TWI266590B - Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit - Google Patents

Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit Download PDF

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Publication number
TWI266590B
TWI266590B TW094113731A TW94113731A TWI266590B TW I266590 B TWI266590 B TW I266590B TW 094113731 A TW094113731 A TW 094113731A TW 94113731 A TW94113731 A TW 94113731A TW I266590 B TWI266590 B TW I266590B
Authority
TW
Taiwan
Prior art keywords
heat
coolant
impeller
passage
cooling
Prior art date
Application number
TW094113731A
Other languages
English (en)
Chinese (zh)
Other versions
TW200601954A (en
Inventor
Yukihiko Hata
Kentaro Tomioka
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of TW200601954A publication Critical patent/TW200601954A/zh
Application granted granted Critical
Publication of TWI266590B publication Critical patent/TWI266590B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094113731A 2004-04-30 2005-04-28 Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit TWI266590B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004136727A JP4377742B2 (ja) 2004-04-30 2004-04-30 放熱器、冷却装置および冷却装置を有する電子機器

Publications (2)

Publication Number Publication Date
TW200601954A TW200601954A (en) 2006-01-01
TWI266590B true TWI266590B (en) 2006-11-11

Family

ID=34939292

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113731A TWI266590B (en) 2004-04-30 2005-04-28 Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit

Country Status (6)

Country Link
US (1) US7539009B2 (enExample)
EP (1) EP1591872A3 (enExample)
JP (1) JP4377742B2 (enExample)
KR (1) KR100634862B1 (enExample)
CN (1) CN100377633C (enExample)
TW (1) TWI266590B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621940B (zh) * 2012-08-27 2018-04-21 新加坡商雷蛇（亞太）私人有限公司 電腦系統、用於一電腦系統之一機殼之零件、及組裝一電腦系統之零件之方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4056504B2 (ja) 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 冷却装置及びこれを備えた電子機器
US7218515B2 (en) * 2005-05-19 2007-05-15 Hewlett-Packard Development Company, L.P. Cooling fan with external circuit board
JP4842040B2 (ja) 2006-07-25 2011-12-21 富士通株式会社 電子機器
JP2008027370A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 電子機器
JP4781929B2 (ja) 2006-07-25 2011-09-28 富士通株式会社 電子機器
JP5283836B2 (ja) 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5148079B2 (ja) * 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP2008027374A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
KR101239975B1 (ko) * 2007-08-28 2013-03-06 삼성전자주식회사 정보처리장치
JP4724197B2 (ja) 2008-03-27 2011-07-13 富士通株式会社 電子機器
US8493727B2 (en) * 2010-06-15 2013-07-23 Apple Inc. Removable hard drive in a small form factor desk top computer
JP5310706B2 (ja) * 2010-12-06 2013-10-09 富士通株式会社 電子機器
US20150226492A1 (en) * 2014-02-12 2015-08-13 Asia Vital Components Co., Ltd. Heat Pipe Structure and Thermal Module Using Same
WO2015167419A1 (en) * 2014-04-28 2015-11-05 Hewlett-Packard Development Company, L.P. A heat-dissipating device including a vapor chamber and a radial fin assembly
CN108541181B (zh) * 2017-03-01 2020-01-17 双鸿科技股份有限公司 具有散热功能的电子设备及其水冷排总成
CN110162157A (zh) * 2019-03-29 2019-08-23 联想(北京)有限公司 散热系统
CN112486291B (zh) * 2019-09-12 2023-04-28 英业达科技有限公司 散热系统
CN112788910A (zh) * 2019-11-08 2021-05-11 研能科技股份有限公司 行动装置散热组件
CN113655868B (zh) * 2020-05-12 2025-03-25 中兴通讯股份有限公司 散热结构、散热方法、终端及存储介质
US12457723B2 (en) 2022-03-30 2025-10-28 Hl Mando Corporation Electromagnetic shielding housing and electromagnetic shielding circuit unit
KR102876541B1 (ko) * 2022-03-30 2025-10-30 에이치엘만도 주식회사 전자파 차폐형 하우징 및 회로 유닛

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3458527B2 (ja) 1995-05-26 2003-10-20 松下電器産業株式会社 ヒートシンク装置
JPH10209659A (ja) 1997-01-20 1998-08-07 Fujikura Ltd 冷却ファンを有する冷却システム
JPH10303582A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器
US6111748A (en) * 1997-05-15 2000-08-29 Intel Corporation Flat fan heat exchanger and use thereof in a computing device
US6118655A (en) * 1997-12-08 2000-09-12 Compaq Computer Corporation Cooling fan with heat pipe-defined fan housing portion
US6333850B1 (en) * 1999-02-05 2001-12-25 Foxconn Precision Components Co., Ltd. Heat sink system
US6832646B1 (en) * 1999-02-26 2004-12-21 Nippon Thermostat Co., Ltd. Cooler for electronic device
TW540982U (en) * 2000-03-21 2003-07-01 Neng-Chau Jang Liquid and air cooling heat sink device used in computer CPU
JP4386219B2 (ja) * 2000-03-31 2009-12-16 富士通株式会社 放熱機構及び当該放熱機構を有する電子機器
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
JP2002151638A (ja) * 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
JP3594238B2 (ja) * 2001-03-29 2004-11-24 インターナショナル・ビジネス・マシーンズ・コーポレーション 電子機器用冷却装置及び電子機器
JP3519710B2 (ja) 2001-09-21 2004-04-19 株式会社東芝 冷却装置及び冷却装置を内蔵した電子機器
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器
JP4126929B2 (ja) 2002-03-01 2008-07-30 ソニー株式会社 放熱装置及び情報処理装置
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
JP3673249B2 (ja) * 2002-08-27 2005-07-20 株式会社東芝 電子機器および冷却装置
JP2004139187A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621940B (zh) * 2012-08-27 2018-04-21 新加坡商雷蛇（亞太）私人有限公司 電腦系統、用於一電腦系統之一機殼之零件、及組裝一電腦系統之零件之方法

Also Published As

Publication number Publication date
KR100634862B1 (ko) 2006-10-17
US7539009B2 (en) 2009-05-26
JP2005317877A (ja) 2005-11-10
CN1694611A (zh) 2005-11-09
CN100377633C (zh) 2008-03-26
EP1591872A2 (en) 2005-11-02
US20050243511A1 (en) 2005-11-03
JP4377742B2 (ja) 2009-12-02
EP1591872A3 (en) 2007-02-14
TW200601954A (en) 2006-01-01
KR20060047669A (ko) 2006-05-18

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees