TWI267158B - Elongated features for improved alignment process integration - Google Patents

Elongated features for improved alignment process integration

Info

Publication number
TWI267158B
TWI267158B TW094118415A TW94118415A TWI267158B TW I267158 B TWI267158 B TW I267158B TW 094118415 A TW094118415 A TW 094118415A TW 94118415 A TW94118415 A TW 94118415A TW I267158 B TWI267158 B TW I267158B
Authority
TW
Taiwan
Prior art keywords
features
alignment
alignment process
elongated
process integration
Prior art date
Application number
TW094118415A
Other languages
English (en)
Other versions
TW200605255A (en
Inventor
Kevin Huggins
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200605255A publication Critical patent/TW200605255A/zh
Application granted granted Critical
Publication of TWI267158B publication Critical patent/TWI267158B/zh

Links

Classifications

    • H10W20/062—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • H10W20/092—
    • H10W46/00—
    • H10W46/101—
    • H10W46/501—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW094118415A 2004-06-23 2005-06-03 Elongated features for improved alignment process integration TWI267158B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/875,081 US20050286052A1 (en) 2004-06-23 2004-06-23 Elongated features for improved alignment process integration

Publications (2)

Publication Number Publication Date
TW200605255A TW200605255A (en) 2006-02-01
TWI267158B true TWI267158B (en) 2006-11-21

Family

ID=34980271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118415A TWI267158B (en) 2004-06-23 2005-06-03 Elongated features for improved alignment process integration

Country Status (5)

Country Link
US (1) US20050286052A1 (zh)
JP (1) JP2008503897A (zh)
CN (1) CN1973371A (zh)
TW (1) TWI267158B (zh)
WO (1) WO2006007297A1 (zh)

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US8004678B2 (en) * 2007-06-26 2011-08-23 Intel Corporation Wafer level alignment structures using subwavelength grating polarizers
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US8343713B2 (en) * 2008-08-08 2013-01-01 Macronix International Co., Ltd. Method for patterning material layer
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JP6003272B2 (ja) 2012-06-15 2016-10-05 富士通セミコンダクター株式会社 露光方法および露光装置
US9093458B2 (en) * 2012-09-06 2015-07-28 Kla-Tencor Corporation Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets
KR102312241B1 (ko) * 2012-11-21 2021-10-13 케이엘에이 코포레이션 프로세스 호환 세그먼팅된 타겟들 및 설계 방법들
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KR102252341B1 (ko) 2013-06-27 2021-05-18 케이엘에이 코포레이션 계측 타겟의 편광 측정 및 대응 타겟 설계
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JP6465540B2 (ja) * 2013-07-09 2019-02-06 キヤノン株式会社 形成方法及び製造方法
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US10504851B2 (en) * 2018-02-26 2019-12-10 Globalfoundries Inc. Structure and method to improve overlay performance in semiconductor devices
CN113675074B (zh) * 2020-05-15 2023-09-29 中芯国际集成电路制造(上海)有限公司 半导体版图及其形成方法、形成的半导体结构及方法
US20250257992A1 (en) * 2024-02-14 2025-08-14 Kla Corporation Metrology measurements on small targets with control of zero-order side lobes
US20250271775A1 (en) * 2024-02-22 2025-08-28 Kla Corporation Off-axis through the lens mutually coherent dark field imaging system with incoherent light for overlay metrology

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Also Published As

Publication number Publication date
JP2008503897A (ja) 2008-02-07
US20050286052A1 (en) 2005-12-29
WO2006007297A1 (en) 2006-01-19
CN1973371A (zh) 2007-05-30
TW200605255A (en) 2006-02-01

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