201005383 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種背光模組框架組合，特別是有關 於一種用以設置至少一發光二極體燈條的背光模組框架組 合。 ' 【先前技術】 爲了提高空間利用率，液晶顯示器目前正朝著薄型化 Ο 發展。同時，隨著地球天然能源漸漸枯竭，油價逐漸的攀 升，因此液晶顯示器亦朝著強調節能的方向作設計。在液 晶顯示器中，背光模組為主要的耗能元件之一，為了達到 節能的效果，目前有越來越多的背光模組之光源改採發光 二極體（Light Emitting Diode ; LED)來取代傳統的冷陰極燈 管（Cold Cathode Fluorescent Lamp ; CCFL)。發光二極體除 了能夠達到節能的效果之外，同時亦可兼顧薄型化之需求。 請參照第1圖，其係繪示一般採用發光二極體作為發 • 光源之背光模組的剖面示意圖。背光模組100中之多個發 光二極體102先焊接至印刷電路板（Printed Circuit Board ; PCB)104上形成燈條106(Light Bar)，再將燈條106接合在 燈條固定座（Light Bar Holder) 108上，然後將燈條固定座 108接合在光源保護罩（Light Source Cover)110上，在完成 燈條固定座108與光源保護罩110之接合後，將光源保護 罩110與光學元件112組裝於殼體116上，接著覆蓋框架 ' 114即完成背光模組100之組裝。 • 在一般發光二極體背光模組的設計中，燈條106係先 201005383 - 以雙面膠黏合於燈條固定座108上，接著再將燈條固定座 108以雙面膠黏合在光源保護罩110上。在第1圖所示之結 構中，當燈條固定座108欲結合至光源保護罩110上時， 須先將雙面膠貼付於燈條固定座1〇8上，接著將燈條固定 座108以垂直圖面方向置放至光源保護罩11〇中，然後再 由作業者以治具將燈條固定座1〇8按壓而牢固地黏付在光 源保護罩110中。而為了兼顧發光二極體1〇2之散熱需求， 通常燈條固定座108及光源保護罩110均以金屬材質加以 參製造。此設計的缺點是組裝程序繁複，且浪費燈條固定座 108之材料。 【發明内容】 因此，本發明之目的係在提供一種背光模組框架組201005383 IX. Description of the Invention: The present invention relates to a backlight module frame assembly, and more particularly to a backlight module frame assembly for arranging at least one light-emitting diode light bar. [Prior Art] In order to improve space utilization, liquid crystal displays are currently developing towards thinner. At the same time, as the earth's natural energy is gradually depleted and oil prices are gradually rising, liquid crystal displays are also designed to emphasize energy conservation. In the liquid crystal display, the backlight module is one of the main energy-consuming components. In order to achieve energy-saving effects, more and more backlight modules have been replaced by Light Emitting Diodes (LEDs). Conventional Cold Cathode Fluorescent Lamp (CCFL). In addition to the energy-saving effect, the light-emitting diode can also meet the needs of thinning. Please refer to FIG. 1 , which is a cross-sectional view showing a backlight module generally using a light-emitting diode as a light source. The plurality of LEDs 102 in the backlight module 100 are soldered to a printed circuit board (PCB) 104 to form a light bar 106, and the light bar 106 is bonded to the light bar holder (Light). On the Bar Holder 108, the light strip mount 108 is then joined to the Light Source Cover 110. After the light strip mount 108 is engaged with the light source shield 110, the light source shield 110 and the optical component are attached. 112 is assembled on the housing 116, and then the frame '114 is covered to complete the assembly of the backlight module 100. • In the design of the general LED backlight module, the light strip 106 is first 201005383 - double-sided adhesive is adhered to the light strip fixing seat 108, and then the light strip fixing seat 108 is adhered to the light source with double-sided adhesive On the cover 110. In the structure shown in FIG. 1, when the light bar fixing base 108 is to be coupled to the light source protection cover 110, the double-sided adhesive tape must be applied to the light bar fixing base 1 8 first, and then the light bar fixing seat 108 is attached. The light source protection cover 11 is placed in the vertical plane direction, and then the operator presses the light bar holder 1 8 with the jig and firmly adheres to the light source protection cover 110. In order to meet the heat dissipation requirements of the light-emitting diodes 1 and 2, the light bar fixing base 108 and the light source protective cover 110 are usually made of metal. A disadvantage of this design is that the assembly procedure is cumbersome and the material of the light strip mount 108 is wasted. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a backlight module frame set
δ利用框架之結構设計變更，使得框架除可提供固定光 學元件之功能外，更可提供燈條固定座之功能，藉此可減 少發光二極體之背光模組的組裝時間，同時可取消一般以 金屬材質製造之燈條固定座，減少材料成本的支出。 根據本發明之-實_ ’提供―種背光模組框架組 合。此背光模組框架組合主要係用來設置至少—發光二極 體燈條，而此背光模組框架組合至少包括框架及至少一光 源保護罩。其中框架定義有容置空間且具有至少一侧壁， 且侧壁具有面對容置空間的内側面，内側面之主要功能係 用以接合發光二極體燈條。而光源保護罩則與框架之頂面 及側壁的底面互相接觸而接合在框架上。 背光模組。此背光 根據本發明另.一實施例，提供_種 6 201005383 权組至少包括.背光模組框架組合、至少一發光二極體燈 條、及至少一光學元件。背光模組框架組合至少包括框架 及至少一光源保護罩。其中框架定義有容置空間且具有至 少一侧壁，而側壁具有面對容置空間的内側面。光源保護 罩係與框架的頂面及側壁的底面互相接觸而接合在框架 上。發光二極體燈條係接合在側壁的内侧面。而光學元件 則設置在框架的容置空間中。 本發明之優點為，利用簡單的結構設計變更，可使得 發光二極體背光模組中燈條的設置更容易簡便，在減縮背 光模組組裝之時間成本的同時，更可提高於背光模組中設 置燈條的準確性，可提高生產的良率。 【實施方式】 请參照第2圖，其係繪示根據本發明之一實施例之背 光模組的剖面示意圖。背光模組2〇〇至少包括：背光模組 框架組合204、至少一發光二極體燈條2〇6、及至少一光學 元件208。其中背光模組框架組合2〇4至少包括框架21〇 及至少一光源保護罩212。框架210中定義有容置空間214 且具有至少一側壁216。侧壁216則具有内侧面218，其中 内側面218係面對前述框架21〇申的容置空間214。光源保 護罩212係與框架21〇的頂面及側壁216的底面互相接觸 而接合在框架210上。在本實施例中，光源保護罩212係 以緊配合方式夾設在框架21〇上，但在其他之實施例中， 因為一般之框架210係採用塑膠材料製造而成，且光源保 護罩212係由金屬材質所組成，故除了採用緊配合方式外， 7 201005383 亦可在光源保護罩212及在框架210上設置卡固結構，使 得光源保護罩212及在框架210之間能夠更緊密的夾設卡 合0 至於發光二極體燈條206由印刷電路板205及多個發 光二極體207所組成，且接合在侧壁216的内側面218上。 而光學元件208則設置在框架210的容置空間214之中。 此設計係將發光二極體燈條206由框架210之底面朝框架 210之頂面推放至定位，再由作業者利用治具具，甚至直接 以雙手按壓發光二極體燈條206而使得發光二極體燈條 206黏附至框架210的内侧面218上，而在此實施例中，係 預先於發光二極體燈條206中之印刷電路板205的底面黏 附一雙面膠，利用雙面膠將發光二極體燈條2〇6黏合在框 架210上，但是並不以此雙面膠接合方式為限。此設計的 優點在於，作業者可清楚地看到發光二極體燈條2〇6欲黏 合之位置，而不會有傳統設計之定位偏差的情況，故可提 高發光二極體燈條206接合於側壁216之内侧面218的良 率。再者，此設計另一優點在於，將發光二極體燈條2〇6 推至定位過程中，僅需移動等同於發光二極體燈條2〇6之 :刷電路板205高度的距離d，如第2圖所示，故有程序簡 單及工時簡短的優點。同時，利用框架21〇延伸之侧壁216 取代傳統設計之燈條固定座，更可減少材料成本之支出。 μ同樣參照第2圖，在本實施例中，背光模組2〇〇之 忙架210之側f 216上更設有與内侧面218相對之外側面 22〇外側面22〇係與光源保護$扣互相接觸，以增進接 口在框木21G之内側面218上發光二極體燈條撕的散熱 8 201005383 效率。 請參照第3A圖’其係♦示根據本創作之另—實施例之 發光二極體燈條、散熱膠帶、框架、及光源保護罩之剖 面示意圖。在本實施例中，背光模組綱更設有至少了 散熱膠冑222,且侧壁216丨同樣設有與内側面218相對 之外侧面220其中散熱谬帶222係依序接合在側壁加 之内侧面218、側壁216之底面、以及外側S 2 2 0。同時， 在此實施例中，散熱膠帶222係介於内側面218與發光 二極體燈條206之間，亦即將散熱膠帶222黏附於内側 面218上，且第2圖中所不之接合在内側面218上的發 光二極體燈條206’則改為接合在散熱膠帶222上。且在 本實施例中，散熱謬帶222更與光源保護罩212互相接 觸’利用散熱膠帶222之較佳的熱傳導特性，改善背光 模組200之整體的散熱效率。此設計係可解決當框架21〇 及其側壁2!6採用塑膠材料製造，進而導致發光二極體 燈條206所產生之廢熱散熱不良的問題。 請參照第3B圖，其係繪示根據本創作之又—實施例之 發光二極體燈條、框架、及光源保護罩的立體透視示音、 圖。在本實施例中，同樣為了解決採用轉材料製造^ 架2H)及其侧壁216所衍生之發光二極體燈條鳩散敎 不良的問題’可在侧壁216之底面設置多個凹槽似，且 側壁216如第2圖所示之結構同樣設有相對於内側面a” 之外側面220，其中凹槽224係由侧壁216之内側面218 延伸至外側面220,藉此增加背光模組2〇〇之散熱效果。 在再-實施例中，可將第3B圖中所示之凹槽以之結構 201005383 . 修改成如第3c圖所示之結構，於側壁216中設有多個貫 穿孔226 ’其中貫穿孔226係連通側壁216之内侧面218 及外側面220。 請參照第4圖，其係繪示根據第2圖之背光模組之框 架的俯視示意圖。在本實施例中，框架210具有依序鄰 接的四個側邊（側邊228、側邊23〇、侧邊232、及侧邊 234)，藉此形成矩形之框架結構。同時，框架2丨〇更具 有一鏤空結構。在其他實施例中，框架21〇可具有一底 β 板結構（未緣示），用以承接如光學元件208之部品，並提 供適當之強度以作為保護。在另一實施例中，第4圖所 示之框架210為一體成形之結構’通常此框架21 〇係由 塑膠類之可熱塑成形之材料所組成。 在一實施例中，背光模組200中設置有二側壁216、二 發光二極體燈條206、及二光源保護罩212，其中侧壁 216、發光二極體燈條206、及光源保護罩212係以三個 一組之方式，亦即以一個側壁216搭配一個光源保護罩 Φ 212，並同時搭配一個發光二極體燈條206的方式，分別 設置在鄰近於相對之侧邊228及侧邊232(如第4圖所示） 之處，而其中側壁216、發光二極體燈條206、及光源保 護罩212之接合方式及相對位置則如第2圖之結構所 示。在另一實施例中’側壁216、發光二極體燈條206、 及光源保護罩212同樣以三個一組之方式而分別設置在 鄰近於相鄰之二侧邊之處’例如：側邊228及側邊230、 • 侧邊230及側邊232、側邊232及側邊234、或侧邊234 及側邊228。 10 201005383 在又一實施例中，背光模組200中設置有三側壁216、 二發光二極體燈條206、及三光源保護罩212，其中侧壁 216、發光二極體燈條206 '及光源保護罩212如同前述 係以二個一組之方式分別設置在鄰近於依序鄰接之三侧 邊之處’例如：侧邊228、側邊23〇、及侧邊232 ;侧邊 230、側邊232、及側邊234 ;側邊232、側邊234、及側 邊228 ;或側邊234、側邊228、及側邊23〇。 在再一實施例中’背光模組200中設置有四側壁216、 四發光二極體燈條206、及四光源保護罩212，其中侧壁 216、發光二極體燈條2〇6、及光源保護罩212同樣以三 個一組之方式分別設置在鄰近於四侧邊（側邊228、侧邊 230、側邊232、及側邊234)之處。 請參照第5圖’其係繪示根據本發明之一實施例之框 架的剖面示意圖。框架210具有頂壁236，頂壁236與側 壁216互相鄰接，同時，頂壁236的底面更設有如反射 片之反射層238。其中反射層238主要作用在於減少框架 210吸收由發光二極體燈條2〇6上之發光二極體2〇7所產 生之光源。 請再參照第2圖，在此實施例中，背光模組2〇〇更包 括有殼體202。殼體202之主要功能係用來容置背光模組 200中之背光模組框架組合2〇4，並提供保護之功能。故 殼體202 —般係由金屬材質（例如鋁合金）製造而成，利用 金屬具有較佳強度的機械材料特性來達到保護的目的。 在習知技術中，針對如筆記型電腦等小型手持式裝置所 设計之背光模組’通常會以如第2圖所示之背光模組框 201005383 . 架組合204來提供固定光學元件208等部品的功能，或 甚至僅以框架210來提供固定光學元件2〇8等部品的功 能；而殼體202通常係在大型裝置之背光模組的設計中 較為常見，例如電視機或者大尺寸的液晶顯示器。在本 實施例中，设體202具有底板之結構，但在其他實施例 中，亦可如前述第4圖所示之框架114,具有一鏤空之結 構’藉此可減少背光模組整體的重量。 在第2圖之實施例中，光學元件2〇8係一導光板。在 ® 其他實施例中，背光模組200所包括之至少一光學元件 208可為如增亮膜之光學膜片（未繪示）或反射片（未繪 示）。 上述已大略描述多個實施例的特徵，以使得熟悉此技 藝者能夠更了解與其對應的詳細敘述。熟悉此技藝者將可 體會到，利用本揭露作為基礎可設計或修改其他程序及結 構’以達到本說明書所介紹之實施例的相同目的及/或優 點。熟悉此技藝者亦可了解到在不脫離本揭露之精神及範 ® 圍之等價的架構，以及在不脫離本揭露之精神及範圍内， 當可作各種的更動、替代和潤飾。 【圖式簡單說明】 為了能夠對本發明之觀點有較佳之理解，請參照上述 之詳細說明並配合相應之圖式。要強調的是，根據工業之 牙示準常規’附圖中之各種特徵並未依比例續示。事實上， 為清楚說明上述實施例，可任意地放大或縮小各種特徵之 ' 尺寸。相關圖式内容說明如下》 12 201005383 第1圖係繪示一般採用發光二極體作為發光源之背光 模組的剖面示意圖。 第2圖係繪示根據本發明之一實施例之背光模組的剖 面示意圖。 第3A圖係繪示根據本創作之另一實施例之發光二極 體燈條、散熱膠帶、框架、及光源保護罩之剖面示意圖。 第3B圖係繪示根據本創作之又一實施例之發光二極 體燈條、框架、及光源保護罩的立體透視示意圖。 第3C圖係繪示根據本創作之再一實施例之發光二極 體燈條、框架、及光源保護罩之立體透視示意圖。 第4圖係繒示根據第2圖之背光模組之框架的俯視示 意圖。 第5圖係繪示根據本發明之一實施例之框架的剖面示 意圖。 【主. 要元件符號說明 100 : 背光 模組 104 : 印刷 電路板 108 ： 燈條 固定座 112 : 光學 元件 116 : 殼體 202 ： 殼體 205 ： 印刷 電路板 207 : 發光 二極體 210 ： 框架 102 發光二極體 106 燈條 110 光源保護罩 114 框架 200 背光模組 204 背光模組框架組合 206 發光二極體燈條 208 光學元件 212 光源保護罩 13 201005383 214 ： 容置空 間 216 :側壁 218 ： 内侧面 220 :外侧面 222 ： 散熱膠 帶 224 :凹槽 226 ： 貫穿孔 228 :側邊 230 ： 侧邊 232 :側邊 234 ： 侧邊 236 :頂壁 238 ： 反射層 d * 距離δ utilizes the structural design change of the frame, so that the frame can provide the function of the fixed optical component, and can also provide the function of the light bar fixing seat, thereby reducing the assembly time of the backlight module of the light emitting diode and canceling Generally, the light bar fixing seat made of metal material reduces the cost of material cost. According to the present invention, a combination of a backlight module frame is provided. The backlight module frame assembly is mainly used to set at least a light-emitting diode light bar, and the backlight module frame combination includes at least a frame and at least one light source protection cover. Wherein the frame defines an accommodating space and has at least one side wall, and the side wall has an inner side facing the accommodating space, and the main function of the inner side is to engage the light emitting diode light bar. The light source protection cover is in contact with the top surface of the frame and the bottom surface of the side wall to engage the frame. Backlight module. The backlight is provided according to another embodiment of the present invention. The power pack includes at least a backlight module frame assembly, at least one light emitting diode strip, and at least one optical component. The backlight module frame assembly includes at least a frame and at least one light source cover. The frame defines an accommodating space and has at least one side wall, and the side wall has an inner side facing the accommodating space. The light source protection cover is joined to the frame by the top surface of the frame and the bottom surface of the side wall. The light-emitting diode light strip is bonded to the inner side of the side wall. The optical component is placed in the housing space of the frame. The invention has the advantages that the simple design change of the structure can make the setting of the light bar in the backlight module of the light-emitting diode easier and simple, and can reduce the time cost of assembling the backlight module, and can be improved in the backlight module. Setting the accuracy of the light bar can increase the yield of production. [Embodiment] Please refer to FIG. 2, which is a cross-sectional view showing a backlight module according to an embodiment of the present invention. The backlight module 2A includes at least a backlight module frame assembly 204, at least one LED strip 2〇6, and at least one optical component 208. The backlight module frame assembly 2〇4 includes at least a frame 21〇 and at least one light source protection cover 212. The housing 210 defines an accommodation space 214 and has at least one side wall 216. The side wall 216 has an inner side 218, wherein the inner side 218 faces the accommodating space 214 of the frame 21 described above. The light source shield 212 is joined to the frame 210 in contact with the top surface of the frame 21 and the bottom surface of the side wall 216. In this embodiment, the light source protection cover 212 is clamped on the frame 21〇 in a tight fit manner, but in other embodiments, since the general frame 210 is made of a plastic material, and the light source protection cover 212 is The utility model is composed of a metal material, so that in addition to the tight fitting manner, 7 201005383 can also provide a fixing structure on the light source protection cover 212 and the frame 210, so that the light source protection cover 212 and the frame 210 can be more closely interposed. The snap-in light is formed by the printed circuit board 205 and the plurality of light-emitting diodes 207 and is bonded to the inner side surface 218 of the side wall 216. The optical component 208 is disposed in the accommodating space 214 of the frame 210. In this design, the LED strip 206 is pushed from the bottom surface of the frame 210 toward the top surface of the frame 210 to be positioned, and then the operator uses the fixture to even press the LED strip 206 directly with both hands. The light-emitting diode strip 206 is adhered to the inner side surface 218 of the frame 210. In this embodiment, a double-sided tape is adhered to the bottom surface of the printed circuit board 205 in the light-emitting diode strip 206. The double-sided tape bonds the LED strips 2〇6 to the frame 210, but is not limited by the double-sided bonding method. The advantage of this design is that the operator can clearly see the position where the light-emitting diode light bar 2〇6 is to be bonded, without the positioning deviation of the conventional design, so that the light-emitting diode light bar 206 can be improved. Yield on the inner side 218 of the sidewall 216. Furthermore, another advantage of this design is that the light-emitting diode light bar 2〇6 is pushed into the positioning process, and only needs to be moved equivalent to the light-emitting diode light bar 2〇6: the height distance d of the brush circuit board 205 As shown in Figure 2, there are advantages of simple program and short working hours. At the same time, the cost of the material cost can be reduced by replacing the traditionally designed light strip holder with the side wall 216 of the frame 21〇. μ also refers to FIG. 2 , in this embodiment, the side f 216 of the busy frame 210 of the backlight module 2 is further provided with an outer side surface 22 opposite to the inner side surface 218, and the outer side surface 22 is coupled with the light source protection. The buckles are in contact with each other to enhance the efficiency of the interface of the light-emitting diode strips on the inner side 218 of the frame wood 21G. Referring to Figure 3A, there is shown a schematic cross-sectional view of a light-emitting diode light strip, a heat dissipating tape, a frame, and a light source protective cover according to another embodiment of the present invention. In this embodiment, the backlight module is further provided with at least a heat dissipating glue 222, and the side wall 216 is also provided with an outer side surface 220 opposite to the inner side surface 218, wherein the heat dissipating belt 222 is sequentially joined to the side wall. Side 218, bottom surface of side wall 216, and outer side S 2 2 0. In the embodiment, the heat dissipating tape 222 is interposed between the inner side surface 218 and the light emitting diode strip 206, that is, the heat dissipating tape 222 is adhered to the inner side surface 218, and the bonding is not shown in FIG. The LED strip 206' on the inner side 218 is instead joined to the heat dissipating tape 222. In this embodiment, the heat dissipation tape 222 is further in contact with the light source protection cover 212. The heat dissipation efficiency of the heat dissipation tape 222 is utilized to improve the heat dissipation efficiency of the backlight module 200 as a whole. This design solves the problem that when the frame 21A and its side walls 2!6 are made of a plastic material, the waste heat generated by the LED strip 206 is poorly radiated. Please refer to FIG. 3B, which is a perspective view and a perspective view of a light-emitting diode light bar, a frame, and a light source protection cover according to still another embodiment of the present invention. In the present embodiment, the same problem is solved in order to solve the problem that the light-emitting diode strips derived from the rotating material manufacturing device 2H) and the side walls 216 thereof are defective. A plurality of grooves may be provided on the bottom surface of the side wall 216. Similarly, the structure of the side wall 216 as shown in FIG. 2 is also provided with the outer side surface 220 relative to the inner side a", wherein the recess 224 extends from the inner side surface 218 of the side wall 216 to the outer side surface 220, thereby increasing the backlight In the re-embodiment, the groove shown in FIG. 3B can be modified into a structure as shown in FIG. 3c, and the structure is provided in the side wall 216. The through hole 226 ′ is formed by the inner side surface 218 and the outer side surface 220 of the side wall 216. Referring to FIG. 4 , it is a schematic plan view of the frame of the backlight module according to FIG. 2 . The frame 210 has four sides (side 228, side 23 〇, side 232, and side 234) that are sequentially adjacent to each other, thereby forming a rectangular frame structure. Hollow structure. In other embodiments, the frame 21 can have a bottom beta plate structure (not The edge is used to receive parts such as the optical element 208 and provide appropriate strength for protection. In another embodiment, the frame 210 shown in FIG. 4 is an integrally formed structure 'typically the frame 21 The utility model is composed of a thermoplastic material which can be formed by a thermoplastic material. In an embodiment, the backlight module 200 is provided with two side walls 216, two light emitting diode light strips 206, and two light source protection covers 212, wherein the side walls 216 The light-emitting diode strip 206 and the light source protection cover 212 are arranged in a group of three, that is, a side wall 216 is matched with a light source protection cover Φ 212 and simultaneously matched with a light-emitting diode light strip 206. And respectively disposed adjacent to the opposite side 228 and the side 232 (as shown in FIG. 4), wherein the side wall 216, the LED strip 206, and the light source protection cover 212 are joined and positioned. The structure is as shown in Fig. 2. In another embodiment, the side wall 216, the light emitting diode strip 206, and the light source protection cover 212 are also disposed adjacent to each other in a group of three. The two sides are 'for example: side 228 and side 230, the side 230 and the side 232, the side 232 and the side 234, or the side 234 and the side 228. 10 201005383 In another embodiment, the backlight module 200 is provided with three side walls 216, two light two The pole light strip 206 and the three light source protection cover 212, wherein the side wall 216, the light-emitting diode light strip 206' and the light source protection cover 212 are respectively disposed adjacent to the adjacent ones in a manner of two groups as described above. The three sides are 'for example: side 228, side 23 〇, and side 232; side 230, side 232, and side 234; side 232, side 234, and side 228; or side Side 234, side 228, and side 23〇. In another embodiment, the backlight module 200 is provided with four sidewalls 216, four LED strips 206, and four light source shields 212, wherein the sidewalls 216, the LED strips 2〇6, and Light source shields 212 are also disposed in three groups adjacent to the four sides (side 228, side 230, side 232, and side 234). Referring to Figure 5, there is shown a cross-sectional view of a frame in accordance with an embodiment of the present invention. The frame 210 has a top wall 236 that abuts the side walls 216, while the bottom surface of the top wall 236 is further provided with a reflective layer 238 such as a reflective sheet. The reflective layer 238 serves mainly to reduce the absorption of the light source generated by the light-emitting diodes 2〇7 on the light-emitting diode strips 2〇6 by the frame 210. Referring to FIG. 2 again, in this embodiment, the backlight module 2 further includes a housing 202. The main function of the housing 202 is to accommodate the backlight module frame assembly 2〇4 in the backlight module 200 and provide protection. Therefore, the casing 202 is generally made of a metal material (e.g., an aluminum alloy), and the metal has a mechanical strength characteristic of a better strength for protection purposes. In the prior art, a backlight module designed for a small handheld device such as a notebook computer will generally provide a fixed optical component 208, such as a backlight module frame 201005383 as shown in FIG. The function of the part, or even the function of fixing the components such as the optical element 2〇8, is only provided by the frame 210; and the housing 202 is usually common in the design of a backlight module of a large device, such as a television or a large-sized liquid crystal. monitor. In this embodiment, the body 202 has a bottom plate structure, but in other embodiments, the frame 114 shown in FIG. 4 may have a hollow structure, thereby reducing the overall weight of the backlight module. . In the embodiment of Fig. 2, the optical element 2〇8 is a light guide plate. In other embodiments, the at least one optical component 208 included in the backlight module 200 can be an optical film (not shown) such as a brightness enhancing film or a reflective sheet (not shown). The features of the various embodiments have been described above in a manner to provide a more detailed description of the embodiments. It will be appreciated by those skilled in the art that <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Those skilled in the art can also appreciate that various modifications, substitutions, and alterations can be made without departing from the spirit and scope of the disclosure, and without departing from the spirit and scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS In order to provide a better understanding of the present invention, reference is made to the above detailed description and the accompanying drawings. It is emphasized that the various features in the drawings are not reproducible in accordance with the drawings. In fact, the dimensions of the various features may be arbitrarily enlarged or reduced in order to clearly illustrate the above embodiments. The related drawings are described below. 12 201005383 The first figure shows a schematic cross-sectional view of a backlight module generally using a light-emitting diode as a light source. 2 is a cross-sectional view showing a backlight module according to an embodiment of the present invention. Figure 3A is a cross-sectional view showing a light-emitting diode light strip, a heat dissipating tape, a frame, and a light source protective cover according to another embodiment of the present invention. FIG. 3B is a perspective perspective view showing a light-emitting diode light bar, a frame, and a light source protection cover according to still another embodiment of the present invention. 3C is a perspective perspective view showing a light-emitting diode light bar, a frame, and a light source protective cover according to still another embodiment of the present invention. Fig. 4 is a plan view showing the frame of the backlight module according to Fig. 2. Figure 5 is a cross-sectional view showing a frame in accordance with an embodiment of the present invention. [Main. Element Symbol Description 100: Backlight Module 104: Printed Circuit Board 108: Light Bar Mount 112: Optical Element 116: Housing 202: Housing 205: Printed Circuit Board 207: Light Emitting Dipole 210: Frame 102 Light-emitting diode 106 Light bar 110 Light source protection cover 114 Frame 200 Backlight module 204 Backlight module frame combination 206 Light-emitting diode light bar 208 Optical element 212 Light source protection cover 13 201005383 214 : accommodating space 216 : Side wall 218 : Inner Side 220: Outer side 222: Thermal tape 224: Groove 226: Through hole 228: Side 230: Side 232: Side 234: Side 236: Top wall 238: Reflective layer d* Distance