TWI268524B - Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure - Google Patents

Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure

Info

Publication number
TWI268524B
TWI268524B TW091134266A TW91134266A TWI268524B TW I268524 B TWI268524 B TW I268524B TW 091134266 A TW091134266 A TW 091134266A TW 91134266 A TW91134266 A TW 91134266A TW I268524 B TWI268524 B TW I268524B
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
printed circuit
same
capacitor structure
Prior art date
Application number
TW091134266A
Other languages
English (en)
Other versions
TW200300947A (en
Inventor
Craig S Allen
Maria Anna Rzeznik
David L Jacques
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Publication of TW200300947A publication Critical patent/TW200300947A/zh
Application granted granted Critical
Publication of TWI268524B publication Critical patent/TWI268524B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
TW091134266A 2001-11-26 2002-11-26 Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure TWI268524B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33338201P 2001-11-26 2001-11-26
US10/268,270 US6819540B2 (en) 2001-11-26 2002-10-10 Dielectric structure

Publications (2)

Publication Number Publication Date
TW200300947A TW200300947A (en) 2003-06-16
TWI268524B true TWI268524B (en) 2006-12-11

Family

ID=26952979

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091134266A TWI268524B (en) 2001-11-26 2002-11-26 Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure

Country Status (5)

Country Link
US (1) US6819540B2 (zh)
EP (1) EP1316976A1 (zh)
JP (1) JP2003243242A (zh)
KR (1) KR20030043714A (zh)
TW (1) TWI268524B (zh)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7914755B2 (en) * 2001-04-12 2011-03-29 Eestor, Inc. Method of preparing ceramic powders using chelate precursors
JP4465429B2 (ja) * 2002-02-21 2010-05-19 株式会社リコー レーザ加工方法
KR100467834B1 (ko) * 2002-12-23 2005-01-25 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
KR100576849B1 (ko) 2003-09-19 2006-05-10 삼성전기주식회사 발광소자 및 그 제조방법
US6872468B1 (en) * 2003-10-09 2005-03-29 Motorola, Inc. Peelable circuit board foil
US7193838B2 (en) * 2003-12-23 2007-03-20 Motorola, Inc. Printed circuit dielectric foil and embedded capacitors
JP4593912B2 (ja) * 2003-12-24 2010-12-08 京セラ株式会社 積層型圧電素子およびその製法、並びに噴射装置
WO2005085496A2 (en) * 2004-03-03 2005-09-15 Energenius, Inc. Ferroelectric thin film composites with improved top contact adhesion and devices containing the same
EP1738378A4 (en) 2004-03-18 2010-05-05 Nanosys Inc NANOFIBRE SURFACE BASED CAPACITORS
JP2006093663A (ja) * 2004-07-29 2006-04-06 Rohm & Haas Electronic Materials Llc 誘電体構造
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
EP1693484A3 (en) * 2005-02-15 2007-06-20 Rohm and Haas Electronic Materials, L.L.C. Plating Method
KR100716824B1 (ko) * 2005-04-28 2007-05-09 삼성전기주식회사 하이브리드 재료를 이용한 커패시터 내장형 인쇄회로기판및 그 제조방법
JP4904601B2 (ja) * 2005-04-28 2012-03-28 エスティー‐エリクソン、ソシエテ、アノニム 集積回路チップ上における電源及びグランドラインルーティングのための受動集積基板を有する集積回路組立体
US7349196B2 (en) * 2005-06-17 2008-03-25 Industrial Technology Research Institute Composite distributed dielectric structure
US7795663B2 (en) * 2005-06-21 2010-09-14 E. I. Du Pont De Nemours And Company Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof
US7621041B2 (en) * 2005-07-11 2009-11-24 E. I. Du Pont De Nemours And Company Methods for forming multilayer structures
US7579070B2 (en) * 2005-08-30 2009-08-25 Intel Corporation Multiple layer deposition for improving adhesion
TWI270901B (en) * 2005-09-16 2007-01-11 Ctech Technology Corp Solid capacitor and fabrication method thereof
US7585722B2 (en) * 2006-01-10 2009-09-08 International Business Machines Corporation Integrated circuit comb capacitor
KR100793916B1 (ko) * 2006-04-05 2008-01-15 삼성전기주식회사 인쇄회로기판 내장형 커패시터의 제조방법
US8853116B2 (en) 2006-08-02 2014-10-07 Eestor, Inc. Method of preparing ceramic powders
US7993611B2 (en) 2006-08-02 2011-08-09 Eestor, Inc. Method of preparing ceramic powders using ammonium oxalate
CA2562986A1 (en) * 2006-10-06 2008-04-06 David A. Kelly Multi-layer ceramic polymer capacitor
EP2109124B1 (en) * 2007-01-26 2017-03-29 Showa Denko K.K. Capacitor material, method for manufacturing the capacitor material, capacitor containing the capacitor material, wiring board and electronic device
US20090238955A1 (en) * 2008-03-20 2009-09-24 E. I. Du Pont De Nemours And Company Processes for the manufacture of barium titanate capacitors on nickel foils
CN102066443B (zh) * 2008-06-19 2014-01-15 旭硝子株式会社 固化性组合物及使用了该组合物的固化膜
WO2010088684A2 (en) * 2009-02-02 2010-08-05 Space Charge, LLC Capacitor using carbon-based extensions
KR101101347B1 (ko) * 2010-04-06 2012-01-02 한국세라믹기술원 무소결 ｍｉｍ 커패시터 및 그 제조 방법
KR101452079B1 (ko) * 2012-12-28 2014-10-16 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
KR101462767B1 (ko) * 2013-03-14 2014-11-20 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
JP6513328B2 (ja) * 2013-07-10 2019-05-15 太陽誘電株式会社 積層セラミックコンデンサ
CN104869754B (zh) * 2014-02-25 2018-06-26 财团法人工业技术研究院 嵌有导线的软性基板及其制造方法
WO2016208006A1 (ja) 2015-06-24 2016-12-29 株式会社メイコー 立体配線基板の製造方法、立体配線基板、立体配線基板用基材
FR3045036B1 (fr) * 2015-12-15 2017-12-22 Commissariat Energie Atomique Procede de preparation d'une solution sol-gel utilisable pour la preparation d'une ceramique de titanate de baryum dope par du hafnium et/ou par au moins un element lanthanide
CN107231747A (zh) * 2017-07-14 2017-10-03 武汉光谷创元电子有限公司 电容、埋电容电路板及其制造方法
US11245065B1 (en) 2018-03-22 2022-02-08 Facebook Technologies, Llc Electroactive polymer devices, systems, and methods
US10962791B1 (en) 2018-03-22 2021-03-30 Facebook Technologies, Llc Apparatuses, systems, and methods for fabricating ultra-thin adjustable lenses
US10914871B2 (en) 2018-03-29 2021-02-09 Facebook Technologies, Llc Optical lens assemblies and related methods
KR102213106B1 (ko) * 2020-07-06 2021-02-05 주식회사태인 필름형 캐패시터 및 이의 제조방법

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2119571B (en) * 1982-03-30 1985-12-11 Standard Telephones Cables Ltd Terminals for multilayer ceramic dielectric capacitors
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JPH079073B2 (ja) 1990-03-30 1995-02-01 大和化工株式会社 膜形成方法
JPH0462715A (ja) * 1990-06-30 1992-02-27 Toshiba Corp 薄膜誘電体材料
JP2670906B2 (ja) * 1990-12-28 1997-10-29 三菱マテリアル 株式会社 セラミックコンデンサ及びその製造方法
US5246732A (en) * 1991-07-16 1993-09-21 U.S. Philips Corporation Method of providing a copper pattern on a dielectric substrate
JP2531906B2 (ja) * 1991-09-13 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション 発泡重合体
JPH0685193A (ja) * 1992-09-07 1994-03-25 Nec Corp 半導体装置
US5390072A (en) * 1992-09-17 1995-02-14 Research Foundation Of State University Of New York Thin film capacitors
JPH0729765A (ja) * 1993-07-08 1995-01-31 Matsushita Electric Ind Co Ltd 大容量コンデンサ
US5420441A (en) * 1993-11-23 1995-05-30 Eastman Kodak Company Automated technique for calibrating a storage phosphor reader
US5429972A (en) * 1994-05-09 1995-07-04 Advanced Micro Devices, Inc. Method of fabricating a capacitor with a textured polysilicon interface and an enhanced dielectric
US5835174A (en) * 1995-10-12 1998-11-10 Rohm And Haas Company Droplets and particles containing liquid crystal and films and apparatus containing the same
EP0917719A2 (en) * 1996-08-12 1999-05-26 Energenius, Inc. Semiconductor supercapacitor system, method for making same and articles produced therefrom
KR100223939B1 (ko) * 1996-09-07 1999-10-15 구본준 고유전막의 제조방법 및 그를 이용한 캐패시터의 제조방법
US5742471A (en) * 1996-11-25 1998-04-21 The Regents Of The University Of California Nanostructure multilayer dielectric materials for capacitors and insulators
US5895263A (en) * 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
EP0899053A3 (en) 1997-08-29 2000-04-05 Sintokogio Ltd. A plated product and a method and apparatus for producing the same
US6068782A (en) * 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
US6137192A (en) 1998-05-15 2000-10-24 Energenius, Inc. Embedded backup energy storage unit
US6093636A (en) * 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
US6270835B1 (en) * 1999-10-07 2001-08-07 Microcoating Technologies, Inc. Formation of this film capacitors
US6288906B1 (en) * 1998-12-18 2001-09-11 Intel Corporation Multiple layer printed circuit board having power planes on outer layers
US6380628B2 (en) * 1999-08-18 2002-04-30 International Business Machines Corporation Microstructure liner having improved adhesion
US6420441B1 (en) 1999-10-01 2002-07-16 Shipley Company, L.L.C. Porous materials
US6780704B1 (en) * 1999-12-03 2004-08-24 Asm International Nv Conformal thin films over textured capacitor electrodes
US6623865B1 (en) 2000-03-04 2003-09-23 Energenius, Inc. Lead zirconate titanate dielectric thin film composites on metallic foils
JP2002015943A (ja) * 2000-06-29 2002-01-18 Kyocera Corp 誘電体の製造方法及びそれを用いた誘電体及びコンデンサ
US6271273B1 (en) * 2000-07-14 2001-08-07 Shipley Company, L.L.C. Porous materials
US6657849B1 (en) * 2000-08-24 2003-12-02 Oak-Mitsui, Inc. Formation of an embedded capacitor plane using a thin dielectric

Also Published As

Publication number Publication date
TW200300947A (en) 2003-06-16
JP2003243242A (ja) 2003-08-29
US20030128496A1 (en) 2003-07-10
EP1316976A1 (en) 2003-06-04
US6819540B2 (en) 2004-11-16
KR20030043714A (ko) 2003-06-02

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