TWI259499B - Method of forming electrode for flat display panel - Google Patents

Method of forming electrode for flat display panel Download PDF

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Publication number
TWI259499B
TWI259499B TW093122277A TW93122277A TWI259499B TW I259499 B TWI259499 B TW I259499B TW 093122277 A TW093122277 A TW 093122277A TW 93122277 A TW93122277 A TW 93122277A TW I259499 B TWI259499 B TW I259499B
Authority
TW
Taiwan
Prior art keywords
metal
substrate
electrode
display panel
partition walls
Prior art date
Application number
TW093122277A
Other languages
English (en)
Chinese (zh)
Other versions
TW200529279A (en
Inventor
Osamu Toyoda
Shinya Fukuta
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200529279A publication Critical patent/TW200529279A/zh
Application granted granted Critical
Publication of TWI259499B publication Critical patent/TWI259499B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/36—Spacers, barriers, ribs, partitions or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Gas-Filled Discharge Tubes (AREA)
TW093122277A 2004-02-27 2004-07-26 Method of forming electrode for flat display panel TWI259499B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004053569A JP2005243499A (ja) 2004-02-27 2004-02-27 フラットディスプレイパネルの電極形成方法

Publications (2)

Publication Number Publication Date
TW200529279A TW200529279A (en) 2005-09-01
TWI259499B true TWI259499B (en) 2006-08-01

Family

ID=34879707

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122277A TWI259499B (en) 2004-02-27 2004-07-26 Method of forming electrode for flat display panel

Country Status (4)

Country Link
US (1) US7138335B2 (enExample)
JP (1) JP2005243499A (enExample)
KR (1) KR100654200B1 (enExample)
TW (1) TWI259499B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100570750B1 (ko) * 2004-01-29 2006-04-12 삼성에스디아이 주식회사 플라즈마 디스플레이 패널용 감광성 도전 조성물
TWI265543B (en) * 2005-11-22 2006-11-01 Marketech Int Corp The manufacturing method of the shadow mask of an opposed discharge plasma display panel
GB2432722A (en) * 2005-11-25 2007-05-30 Seiko Epson Corp Electrochemical cell and method of manufacture
GB2432723B (en) * 2005-11-25 2010-12-08 Seiko Epson Corp Electrochemical cell and method of manufacture
GB2432721B (en) * 2005-11-25 2011-06-22 Seiko Epson Corp Electrochemical cell structure and method of fabrication
KR100901017B1 (ko) * 2007-10-11 2009-06-04 성균관대학교산학협력단 기판의 금속패턴 형성방법
JP5227570B2 (ja) * 2007-11-13 2013-07-03 セーレン株式会社 透明導電性部材の製造方法
US8179032B2 (en) * 2008-09-23 2012-05-15 The Board Of Trustees Of The University Of Illinois Ellipsoidal microcavity plasma devices and powder blasting formation
US8865522B2 (en) 2010-07-15 2014-10-21 Infineon Technologies Austria Ag Method for manufacturing semiconductor devices having a glass substrate
US9029200B2 (en) 2010-07-15 2015-05-12 Infineon Technologies Austria Ag Method for manufacturing semiconductor devices having a metallisation layer
US8202786B2 (en) * 2010-07-15 2012-06-19 Infineon Technologies Austria Ag Method for manufacturing semiconductor devices having a glass substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4349583A (en) * 1981-07-28 1982-09-14 International Business Machines Corporation Laser enhanced maskless method for plating and simultaneous plating and etching of patterns
JP3022226B2 (ja) * 1994-12-08 2000-03-15 大伸化学株式会社 無電解めっき法における触媒化方法
US6207369B1 (en) * 1995-03-10 2001-03-27 Meso Scale Technologies, Llc Multi-array, multi-specific electrochemiluminescence testing
TW353762B (en) * 1996-10-21 1999-03-01 Dainippon Printing Co Ltd Transfer sheet, and pattern-forming method
US6207268B1 (en) * 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
JP2001043793A (ja) 1999-08-02 2001-02-16 Fujitsu Ltd 表示パネルの隔壁形成方法
JP2001236885A (ja) * 2000-02-22 2001-08-31 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルおよびその製造方法
JP2002348680A (ja) * 2001-05-22 2002-12-04 Sharp Corp 金属膜パターンおよびその製造方法

Also Published As

Publication number Publication date
KR100654200B1 (ko) 2006-12-06
US20050191783A1 (en) 2005-09-01
US7138335B2 (en) 2006-11-21
JP2005243499A (ja) 2005-09-08
TW200529279A (en) 2005-09-01
KR20050087706A (ko) 2005-08-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees