CN100377633C - 结合有冷却单元的电子设备 - Google Patents

结合有冷却单元的电子设备 Download PDF

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Publication number
CN100377633C
CN100377633C CNB2005100670945A CN200510067094A CN100377633C CN 100377633 C CN100377633 C CN 100377633C CN B2005100670945 A CNB2005100670945 A CN B2005100670945A CN 200510067094 A CN200510067094 A CN 200510067094A CN 100377633 C CN100377633 C CN 100377633C
Authority
CN
China
Prior art keywords
housing
heat
coolant
heat dissipation
impeller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100670945A
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English (en)
Chinese (zh)
Other versions
CN1694611A (zh
Inventor
畑由喜彦
富冈健太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN1694611A publication Critical patent/CN1694611A/zh
Application granted granted Critical
Publication of CN100377633C publication Critical patent/CN100377633C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB2005100670945A 2004-04-30 2005-04-29 结合有冷却单元的电子设备 Expired - Fee Related CN100377633C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004136727A JP4377742B2 (ja) 2004-04-30 2004-04-30 放熱器、冷却装置および冷却装置を有する電子機器
JP2004136727 2004-04-30

Publications (2)

Publication Number Publication Date
CN1694611A CN1694611A (zh) 2005-11-09
CN100377633C true CN100377633C (zh) 2008-03-26

Family

ID=34939292

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100670945A Expired - Fee Related CN100377633C (zh) 2004-04-30 2005-04-29 结合有冷却单元的电子设备

Country Status (6)

Country Link
US (1) US7539009B2 (enExample)
EP (1) EP1591872A3 (enExample)
JP (1) JP4377742B2 (enExample)
KR (1) KR100634862B1 (enExample)
CN (1) CN100377633C (enExample)
TW (1) TWI266590B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4056504B2 (ja) 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 冷却装置及びこれを備えた電子機器
US7218515B2 (en) * 2005-05-19 2007-05-15 Hewlett-Packard Development Company, L.P. Cooling fan with external circuit board
JP4781929B2 (ja) 2006-07-25 2011-09-28 富士通株式会社 電子機器
JP5148079B2 (ja) 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP2008027374A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP2008027370A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 電子機器
JP5283836B2 (ja) 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP4842040B2 (ja) 2006-07-25 2011-12-21 富士通株式会社 電子機器
KR101239975B1 (ko) * 2007-08-28 2013-03-06 삼성전자주식회사 정보처리장치
JP4724197B2 (ja) 2008-03-27 2011-07-13 富士通株式会社 電子機器
US8432679B2 (en) * 2010-06-15 2013-04-30 Apple Inc. Silicone barrier for drive window
JP5310706B2 (ja) * 2010-12-06 2013-10-09 富士通株式会社 電子機器
US9665139B2 (en) 2012-08-27 2017-05-30 Razer (Asia-Pacific) Pte. Ltd. Cooling system for a computer and method for assembling the same
US20150226492A1 (en) * 2014-02-12 2015-08-13 Asia Vital Components Co., Ltd. Heat Pipe Structure and Thermal Module Using Same
WO2015167419A1 (en) * 2014-04-28 2015-11-05 Hewlett-Packard Development Company, L.P. A heat-dissipating device including a vapor chamber and a radial fin assembly
CN108541181B (zh) * 2017-03-01 2020-01-17 双鸿科技股份有限公司 具有散热功能的电子设备及其水冷排总成
CN110162157A (zh) * 2019-03-29 2019-08-23 联想(北京)有限公司 散热系统
CN112486291B (zh) * 2019-09-12 2023-04-28 英业达科技有限公司 散热系统
CN112788910A (zh) * 2019-11-08 2021-05-11 研能科技股份有限公司 行动装置散热组件
CN113655868B (zh) * 2020-05-12 2025-03-25 中兴通讯股份有限公司 散热结构、散热方法、终端及存储介质
US12457723B2 (en) 2022-03-30 2025-10-28 Hl Mando Corporation Electromagnetic shielding housing and electromagnetic shielding circuit unit
KR102876541B1 (ko) * 2022-03-30 2025-10-30 에이치엘만도 주식회사 전자파 차폐형 하우징 및 회로 유닛

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10303582A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器
US6111748A (en) * 1997-05-15 2000-08-29 Intel Corporation Flat fan heat exchanger and use thereof in a computing device
US6118655A (en) * 1997-12-08 2000-09-12 Compaq Computer Corporation Cooling fan with heat pipe-defined fan housing portion
US6333850B1 (en) * 1999-02-05 2001-12-25 Foxconn Precision Components Co., Ltd. Heat sink system
JP2002151638A (ja) * 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
JP2003101272A (ja) * 2001-09-21 2003-04-04 Toshiba Corp 冷却装置及び冷却装置を内蔵した電子機器
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
CN1490696A (zh) * 2002-10-15 2004-04-21 ��ʽ���綫֥ 具有冷却发热元件的冷却液循环管路的电子装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3458527B2 (ja) 1995-05-26 2003-10-20 松下電器産業株式会社 ヒートシンク装置
JPH10209659A (ja) 1997-01-20 1998-08-07 Fujikura Ltd 冷却ファンを有する冷却システム
JP4132680B2 (ja) * 1999-02-26 2008-08-13 日本サーモスタット株式会社 電子機器の冷却装置
TW540982U (en) * 2000-03-21 2003-07-01 Neng-Chau Jang Liquid and air cooling heat sink device used in computer CPU
JP4386219B2 (ja) * 2000-03-31 2009-12-16 富士通株式会社 放熱機構及び当該放熱機構を有する電子機器
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
JP3594238B2 (ja) * 2001-03-29 2004-11-24 インターナショナル・ビジネス・マシーンズ・コーポレーション 電子機器用冷却装置及び電子機器
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器
JP4126929B2 (ja) 2002-03-01 2008-07-30 ソニー株式会社 放熱装置及び情報処理装置
JP3673249B2 (ja) * 2002-08-27 2005-07-20 株式会社東芝 電子機器および冷却装置
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10303582A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器
US6111748A (en) * 1997-05-15 2000-08-29 Intel Corporation Flat fan heat exchanger and use thereof in a computing device
US6118655A (en) * 1997-12-08 2000-09-12 Compaq Computer Corporation Cooling fan with heat pipe-defined fan housing portion
US6333850B1 (en) * 1999-02-05 2001-12-25 Foxconn Precision Components Co., Ltd. Heat sink system
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
JP2002151638A (ja) * 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
JP2003101272A (ja) * 2001-09-21 2003-04-04 Toshiba Corp 冷却装置及び冷却装置を内蔵した電子機器
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
CN1490696A (zh) * 2002-10-15 2004-04-21 ��ʽ���綫֥ 具有冷却发热元件的冷却液循环管路的电子装置

Also Published As

Publication number Publication date
TW200601954A (en) 2006-01-01
KR20060047669A (ko) 2006-05-18
CN1694611A (zh) 2005-11-09
JP4377742B2 (ja) 2009-12-02
US20050243511A1 (en) 2005-11-03
US7539009B2 (en) 2009-05-26
EP1591872A3 (en) 2007-02-14
JP2005317877A (ja) 2005-11-10
TWI266590B (en) 2006-11-11
EP1591872A2 (en) 2005-11-02
KR100634862B1 (ko) 2006-10-17

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080326

Termination date: 20140429