TWI265587B - Surface inspection apparatus - Google Patents
Surface inspection apparatusInfo
- Publication number
- TWI265587B TWI265587B TW093136736A TW93136736A TWI265587B TW I265587 B TWI265587 B TW I265587B TW 093136736 A TW093136736 A TW 093136736A TW 93136736 A TW93136736 A TW 93136736A TW I265587 B TWI265587 B TW I265587B
- Authority
- TW
- Taiwan
- Prior art keywords
- clamp
- wafer
- positioning seats
- pawls
- rotated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003417534A JP4391217B2 (ja) | 2003-12-16 | 2003-12-16 | 表面検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200525685A TW200525685A (en) | 2005-08-01 |
TWI265587B true TWI265587B (en) | 2006-11-01 |
Family
ID=34510604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093136736A TWI265587B (en) | 2003-12-16 | 2004-11-29 | Surface inspection apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US7432700B2 (zh) |
EP (1) | EP1544897B1 (zh) |
JP (1) | JP4391217B2 (zh) |
CN (1) | CN100375259C (zh) |
DE (1) | DE602004022244D1 (zh) |
IL (1) | IL165287A (zh) |
TW (1) | TWI265587B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4695106B2 (ja) * | 2007-02-21 | 2011-06-08 | 東京エレクトロン株式会社 | チャックトップの高さを求める方法及びこの方法を記録したプログラム記録媒体 |
JP5122880B2 (ja) * | 2007-07-11 | 2013-01-16 | 株式会社ディスコ | レーザー加工装置のアライメント方法 |
JP6080119B2 (ja) * | 2012-06-15 | 2017-02-15 | アテル株式会社 | アライナ装置 |
CN102709224B (zh) * | 2012-06-19 | 2015-01-14 | 北京七星华创电子股份有限公司 | 旋转薄片盘状物夹持装置 |
CN102808175B (zh) * | 2012-07-24 | 2014-04-02 | 北京鼎臣超导科技有限公司 | 一种新型大面积双面超导薄膜基片夹具及其应用 |
CN103730400B (zh) * | 2012-10-16 | 2016-06-29 | 沈阳芯源微电子设备有限公司 | 一种多尺寸晶圆对中装置 |
JP6179012B2 (ja) * | 2013-07-28 | 2017-08-16 | アテル株式会社 | ウエハ位置決め装置 |
CN103745950B (zh) * | 2014-01-29 | 2017-05-03 | 北京七星华创电子股份有限公司 | 一种具有限位结构的盘状物夹持装置 |
EP2942654B1 (en) * | 2014-05-08 | 2018-10-10 | Airbus Defence and Space GmbH | Detector plane alignment adjusting device |
KR102386746B1 (ko) | 2016-07-09 | 2022-04-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 캐리어 |
KR102017068B1 (ko) * | 2017-09-12 | 2019-09-03 | 주식회사 필옵틱스 | 정밀 회전 스테이지 장치 |
US10978331B2 (en) | 2018-03-30 | 2021-04-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for orientator based wafer defect sensing |
CN108612982A (zh) * | 2018-06-25 | 2018-10-02 | 深圳市诚辉达电子有限公司 | 一种自动式夹持装置及夹持支架 |
CN112833733B (zh) * | 2021-01-22 | 2023-07-11 | 湖北兴发化工集团股份有限公司 | 一种圆孔圆心定位装置及定位方法 |
CN114459311B (zh) * | 2022-02-09 | 2023-09-05 | 重庆臻宝科技股份有限公司 | 硅环台阶检测装置 |
CN115889081B (zh) * | 2022-11-30 | 2023-06-27 | 安徽微芯长江半导体材料有限公司 | 一种碳化硅晶片贴蜡装置及其方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0146005B1 (en) * | 1983-11-26 | 1991-08-28 | Kabushiki Kaisha Toshiba | Surface defect inspecting apparatus |
JP2729297B2 (ja) | 1987-12-24 | 1998-03-18 | 株式会社ダイヘン | 半導体ウエハのセンタ合せ装置 |
JP2566042B2 (ja) | 1990-05-21 | 1996-12-25 | 株式会社東芝 | 光半導体製造装置 |
JP2846423B2 (ja) | 1990-07-10 | 1999-01-13 | 古河電気工業株式会社 | 円板のセンタリング装置 |
US5324927A (en) * | 1993-01-08 | 1994-06-28 | Board Of Regents-Univ. Of Nebraska | Return mail piece and method of marking the same |
JP3582918B2 (ja) * | 1995-02-14 | 2004-10-27 | 株式会社トプコン | レーザ測量機 |
JPH098086A (ja) * | 1995-06-23 | 1997-01-10 | Tokyo Electron Ltd | プローブカード装着機構およびそれに用いる移動部材、並びにプローブカード装着機構を有するプローバー |
US5635694A (en) * | 1995-09-27 | 1997-06-03 | Xerox Corporation | System and method for embedding machine coded destination information into a postal mark |
US5978781A (en) * | 1997-05-08 | 1999-11-02 | Pitney Bowes Inc. | Digital printing, metering, and recording of other post services on the face of a mail piece |
JPH11237345A (ja) * | 1998-02-24 | 1999-08-31 | Hitachi Ltd | 表面計測装置 |
DE19812902A1 (de) * | 1998-03-18 | 1999-09-23 | Francotyp Postalia Gmbh | Verfahren für eine Frankier- und Adressiermaschine |
US6217034B1 (en) * | 1998-09-24 | 2001-04-17 | Kla-Tencor Corporation | Edge handling wafer chuck |
US6303509B1 (en) * | 1999-10-29 | 2001-10-16 | Taiwan Semiconductor Manufacturing Company | Method to calibrate the wafer transfer for oxide etcher (with clamp) |
JP2003090803A (ja) * | 2001-09-19 | 2003-03-28 | Mitsubishi Electric Corp | 被処理基板欠陥検査装置、これを用いた半導体製造装置、及び被処理基板欠陥検査方法 |
JP4249498B2 (ja) | 2003-01-20 | 2009-04-02 | 株式会社トプコン | 表面検査装置 |
-
2003
- 2003-12-16 JP JP2003417534A patent/JP4391217B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-18 IL IL165287A patent/IL165287A/en not_active IP Right Cessation
- 2004-11-29 TW TW093136736A patent/TWI265587B/zh not_active IP Right Cessation
- 2004-11-29 US US10/999,021 patent/US7432700B2/en not_active Expired - Fee Related
- 2004-12-10 DE DE602004022244T patent/DE602004022244D1/de active Active
- 2004-12-10 EP EP04029307A patent/EP1544897B1/en not_active Not-in-force
- 2004-12-16 CN CNB2004101011546A patent/CN100375259C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1544897A2 (en) | 2005-06-22 |
IL165287A (en) | 2010-05-17 |
TW200525685A (en) | 2005-08-01 |
EP1544897B1 (en) | 2009-07-29 |
DE602004022244D1 (de) | 2009-09-10 |
US20050126314A1 (en) | 2005-06-16 |
JP2005180933A (ja) | 2005-07-07 |
CN1630056A (zh) | 2005-06-22 |
EP1544897A3 (en) | 2006-02-15 |
JP4391217B2 (ja) | 2009-12-24 |
CN100375259C (zh) | 2008-03-12 |
US7432700B2 (en) | 2008-10-07 |
IL165287A0 (en) | 2005-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |