TWI268206B - Method and device for breaking brittle material substrate and processing apparatus comprising positioning a brittle substrate on a stack comprised of a rubber plate and a stainless plate and arranging two stoppers on opposite sides of the brittle substrate - Google Patents
Method and device for breaking brittle material substrate and processing apparatus comprising positioning a brittle substrate on a stack comprised of a rubber plate and a stainless plate and arranging two stoppers on opposite sides of the brittle substrateInfo
- Publication number
- TWI268206B TWI268206B TW092125423A TW92125423A TWI268206B TW I268206 B TWI268206 B TW I268206B TW 092125423 A TW092125423 A TW 092125423A TW 92125423 A TW92125423 A TW 92125423A TW I268206 B TWI268206 B TW I268206B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- brittle
- brittle substrate
- breaking
- stoppers
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002298424A JP4169565B2 (ja) | 2002-10-11 | 2002-10-11 | 脆性材料基板のブレーク方法及びその装置並びに加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200408516A TW200408516A (en) | 2004-06-01 |
TWI268206B true TWI268206B (en) | 2006-12-11 |
Family
ID=32287849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092125423A TWI268206B (en) | 2002-10-11 | 2003-09-16 | Method and device for breaking brittle material substrate and processing apparatus comprising positioning a brittle substrate on a stack comprised of a rubber plate and a stainless plate and arranging two stoppers on opposite sides of the brittle substrate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4169565B2 (zh) |
KR (1) | KR100924290B1 (zh) |
CN (1) | CN100358694C (zh) |
TW (1) | TWI268206B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1750917A (zh) * | 2003-02-21 | 2006-03-22 | 三星钻石工业股份有限公司 | 基板加工用台和基板加工装置 |
DE102007001133B4 (de) | 2007-01-05 | 2008-09-04 | Mdi Schott Advanced Processing Gmbh | Verfahren und Vorrichtung zum Brechen von Dünnglasscheiben |
KR100890764B1 (ko) | 2008-01-25 | 2009-03-26 | 삼성코닝정밀유리 주식회사 | 가공 테이블 일체형 유리 기판 브레이킹 장치 |
JP5284725B2 (ja) * | 2008-08-29 | 2013-09-11 | 三星ダイヤモンド工業株式会社 | 脆性材料ブレーク装置 |
JP5284726B2 (ja) * | 2008-08-29 | 2013-09-11 | 三星ダイヤモンド工業株式会社 | 脆性材料ブレーク装置 |
JP5193141B2 (ja) * | 2009-07-21 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | ブレイクユニット及びブレイク方法 |
JP5550357B2 (ja) * | 2010-01-15 | 2014-07-16 | 株式会社ジャパンディスプレイ | フロントウインドウ付き表示装置 |
JP5129826B2 (ja) * | 2010-02-05 | 2013-01-30 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法 |
JP5210409B2 (ja) * | 2011-04-06 | 2013-06-12 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
DE102013215706A1 (de) * | 2013-08-08 | 2015-02-12 | Bielomatik Leuze Gmbh + Co. Kg | Transfer-Stanzen |
JP6154713B2 (ja) * | 2013-09-30 | 2017-06-28 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法並びにブレイク装置 |
JP6650663B2 (ja) * | 2014-03-28 | 2020-02-19 | 三星ダイヤモンド工業株式会社 | 樹脂シートの分断方法及び分断装置 |
JP6342777B2 (ja) * | 2014-10-09 | 2018-06-13 | 株式会社ケーヒン | 基板切断装置の運転方法及び基板切断装置 |
JP6569330B2 (ja) | 2015-06-29 | 2019-09-04 | 三星ダイヤモンド工業株式会社 | ブレーク装置 |
JP6520466B2 (ja) | 2015-06-29 | 2019-05-29 | 三星ダイヤモンド工業株式会社 | ブレーク装置 |
CN105040994B (zh) * | 2015-07-25 | 2017-08-01 | 安徽卡塔门窗有限公司 | 一种玻璃窗加工用固定平台 |
JP6544179B2 (ja) * | 2015-09-25 | 2019-07-17 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
JP2018171671A (ja) * | 2017-03-31 | 2018-11-08 | 三星ダイヤモンド工業株式会社 | 樹脂シートの分断装置及び分断方法 |
WO2018210605A1 (de) * | 2017-05-17 | 2018-11-22 | Evonik Degussa Gmbh | Kernhydrophobe wärmedämmplatte mit gehärteter oberfläche |
JP6460267B2 (ja) * | 2018-01-29 | 2019-01-30 | 三星ダイヤモンド工業株式会社 | ブレーク装置 |
CN112388710B (zh) * | 2019-08-19 | 2021-07-06 | 苏州维嘉科技股份有限公司 | 分板机沿边切割的方法、装置、存储介质和分板机 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03208826A (ja) * | 1990-01-12 | 1991-09-12 | Fuji Xerox Co Ltd | 脆性板の切断方法及び切断用治具 |
JP3227800B2 (ja) * | 1992-06-30 | 2001-11-12 | 富士ゼロックス株式会社 | 脆性板切断方法およびその装置 |
JPH09183627A (ja) * | 1996-12-25 | 1997-07-15 | Casio Comput Co Ltd | ガラス切断方法およびその装置 |
JP4058542B2 (ja) | 1997-05-30 | 2008-03-12 | 三星ダイヤモンド工業株式会社 | 基板ブレイク装置、基板ブレイク方法、基板分断装置および基板分断システム |
JP4187364B2 (ja) * | 1998-09-16 | 2008-11-26 | Hoya株式会社 | 板状ガラス母材の切断方法、プリフォームの製造方法、および板状ガラス母材切断装置 |
JP2001010834A (ja) * | 1999-06-28 | 2001-01-16 | Shirai Tekkosho:Kk | 液晶パネルの折割方法及びその装置 |
JP3787489B2 (ja) | 2000-10-02 | 2006-06-21 | 三星ダイヤモンド工業株式会社 | 脆性基板のブレイク方法及び装置 |
-
2002
- 2002-10-11 JP JP2002298424A patent/JP4169565B2/ja not_active Expired - Fee Related
-
2003
- 2003-09-16 TW TW092125423A patent/TWI268206B/zh not_active IP Right Cessation
- 2003-09-25 KR KR1020030066421A patent/KR100924290B1/ko not_active IP Right Cessation
- 2003-10-10 CN CNB2003101006331A patent/CN100358694C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1496799A (zh) | 2004-05-19 |
JP2004131341A (ja) | 2004-04-30 |
KR100924290B1 (ko) | 2009-10-30 |
JP4169565B2 (ja) | 2008-10-22 |
TW200408516A (en) | 2004-06-01 |
KR20040033245A (ko) | 2004-04-21 |
CN100358694C (zh) | 2008-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |