WO2013027877A1 - Method for manufacturing a heat radiation module - Google Patents

Method for manufacturing a heat radiation module Download PDF

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Publication number
WO2013027877A1
WO2013027877A1 PCT/KR2011/006271 KR2011006271W WO2013027877A1 WO 2013027877 A1 WO2013027877 A1 WO 2013027877A1 KR 2011006271 W KR2011006271 W KR 2011006271W WO 2013027877 A1 WO2013027877 A1 WO 2013027877A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
manufacturing
plate member
protrusion
dissipation module
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PCT/KR2011/006271
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French (fr)
Korean (ko)
Inventor
김대준
Original Assignee
주식회사 파랑
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Priority to PCT/KR2011/006271 priority Critical patent/WO2013027877A1/en
Publication of WO2013027877A1 publication Critical patent/WO2013027877A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method of manufacturing a heat dissipation module, and more particularly, to a device for dissipating heat generated from an electronic component such as a VGA card or a GPU coupled to a graphics card.
  • High-end computers have a built-in graphics card.
  • the graphics card is composed of a board and various electronic components (CPU, memory) mounted on the surface of the board. Of these, especially when the CPU is running, a significant amount of heat is generated. If these heats are not dissipated in a timely manner, the CPU will slow down and eventually the performance of the graphics card will be degraded.
  • the graphics card's CPU, along with other electronic components, is exposed on the board's surface. Therefore, the heat dissipation module should be in contact with the CPU without contact with other electronic components.
  • the heat dissipation module is made of a metal, such as aluminum, in order to ensure good heat flow, the body portion and the heat dissipation fin of the heat dissipation module is preferably formed integrally connected without short-circuit.
  • the present invention is to provide a method of manufacturing a heat dissipation module that can immediately dissipate heat generated from the electronic components mounted on the graphics card using the skiving method.
  • the present invention is to provide a method of manufacturing a heat dissipation module in contact with the surface of only a specific component (for example, CPU, GPU, VGA ) without contacting other electronic components mounted on the board of the graphics card.
  • a specific component for example, CPU, GPU, VGA
  • the present invention is to provide a method for manufacturing a heat dissipation module formed with a through hole in order to facilitate the flow of air of the heat dissipation fin.
  • (C) there is provided a method of manufacturing a heat dissipation module comprising the step of skiving the plate member to form a heat dissipation fin.
  • a method of manufacturing a heat dissipation module further comprising forming a through hole by removing a portion of the plate member.
  • a method of manufacturing a heat dissipation module is provided, further comprising the step of coupling a fan module adjacent to the heat dissipation fins.
  • the present invention provides a method of manufacturing a heat dissipation module capable of immediately dissipating heat generated from an electronic component mounted on a graphics card using a skiving method.
  • the present invention provides a method of manufacturing a heat dissipation module that does not contact other electronic components mounted on a board of a graphics card but only contacts the surface of a specific component (for example, a CPU).
  • the present invention provides a method for manufacturing a heat dissipation module having a through hole in order to facilitate the flow of air of the heat dissipation fins.
  • the present invention provides a method for manufacturing a heat dissipation module in which a fan module for forcibly circulating air is combined.
  • FIG. 1 is a flow chart of a manufacturing method of a heat radiation module according to an embodiment of the present invention.
  • FIG 2 is an exemplary view of a skiving method according to an embodiment of the present invention.
  • 3 to 9 is a process chart of the manufacturing method of the heat dissipation module according to an embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of the heat dissipation module coupled to the electronic component.
  • (C) there is provided a method of manufacturing a heat dissipation module comprising the step of skiving the plate member to form a heat dissipation fin.
  • FIG. 1 is a flow chart of a manufacturing method of a heat dissipation module according to an embodiment of the present invention
  • Figure 2 is an exemplary view of a skiving method according to an embodiment of the present invention
  • Figures 3 to 9 are one embodiment of the present invention
  • Figure 10 is a cross-sectional view of the heat dissipation module coupled to the electronic component.
  • 4, 5, 7, 9 and 10 are side views of the body portion 11 of FIG. 3 viewed from the A direction. 6 and 8 are rear perspective views.
  • the method of manufacturing the heat dissipation module of the present embodiment uses a skiving method.
  • the skiving method continuously cuts the surface of the metal plate in an inclined form by using a blade of the skiving device, and continuously erects the cut heat dissipation fin so as not to fall off from the body.
  • Figure 2 shows the heat dissipation fin 120 is formed in the body portion 110 by the skiving method.
  • the body and the heat dissipation fins are integrally connected without being separated, so that the heat flows smoothly.
  • S11 is a step of manufacturing the body member 11 including the plate member 112 and the protrusion 111 formed in the lower portion of the plate member 112 by extrusion.
  • the plate member 112 and the protrusion 111 may be produced by aluminum extrusion process.
  • the protrusion 111 formed on the plate member 112 is formed below the plate member 112 in the extrusion direction. Since the plate member 112 and the protrusion 111 are integrally formed, when there is heat in the lower portion of the protrusion 111, the plate member 112 smoothly moves to the top of the plate member 112. (See Figure 3)
  • S12 is a step of removing a part of the protrusion 111. Since the protrusion part 111 was formed as extrusion, it is long formed in the extrusion direction in the lower part of the plate member 112. As shown in FIG. The lower part of the protrusion 111 is in contact with an electronic component that generates a lot of heat, such as the central processing unit 101 of the graphics card. Therefore, the remaining portion except for the portion in contact with the central processing unit 101 is an unnecessary portion. (See Figures 5 and 6)
  • S13 is a step of forming a heat radiation fin 113 by skiving the upper portion of the plate member (112).
  • a plurality of thin plate-like heat radiation fins 113 are formed.
  • the distance between the radiation fins 113 may be narrowed to about 1 mm. Therefore, the density of the heat radiation fins 113 per unit length can be increased. (See Figures 4, 5 and 6)
  • the heat dissipation fins 113 may be formed in a state where the jig is coupled to the lower portion of the plate member 112.
  • a strong pressure is transmitted to the upper portion of the plate member 112. If the jig is not supported on the lower part of the body portion 11, the plate member 112 loses balance and falls down.
  • the heat dissipation module manufacturing method of the present embodiment may proceed to step S13 after step S12, or may proceed to step S12 after step S13.
  • step S13 the heat dissipation module 10 as shown in Figure 6 is completed.
  • 6 is a rear perspective view of the heat dissipation module 10.
  • the protrusion 111 is coupled to the plate member 112 with a portion thereof removed. Since the remaining protrusion 111 has a size corresponding to the top of the CPU 101 of the graphics card, the protrusion 111 may be coupled to the top of the CPU 101. Since the protrusion 111 is coupled only to the central processing unit 101, even if the size of the plate member 112 is increased, the protrusion 111 does not collide with another electronic component 103. Therefore, the heat dissipation module 10 having high heat dissipation efficiency can be manufactured.
  • S14 is a step of forming a through-hole 114 by removing a portion of the plate member 112.
  • 8 is a rear perspective view, when a part of the plate member 112 is removed, the heat radiation fins 113 are exposed in the rear direction. In this way, when the heat radiation fins 113 are exposed, the air flows smoothly, so the heat radiation effect is excellent.
  • the remaining plate member 112 serves as a frame so that the heat radiation fins 113 do not fall.
  • the region for removing a portion of the plate member 112 may have various forms as long as the remaining plate member 112 can support the heat dissipation fins 113.
  • Side of the heat dissipation module 10 through the step S14 is the same as that of FIG. Referring to FIG. 7, it can be seen that the sidewall of the through hole 114 shown in FIG. 8 is exposed.
  • S15 is a step of coupling the fan module 21 on the top of the heat dissipation fins 113.
  • the fan module 21 may be coupled to the heat dissipation fin 113.
  • the fan module 21 has a fan built in, forcibly circulating air. When the air flows on the surface of the heat dissipation fin 113 faster, heat can be quickly discharged to the outside, and the heat dissipation effect is excellent.
  • S11 to S15 may substantially proceed sequentially during product manufacturing, or may proceed in a different order. If there is no problem in the completion of the product, it can be combined in various orders for the convenience of the process.
  • FIG. 10 shows a side view of the heat dissipation module 10 coupled to the central processing unit 101.
  • the present invention is a device for heat dissipation of electronic components.

Abstract

Disclosed is a method for manufacturing a heat radiation module. Provided is the method for manufacturing the heat radiation module, comprising the steps of: (a) manufacturing, by means of extrusion, a body including a plate member and a projecting portion formed on the lower portion of the plate member; (b) removing a part of the projecting portion; and (c) skiving the plate member to form heat radiation fins.

Description

방열모듈의 제조방법Manufacturing method of heat dissipation module
본 발명은 방열모듈의 제조방법에 관한 것으로서, 더욱 상세하게는 그래픽 카드에 결합된 VGA 카드 혹는 GPU 와 같은 전자 부품에서 발생된 열을 방열하기 위한 장치이다.The present invention relates to a method of manufacturing a heat dissipation module, and more particularly, to a device for dissipating heat generated from an electronic component such as a VGA card or a GPU coupled to a graphics card.
고사양의 컴퓨터에는 그래픽 카드가 내장되어 있다. 그래픽 카드는 보드와, 보드의 표면에 실장되는 각종 전자부품(CPU, 메모리)들로 구성된다. 이 중에서 특히, CPU가 작동하면 상당한 열이 발생한다. 이러한 열을 적시에 발산시켜주지 않으면, CPU의 작동이 느려지게 되고 종국에는 그래픽 카드의 성능이 떨어진다. High-end computers have a built-in graphics card. The graphics card is composed of a board and various electronic components (CPU, memory) mounted on the surface of the board. Of these, especially when the CPU is running, a significant amount of heat is generated. If these heats are not dissipated in a timely manner, the CPU will slow down and eventually the performance of the graphics card will be degraded.
그래픽 카드의 CPU는 다른 전자부품과 함께 보드의 표면에 노출되어 있다. 따라서, 방열모듈은 다른 전자부품과 접촉하지 않고 CPU와 접촉하여야한다. The graphics card's CPU, along with other electronic components, is exposed on the board's surface. Therefore, the heat dissipation module should be in contact with the CPU without contact with other electronic components.
아울러, 방열모듈은 알루미늄과 같은 금속으로 제조되는데, 열의 흐름이 좋도록 하기 위해서는 방열모듈의 몸체부와 방열핀이 단락되지 않고 일체적으로 연결되어 형성되는 것이 좋다. In addition, the heat dissipation module is made of a metal, such as aluminum, in order to ensure good heat flow, the body portion and the heat dissipation fin of the heat dissipation module is preferably formed integrally connected without short-circuit.
본 발명은 스카이빙 공법을 이용하여 그래픽 카드에 실장된 전자부품에서 발생된 열을 즉시 방열시킬 수 있는 방열모듈을 제조하는 방법을 제공하고자 한다.The present invention is to provide a method of manufacturing a heat dissipation module that can immediately dissipate heat generated from the electronic components mounted on the graphics card using the skiving method.
또한, 본 발명은 그래픽 카드의 보드 위에 실장된 다른 전자부품과는 접촉하지 않고 오직 특정부품(예를 들어, CPU 혹은 GPU, VGA )의 표면과 접촉하는 방열모듈을 제조방법을 제공하고자 한다.In addition, the present invention is to provide a method of manufacturing a heat dissipation module in contact with the surface of only a specific component ( for example, CPU, GPU, VGA ) without contacting other electronic components mounted on the board of the graphics card.
또한, 본 발명은 방열핀의 공기의 흐름이 원활하도록 하기 위하여, 관통홀이 형성된 방열모듈을 제조하는 방법을 제공하고자 한다.In addition, the present invention is to provide a method for manufacturing a heat dissipation module formed with a through hole in order to facilitate the flow of air of the heat dissipation fin.
또한, 강제적으로 공기를 순환시키기 위한 팬모듈이 결합된 방열모듈 제조방법을 제공하고자 한다.In addition, to provide a method for manufacturing a heat dissipation module combined with a fan module for forcibly circulating air.
본 발명의 일측면에 따르면,According to one aspect of the invention,
(a) 판부재와 상기 판부재의 하부에 형성된 돌출부를 포함하는 몸체부를 압출로 제조하는 단계; (a) manufacturing a body part including an plate member and a protrusion formed under the plate member by extrusion;
(b) 상기 돌출부의 일부를 제거하는 단계; 및 (b) removing a portion of the protrusion; And
(c) 상기 판부재를 스카이빙하여 방열핀을 형성하는 단계를 포함하는 방열모듈의 제조방법이 제공된다. (C) there is provided a method of manufacturing a heat dissipation module comprising the step of skiving the plate member to form a heat dissipation fin.
또한, 상기 (c) 단계 이후에, Further, after the step (c),
상기 판부재의 일부를 제거하여 관통홀을 형성하는 단계를 더 포함하는 방열모듈의 제조방법이 제공된다. There is provided a method of manufacturing a heat dissipation module, further comprising forming a through hole by removing a portion of the plate member.
또한, 상기 (d) 단계 이후에, Further, after the step (d),
상기 방열핀에 인접하여 팬모듈을 결합하는 단계를 더 포함하는 방열모듈의 제조방법이 제공된다.A method of manufacturing a heat dissipation module is provided, further comprising the step of coupling a fan module adjacent to the heat dissipation fins.
본 발명은 스카이빙 공법을 이용하여 그래픽 카드에 실장된 전자부품에서 발생된 열을 즉시 방열시킬 수 있는 방열모듈을 제조하는 방법을 제공한다.The present invention provides a method of manufacturing a heat dissipation module capable of immediately dissipating heat generated from an electronic component mounted on a graphics card using a skiving method.
또한, 본 발명은 그래픽 카드의 보드 위에 실장된 다른 전자부품과는 접촉하지 않고 오직 특정부품(예를 들어, CPU)의 표면과 접촉하는 방열모듈을 제조방법을 제공한다.In addition, the present invention provides a method of manufacturing a heat dissipation module that does not contact other electronic components mounted on a board of a graphics card but only contacts the surface of a specific component (for example, a CPU).
또한, 본 발명은 방열핀의 공기의 흐름이 원활하도록 하기 위하여, 관통홀이 형성된 방열모듈을 제조하는 방법을 제공한다.In addition, the present invention provides a method for manufacturing a heat dissipation module having a through hole in order to facilitate the flow of air of the heat dissipation fins.
또한, 강제적으로 공기를 순환시키기 위한 팬모듈이 결합된 방열모듈 제조방법을 제공한다.In addition, the present invention provides a method for manufacturing a heat dissipation module in which a fan module for forcibly circulating air is combined.
도 1은 본 발명의 일 실시예에 따른 방열모듈의 제조방법의 순서도.1 is a flow chart of a manufacturing method of a heat radiation module according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 스카이빙 공법의 예시도.2 is an exemplary view of a skiving method according to an embodiment of the present invention.
도 3 내지 도 9는 본 발명의 일 실시예에 따른 방열모듈의 제조방법의 공정도.3 to 9 is a process chart of the manufacturing method of the heat dissipation module according to an embodiment of the present invention.
도 10은 전자부품에 방열모듈이 결합된 단면도. 10 is a cross-sectional view of the heat dissipation module coupled to the electronic component.
본 발명의 일측면에 따르면,According to one aspect of the invention,
(a) 판부재와 상기 판부재의 하부에 형성된 돌출부를 포함하는 몸체부를 압출로 제조하는 단계; (a) manufacturing a body part including an plate member and a protrusion formed under the plate member by extrusion;
(b) 상기 돌출부의 일부를 제거하는 단계; 및 (b) removing a portion of the protrusion; And
(c) 상기 판부재를 스카이빙하여 방열핀을 형성하는 단계를 포함하는 방열모듈의 제조방법이 제공된다. (C) there is provided a method of manufacturing a heat dissipation module comprising the step of skiving the plate member to form a heat dissipation fin.
이하에는, 본 발명의 바람직한 실시예를 첨부도면을 참조로 상세하게 설명하되, 이는 본 발명에 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 상세하게 설명하기 위한 것이지, 이로써 본 발명의 사상 및 범주가 한정되는 것을 의미하지는 않는다.DETAILED DESCRIPTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, which are intended to explain in detail enough to enable those skilled in the art to easily carry out the present invention. This does not mean that the spirit and scope of the present invention is limited.
도 1은 본 발명의 일 실시예에 따른 방열모듈의 제조방법의 순서도이며, 도 2는 본 발명의 일 실시예에 따른 스카이빙 공법의 예시도이며, 도 3 내지 도 9는 본 발명의 일 실시예에 따른 방열모듈의 제조방법의 공정도이며, 도 10은 전자부품에 방열모듈이 결합된 단면도이다. 도4 , 도 5, 도 7, 도 9 및 도 10은 도 3의 몸체부(11)를 A 방향에서 바라본 측면도이다. 도 6 및 도 8은 후면 사시도이다. 1 is a flow chart of a manufacturing method of a heat dissipation module according to an embodiment of the present invention, Figure 2 is an exemplary view of a skiving method according to an embodiment of the present invention, Figures 3 to 9 are one embodiment of the present invention Process diagram of a method of manufacturing a heat dissipation module according to an example, Figure 10 is a cross-sectional view of the heat dissipation module coupled to the electronic component. 4, 5, 7, 9 and 10 are side views of the body portion 11 of FIG. 3 viewed from the A direction. 6 and 8 are rear perspective views.
본 실시예의 방열모듈의 제조방법은 스카이빙(skiving) 공법을 이용한다. 스카이빙 공법이란 스카이빙 장치의 칼날을 이용하여 금속판의 표면을 경사진 형태로 절개하고, 몸체부와 떨어지지 않도록 절개된 방열핀을 세우는 공정을 연속적으로 진행한다. 도 2는 스카이빙 공법으로 몸체부(110)에서 방열핀(120)이 형성되는 모습을 보여준다.The method of manufacturing the heat dissipation module of the present embodiment uses a skiving method. The skiving method continuously cuts the surface of the metal plate in an inclined form by using a blade of the skiving device, and continuously erects the cut heat dissipation fin so as not to fall off from the body. Figure 2 shows the heat dissipation fin 120 is formed in the body portion 110 by the skiving method.
스카이빙 공법을 이용할 경우, 몸체부와 방열핀이 분리되지 않고 일체적으로 연결되어 열의 흐름이 원활하게 된다. When using the skiving method, the body and the heat dissipation fins are integrally connected without being separated, so that the heat flows smoothly.
S11은 판부재(112)와 상기 판부재(112)의 하부에 형성된 돌출부(111)를 포함하는 몸체부(11)를 압출로 제조하는 단계이다. S11 is a step of manufacturing the body member 11 including the plate member 112 and the protrusion 111 formed in the lower portion of the plate member 112 by extrusion.
판부재(112)와 돌출부(111)는 알루미늄을 압출공정으로 제조할 수 있다. 판부재(112)에 형성된 돌출부(111)는 압출방향으로 판부재(112)의 하부에 형성된다. 판부재(112)와 돌출부(111)가 일체적으로 형성됨으로써, 돌출부(111)의 하부에 열이 있을 경우 판부재(112)의 상부로 원활하게 이동하게 된다. (도 3 참조)The plate member 112 and the protrusion 111 may be produced by aluminum extrusion process. The protrusion 111 formed on the plate member 112 is formed below the plate member 112 in the extrusion direction. Since the plate member 112 and the protrusion 111 are integrally formed, when there is heat in the lower portion of the protrusion 111, the plate member 112 smoothly moves to the top of the plate member 112. (See Figure 3)
S12는 상기 돌출부(111)의 일부를 제거하는 단계이다. 돌출부(111)는 압출로서 형성되었기 때문에, 판부재(112)의 하부에 압출 방향으로 길게 형성되어 있다. 돌출부(111)의 하부는 그래픽 카드의 중앙처리장치(101)와 같이 열이 많이 발생하는 전자부품과 접촉하는 부분이다. 따라서, 중앙처리장치(101)와 접촉되는 부분을 제외한 나머지 부분은 불필요한 부분이다. (도 5 및 도 6 참조) S12 is a step of removing a part of the protrusion 111. Since the protrusion part 111 was formed as extrusion, it is long formed in the extrusion direction in the lower part of the plate member 112. As shown in FIG. The lower part of the protrusion 111 is in contact with an electronic component that generates a lot of heat, such as the central processing unit 101 of the graphics card. Therefore, the remaining portion except for the portion in contact with the central processing unit 101 is an unnecessary portion. (See Figures 5 and 6)
그래픽 카드의 보드(102)에는 중앙처리장치(101) 이외에도 다른 전자부품(103)이 표면에 돌출되어 실장되어 있다. 따라서, 돌출부(111)의 일부를 제거하지 않을 경우, 돌출부(111)와 다른 전자부품(103)이 공간적으로 겹쳐져 부딪칠 수 있다. 본 단계에서, 돌출부(111)의 일부를 제거함으로써, 돌출부(111)와 다른 전자부품(103)과 공간적으로 겹쳐지는 것을 방지한다. (도 10 참조)In addition to the central processing unit 101, other electronic components 103 protrude from the surface of the board 102 of the graphics card and are mounted. Accordingly, when a part of the protrusion 111 is not removed, the protrusion 111 and the other electronic component 103 may overlap and collide spatially. In this step, by removing a part of the protrusion 111, it is prevented from spatially overlapping the protrusion 111 and the other electronic component 103. (See FIG. 10)
S13은 상기 판부재(112)의 상부를 스카이빙하여 방열핀(113)을 형성하는 단계이다. 판부재(112)의 상부를 스카이빙하면, 얇은 판상의 방열핀(113)이 다수 형성된다. 스카이빙 공정으로 방열핀(113)을 형성할 경우, 방열핀(113)간의 간격을 1mm 내외로 좁힐 수 있다. 따라서, 단위 길이당 방열핀(113)의 밀도를 증가시킬 수 있다. (도 4, 도 5 및 도 6 참조)S13 is a step of forming a heat radiation fin 113 by skiving the upper portion of the plate member (112). When skiving the upper portion of the plate member 112, a plurality of thin plate-like heat radiation fins 113 are formed. When the radiation fins 113 are formed by the skiving process, the distance between the radiation fins 113 may be narrowed to about 1 mm. Therefore, the density of the heat radiation fins 113 per unit length can be increased. (See Figures 4, 5 and 6)
한편, 판부재(112)의 하부에 지그를 결합한 상태로 방열핀(113)을 형성할 수 있다. 스카이빙 공법을 진행하면 판부재(112)의 상부에 강한 압력이 전해진다. 지그를 몸체부(11)의 하부에 받쳐주지 않으면, 판부재(112)가 균형을 잃고 쓰러진다.Meanwhile, the heat dissipation fins 113 may be formed in a state where the jig is coupled to the lower portion of the plate member 112. When the skiving method proceeds, a strong pressure is transmitted to the upper portion of the plate member 112. If the jig is not supported on the lower part of the body portion 11, the plate member 112 loses balance and falls down.
본 실시예의 방열모듈 제조방법은, S12 단계 이후에 S13단계를 진행할 수도 있고, S13 단계 이후에 S12단계를 진행할 수 있다.The heat dissipation module manufacturing method of the present embodiment may proceed to step S13 after step S12, or may proceed to step S12 after step S13.
이상의 S11에서 S13단계를 진행하면, 도 6과 같은 방열모듈(10)이 완성된다. 도 6은 방열모듈(10)의 후면 사시도이다. 도 6을 참조하면, 돌출부(111)는 일부분이 제거된 상태로, 판부재(112)에 결합되어 있다. 남아 있는 돌출부(111)는 도 10과 같이, 그래픽 카드의 중앙처리장치(101)의 상부와 대응되는 크기이기 때문에, 중앙처리장치(101)의 상부에 결합될 수 있다. 돌출부(111)가 중앙처리장치(101)에만 결합하기 때문에, 판부재(112)의 크기를 크게 하더라도, 다른 전자부품(103)과 부딪치지 않게 된다. 따라서, 방열효율이 높은 방열모듈(10)을 제조할 수 있다.Proceeding from step S13 to step S13, the heat dissipation module 10 as shown in Figure 6 is completed. 6 is a rear perspective view of the heat dissipation module 10. Referring to FIG. 6, the protrusion 111 is coupled to the plate member 112 with a portion thereof removed. Since the remaining protrusion 111 has a size corresponding to the top of the CPU 101 of the graphics card, the protrusion 111 may be coupled to the top of the CPU 101. Since the protrusion 111 is coupled only to the central processing unit 101, even if the size of the plate member 112 is increased, the protrusion 111 does not collide with another electronic component 103. Therefore, the heat dissipation module 10 having high heat dissipation efficiency can be manufactured.
S14는 상기 판부재(112)의 일부를 제거하여 관통홀(114)을 형성하는 단계이다. 도 8은 후면 사시도로서, 판부재(112)의 일부를 제거하면, 방열핀(113)이 후면 방향에서 노출된다. 이렇게, 방열핀(113)이 노출될 경우 공기의 흐름이 원활하여 방열효과가 뛰어나다. 한편, 남아 있는 판부재(112)는 프레임의 역할을 하여 방열핀(113)이 쓰러지지 않도록 한다. 판부재(112)의 일부를 제거하는 영역은 남아 있는 판부재(112)가 방열핀(113)을 지지할 수 있는 구조라면 다양한 형태가 가능하다. S14단계를 거친 방열모듈(10)의 측면은 도 7과 같은 형태이다. 도 7을 보면, 도 8에 도시된 관통홀(114)의 측벽이 노출된 것을 볼 수 있다.S14 is a step of forming a through-hole 114 by removing a portion of the plate member 112. 8 is a rear perspective view, when a part of the plate member 112 is removed, the heat radiation fins 113 are exposed in the rear direction. In this way, when the heat radiation fins 113 are exposed, the air flows smoothly, so the heat radiation effect is excellent. On the other hand, the remaining plate member 112 serves as a frame so that the heat radiation fins 113 do not fall. The region for removing a portion of the plate member 112 may have various forms as long as the remaining plate member 112 can support the heat dissipation fins 113. Side of the heat dissipation module 10 through the step S14 is the same as that of FIG. Referring to FIG. 7, it can be seen that the sidewall of the through hole 114 shown in FIG. 8 is exposed.
S15는 상기 방열핀(113)의 상부에 팬모듈(21)을 결합하는 단계이다. 방열핀(113)에 인접하여 팬모듈(21)을 결합할 수 있다. 팬모듈(21)에는 팬이 내장되어 있어, 강제적으로 공기를 순환시킨다. 방열핀(113)의 표면의 공기의 흐름을 빠르게 하면, 열을 외부로 빨리 배출할 수 있어, 방열효과가 뛰어난다.S15 is a step of coupling the fan module 21 on the top of the heat dissipation fins 113. The fan module 21 may be coupled to the heat dissipation fin 113. The fan module 21 has a fan built in, forcibly circulating air. When the air flows on the surface of the heat dissipation fin 113 faster, heat can be quickly discharged to the outside, and the heat dissipation effect is excellent.
이상의 S11 내지 S15는 실질적으로 제품제조시 순차적으로 진행될 수도 있고, 순서를 달리하여 진행될 수 있다. 제품의 완성에 문제가 없다면, 공정의 편의성을 위하여 다양한 순서로 조합될 수 있다. S11 to S15 may substantially proceed sequentially during product manufacturing, or may proceed in a different order. If there is no problem in the completion of the product, it can be combined in various orders for the convenience of the process.
도 10은 방열모듈(10)을 중앙처리장치(101)에 결합한 모습의 측면을 보여준다.10 shows a side view of the heat dissipation module 10 coupled to the central processing unit 101.
이상에서 본 발명의 실시예에 대해서 상세히 설명하였으나, 이는 하나의 실시예에 불과하며, 이로써 본 발명의 특허청구범위를 한정하는 것은 아니다. 본 실시예를 바탕으로 균등한 범위까지 당업자가 변형 및 추가하는 범위도 본 발명의 권리범위에 속한다 할 것이다.Although the embodiment of the present invention has been described in detail above, this is only one embodiment, and thus, does not limit the claims of the present invention. Based on the present embodiment, modifications and additions made by those skilled in the art to the equivalent range will also belong to the scope of the present invention.
본 발명은 전자부품의 방열을 위한 장치이다.The present invention is a device for heat dissipation of electronic components.

Claims (3)

  1. (a) 판부재와 상기 판부재의 하부에 형성된 돌출부를 포함하는 몸체부를 압출로 제조하는 단계; (a) manufacturing a body part including an plate member and a protrusion formed under the plate member by extrusion;
    (b) 상기 돌출부의 일부를 제거하는 단계; 및 (b) removing a portion of the protrusion; And
    (c) 상기 판부재를 스카이빙하여 방열핀을 형성하는 단계를 포함하는 방열모듈의 제조방법.(C) a method of manufacturing a heat dissipation module comprising the step of skiving the plate member to form a heat dissipation fin.
  2. 제1항에 있어서,The method of claim 1,
    상기 (c) 단계 이후에, After step (c),
    상기 판부재의 일부를 제거하여 관통홀을 형성하는 단계를 더 포함하는 방열모듈의 제조방법. And removing a portion of the plate member to form a through hole.
  3. 제2항에 있어서,The method of claim 2,
    상기 (d) 단계 이후에, After step (d),
    상기 방열핀에 인접하여 팬모듈을 결합하는 단계를 더 포함하는 방열모듈의 제조방법.And coupling a fan module adjacent to the heat dissipation fins.
PCT/KR2011/006271 2011-08-25 2011-08-25 Method for manufacturing a heat radiation module WO2013027877A1 (en)

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Application Number Priority Date Filing Date Title
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200278A (en) * 1997-01-13 1998-07-31 Yaskawa Electric Corp Cooler
JP2001257297A (en) * 2000-03-10 2001-09-21 Showa Denko Kk Heat sink
US20030063439A1 (en) * 2001-09-28 2003-04-03 Wen Wei Radial base heatsink
KR100885231B1 (en) * 2008-03-21 2009-02-24 (주)디앤씨파워텍 Heat sink assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200278A (en) * 1997-01-13 1998-07-31 Yaskawa Electric Corp Cooler
JP2001257297A (en) * 2000-03-10 2001-09-21 Showa Denko Kk Heat sink
US20030063439A1 (en) * 2001-09-28 2003-04-03 Wen Wei Radial base heatsink
KR100885231B1 (en) * 2008-03-21 2009-02-24 (주)디앤씨파워텍 Heat sink assembly

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