation unit is fastened, the positive electrode through the first electrode A first holder supplied with a power supply voltage; A second holder disposed to face the first holder and receiving a negative power supply voltage through a second electrode; An insulating buffer layer disposed in an inner space of the heat dissipation unit; A first plate electrode disposed in the inner space and electrically connected to the first electrode and formed on the insulating buffer layer to supply power to the thermistor; A stone guide provided on the first plate electrode to receive the thermistor; And a second plate electrode provided on a stone guide for accommodating the thermistors, the second plate electrode electrically connected to the second electrode to supply power to the thermistors, and the heat dissipation part is integrally formed by cutting one ingot. It can also be achieved through the provision of an integrated heat dissipation device, characterized in that formed.

Hereinafter, with reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention. Hereinafter, the same reference numerals are used for the same components in the drawings, and duplicate descriptions of the same components are omitted.

Example

1 is a perspective view of a heat dissipation device that is integrally provided according to a preferred embodiment of the present invention.

2A is a plan view of the heat dissipation device in a first direction in FIG. 1, and FIG. 2B is a plan view of the heat dissipation device in a second direction in FIG. 1.

1, 2A and 2B, the heat dissipation device according to the present embodiment has a heat dissipation unit, a first holder and a second holder.

The heat dissipation unit 100 is integrally formed by processing one ingot. That is, one ingot is provided through various forms of casting or mold technology, and the heat dissipation body 120 and the heat dissipation plate 140 are provided by cutting the outer area of the ingot.

The heat dissipation body 120 has a central portion curved inwardly. A plurality of heat sinks 140 are provided in upper and lower outer regions of the heat dissipation body 120 integrally with the heat dissipation body 120.

The heat sinks 140 generally have a wing shape and are arranged at regular intervals from each other. The heat sink 140 is formed through a skiving process. In FIG. 1, the heat dissipation plates 140 provided above and below the heat dissipation body are integrally formed with the heat dissipation body 120 through a cutting process for one ingot.

The first holder 200 has a first housing 220, a first fastening groove 240, and a first electrode 260.

The first holder 200 accommodates one end portion of the heat dissipation part 100. In addition, the conductive electrode provided in the inner space of the heat dissipation unit 100 is electrically connected to the first electrode 260 protruding to the outside of the first holder 200.

In addition, the first housing 220 accommodates one end portion of the heat dissipation unit 100 through holes formed therein, and electrically connects the first electrode 260 and the conductive electrode provided in the heat dissipation unit 100. .

In addition, the first fastening groove 240 is provided in the outer region of the first housing 220. The first fastening groove 240 allows the heat dissipation device to be fixed to the electrical appliance using the same. That is, the fastening means is inserted into the first fastening groove 240 by using an appropriate fastening means such as a screw or a bolt and serves to fix the heat dissipation device in the electric product.

The second holder 300 is provided at a position opposite to the first holder 200. Like the first holder 200, the other end portion of the heat dissipation part 100 is accommodated. In addition, the second holder 300 has substantially the same shape and components as those of the first holder 200. However, the shape may be somewhat asymmetrical and may have a shape different from that of the first holder 200 according to a situation in which the electrical product is mounted.

The second holder 300 is composed of a second housing 320, a second fastening groove 340, and a second electrode 360.

The second fastening groove 340 together with the first fastening groove 240 allows the heating device to be fixed to the electronic product through an appropriate fastening means. The second electrode 360 supplies power to the thermistor provided in the heat dissipation device together with the first electrode 260. For example, when the first electrode 260 is connected to the positive power supply voltage, the second electrode 360 is connected to the negative power supply voltage, and vice versa.

Figure 3a is an exploded perspective view showing a heat dissipation device formed integrally in accordance with a preferred embodiment of the present invention, Figure 3b is a perspective view showing the elements inserted into the interior space of the heat dissipation device in Figure 3a.

3A and 3B, the heat dissipation unit 100 includes a heat dissipation body 120 and a heat dissipation plate 140 which are integrally formed.

The heat dissipation body 120 has a curved shape toward the inside, and the heat dissipation body 120 has an inner space 160. In addition, as described above, in the upper and lower regions of the heat dissipation body 120, a plurality of heat dissipation plates 140 formed through cutting are regularly provided in a wing shape. Left and right ends of the heat dissipation body 120 are fastened to the first holder 200 and the second holder 300, respectively. In addition, the heat dissipation unit 100 is made of a metal having excellent thermal conductivity. Therefore, the heat dissipation unit 100 is preferably made of aluminum, aluminum alloy, copper or copper alloy. However, in consideration of manufacturing costs during manufacturing, various metals may be used to form the heat dissipation unit 100.

The insulating buffer layer 400, the first plate electrode 410, the stone guide 420, the thermistor 430, and the second plate electrode 440 are inserted into the inner space 160 of the heat dissipation part 100.

The insulating buffer layer 400 is provided between the heat dissipation unit 100 and the first plate electrode 410, and electrically blocks the heat dissipation body 120 and the first plate electrode 410 of the heat dissipation unit 100. Do this. In addition, the thermistor 430 is prevented from being broken by absorbing an external stress applied to the heat radiating device. Therefore, the insulating buffer layer 400 should have elasticity and bend well. In addition, it must have a property that can withstand the heat generated by the thermistor 430. Therefore, it is preferable that the insulating buffer layer 400 is a polymer insulating tape which does not cause deformation even at about 300 ° C. That is, it should be a material without deformation even at least 300 ° C or less. The polymer insulating tape is poly-acrylonitrile syndiotactic, poly-hexamethylene oxamide, poly-hexamethylene terephthalamide, poly-hydrazo adipamide, poly-methylene adipamide, poly-methylene sebacamide, poly-pentamethylene terephthalamide, poly-phenylene, cyclobutylene, poly-terephthalic anhydride Or poly-vinylcyclohexane.

The first plate electrode 410 is provided on the insulating buffer layer 400 and is seated in the internal space 160.

The first plate electrode 410 is made of a conductive metal material. In addition, one end of the first plate electrode 410 is electrically connected to the first electrode 260 connected to the external power source. In addition, the first plate electrode 410 and the first electrode 260 may be integrally formed. Power delivered through the first electrode 260 is transferred to thermistors 430 through the first plate electrode 410.

Thermistors 430 are provided on the first plate electrode 410 and electrically connected to the first plate electrode 410. In addition, the thermistors 430 are mounted on the stone guides 420.

The thermistors 430 are preferably static thermistors. That is, the resistance of the thermistor 430 increases as the temperature of the thermistor 430 increases. In addition, the upper and lower surfaces of the thermistor 430 are coated with a conductive material. In particular, electric power transmitted through the first plate electrode 410 due to the conductive material applied to the lower surface is easily transmitted to the thermistor 430. A plurality of thermistors 430 are received in the stone guide 420.

The stone guide 420 accommodates at least two thermistors 430. The stone guide 420 is composed of an insulator, preferably made of a polymer material that is not easily broken. In addition, in order for one heat dissipation device to cover a large area, it is preferable that a plurality of stone guides 420 be provided.

In particular, in order to perform heating for a large area of space, the length of the heat dissipation unit 100 is extended, and a large number of thermistors 430 should be provided as long as the extended length. However, when only one stone guide 420 is provided and about three thermistors are accommodated in the provided stone guide 420, it is difficult to apply to a heat radiation device having a long length. That is, when one stone guide is provided in one heat dissipation device, and three thermistors are mounted in one stone guide, the thermistors are broken inside the heat dissipation device mounted on the electric product.

In order to solve the above problems, a plurality of stone guides 420 should be provided inside the heat radiation device having a long length. In addition, the stone guides 420 are provided with a concave-convex fastening groove in the left and right outer regions so as to be easily detached from each other. Therefore, the concave-convex fastening grooves formed in the outer regions of the adjacent stone guides 420 are formed to engage with each other. When a plurality of stone guides 420 are provided in one heat dissipation device, and the stone guides 420 are provided to engage each other, the thermistor 430 is prevented from being broken by a mechanical force applied to the heat dissipation device. do. That is, the stone guides 420 may also absorb the force through the uneven portion in response to the mechanical force that may be applied to the top, bottom, left, and right sides of the heat dissipation device, thereby preventing the force from being broken by transferring the force to the thermistor 430.

The second plate electrode 440 is provided on an upper portion of the stone guide 420 in which the thermistors 430 are accommodated and accommodated in the inner space 160 of the heat dissipation device. The second plate electrode 440 is preferably formed of the same material as the first plate electrode 410. The second plate electrode 440 is electrically connected to the plurality of thermistors 430 accommodated in the stone guide 420, and is connected to the second electrode 360 at one end thereof. In addition, the direction in which the second electrode 440 is connected is preferably opposite to the direction in which the first electrode 260 is formed. In particular, the top of each thermistor 430 is doped with a conductive material to facilitate electrical connection with the second plate electrode 440.

In addition, another insulating buffer layer may be further provided on the second plate electrode 440 to be stored in the internal space. That is, the insulating buffer layer 400 may be provided below the first plate electrode 410 and above the second plate electrode 440. Similarly, in FIG. 3B, the insulating buffer layer 400 is illustrated to be provided only between the first plate electrode 410 and the heat dissipation body 120, but the insulation buffer layer 400 may include the second plate electrode 440 and the heat dissipation body ( It may also be provided between 120).

In addition, in FIG. 3B, three or four thermistors 430 are accommodated in the stone guide 420, but the number of thermistors 430 accommodated in the stone guide 420 may be large. It does not depart from the intent.

4A and 4B are cross-sectional views illustrating a method of accommodating a plurality of components in an inner space of a heat dissipation device.

First, referring to FIG. 4A, a stone guide 420 and a second receiving the insulating buffer layer 400, the first plate electrode 410, and the thermistor 430 in the inner space 160 of the heat dissipation part 100. The plate electrodes 440 are sequentially stacked and stored in the internal space 160. In addition, both sides of the body portion 120 of the heat dissipation portion 100 has a curved shape toward the inside. Subsequently, the insulating buffer layer 400, the first plate electrode 410, the thermistor 430, the stone guide 420, and the second plate electrode 440 are pressurized by applying external force to the internal space 160. That is, the height of the inner space 160 is reduced by applying pressure in the direction of the arrow to both sides of the portion where the wing-shaped heat sink 140 meets the heat dissipation body 120.

Referring to FIG. 4B, a pressure of the inner space 160 is reduced by applying pressure in the direction of the arrow in FIG. 4A to fix a plurality of components accommodated in the inner space 160.

In addition, when the first holder 200 and the second holder 300 are fitted to both sides of the heat dissipating part 100 protruding to the outside in FIG. 3A, a heat dissipation device formed in one piece shown in FIG. 1 may be obtained. .

5 is a perspective view illustrating stone guides provided in the heat dissipation device according to the preferred embodiment of the present invention.

5, it is preferable that two or more stone guides 420a and 420b according to the present embodiment are provided. That is, a plurality of stone guides 420a and 420b accommodating thermistors 430 may be provided to supply heated air to a wide space. In addition, the left and right sides of the stone guides 420a and 420b have a concave-convex shape, and have a structure that is easy to fasten with adjacent stone guides 420a and 420b. The material of the stone guides 420a and 420b is preferably a polymer insulator.

In addition, the stone guides 420a and 420b have a structure that is easily detachable from adjacent stone guides 420a and 420b, and even though stress is applied to the concave-convex connection portion, the stress may be distributed through the connection portion. That is, in the case of forming a single stone guide, the length of the stone guide is abnormally extended, and the phenomenon of breaking the thermistor housed in the stone guide cannot be avoided. However, when a plurality of stone guides 420a and 420b are used, The breakage of the thermistor in the elongated heat dissipation device can be avoided.

Therefore, according to the present embodiment, it is possible to maximize the heat dissipation efficiency by integrally forming a heat dissipation unit having a heat sink. In addition, it is possible to supply easily heated air to a large area of space. That is, a plurality of stone guides may be provided in a long heat dissipation device to cover a large area, and an insulation buffer layer may be included therein to avoid a breakage of the thermistors stored in the stone guides.

According to the present invention as described above, the heat dissipation unit for heating the air is integrally formed through a cutting process for one ingot. Therefore, the heat dissipation efficiency can be maximized as compared with the case in which the heat dissipation unit is assembled up and down. In addition, it is possible to prevent the stone guide from being broken by inserting a flexible insulating buffer layer therein. In addition, a phenomenon in which the thermistor is broken can be avoided by absorbing a stress applied from the outside through a plurality of stone guides seated in the inner space and their concave-convex fastening portions.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. I will be able.

Claims (8)

A heat dissipation unit including a heat dissipation body having an internal space and a heat dissipation plate; An insulation buffer layer provided in an inner space of the heat dissipation unit; A first plate electrode provided in the inner space and formed on the insulating buffer layer; Stone guides provided in the inner space and provided on the first plate electrode to accommodate thermistors; A second plate electrode provided in the inner space and provided on the stone guide; A first holder provided to fasten the heat dissipation unit; And A second holder provided opposite to the first holder and provided to fasten the heat dissipation unit; The heat dissipation unit is formed integrally by cutting one ingot, The heat dissipation plate is integrally formed in the heat dissipation body in the shape of a wing, the stone guide is an integrated heat dissipation device, characterized in that to absorb the mechanical force applied by having a concave-convex fastening groove in the left and right outer region. The integrated heat dissipation device according to claim 1, wherein the insulating buffer layer has a bending property and is a polymer insulating tape which does not cause deformation even at 300 ° C or lower. The method of claim 2, wherein the polymer insulating tape is poly-acrylonitrile syndiotactic, poly-hexamethylene oxamide, poly-hexamethylene terephthalamide, poly-hydrazo adipamide, poly-methylene adipamide, poly-methylene sebacamide, poly-pentamethylene terephthalamide, poly-phenylene, Integral heat dissipation device, characterized in that cyclobutylene, poly-terephthalic anhydride or poly-vinylcyclohexane. The unitary heat dissipation device of claim 1, wherein the stone guides are coupled to adjacent stone guides through the concave-convex shape provided in the left and right outer regions. delete A heat dissipation device using a thermistor heated by an applied electric power and a heat dissipation unit for dissipating heat generated by the thermistor to the outside, A first holder fastening the radiating unit and receiving a positive power voltage through a first electrode; A second holder disposed to face the first holder and receiving a negative power supply voltage through a second electrode; An insulating buffer layer disposed in an inner space of the heat dissipation unit; A first plate electrode disposed in the internal space and electrically connected to the first electrode and formed on the insulating buffer layer to supply power to the thermistor; A stone guide provided on the first plate electrode and accommodating the thermistor and having fastening grooves having irregularities on left and right sides; And A second plate electrode provided on a stone guide for accommodating the thermistors and electrically connected to the second electrode to supply power to the thermistors, The heat dissipation unit is formed integrally by cutting one ingot, The heat dissipation unit includes a heat dissipation body defining an inner space and a heat dissipation plate for discharging heat generated by the thermistor to the outside, wherein the heat dissipation plate is formed through a skiving process. The integrated heat dissipation device according to claim 6, wherein the insulating buffer layer has a bending property and is a polymer insulating tape which does not cause deformation even at 300 ° C or lower. The method of claim 7, wherein the polymer insulating tape is poly-acrylonitrile syndiotactic, poly-hexamethylene oxamide, poly-hexamethylene terephthalamide, poly-hydrazo adipamide, poly-methylene adipamide, poly-methylene sebacamide, poly-pentamethylene terephthalamide, poly-phenylene, Integral heat dissipation device, characterized in that cyclobutylene, poly-terephthalic anhydride or poly-vinylcyclohexane.

Images