TWI452394B - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- TWI452394B TWI452394B TW100144308A TW100144308A TWI452394B TW I452394 B TWI452394 B TW I452394B TW 100144308 A TW100144308 A TW 100144308A TW 100144308 A TW100144308 A TW 100144308A TW I452394 B TWI452394 B TW I452394B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive sheet
- thermal conductive
- sheet
- light
- heat
- Prior art date
Links
Landscapes
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
本發明關於一種背光模組。The invention relates to a backlight module.
背光模組若累積過多的熱，會使發光元件的溫度局部上升，造成發光效率下降、色度偏移及壽命衰減現象。請參考圖4，目前習知背光模組100的散熱途徑，主要透過燈條102將其產生的熱傳導至金屬散熱片106，透過金屬散熱片106吸收部份熱再將部份熱傳導至背板108而與外界冷空氣進行熱交換。然而，為增加燈條102的混光距離，需降低抵靠在燈條102背面102a(背向導光板104的一面)的金屬散熱片106的厚度d，如此容易使熱阻過大而產生熱堆積，導致燈條102的溫度過高。另外，為了背光模組100的薄形化需求，背光模組100的整體厚度需降低，例如降低燈條102下方的金屬散熱片106的高度h，如此容易使熱阻過大，熱量傳導不易而產生熱堆積，導致燈條102的溫度過高，即使將金屬散熱片106與背板108的接觸面積變大仍有熱量傳導不易而產生熱堆積的問題，因為燈條102傳導過來的熱會卡在金屬散熱片106的高度h過窄的位置處。If the backlight module accumulates too much heat, the temperature of the light-emitting element locally rises, resulting in a decrease in luminous efficiency, chromaticity shift, and lifetime decay. Referring to FIG. 4 , the heat dissipation path of the conventional backlight module 100 is mainly transmitted to the metal heat sink 106 through the light strip 102 , and the partial heat is absorbed through the metal heat sink 106 to conduct part of the heat to the back plate 108 . And exchange heat with the outside cold air. However, in order to increase the light mixing distance of the light bar 102, it is necessary to reduce the thickness d of the metal heat sink 106 that abuts against the back surface 102a of the light bar 102 (the side of the back light guide plate 104), so that the heat resistance is excessively large and heat accumulation occurs. This causes the temperature of the light bar 102 to be too high. In addition, for the thinning requirement of the backlight module 100, the overall thickness of the backlight module 100 needs to be reduced, for example, the height h of the metal heat sink 106 under the light bar 102 is lowered, so that the thermal resistance is too large, and heat conduction is not easy. The heat accumulation causes the temperature of the light bar 102 to be too high. Even if the contact area between the metal heat sink 106 and the back plate 108 is increased, heat conduction is difficult and heat accumulation is caused because the heat transmitted by the light bar 102 is stuck. The height h of the metal fins 106 is too narrow.
台灣專利公告號TWM314347揭露一種金屬背板，金屬背板具有底部、側部及彎折部，彎折部抵靠於一燈管套的表面以利熱能排出。台灣專利公開號TW200811522揭露一種光源組件，其中發光二極體固定於一基板上，且一鋁板或一銅板抵靠於基板下方。一鋁質罩體具有容置凹槽及凸肋，藉以供發光元件插入固定且可提供散熱效果。台灣專利公開號TW200835967揭露一種光源組件，其中發光二極體光源置於一L型導熱結構上以增加散熱路徑並提高散熱效率。台灣專利公告號TW492621揭露一種散熱結構，散熱結構包括銅製或銀製高導熱板體及鋁合金散熱片，利用鍛造法將高導熱板體及散熱片鉚合成一體。台灣專利公告號TWI339294揭露一種光源固定座，其中光源產生的熱量藉由光源固定座導出。Taiwan Patent Publication No. TWM314347 discloses a metal backing plate having a bottom portion, a side portion and a bent portion, the bent portion abutting against the surface of a tube sleeve for heat energy discharge. Taiwan Patent Publication No. TW200811522 discloses a light source assembly in which a light emitting diode is fixed on a substrate, and an aluminum plate or a copper plate abuts against the substrate. An aluminum cover has a receiving groove and a rib for inserting and fixing the light-emitting element and providing a heat dissipation effect. Taiwan Patent Publication No. TW200835967 discloses a light source assembly in which a light emitting diode light source is placed on an L-type heat conducting structure to increase a heat dissipation path and improve heat dissipation efficiency. Taiwan Patent Publication No. TW492621 discloses a heat dissipating structure comprising a high-heat-conducting plate made of copper or silver and an aluminum alloy fin, and the high-heat-conducting plate body and the fin are riveted into one by a forging method. Taiwan Patent Publication No. TWI339294 discloses a light source holder in which heat generated by a light source is led out by a light source holder.
本發明提供一種至少具有高散熱效率、高材料選擇彈性及低製造成本其中之一的背光模組。The present invention provides a backlight module having at least one of high heat dissipation efficiency, high material selection flexibility, and low manufacturing cost.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為達上述之一或部份或全部目的或是其他目的，本發明的一實施例提供一種背光模組，包括導光板、燈條、第一導熱片、第二導熱片以及背板。導光板具有入光面，燈條設置於鄰近入光面位置處，且燈條具有面向入光面的第一側面及相對於第一側面的第二側面。第一導熱片具有基部及與基部夾一角度的彎折部，第一導熱片的彎折部抵靠燈條的第二側面。第二導熱片疊置於第一導熱片上且抵靠燈條的第一側面。其中第一導熱片的基部抵靠背板。Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. An embodiment of the present invention provides a backlight module including a light guide plate, a light bar, a first heat conductive sheet, a second heat conductive sheet, and a back sheet. The light guide plate has a light incident surface, the light bar is disposed adjacent to the light incident surface, and the light bar has a first side facing the light incident surface and a second side opposite to the first side surface. The first thermal conductive sheet has a base portion and a bent portion at an angle to the base portion, and the bent portion of the first thermal conductive sheet abuts against the second side surface of the light strip. The second thermally conductive sheet is stacked on the first thermally conductive sheet and abuts against the first side of the light strip. Wherein the base of the first thermal pad abuts the back plate.
於一實施例中，第二導熱片具有基部及與基部夾一角度的彎折部，第二導熱片的基部抵靠第一導熱片，且第二導熱片的彎折部抵靠燈條的第一側面。In one embodiment, the second thermal conductive sheet has a base portion and a bent portion at an angle to the base portion, the base portion of the second thermal conductive sheet abuts against the first thermal conductive sheet, and the bent portion of the second thermal conductive sheet abuts against the light strip The first side.
於一實施例中，第一導熱片及第二導熱片可分別為一金屬導熱片。In one embodiment, the first thermal conductive sheet and the second thermal conductive sheet may each be a metal thermal conductive sheet.
於一實施例中，第一導熱片及第二導熱片可利用沖壓方式成型。In an embodiment, the first thermal conductive sheet and the second thermal conductive sheet can be formed by stamping.
於一實施例中，第一導熱片與第二導熱片的材質不同。In an embodiment, the first thermal conductive sheet and the second thermal conductive sheet are made of different materials.
於一實施例中，第一導熱片及第二導熱片的至少其中之一係由不同材質的複數區段組合構成，於一實施例中，這些區段包括至少一鋁材區段及至少一銅材區段。In one embodiment, at least one of the first thermally conductive sheet and the second thermally conductive sheet is composed of a plurality of sections of different materials. In one embodiment, the sections include at least one aluminum section and at least one Copper section.
於一實施例中，背光模組更包括至少一鎖固件以將第一導熱片及第二導熱片鎖固於背板上，且於一實施例中，鎖固件可包含一螺絲。In one embodiment, the backlight module further includes at least one locking component to lock the first thermal conductive sheet and the second thermal conductive sheet to the backing plate, and in an embodiment, the locking component may include a screw.
綜上所述，本發明的實施例的背光模組至少具有下列其中一個優點：藉由上述實施例的設計，因燈條的兩個側面分別接觸第一導熱片及第二導熱片，故熱可從燈條的第一側面及第二側面雙向排出，增加散熱途徑並提高散熱效果及熱均性且還能達到背光模組薄形化與窄邊框的要求。再者，利用堆疊導熱片或組合導熱片區段的製造方式，使散熱均勻，降低金屬受熱不均導致熱應力而產生形變，可針對實際散熱需求、成本考量或其他因素使導熱結構的不同區塊具有不同的材質，且各個導熱片可經模具沖壓分別成形製造再進行組合，故可提供較佳的材質選擇彈性且成本較低。另外，進行板金沖壓處理的導熱片具有較佳的結構強度，故導熱片不僅可提高散熱效果也可增強背光模組整體的結構強度。In summary, the backlight module of the embodiment of the present invention has at least one of the following advantages: by the design of the above embodiment, since the two sides of the light bar respectively contact the first heat conductive sheet and the second heat conductive sheet, the heat is It can be discharged bidirectionally from the first side and the second side of the light bar, thereby increasing the heat dissipation path, improving the heat dissipation effect and heat uniformity, and achieving the requirements of thinning and narrow frame of the backlight module. Furthermore, by using the stacked thermal conductive sheet or the combined manufacturing method of the thermal conductive sheet section, the heat dissipation is uniform, the thermal stress of the metal is reduced, and the thermal stress is deformed, and different blocks of the thermal conductive structure can be made according to actual heat dissipation requirements, cost considerations or other factors. Different materials are available, and each of the heat conductive sheets can be separately formed by die stamping and then combined, so that better material selection flexibility and low cost can be provided. In addition, the thermal conductive sheet subjected to the sheet metal stamping treatment has better structural strength, so that the thermal conductive sheet can not only improve the heat dissipation effect but also enhance the structural strength of the entire backlight module.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉實施例並配合所附圖式，作詳細說明如下。Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above and other objects, features, and advantages of the invention will be apparent from
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明並非用來限制本發明。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.
請參考圖1，本發明一實施例的背光模組10包括一導光板12、一燈條14、一第一導熱片16、一第二導熱片18以及一背板22。導光板12具有一入光面12a，燈條14設置於鄰近入光面12a位置處，且燈條14具有面向入光面12a的一第一側面14a及相對於第一側面14a的一第二側面14b。換句話說，第二側面14b背向入光面12a。第一導熱片16具有一基部16a及與基部16a夾一角度的一彎折部16b，第一導熱片16的基部16a抵靠於背板22，且第一導熱片16的彎折部16b抵靠燈條14的第二側面14b。第二導熱片18疊置於第一導熱片16上且抵靠燈條14的第一側面14a。第二導熱片18具有一基部18a及與基部18a夾一角度的一彎折部18b，第二導熱片18的基部18a抵靠第一導熱片16，且第二導熱片18的彎折部18b抵靠燈條14的第一側面14a。燈條14例如可為一發光二極體燈條(LED light bar)且具有至少一發光二極體141。Referring to FIG. 1 , a backlight module 10 according to an embodiment of the invention includes a light guide plate 12 , a light bar 14 , a first heat conductive sheet 16 , a second heat conductive sheet 18 , and a back sheet 22 . The light guide plate 12 has a light incident surface 12a. The light bar 14 is disposed adjacent to the light incident surface 12a, and the light bar 14 has a first side surface 14a facing the light incident surface 12a and a second surface opposite to the first side surface 14a. Side 14b. In other words, the second side 14b faces away from the light incident surface 12a. The first heat conducting sheet 16 has a base portion 16a and a bent portion 16b at an angle with the base portion 16a. The base portion 16a of the first heat conducting sheet 16 abuts against the backing plate 22, and the bent portion 16b of the first heat conducting sheet 16 abuts. It depends on the second side 14b of the light bar 14. The second thermally conductive sheet 18 is superposed on the first thermally conductive sheet 16 and abuts against the first side 14a of the light bar 14. The second heat conducting sheet 18 has a base portion 18a and a bent portion 18b at an angle with the base portion 18a. The base portion 18a of the second heat conducting sheet 18 abuts against the first heat conducting sheet 16, and the bent portion 18b of the second heat conducting sheet 18 Abuts the first side 14a of the light bar 14. The light bar 14 can be, for example, an LED light bar and has at least one light-emitting diode 141.
圖1所示的箭頭方向指出燈條14的主要散熱途徑，燈條14產生的熱可透過彼此堆疊的第一導熱片16及第二導熱片18有效並迅速傳導至背板22而與外界冷空氣進行熱交換。因燈條14的第一側面14a及第二側面14b分別接觸第二導熱片18及第一導熱片16，故熱可從燈條14的第一側面14a及第二側面14b雙向排出，增加散熱途徑並提高散熱效果。再者，因第一導熱片16及第二導熱片18係利用堆疊方式構成一複合散熱結構，故第一導熱片16及第二導熱片18的材質可分別選擇，且第一導熱片16及第二導熱片18的至少其中之一亦可由不同材質的複數區段組合構成。如圖2所示，舉例而言，第二導熱片18可由第一區段181、第二區段182及第三區段183組合構成，因第二導熱片18的中間部分通常溫度較高，故中間的第二區段182例如可用熱傳導係數相對較高的銅材，兩側的第一區段181及第三區段183例如可用材質較輕且成本較低的鋁材，使散熱均勻，降低導熱片受熱不均導致熱應力而產生形變。亦即，上述實施例利用堆疊導熱片或組合導熱片區段的方式，可針對實際散熱需求、成本考量或其他因素使一導熱結構的不同區塊具有不同的材質。The direction of the arrow shown in FIG. 1 indicates the main heat dissipation path of the light bar 14. The heat generated by the light bar 14 can be effectively transmitted to the back plate 22 through the first heat conducting sheet 16 and the second heat conducting sheet 18 stacked on each other to be cold. The air is heat exchanged. Since the first side surface 14a and the second side surface 14b of the light bar 14 respectively contact the second heat conducting sheet 18 and the first heat conducting sheet 16, heat can be bidirectionally discharged from the first side surface 14a and the second side surface 14b of the light strip 14 to increase heat dissipation. Ways and improve heat dissipation. Furthermore, since the first heat conducting sheet 16 and the second heat conducting sheet 18 form a composite heat dissipating structure by stacking, the materials of the first heat conducting sheet 16 and the second heat conducting sheet 18 can be respectively selected, and the first heat conducting sheet 16 and At least one of the second thermally conductive sheets 18 may also be composed of a combination of a plurality of sections of different materials. As shown in FIG. 2, for example, the second heat conducting sheet 18 may be composed of a combination of the first section 181, the second section 182, and the third section 183, because the middle portion of the second heat conducting sheet 18 is generally at a higher temperature. Therefore, in the middle second section 182, for example, a copper material having a relatively high heat transfer coefficient can be used, and the first section 181 and the third section 183 on both sides can be made of, for example, a lighter material and a lower cost aluminum material, so that heat dissipation is uniform. Reducing the unevenness of the heat transfer sheet causes thermal stress to cause deformation. That is, the above embodiment utilizes the method of stacking the thermal conductive sheets or combining the thermal conductive sheet segments, and different blocks of a heat conducting structure may have different materials for actual heat dissipation requirements, cost considerations, or other factors.
比較圖3A及圖3B可知，如圖3A所示，習知設計欲形成背板108與燈條102間的導熱結構(金屬散熱片106)時，因導熱結構於不同區域需具有不同厚度，故通常利用鋁擠一體成型的方式製造，然而鋁擠成形的製造方式材料選擇單一而不具彈性且成本較高。反之如圖3B所示，依上述實施例之設計，利用至少堆疊第一導熱片16及第二導熱片18形成導熱結構的方式，第一導熱片16及第二導熱片18可經模具沖壓分別成型再進行組合，故可提供較佳的材質選擇彈性且成本較低。3A and 3B, as shown in FIG. 3A, when a heat-conducting structure (metal heat sink 106) between the back plate 108 and the light bar 102 is conventionally designed, the heat-conducting structure needs to have different thicknesses in different regions. It is usually manufactured by means of aluminum extrusion molding, however, the aluminum extrusion molding material is selected to be single, not elastic, and high in cost. On the other hand, as shown in FIG. 3B, according to the design of the above embodiment, the first heat conducting sheet 16 and the second heat conducting sheet 18 are formed by stamping the first heat conducting sheet 16 and the second heat conducting sheet 18, respectively. Forming and then combining, it can provide better material selection flexibility and lower cost.
依本發明實施例的設計，第二導熱片18一端抵靠燈條，而第二導熱片18的形態完全不限定，例如第二導熱片18的一端可彎折形成一彎折部18b(圖1所示)，亦可不形成彎折部(圖3B所示)。再者，於一實施例中，可利用例如螺絲的鎖固件32將第一導熱片16及第二導熱片18鎖固於背板22上(圖1所示)。According to the design of the embodiment of the present invention, one end of the second thermal conductive sheet 18 abuts against the light bar, and the shape of the second thermal conductive sheet 18 is not limited. For example, one end of the second thermal conductive sheet 18 can be bent to form a bent portion 18b (Fig. 1)), or a bent portion (shown in FIG. 3B) may not be formed. Moreover, in an embodiment, the first thermal conductive sheet 16 and the second thermal conductive sheet 18 can be locked to the backing plate 22 by using a fastener 32 such as a screw (shown in FIG. 1).
綜上所述，本發明的實施例的背光模組至少具有下列其中一個優點：因燈條14的第一側面14a及第二側面14b分別接觸第二導熱片18及第一導熱片16，故熱可從燈條14的第一側面14a及第二側面14b雙向排出，增加散熱途徑並提高散熱效果及熱均性。再者，利用堆疊第一導熱片16及第二導熱片18，或者第一導熱片16及第二導熱片18的至少其中之一由不同材質的複數區段組合構成，使散熱均勻，降低金屬受熱不均導致熱應力而產生形變，可針對實際散熱需求、成本考量或其他因素使一導熱結構的不同區塊具有不同的材質，且各個導熱片可經模具沖壓分別成形製造再進行組合，故可提供較佳的材質選擇彈性且成本較低。另外，進行板金沖壓處理的第一導熱片16及第二導熱片18具有較佳的結構強度，故第一導熱片16及第二導熱片18不僅可提高散熱效果也可增強背光模組整體的結構強度。In summary, the backlight module of the embodiment of the present invention has at least one of the following advantages: since the first side 14a and the second side 14b of the light bar 14 respectively contact the second heat conducting sheet 18 and the first heat conducting sheet 16, The heat can be discharged bidirectionally from the first side 14a and the second side 14b of the light bar 14, increasing the heat dissipation path and improving the heat dissipation effect and heat uniformity. Furthermore, by stacking the first thermal conductive sheet 16 and the second thermal conductive sheet 18, or at least one of the first thermal conductive sheet 16 and the second thermal conductive sheet 18 is composed of a plurality of different sections of different materials to uniformly dissipate heat and reduce metal. The heat is unevenly caused to cause deformation by thermal stress, and different blocks of a heat-conducting structure may have different materials for actual heat dissipation requirements, cost considerations, or other factors, and each of the heat-conducting sheets may be separately formed by die stamping and then combined. It provides better material selection flexibility and lower cost. In addition, the first thermal conductive sheet 16 and the second thermal conductive sheet 18 which are subjected to the sheet metal stamping treatment have better structural strength, so that the first thermal conductive sheet 16 and the second thermal conductive sheet 18 can not only improve the heat dissipation effect but also enhance the overall backlight module. Structural strength.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外，摘要部分和標題僅是用來輔助專利文件搜尋之用，並非用來限制本發明之權利範圍。此外，本說明書或申請專利範圍中提及的“第一”、“第二”等用語僅用以命名元件的名稱或區別不同實施例或範圍，而並非用來限制元件數量上的上限或下限。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. In addition, the terms "first", "second" and the like mentioned in the specification or the claims are only used to name the components or distinguish different embodiments or ranges, and are not intended to limit the upper or lower limit of the number of components. .
10．．．背光模組10. . . Backlight module
12．．．導光板12. . . Light guide
12a．．．入光面12a. . . Glossy surface
14．．．燈條14. . . Light
141．．．發光二極體141. . . Light-emitting diode
14a．．．第一側面14a. . . First side
14b．．．第二側面14b. . . Second side
16．．．第一導熱片16. . . First thermal sheet
16a．．．第一導熱片的基部16a. . . Base of the first thermal pad
16b．．．第一導熱片的彎折部16b. . . Bending portion of the first thermal conductive sheet
18．．．第二導熱片18. . . Second thermal sheet
18a．．．第二導熱片的基部18a. . . Base of the second thermal pad
18b．．．第二導熱片的彎折部18b. . . Bending portion of the second thermal sheet
181、182、183．．．第二導熱片的區段181, 182, 183. . . Section of the second thermal pad
22．．．背板twenty two. . . Backplane
32．．．鎖固件32. . . Lock firmware
100．．．背光模組100. . . Backlight module
102．．．燈條102. . . Light
102a．．．燈條的背面102a. . . The back of the light bar
104．．．導光板104. . . Light guide
106．．．金屬散熱片106. . . Metal heat sink
108．．．背板108. . . Backplane
d．．．厚度d. . . thickness
h．．．高度h. . . height
圖1為本發明一實施例的背光模組的示意圖。FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the invention.
圖2為本發明一實施例的導熱片的示意圖。2 is a schematic view of a thermally conductive sheet according to an embodiment of the present invention.
圖3A為一習知背光模組的示意圖。FIG. 3A is a schematic diagram of a conventional backlight module.
圖3B為本發明一實施例的背光模組的示意圖。FIG. 3B is a schematic diagram of a backlight module according to an embodiment of the invention.
圖4為一習知背光模組的示意圖。4 is a schematic diagram of a conventional backlight module.
10．．．背光模組10. . . Backlight module
12．．．導光板12. . . Light guide
12a．．．入光面12a. . . Glossy surface
14．．．燈條14. . . Light
141．．．發光二極體141. . . Light-emitting diode
14a．．．第一側面14a. . . First side
14b．．．第二側面14b. . . Second side
16．．．第一導熱片16. . . First thermal sheet
16a．．．第一導熱片的基部16a. . . Base of the first thermal pad
16b．．．第一導熱片的彎折部16b. . . Bending portion of the first thermal conductive sheet
18．．．第二導熱片18. . . Second thermal sheet
18a．．．第二導熱片的基部18a. . . Base of the second thermal pad
18b．．．第二導熱片的彎折部18b. . . Bending portion of the second thermal sheet
22．．．背板twenty two. . . Backplane
32．．．鎖固件32. . . Lock firmware
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100144308A TWI452394B (en) | 2011-12-02 | 2011-12-02 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100144308A TWI452394B (en) | 2011-12-02 | 2011-12-02 | Backlight module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201323989A TW201323989A (en) | 2013-06-16 |
| TWI452394B true TWI452394B (en) | 2014-09-11 |
Family
ID=49032923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100144308A TWI452394B (en) | 2011-12-02 | 2011-12-02 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI452394B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI497012B (en) * | 2013-06-24 | 2015-08-21 | Young Lighting Technology Inc | Light source module |
| KR102605921B1 (en) * | 2016-09-27 | 2023-11-27 | 삼성디스플레이 주식회사 | Backlight unit and display apparatus including the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010113845A (en) * | 2008-11-04 | 2010-05-20 | Toshiba Home Technology Corp | Cooling unit |
| TWM413881U (en) * | 2011-04-29 | 2011-10-11 | Kocam Int Co Ltd | LED backlight module with extrusion shell body |
| CN202056686U (en) * | 2011-05-11 | 2011-11-30 | 京东方科技集团股份有限公司 | Backlight module and liquid crystal module |
| EP2390712A1 (en) * | 2010-05-25 | 2011-11-30 | LG Innotek Co., Ltd. | Backlight unit and display device including the same |
-
2011
- 2011-12-02 TW TW100144308A patent/TWI452394B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010113845A (en) * | 2008-11-04 | 2010-05-20 | Toshiba Home Technology Corp | Cooling unit |
| EP2390712A1 (en) * | 2010-05-25 | 2011-11-30 | LG Innotek Co., Ltd. | Backlight unit and display device including the same |
| TWM413881U (en) * | 2011-04-29 | 2011-10-11 | Kocam Int Co Ltd | LED backlight module with extrusion shell body |
| CN202056686U (en) * | 2011-05-11 | 2011-11-30 | 京东方科技集团股份有限公司 | Backlight module and liquid crystal module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201323989A (en) | 2013-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8573811B2 (en) | Backlight module with heat dissipating element and heat sink | |
| CN107923607B (en) | Heat sink, lighting device and method for manufacturing a heat sink | |
| US8960267B2 (en) | Heat sink module | |
| US6978829B1 (en) | Radiator assembly | |
| US20140020882A1 (en) | Heat sink for led lighting | |
| US7837358B2 (en) | Light-emitting diode module with heat dissipating structure | |
| TWI431365B (en) | Backlight module having light-emitting diode | |
| US8469580B2 (en) | Edge-lighting type backlight module | |
| JP2011154929A (en) | Heat exhausting device | |
| TWI452394B (en) | Backlight module | |
| US7733653B1 (en) | Heat radiating member mounting structure | |
| KR101997557B1 (en) | Heat-transfer apparatus and fabrication method thereof | |
| TWI497012B (en) | Light source module | |
| JP2011040558A (en) | Heat sink | |
| KR20150052500A (en) | Heat sink for led module | |
| TWI429391B (en) | Backlight module and heat-dissipation assembly | |
| TWI422923B (en) | Complex back plate for backlight module | |
| JP2012234909A (en) | Heat sink, manufacturing method of the heat sink, and lighting appliance | |
| TWI407205B (en) | Light source assembly | |
| JP5905640B2 (en) | Backlight unit | |
| KR200467169Y1 (en) | Heat pipe-attached heat sink with bottom radiation fins | |
| CN220870814U (en) | Radiator and lighting device comprising same | |
| JP2014077837A (en) | Liquid crystal display device | |
| CN212969867U (en) | ELED television and display screen and cooling fin thereof | |
| TWI668555B (en) | Memory heat dissipation unit and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |