KR100824697B1 - Heating Apparatus of using Thermistor - Google Patents

Abstract

Disclosed is a heat dissipation device for supplying air heated in a large capacity space. As the length of the heat dissipation device is increased, a plurality of stone guides for accommodating thermistors are provided to prevent the thermistor from being broken. In addition, a polymer insulating tape having insulating properties is provided between the plate electrode and the heat dissipation unit to absorb or disperse the stress applied from the outside. The polymer insulating tape is provided with an insulating buffer layer and is made of a material that bends well and can withstand relatively high temperatures.

Description

Heat dissipation device using a thermistor {Heating Apparatus of using Thermistor}

1 is a perspective view of a heat dissipation device using a thermistor according to a preferred embodiment of the present invention.

2A is a plan view of the heat dissipation device in a first direction in FIG. 1, and FIG. 2B is a plan view of the heat dissipation device in a second direction in FIG. 1.

3 is an exploded perspective view illustrating a heat dissipation device using a thermistor according to a preferred embodiment of the present invention.

4 is a cross-sectional view of the heat dissipation device shown in FIG. 1 according to a preferred embodiment of the present invention.

5 is a perspective view illustrating stone guides provided in the heat dissipation device according to the preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: first heat dissipation unit 120: first heat dissipation member

140: first body portion 200: second heat dissipation portion

220: second heat dissipation member 240: second body portion

300: first holder 320: first housing

340: first fastening groove 360: first electrode

400: first holder 420: second holder

440: second fastening groove 460: second electrode

500: insulating buffer layer 510: first plate electrode

520: Stone Guide 530: Thermistor

540: second plate electrode 560: fixed pin

The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device using a thermistor.

The heat dissipation device is used for various purposes such as a vehicle preheater, a heater of a system air conditioner or a drying heater of a washing machine. When used as a vehicle preheater, it is used to supply heat to the vehicle using electrical energy supplied from the vehicle's battery before the engine is running to generate sufficient heat to transfer heat into the vehicle. In addition, when used as a heater of the system air conditioner, the radiator converts the supplied electrical energy into thermal energy and supplies it to the room. Similarly, when used in a washing machine, the heat dissipation device supplies warm air to the laundry after washing so that the laundry can be easily dried.

Various applications of the above-described heat dissipation device generate heat by using electrical energy, and the air is heated while the air passes through the heat dissipation device, and has a structure in which warm air is supplied. To generate heat, the heat dissipation device uses a positive thermistor inside. That is, a positive temperature thermistor (PTC) is used as a heating element, and a heat dissipation device is formed by mounting it on a predetermined structure.

A heat dissipation device using a static thermistor is disclosed in Korean Patent No. 245793 and Korean Patent No. 515551.

Korean Patent No. 245793 has a shape in which a heat dissipation tube is inserted into an U-shaped opening, and the thermistor is adjacent to a side of the heat dissipation tube to transfer heat. The structure is characterized in that the air inside has a uniform temperature distribution by the heat dissipation tube.

In addition, the Republic of Korea Patent No. 515551 relates to the structure of the pre-heater is an improvement of the patent of the German Berusa and the United States Patent No. 5198640, which was published internationally on August 28, 2003. In Patent No. 57571, PTC, which is a heating element, is seated in a predetermined container, and a plurality of receptors have a shape penetrating through the stacked heat radiating members.

The Republic of Korea Patent No. 245793 has a structure that is suitable for transferring heat in a narrow space using an insulating case, etc., has a disadvantage that can not supply heat to a large area.

In addition, the Republic of Korea Patent No. 515551 has the advantage that can supply heat to a relatively large space. However, since the heat dissipation member having the function of dissipating heat is assembled, there is a disadvantage that the heat efficiency transmitted from the heat generator to the heat dissipation member is low.

In order to overcome the above-mentioned problems, the static thermistor is housed therein, and the heat sink is integrally formed with a housing for accommodating the static thermistor. A heat dissipation device using a thermistor to be assembled has been developed. However, in the case of the heat dissipation device, there is a certain limit to increase the size of the heat dissipation device due to the thermistor having a brittle property. In addition, in order to heat a large space, there is a need to connect a plurality of independent heat dissipation devices in parallel or in series. In particular, manufacturers of vehicles, system air conditioners or washing machines that need to heat a large space in a short time has been a factor to increase the manufacturing cost, because a large number of heat dissipation devices must be used.

Accordingly, it is an object of the present invention to provide a heat dissipation apparatus using a thermistor capable of easily supplying heated air to a large area of space.

The present invention for achieving the above object of the present invention, the first heat dissipation unit having a first heat dissipation member and the first body portion formed integrally through the skiving process; A second heat dissipation part coupled to the first heat dissipation part and having a second heat dissipation member and a first body part integrally formed through a skiving process; An insulating buffer layer provided in an inner space formed by the fastening of the first heat dissipating unit and the second heat dissipating unit; A first plate electrode formed on the insulating buffer layer; A plurality of stone guides provided on the first plate electrode to receive thermistors; A second plate electrode provided on the stone guides and configured to supply power to the thermistors; A first holder provided to fasten the first heat dissipation unit and the second heat dissipation unit; And a second holder provided opposite to the first holder and provided to fasten the first heat dissipation unit and the second heat dissipation unit, wherein the insulating buffer layer has a bending property and does not cause deformation even at 300 ° C. or higher. Provided is a heat dissipation device using a thermistor, which is an insulating tape.

In addition, the above object of the present invention, in the heat dissipation device using a thermistor which is heated by the applied electric power and the first heat dissipation unit and the second heat dissipation unit for dissipating heat generated by the thermistor to the outside, A first holder fastening the second heat dissipation unit and receiving a positive power supply voltage through the first electrode; A second holder disposed opposite the first holder and receiving a negative power supply voltage through a second electrode; An insulation buffer layer disposed in an inner space formed by the fastening of the first heat dissipation unit and the second heat dissipation unit, and provided on the first heat dissipation unit; A first plate electrode disposed in the inner space and electrically connected to the first electrode and formed on the insulating buffer layer to supply power to the thermistor; A plurality of stone guides provided on the first plate electrode and accommodating the thermistors; And a second plate electrode provided on a stone guide for accommodating the thermistors, the second plate electrode electrically connected to the second electrode to supply power to the thermistors, and the insulating buffer layer has a bending property, and is 300 ° C. or more. It is also achieved through the provision of a heat dissipation device using a thermistor, characterized in that the polymer insulating tape does not cause any deformation.

Hereinafter, with reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention. Hereinafter, the same reference numerals are used for the same components in the drawings, and redundant description of the same components is omitted.

Example

1 is a perspective view of a heat dissipation device using a thermistor according to a preferred embodiment of the present invention.

2A is a plan view of the heat dissipation device in a first direction in FIG. 1, and FIG. 2B is a plan view of the heat dissipation device in a second direction in FIG. 1.

1, 2A and 2B, the heat dissipation device according to the present embodiment may include a first heat dissipation unit 100, a second heat dissipation unit 200, a first holder 300, and a second holder 400. Have

The first heat dissipation unit 100 and the second heat dissipation unit 200 are provided above and below, respectively, and are coupled by fastening grooves having concave-convex shapes of the heat dissipation units 100 and 200. In addition, a large number of thermistors, which are heat generating elements, is provided in the inner space where the first heat dissipation unit 100 and the second heat dissipation unit 200 are fastened. In addition, although not shown in FIG. 1, conductive electrodes are provided above and below the plurality of thermistors, and each conductive electrode is electrically connected to the power inlet terminal through the first holder 300 and the second holder 400. do.

The first heat dissipation unit 100 has a wing-shaped first heat dissipation member 120. The first heat dissipation member 120 is formed through a skiving process. That is, before processing the first heat dissipation unit 100, an ingot is prepared, and the wing-shaped first heat dissipation member 120 is formed through mechanical processing of the ingot. However, the blade-type heat dissipation member is not formed through welding or assembly as in the related art, but is formed through cutting on the ingot. Therefore, the first heat dissipation member 120 is integrally formed with the body of the first heat dissipation part 100.

The second heat dissipation unit 200 is provided such that one surface of the body has an uneven shape corresponding to the first heat dissipation unit 100 so as to be easily coupled with the first heat dissipation unit 100. In addition, the second heat dissipation member 220 is formed through a skiving process like the first heat dissipation member 120. That is, by cutting the ingot, the bodies of the second heat dissipation member 220 and the second heat dissipation unit 200 are integrally formed.

The first holder 300 has a first housing 320, a first fastening groove 340, and a first electrode 360.

The first holder 300 accommodates end portions of the first heat dissipation part 100 and the second heat dissipation part 200 fastened by grooves having irregularities, and the first heat dissipation part 100 and the second heat dissipation part ( 200). In addition, the conductive electrode disposed in the internal space formed by the fastening of the first heat dissipation unit 100 and the second heat dissipation unit 200 is electrically connected to the first electrode 360 protruding to the outside of the first holder 300. Connected.

In addition, the first housing 320 accommodates the end portions of the first heat dissipation part 100 and the second heat dissipation part 200, and the first heat dissipation part 100 and the second heat dissipation part 200 through holes formed therein. ) Is inserted. The conductive electrode disposed in the internal space formed by the fastening of the heat radiating parts 100 and 200 is electrically connected to the first electrode 360 provided in the first holder 300.

In addition, a first fastening groove 340 is provided in an outer region of the first housing 320. The first fastening groove 340 allows the heat dissipation device to be fixed to an electrical product using the same. That is, the fastening means is inserted into the first fastening groove 340 by using an appropriate fastening means such as a screw or a bolt to fix the heat dissipation device in the electric product.

The second holder 400 is provided at a position opposite to the first holder 300. Like the first holder 300, the other end portions of the first heat dissipation part 100 and the second heat dissipation part 200 are accommodated and serve to fix the heat dissipation parts 100 and 200. In addition, the second holder 400 has substantially the same shape and components as those of the first holder 300. However, depending on the situation in which the electrical product is mounted, the shape is somewhat asymmetrical, and may have a different shape from the first holder 300.

The second holder 400 includes a second housing 420, a second fastening groove 440, and a second electrode 460.

The second fastening groove 440 together with the first fastening groove 340 allows the heat dissipation device to be fixed to the electronic product through an appropriate fastening means. The second electrode 460 together with the first electrode 360 supplies power to a thermistor provided in the heat dissipation device. For example, when the first electrode 360 is connected to the positive power supply voltage, the second electrode 460 is connected to the negative power supply voltage, and vice versa.

3 is an exploded perspective view illustrating a heat dissipation device using a thermistor according to a preferred embodiment of the present invention.

Referring to FIG. 3, the insulating buffer layer 500, the first plate electrode 510, the stone guide 520, thermistors 530, and the first heat dissipation part 100 and the second heat dissipation part 200 are disposed between the first and second heat dissipation parts 100 and 200. The two plate electrode 540 is provided.

The first heat dissipation part 100 includes a first heat dissipation member 120 and a first body part 140. In addition, the second heat dissipation part includes a second heat dissipation member 220 and a second body part 240.

The first body part 140 of the first heat dissipation part 100 and the second body part 240 of the second heat dissipation part 200 have guide grooves for fastening to each other. That is, the guide grooves of the first body part 140 and the guide grooves of the second body part 240 are fastened to each other, and the insulating buffer layer 500 is formed in the internal space formed by the fastening of the body parts 140 and 240. The first plate electrode 510, the stone guide 520, the thermistor 530, and the second plate electrode 540 are accommodated.

In addition, the first heat dissipation member 120 and the second heat dissipation member 220 are integrally formed on each of the first body part 140 and the second body part 240 through a skiving process. That is, the two ingots are respectively cut to form a first heat dissipation member 120 and a second heat dissipation member 220 having a thin and wing shape. In addition, the first heat dissipation unit 100 and the second heat dissipation unit 200 are made of a metal having excellent thermal conductivity. Therefore, the first heat dissipation unit 100 and the second heat dissipation unit 200 are made of aluminum and aluminum. It is preferably made of an alloy, copper or a copper alloy. However, in manufacturing, various metals may be used to form the heat dissipation unit in consideration of manufacturing costs and the like.

In addition, when the first heat dissipation unit 100 and the second heat dissipation unit 200 are fastened, fixing pins 560 are inserted into a space formed by the fastening of the body parts 140 and 240. The fixing pin 560 has a generally cylindrical shape. The first heat dissipation part 100 and the second heat dissipation part 200 are fixed by the insertion of the fixing pin 560. When the length of the heat dissipation device provided to supply heat to a large space is long, a plurality of fixing pins are provided and inserted into the space formed by the coupling of the body parts 140 and 240.

An insulating buffer layer 500 is provided on the first heat dissipation part 100.

), poly-hexamethylene oxamide(

), poly-hexamethylene terephthalamide(

), poly-hydrazo adipamide(

), poly-methylene adipamide(

) , poly-methylene sebacamide(

) , poly-pentamethylene terephthalamide(

), poly-phenylene(

), poly-terephthalic anhydride(

)또는 poly-vinylcyclohexane(

)임이 바람직하다. 상기 절연 버퍼층(500)은 제1 방열부(100)의 제1 몸체부(140) 상에 안착된다.The insulating buffer layer 500 is provided between the first heat dissipation unit 100 and the first plate electrode 510 and serves to electrically block the first heat dissipation unit 100 and the first plate electrode 510. do. In addition, by absorbing the external stress applied to the heat dissipation device, the thermistor 530 is prevented from being broken. Therefore, the insulating buffer layer 500 should be elastic and have good bending characteristics. In addition, it must have a property that can withstand the heat generated by the thermistor 530. Therefore, it is preferable that the insulating buffer layer 500 is a polymer insulating tape which does not cause deformation even at about 300 ° C. or less. The polymer insulating tape is poly-acrylonitrile syndiotactic (

), poly-hexamethylene oxamide

), poly-hexamethylene terephthalamide (

), poly-hydrazo adipamide (

), poly-methylene adipamide (

), poly-methylene sebacamide (

), poly-pentamethylene terephthalamide (

), poly-phenylene (

), poly-terephthalic anhydride (

Or poly-vinylcyclohexane (

Is preferred. The insulating buffer layer 500 is seated on the first body part 140 of the first heat dissipation part 100.

The first plate electrode 510 is provided on the insulating buffer layer 500.

The first plate electrode 510 is made of a conductive metal material. In addition, one end of the first plate electrode 510 is electrically connected to the first electrode 360 connected to the external power source. In addition, the first plate electrode 510 and the first electrode 360 may be integrally formed. Power delivered through the first electrode 360 is transmitted to thermistors 530 through the first plate electrode 510.

Thermistors 530 are provided on the first plate electrode 510 and electrically connected to the first plate electrode 510. In addition, the service places 530 are provided by being seated on the plurality of stone guides 520.

The thermistors 530 are preferably static thermistors. That is, the resistance of the thermistor 530 increases as the temperature of the thermistor 530 increases. In addition, the top and bottom surfaces of the thermistor 530 are coated with a conductive material. In particular, electric power transmitted through the first plate electrode 510 due to the conductive material applied to the lower surface is easily transmitted to the thermistor 530. A number of thermistors 530 are received in the stone guide 520.

The stone guide 520 accommodates at least two thermistors 530. The stone guide 520 is preferably made of an insulator, but preferably made of a polymer material that is not easily broken. In addition, a number of stone guides 520 are provided so that one heat dissipation device covers a large area.

The length of the first heat dissipation unit 100 and the second heat dissipation unit 200 is extended to heat the large area of space, and a plurality of thermistors 530 should be provided as long as the extended length. However, when only one stone guide 520 is provided and three or more thermistors 530 are accommodated in the provided stone guide 520, it is difficult to apply to a heat radiation device having a long length. That is, when one stone guide 520 is provided in one heat dissipation device and three thermistors 530 are mounted in one stone guide 520, thermistors ( 530 is broken.

In order to solve the above problems, in the present embodiment, a plurality of stone guides 520 are provided inside the heat radiation device having a long length. In addition, the stone guides 520 have a concave-convex coupling groove in the left and right outer regions so as to be easily detached from each other. Therefore, the concave-convex grooves formed in the outer regions of the adjacent stone guides 520 are formed to be engaged with each other. When a plurality of stone guides 520 are provided in one heat dissipation device and the stone guides 520 are interlocked with each other, the thermistor 530 is prevented from being broken by a mechanical force applied to the heat dissipation device. . That is, the stone guides 520 may also absorb the force through the uneven portion in response to the mechanical force that may be applied to the top, bottom, left, and right sides of the heat dissipation device, thereby preventing the breakage of the force being transmitted to the thermistor 530.

The second plate electrode 540 is provided on the stone guides 520 in which the thermistors 530 are accommodated. The second plate electrode 540 is preferably formed of the same material as the first plate electrode 510. The second plate electrode 540 is electrically connected to the plurality of thermistors 530 housed in the stone guide 520, and is connected to the second electrode 460 at one end thereof. In addition, the direction in which the second electrode 460 is connected is preferably opposite to the direction in which the first electrode 360 is formed. In particular, each thermistor 530 is doped with a conductive material to facilitate electrical connection with the second plate electrode 540.

In addition, an insulating buffer layer may be further provided on the second plate electrode 540. That is, the insulating buffer layer may be provided below the first plate electrode 510 and above the second plate electrode 540. Similarly, in FIG. 3, the insulating buffer layer 500 is illustrated to be provided only between the first plate electrode 510 and the first heat dissipation part 500. However, the insulating buffer layer 500 is formed with the second plate electrode 540. It may be provided between the second heat dissipation unit 200, and may be provided between the second plate electrode 540 and the second heat dissipation unit 200 alone.

In addition, in FIG. 3, three thermistors 530 are accommodated in the stone guide 520 provided at the outer portion of the heat dissipation device, and the thermistor 530 is provided in the stone guide 520 provided at the central part of the heat dissipation device. Although illustrated as being accommodated in four, the number of thermistors 530 accommodated in the stone guide 520 does not depart from the gist of the present invention.

Referring to FIG. 4, the first heat dissipation unit 100 and the second heat dissipation unit 200 are fastened to each other.

The first heat dissipation unit 100 is composed of the first heat dissipation member 120 and the first body portion 140, the first body portion 140 has a curved shape toward the outside. In addition, in FIG. 4, the first heat dissipation part 100 has a symmetrical shape.

The second heat dissipation part 200 is composed of a second heat dissipation member 220 and a second body part 240, and the second body part 240 has a curved shape toward the outer side, and approximately the first body part. And correspond to 140.

Two guide grooves 570 are formed on the left and right sides of the heat dissipation parts 100 and 200 by the combination of the first heat dissipation part 100 and the second heat dissipation part 200. In addition, fixing pins 560 are inserted into the two guide grooves 570, respectively. The shape of the fixing pins 560 is preferably cylindrical.

In addition, an inner space is formed at a central portion of the region joined by the first heat dissipation unit 100 and the second heat dissipation unit 200. In the internal space, the insulating buffer layer 500, the first plate electrode 510, the stone guide 520, the thermistor 530 accommodated in the stone guide 520, and the second plate electrode 540 disclosed in FIG. 3 are provided. do.

When a power supply voltage is applied through the first plate electrode 510 and the second plate electrode 540, the thermistor 530 stored in the stone guide 520 generates heat. Heat generated by the thermistor 530 is transferred to the wing-shaped heat dissipation members 120 and 220 of the first heat dissipation unit 100 and the second heat dissipation unit 200. In this case, when air is supplied in the direction of the arrow, the air is supplied with heat while passing through the spaces between the heat dissipation members 120 and 220, and supplying the heated air.

In the present embodiment, two or more stone guides 520 provided in the inner space by the combination of the heat radiating parts 100 and 200 are provided. That is, the length of the heat dissipation device is elongated to provide heated air in a large space. As the length of the heat dissipation device is extended, a plurality of stone guides 520 should be provided. If only one stone guide 520 is used and the length of the thermistor 530 accommodated in the stone guide 520 is extended, the thermistor 530 may not be broken. Therefore, an insulating buffer layer 500 capable of dispersing or absorbing the mechanical force applied to the heat radiating parts 100 and 200 is inserted, and two or more stone guides 520 are provided to handle the dispersion and absorption of the mechanical force. Let's do it. In addition, cylindrical fixing pins are used to fix the heat dissipating parts 100 and 200 which are fastened up and down.

5 is a perspective view showing the stone guides provided in the heat radiation device according to a preferred embodiment of the present invention.

Referring to FIG. 5, two or more stone guides 520a and 520b according to the present embodiment are provided. That is, a plurality of stone guides 520a and 520b accommodating thermistors to supply heated air to a large space are provided. In addition, the left and right sides of the stone guides 520a and 520b have a concave-convex shape, and have a structure that can be easily fastened with adjacent stone guides 520a and 520b. The material of the stone guides 520a and 520b is preferably a polymer insulator.

In addition, the stone guide 520a has a structure in which the adjacent stone guide 520b is easily detachable, and even though stress is applied to the concave-convex connection part, the stone guide 520a may disperse the stress through the connection part. That is, in the case of forming one stone guide, the length of the stone guide is abnormally extended, and the phenomenon of breaking the thermistor stored in the stone guide cannot be avoided, but in the case of using a plurality of stone guides 520a and 520b, The breakage of the thermistor in the elongated heat dissipation device can be avoided.

Therefore, according to this embodiment, it is possible to supply easily heated air to a large area of space. In addition, a plurality of stone guides are provided in a long heat dissipation device to cover a large area, and an insulating buffer layer may be included therein to avoid the breakage of the thermistors stored in the stone guides.

According to the present invention as described above, the heat dissipation portion having a heat dissipation member that is a wing-shaped heat dissipation plate formed from the ingot through the cutting process is coupled up and down. A plurality of stone guides are disposed in the interior formed through the coupling, and the thermistors are accommodated in the stone guides. In addition, an insulating buffer layer having insulating properties and flexible flexibility is provided to prevent the thermistor from breaking. Therefore, the heated air can be easily supplied to a large area.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

Claims (9)

A first heat dissipation unit having a first heat dissipation member and a first body part integrally formed through a skiving process; A second heat dissipation part coupled to the first heat dissipation part and having a second heat dissipation member and a first body part integrally formed through a skiving process; An insulating buffer layer provided in an inner space formed by the fastening of the first heat dissipating unit and the second heat dissipating unit; A first plate electrode formed on the insulating buffer layer; A plurality of stone guides provided on the first plate electrode to receive thermistors; A second plate electrode provided on the stone guides and configured to supply power to the thermistors; A first holder provided to fasten the first heat dissipation unit and the second heat dissipation unit; And A second holder provided opposite to the first holder and provided to fasten the first heat dissipation unit and the second heat dissipation unit; The insulating buffer layer has a bending property, the heat dissipation device using a thermistor, characterized in that the polymer insulating tape which does not occur deformation below 300 ℃. The method of claim 1, wherein the polymer insulating tape is poly-acrylonitrile syndiotactic (

), poly-hexamethylene oxamide

), poly-hexamethylene terephthalamide (

), poly-hydrazo adipamide (

), poly-methylene adipamide (

), poly-methylene sebacamide (

), poly-pentamethylene terephthalamide (

), poly-phenylene (

), poly-terephthalic anhydride (

Or poly-vinylcyclohexane (

A heat dissipation device using a thermistor, characterized in that The heat dissipating device using a thermistor according to claim 1, wherein the stone guides have a concave-convex shape in the terminal portion to facilitate fastening with adjacent stone guides. 4. The thermistor according to claim 3, wherein the stone guide is fastened to an adjacent stone guide through the concave-convex shape provided at an end thereof, and is configured to absorb or disperse external stress applied to the heat dissipation device. Heat dissipation device. According to claim 1, wherein the guide grooves formed on both sides by the fastening of the first heat dissipation portion and the second heat dissipation portion is characterized in that the cylindrical fixing pins are inserted to fix the fastening of the first heat dissipation portion and the second heat dissipation portion. Heat dissipation device using thermistor to make. A heat dissipation device using a thermistor heated by an applied electric power and a first heat dissipation unit and a second heat dissipation unit for dissipating heat generated by the thermistor to the outside, A first holder coupled to the first heat dissipation unit and the second heat dissipation unit, and receiving a positive power supply voltage through a first electrode; A second holder disposed opposite the first holder and receiving a negative power supply voltage through a second electrode; An insulation buffer layer disposed in an inner space formed by the fastening of the first heat dissipation unit and the second heat dissipation unit, and provided on the first heat dissipation unit; A first plate electrode disposed in the inner space and electrically connected to the first electrode and formed on the insulating buffer layer to supply power to the thermistor; A plurality of stone guides provided on the first plate electrode and accommodating the thermistors; And A second plate electrode provided on a stone guide for accommodating the thermistors and electrically connected to the second electrode to supply power to the thermistors, The insulating buffer layer is a heat dissipating device using a thermistor, characterized in that the polymer insulating tape having a bending property, which does not occur even at 300 ℃ or more. The method of claim 6, wherein the polymer insulating tape is poly-acrylonitrile syndiotactic (

), poly-hexamethylene oxamide

), poly-hexamethylene terephthalamide (

), poly-hydrazo adipamide (

), poly-methylene adipamide (

), poly-methylene sebacamide (

), poly-pentamethylene terephthalamide (

), poly-phenylene (

), poly-terephthalic anhydride (

Or poly-vinylcyclohexane (

A heat dissipation device using a thermistor, characterized in that The heat dissipation using a thermistor of claim 6, wherein the stone guide is fastened to an adjacent stone guide through a concave-convex shape provided at an end thereof, and is configured to absorb or disperse external stress applied to the heat dissipation device. Device. The method according to claim 6, wherein the guide grooves formed on both sides by the fastening of the first heat dissipation portion and the second heat dissipation portion are cylindrical fixing pins are inserted to fix the fastening of the first heat dissipation portion and the second heat dissipation portion. Heat dissipation device using thermistor to make.

Images