CN202056686U - Backlight module and liquid crystal module - Google Patents
Backlight module and liquid crystal module Download PDFInfo
- Publication number
- CN202056686U CN202056686U CN2011201486343U CN201120148634U CN202056686U CN 202056686 U CN202056686 U CN 202056686U CN 2011201486343 U CN2011201486343 U CN 2011201486343U CN 201120148634 U CN201120148634 U CN 201120148634U CN 202056686 U CN202056686 U CN 202056686U
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- module backlight
- layer
- backboard
- heat
- module
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Abstract
The utility model discloses a backlight module, which comprises a lamp strip, an adhesive metal layer and a heat dissipation back plate, wherein the lamp strip is connected to the heat dissipation back plate through the adhesive metal layer. The utility model further discloses a liquid crystal module, which comprises a liquid crystal panel and the backlight module, wherein the liquid crystal panel is arranged onto the backlight module. Since the lamp strip is connected with the heat dissipation back plate by the aid of the adhesive metal layer with higher thermal conductivity coefficient, heat can be transferred onto the heat dissipation back plate from the lamp strip effectively, and heat dissipation performance of the backlight module is improved.
Description
Technical field
The utility model relates to technical field of liquid crystal display, relates in particular to a kind of module backlight and liquid crystal module.
Background technology
The module backlight of current use is that the mode that adopts lamp bar aluminium base to attach the heat radiation backboard is outward dispelled the heat, as shown in Figure 1, the heat radiation backboard of lamp bar and downside is connected by heat-conducting glue, wherein, the lamp bar comprises: light source, cover copper circuit layer, printed circuit board (PCB) (PCB, Printed Circuit Board) layer, heat conduction glue-line and aluminium base flaggy, light source is positioned at and covers the copper circuit layer upper surface, and be connected with the PCB layer by covering copper circuit layer, aluminium base flaggy is connected with the PCB layer by the heat conduction glue-line; The heat radiation backboard is generally aluminium backboard or radiating block.
At present in the module radiator structure this backlight that uses, adopt surface mounting technology (SMT, SurfaceMounted Technology) utilize the heat conduction glue-line that aluminium base flaggy is connected with the PCB layer, when the aluminium backboard of aluminium base flaggy and attaching or radiating block are connected, because (wherein the thermal conductivity factor of common siliceous heat-conducting glue (Thermal Conductivity) is generally in 5 watts/Mi Du to be subjected to a heat-conducting glue and SMT subsides pair technogenic influence, having air layer when using the SMT subsides to pay technology produces), heat can not be delivered on aluminium backboard or the radiating block from the lamp bar effectively, can reduce the radiating effect of module backlight.
The utility model content
The utility model embodiment provides a kind of module backlight and liquid crystal module, in order to solve the problem of module heat dispersion difference backlight in the prior art.
The module backlight that the utility model embodiment provides comprises: lamp bar, metal adhesion coating and heat radiation backboard; Wherein, the lamp bar connects the heat radiation backboard by the metal adhesion coating.
The liquid crystal module that the utility model embodiment provides comprises: liquid crystal panel and above-mentioned module backlight, wherein, liquid crystal panel is positioned on the module backlight.
The beneficial effect of the utility model embodiment comprises:
Module backlight and liquid crystal module that the utility model embodiment provides, because the lamp bar is to be connected with the heat radiation backboard by the higher metal adhesion coating of thermal conductivity factor, heat can be delivered on the heat radiation backboard from the lamp bar effectively, has promoted the thermal diffusivity of module backlight.
Description of drawings
Fig. 1 is the cross section structure schematic diagram of module backlight in the prior art;
Fig. 2 is the cross section structure schematic diagram of module backlight among the utility model embodiment;
Fig. 3 a is that the heat radiation backboard of module backlight among the utility model embodiment is the cross section structure schematic diagram of a whole iron backboard;
Fig. 3 b is that the heat radiation backboard of module backlight among the utility model embodiment is the cross section structure schematic diagram that polylith iron backboard splices and combines;
Fig. 4 is the cross section structure schematic diagram of lamp bar among the utility model embodiment;
Fig. 5 comprises the cross section structure schematic diagram of the lamp bar of at least one through hole for PCB layer among the utility model embodiment;
Fig. 6 is the cross section structure schematic diagram of liquid crystal module among the utility model embodiment.
The specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the module backlight that the utility model embodiment is provided is described in detail.
The utility model embodiment provides a kind of module backlight, as shown in Figure 2, specifically comprises: lamp bar 201, metal adhesion coating 202 and heat radiation backboard 203; Wherein, lamp bar 201 is connected with heat radiation backboard 203 by metal adhesion coating 202.
Use metal adhesion coating 202 that lamp bar 201 and heat radiation backboard 203 are coupled together among the utility model embodiment, and the attachment of lamp bar and heat radiation backboard is the heat conduction glue-line in the prior art, preferably, metal adhesion coating 202 is a soldering-tin layer among the utility model embodiment.Because the thermal conductivity factor of tin is 66 watts/Mi Du, be 10 to 20 times of common siliceous heat-conducting glue (general thermal conductivity factor in 5 watts/Mi Du), adopt scolding tin to connect lamp bar 201 and can effectively heat be delivered on the heat radiation backboard 203 from lamp bar 201, strengthened radiating effect with heat radiation backboard 203.
The heat radiation backboard 203 that uses among the utility model embodiment is specially a monoblock iron backboard 2031 (shown in Fig. 3 a) or is spliced and combined by polylith iron backboard 2031 and forms (shown in Fig. 3 b).In small size module backlight, can adopt a monoblock iron backboard 2031 as heat radiation template 203, the thermal conductivity factor of iron is that the thermal conductivity factor of 80 watts/Mi Du and metal adhesion coating 202 used tin is suitable, dispels the heat so heat can be delivered to iron backboard 2031 effectively from lamp bar 201.And when module backlight adopts polylith iron backboard 2031 to splice and combine as heat radiation backboard 203, can carry out processing operations such as anodic oxidation flexibly at certain piece iron backboard 2031, reach effect, thereby satisfy the user demand of the big product of caloric value (large scale liquid crystal module and high-capacity LED are used) at this piece iron backboard 2031 lifting heat loss through radiation efficient.
In addition, use lower iron backboard 2031 of price or polylith iron backboard 2031 to splice and combine and replace higher aluminium backboard or the radiating block of cost in the existing module backlight, also reduced the heat radiation cost of product.
The utility model embodiment also further improves the structure of the lamp bar in the existing module backlight, the aluminium base flaggy in the lamp bar of existing module backlight and the heat conduction glue-line of connection PCB layer and aluminium base have been removed, as shown in Figure 4, the lamp bar 201 of the module backlight among the utility model embodiment specifically comprises: light source 2011, cover copper circuit layer 2012, printed circuit board (PCB) (PCB) layer 2013 and cover copper heat-conducting layer 2014; Wherein:
Preferably, the light source 2011 among the utility model embodiment is light emitting diode (LED, LightEmitting Diode).
Removed the heat conduction glue-line of connection PCB layer and aluminium base flaggy in the lamp bar 201 of the utility model embodiment, and removed aluminium base flaggy, having reduced needs to use SMT to paste the number of plies of paying technology, make that pasting the probability that occurs air layer in pair technical process at SMT reduces, and with thermal conductivity factor higher cover copper heat-conducting layer 2014 (thermal conductivity factor of copper be 401 watts/Mi Du) replaced the lower heat conduction glue-line of thermal conductivity factor, further strengthened heat-conductive characteristic, module integral heat sink performance backlight is further strengthened.
In addition, the utility model embodiment utilizes the higher aluminium base of heat radiation backboard 203 (iron backboard 2031) displacement cost can also play conservation as supporter, reduces the cost techniques effect of module backlight.Certainly, as not considering cost factor, the heat radiation backboard 203 of the utility model embodiment also can adopt copper base or other metal substrates.
More preferably, in the PCB layer 2013 of the utility model embodiment lamp bar 201, can also comprise at least one through hole 2015, the inwall of through hole 2015 covers copper (being commonly referred to as copper), as shown in Figure 5, the two ends of this through hole 2015 and PCB layer the covering copper circuit layer 2012 and covers copper heat-conducting layer 2014 and be connected of both sides about in the of 2013.The described through hole that covers copper 2015 with cover 2014 conductings of copper heat-conducting layer, the heat of PCB layer 2013 in the lamp bar 201 can be transmitted to fully on the heat radiation backboard 203, strengthened radiating efficiency.When the heat radiation backboard 203 of large scale module backlight formed for polylith iron backboard 2031 splices and combines, the position of a through hole 2015 was corresponding one by one with the position of an iron backboard 2031.
In traditional back light module unit structure, the heat-conducting glue layer thickness is about 0.2mm, and aluminium base thickness is about 1mm, and the aluminium back plate thickness is about 0.7mm-1mm, and radiating block thickness is about 1.2mm.In the module backlight that employing the utility model embodiment provides, the thickness that covers the thickness of copper heat-conducting layer 2014 and metal adhesion coating 202 (soldering-tin layer) greater than 0mm less than 0.05mm, thickness almost can be ignored, the thickness of iron backboard 2031 is decided according to the product structure that module backlight is applied in, and thickness is generally between 0.5mm-0.8mm.According to calculating as can be known:
The module backlight of the utility model embodiment is compared as the module backlight of heat radiation backboard with traditional use aluminium backboard, can save about space: 0.2mm (realizing under the situation of same intensity that 2031 meetings of iron backboard are than more than the thin 0.2mm of aluminium backboard)+0.2mm (the heat-conducting glue layer thickness of connection PCB layer and aluminium base flaggy)+0.2mm (the heat-conducting glue layer thickness that is connected aluminium base flaggy and heat radiation backboard)+1mm (aluminium base layer thickness)=1.6mm;
The module backlight of the utility model embodiment is compared as the module backlight of heat radiation backboard with traditional use radiating block, can save about space: 1.2mm (radiating block thickness)+0.2mm (the heat-conducting glue layer thickness of connection PCB layer and aluminium base flaggy)+0.2mm (the heat-conducting glue layer thickness that is connected aluminium base flaggy and heat radiation backboard)+1mm (aluminium base layer thickness)=2.6mm.
Obviously, adopt the structure of the utility model embodiment module backlight, compare with the structure of existing module backlight, can dwindle entire aphototropism mould greatly and take up space, the super narrow frame that helps using the product of the described module backlight of the utility model embodiment designs.
The utility model embodiment also provides a kind of liquid crystal module, and as shown in Figure 6, this liquid crystal module comprises liquid crystal panel 601 and aforesaid module backlight 602.Wherein, liquid crystal panel 601 is positioned on the module 602 backlight, and preferably, liquid crystal panel 601 is to fix or other modes are positioned on the module 602 backlight by the glue frame.
In the module backlight and liquid crystal module that the utility model embodiment provides, the lamp bar is connected with the heat radiation backboard by the higher metal adhesion coating of thermal conductivity factor, and heat can be delivered on the heat radiation backboard from the lamp bar effectively, has promoted the thermal diffusivity of module backlight.
And, the thicker heat conduction glue-line of copper heat-conducting layer replacement is covered in the aluminium base flaggy and the use of having removed in the module lamp bar backlight among the utility model embodiment in traditional module backlight, dwindle entire aphototropism mould greatly and taken up space, helped using the super narrow frame design of the product of the utility model embodiment module backlight.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (10)
1. a module backlight is characterized in that, comprising: lamp bar (201), metal adhesion coating (202) and heat radiation backboard (203); Wherein, described lamp bar (201) connects described heat radiation backboard (203) by metal adhesion coating (202).
2. module backlight as claimed in claim 1 is characterized in that, described lamp bar (201) comprising: light source (2011), cover copper circuit layer (2012), printing board PCB layer (2013) and cover copper heat-conducting layer (2014); Wherein:
Described PCB layer (2013) upper and lower surface is adhered to described copper circuit layer (2012) and the described copper heat-conducting layer (2014) that covers of covering respectively;
Described light source (2011) is positioned at and covers copper circuit layer (2012) upper surface.
3. module backlight as claimed in claim 2 is characterized in that, described light source (2011) is a LED.
4. module backlight as claimed in claim 2, it is characterized in that, comprise at least one through hole (2015) in the described PCB layer (2013), described through hole (2015) inwall covers copper, and the two ends of described through hole (2015) are connected with the described copper heat-conducting layer (2014) that covers with the described copper circuit layer (2012) that covers.
5. module backlight as claimed in claim 2 is characterized in that, the described thickness of copper heat-conducting layer (2014) that covers is less than 0.05mm.
6. as each described module backlight of claim 1-5, it is characterized in that described metal adhesion coating (202) is a soldering-tin layer.
7. module backlight as claimed in claim 6 is characterized in that the thickness of described soldering-tin layer is less than 0.05mm.
8. as each described module backlight of claim 1-5, it is characterized in that described heat radiation backboard (203) is the iron backboard (2031) of an integral body, or splice and combine by polylith iron backboard (2031) and to form.
9. module backlight as claimed in claim 8 is characterized in that, the thickness span of described iron backboard (2031) is between the 0.5mm to 0.8mm.
10. a liquid crystal module is characterized in that, comprises liquid crystal panel (601) and as each described module backlight (602) of claim 1-9, described liquid crystal panel (601) is positioned on the described module backlight (602).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201486343U CN202056686U (en) | 2011-05-11 | 2011-05-11 | Backlight module and liquid crystal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201486343U CN202056686U (en) | 2011-05-11 | 2011-05-11 | Backlight module and liquid crystal module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202056686U true CN202056686U (en) | 2011-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201486343U Expired - Lifetime CN202056686U (en) | 2011-05-11 | 2011-05-11 | Backlight module and liquid crystal module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202056686U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103162183A (en) * | 2013-02-21 | 2013-06-19 | 合肥京东方光电科技有限公司 | Luminescent device, backlight module and display device |
| TWI452394B (en) * | 2011-12-02 | 2014-09-11 | Young Lighting Technology Corp | Backlight module |
| CN106647035A (en) * | 2017-01-25 | 2017-05-10 | 北海星沅电子科技有限公司 | Vehicle-mounted current-multiplying liquid crystal module |
| WO2024000548A1 (en) * | 2022-06-30 | 2024-01-04 | 京东方科技集团股份有限公司 | Light-emitting module and preparation method therefor, and display apparatus |
-
2011
- 2011-05-11 CN CN2011201486343U patent/CN202056686U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI452394B (en) * | 2011-12-02 | 2014-09-11 | Young Lighting Technology Corp | Backlight module |
| CN103162183A (en) * | 2013-02-21 | 2013-06-19 | 合肥京东方光电科技有限公司 | Luminescent device, backlight module and display device |
| CN106647035A (en) * | 2017-01-25 | 2017-05-10 | 北海星沅电子科技有限公司 | Vehicle-mounted current-multiplying liquid crystal module |
| WO2024000548A1 (en) * | 2022-06-30 | 2024-01-04 | 京东方科技集团股份有限公司 | Light-emitting module and preparation method therefor, and display apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111130 |
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| CX01 | Expiry of patent term |