TWI268206B - Method and device for breaking brittle material substrate and processing apparatus comprising positioning a brittle substrate on a stack comprised of a rubber plate and a stainless plate and arranging two stoppers on opposite sides of the brittle substrate - Google Patents

Method and device for breaking brittle material substrate and processing apparatus comprising positioning a brittle substrate on a stack comprised of a rubber plate and a stainless plate and arranging two stoppers on opposite sides of the brittle substrate

Info

Publication number
TWI268206B
TWI268206B TW092125423A TW92125423A TWI268206B TW I268206 B TWI268206 B TW I268206B TW 092125423 A TW092125423 A TW 092125423A TW 92125423 A TW92125423 A TW 92125423A TW I268206 B TWI268206 B TW I268206B
Authority
TW
Taiwan
Prior art keywords
substrate
brittle
brittle substrate
breaking
stoppers
Prior art date
Application number
TW092125423A
Other languages
English (en)
Other versions
TW200408516A (en
Inventor
Kazuya Maekawa
Kazuyuki Nonaka
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200408516A publication Critical patent/TW200408516A/zh
Application granted granted Critical
Publication of TWI268206B publication Critical patent/TWI268206B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW092125423A 2002-10-11 2003-09-16 Method and device for breaking brittle material substrate and processing apparatus comprising positioning a brittle substrate on a stack comprised of a rubber plate and a stainless plate and arranging two stoppers on opposite sides of the brittle substrate TWI268206B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002298424A JP4169565B2 (ja) 2002-10-11 2002-10-11 脆性材料基板のブレーク方法及びその装置並びに加工装置

Publications (2)

Publication Number Publication Date
TW200408516A TW200408516A (en) 2004-06-01
TWI268206B true TWI268206B (en) 2006-12-11

Family

ID=32287849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125423A TWI268206B (en) 2002-10-11 2003-09-16 Method and device for breaking brittle material substrate and processing apparatus comprising positioning a brittle substrate on a stack comprised of a rubber plate and a stainless plate and arranging two stoppers on opposite sides of the brittle substrate

Country Status (4)

Country Link
JP (1) JP4169565B2 (zh)
KR (1) KR100924290B1 (zh)
CN (1) CN100358694C (zh)
TW (1) TWI268206B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1750917A (zh) * 2003-02-21 2006-03-22 三星钻石工业股份有限公司 基板加工用台和基板加工装置
DE102007001133B4 (de) 2007-01-05 2008-09-04 Mdi Schott Advanced Processing Gmbh Verfahren und Vorrichtung zum Brechen von Dünnglasscheiben
KR100890764B1 (ko) 2008-01-25 2009-03-26 삼성코닝정밀유리 주식회사 가공 테이블 일체형 유리 기판 브레이킹 장치
JP5284725B2 (ja) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 脆性材料ブレーク装置
JP5284726B2 (ja) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 脆性材料ブレーク装置
JP5193141B2 (ja) * 2009-07-21 2013-05-08 三星ダイヤモンド工業株式会社 ブレイクユニット及びブレイク方法
JP5550357B2 (ja) * 2010-01-15 2014-07-16 株式会社ジャパンディスプレイ フロントウインドウ付き表示装置
JP5129826B2 (ja) * 2010-02-05 2013-01-30 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP5210409B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置
DE102013215706A1 (de) * 2013-08-08 2015-02-12 Bielomatik Leuze Gmbh + Co. Kg Transfer-Stanzen
JP6154713B2 (ja) * 2013-09-30 2017-06-28 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
JP6650663B2 (ja) * 2014-03-28 2020-02-19 三星ダイヤモンド工業株式会社 樹脂シートの分断方法及び分断装置
JP6342777B2 (ja) * 2014-10-09 2018-06-13 株式会社ケーヒン 基板切断装置の運転方法及び基板切断装置
JP6569330B2 (ja) 2015-06-29 2019-09-04 三星ダイヤモンド工業株式会社 ブレーク装置
JP6520466B2 (ja) 2015-06-29 2019-05-29 三星ダイヤモンド工業株式会社 ブレーク装置
CN105040994B (zh) * 2015-07-25 2017-08-01 安徽卡塔门窗有限公司 一种玻璃窗加工用固定平台
JP6544179B2 (ja) * 2015-09-25 2019-07-17 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP2018171671A (ja) * 2017-03-31 2018-11-08 三星ダイヤモンド工業株式会社 樹脂シートの分断装置及び分断方法
WO2018210605A1 (de) * 2017-05-17 2018-11-22 Evonik Degussa Gmbh Kernhydrophobe wärmedämmplatte mit gehärteter oberfläche
JP6460267B2 (ja) * 2018-01-29 2019-01-30 三星ダイヤモンド工業株式会社 ブレーク装置
CN112388710B (zh) * 2019-08-19 2021-07-06 苏州维嘉科技股份有限公司 分板机沿边切割的方法、装置、存储介质和分板机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03208826A (ja) * 1990-01-12 1991-09-12 Fuji Xerox Co Ltd 脆性板の切断方法及び切断用治具
JP3227800B2 (ja) * 1992-06-30 2001-11-12 富士ゼロックス株式会社 脆性板切断方法およびその装置
JPH09183627A (ja) * 1996-12-25 1997-07-15 Casio Comput Co Ltd ガラス切断方法およびその装置
JP4058542B2 (ja) 1997-05-30 2008-03-12 三星ダイヤモンド工業株式会社 基板ブレイク装置、基板ブレイク方法、基板分断装置および基板分断システム
JP4187364B2 (ja) * 1998-09-16 2008-11-26 Ｈｏｙａ株式会社 板状ガラス母材の切断方法、プリフォームの製造方法、および板状ガラス母材切断装置
JP2001010834A (ja) * 1999-06-28 2001-01-16 Shirai Tekkosho:Kk 液晶パネルの折割方法及びその装置
JP3787489B2 (ja) 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置

Also Published As

Publication number Publication date
CN1496799A (zh) 2004-05-19
JP2004131341A (ja) 2004-04-30
KR100924290B1 (ko) 2009-10-30
JP4169565B2 (ja) 2008-10-22
TW200408516A (en) 2004-06-01
KR20040033245A (ko) 2004-04-21
CN100358694C (zh) 2008-01-02

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees