TW200523123A - Nozzle plate and manufacturing method the same - Google Patents

Abstract

A nozzle plate (8) has a first nozzle layer (1) and a second nozzle layer (2). The first nozzle layer (1) has a first nozzle hole (11a), and is provided on the fluid discharge side and thin. The second nozzle layer (2) is layered on the fluid supply side of the first nozzle layer (1) and thicker than the first nozzle layer (1), and has a second nozzle hole (11b) communicating with the first nozzle hole (11a) and forming a nozzle hole (11) together with the first nozzle hole (11a). A first electrode layer (25) formed on the inner wall of the first nozzle hole (11a) and a second electrode layer (26) formed on the inner wall of the second nozzle hole (11b) are electrically connected. A nozzle plate suitable for electrostatic suction-type fluid discharge device discharging an ultra-micro amount of fluid is provided. In the nozzle plate, an electrode is stably formed in the vicinity of a nozzle head portion, nozzle holes are easily made to be electrically independent from each other, and a drive signal for the electrode formed in the nozzle hole can be applied from the fluid supply side of the nozzle plate.

Description

200523123 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a nozzle-type flat plate which is more specifically attracted by static electricity and discharges fluid to the nozzle-type flat plate of the device. [Prior art] The spraying of a fluid discharge head of a fluid such as ink is used to charge the fluid and discharge it by an electrostatically attracted fluid on the object. There are various fluids such as ink (exhaust material remaining ^ is discharged to the object). A fluid ejection method on an object (recording medium). Here is an explanation of an inkjet method using ink as a fluid. On demand type inkjet method has been developed... Piezoelectric method using piezoelectric phenomenon, using ink The thermal method of film boiling phenomenon and the electrostatic attraction method using electrostatic phenomenon. Especially in recent years, high-resolution inkjet method is strongly required. In order to achieve high-resolution inkjet recording, the discharged ink droplets must be minute At this time, the movement of the ink droplet discharged from the nozzle before spraying on the recording medium can be expressed by the following motion equation (formula (1)): p ink · (4/3 · 疋 · d3) · dv / dt = -Cd · (1/2 · p air · v2) · (π · d2 / 4) ..... ⑴ The above ink is the volume density of the ink, v is the droplet velocity, and cd is the resistance coefficient. P air is the density of air, d is the ink droplet radius, and cd is determined by Formula (2) below.

Cd = 24 / Re · (1 + 3/16 · Re0 62) ......... (2) The above Re series Reynolds number (Reynolds number), set the air viscosity to "95731.doc 200523123 Hour 'can be expressed by the following formula (3).

Re = 2 · d · p ink · v / ........... · · ⑺ The above formula (1) The influence of the droplet radius on the left on the kinetic energy of the ink droplet is greater than the droplet radius on the air The effect of viscous resistance. Therefore, at the same speed, the smaller the droplet, the faster the speed of the droplet is decelerated, and it is impossible to reach the recording medium that leaves a certain distance, or even if it reaches, the spray accuracy is poor. In order to prevent this, the initial velocity of droplet discharge must be increased, that is, the discharge energy per unit volume must be raised. However, the conventional piezoelectric and thermal inkjet heads have the following problems when the discharged liquid droplets are given a small A, that is, the discharge energy per unit volume of the discharged liquid droplets is increased. To make the discharged droplet volume be

It is particularly difficult to make the diameter of a droplet (hereinafter referred to as the droplet diameter) 1 μm or less. Problem 1 The discharge energy of the piezoelectric inkjet head is related to the k-position s of the driven piezoelectric element and the pressure generated. The displacement amount of the piezoelectric element is closely related to the ink discharge amount, that is, the ink droplet size. In order to reduce the droplet size, the displacement amount must also be reduced. Therefore, it is difficult to increase the discharge energy per unit volume of the discharged liquid droplets. Problem 2 · The thermal inkjet head uses the film boiling phenomenon of the ink, so the pressure when forming the bubble has a physical limit, and the discharge energy of the ink is roughly determined by the area of the heating element. The area of the heating element is proportional to the volume of the bubble generation, that is, it is approximately proportional to the ink discharge amount. Therefore, when the size of the ink droplets is reduced, the volume of bubbles generated becomes smaller, and the discharge energy becomes smaller. Therefore, it is difficult to increase the discharge energy per unit volume of ink discharge droplets. Question 3 · Because the driving of the piezoelectric (thermal) driving (heating) element 95731.doc 200523123 is closely related to the discharge volume, it is very difficult to suppress the deviation. Therefore, in order to solve the above-mentioned problems, a method of discharging minute liquid droplets is used. The electrostatic suction method is shown by the formula (4) below the nozzle. 'Especially for the discharge of tiny droplet gauges', the motion equation of ink droplets attracted by electrostatic attraction has been developed as ^ ink · (4/3 · ^. D3). Dv / dt (4) = q.E_Cd . (1/2 ·, ____ Among them, q is the charge of the droplets and E is the electric field strength around it. From the above-mentioned public 4.⑷, we know that the electrostatic attraction method, the discharged droplets and the discharge energy are different 'even in scattering. It can also withstand electrostatic force. Therefore, the discharge energy per unit volume can be reduced, and it can be used to discharge tiny liquid droplets. / Inkjet device of electrostatic suction method (hereinafter referred to as electrostatic suction type inkjet device), as described in this patent The publication "Japanese Patent Application Laid-Open No. 8_238774 (publication date: September 17, 2007)" discloses that a device for applying a voltage application electrode to a nozzle is provided. In addition, Japanese Patent Application Laid-Open No. 2_-127410 The bulletin (publication date: May 9, 2000) "discloses that an inkjet device is provided with a slit formed in a nozzle, a needle electrode protruding from the nozzle, and an ink containing fine particles is discharged. See Figure Π The description is disclosed in the above-mentioned Japanese Patent Laid-Open Publication No. Hei 8 -238774 (Publication Date · September 17, 1996) "The inkjet device is as follows. Figure 17 is a schematic cross-sectional view of the inkjet device. 101 in the figure indicates an ink ejection chamber, and 102 indicates ink. , 103 indicates an ink chamber, 104 indicates a nozzle hole, 105 indicates an ink tank, 10 indicates an ink supply path, and 9573l.d0 (200523123 rotates a roller, 108 indicates a recording medium and indicates a processing control unit. 110 indicates a control element. There are two parts of the electrostatic field applied on the 103 side of the ink chamber 103 of the ink ejection chamber 表, and 115 are arranged on the metal cylinder ⑺ of the rotating drum 107, and the 116 is on the opposite side. A bias power supply unit of thousands of volts of negative electric day is applied to the electrode unit 115. 117 is a high-waste power supply unit that supplies a high voltage of several hundred V to the electrostatic field application electrode unit 114, and 118 is a grounding unit. Between the electrostatic field applying electrode portion 114 and the counter electrode portion ⑴, the high voltage of the bias power supply portion / hundreds of high voltage power supply portions 117 of a negative voltage of several thousand V applied to the counter electrode portion 115 overlaps to form an overlap. The electric field 'controls the discharge of the ink 102 from the nozzle hole 104 by this overlapping electric field. 119 is a convex meniscus formed in the nozzle hole 104 by a bias voltage of several thousand 乂 applied to the opposite electrode portion 115. The following describes the operation of the inkjet device of the electrostatic suction method with the above structure. &Quot; First The capillary 102 passes through the ink supply path 106 to the nozzle hole 10 of the ink 102 through the capillary phenomenon. At this time, opposite to the nozzle hole 104, a counter electrode portion on which the recording medium 108 is mounted is arranged. 5 The ink 102 that has reached the nozzle hole 104 forms a convex ink meniscus 11 by applying a bias G of several thousands to the electrode portion 115. By applying a signal voltage from the high-voltage power supply section 117 of several hundred volts to the electrostatic field application electrode section 114 disposed in the ink chamber 103, the signal voltage is superimposed on the voltage from the bias power supply section 116 applied to the opposite electrode section 115. The ink 102 is discharged to the recording medium 10 8 ′ by the superimposed electric field to form a printing image. Figures 18 (a) to 18 (C) illustrate the above-mentioned Japanese Laid-Open Patent Gazette "Japanese Patent No. 9573l.doc 200523123 Hirahatagawa Gazette (Publication Date: September 17, 1996). The action of the meniscus is as follows. "^ Production = Electric: Front ', as shown in Figure 18 (b), is convex by applying to the ink:' The balance of the surface tension of the broad ink forms a protrusion on the ink surface. The state of the meniscus 119a. When the driving voltage is applied in the above state, as shown in _18 (b), the meniscus 911 9b is formed due to the formation on the liquid surface. , Hunting this, forming the raised surface of the liquid surface raised τ captured dome moon part 119b.

Then, when the driving voltage is continuously applied, ^ L ^ r port S (c) does not concentrate on the center of the surface of the liquid meter to form a half-moon-shaped f-moon part of the so-called Taylor connection (Ca_eet_). i i9e, at a stage where the electrostatic force concentrated on the top of the Fengle line exceeds the surface tension of the ink, the droplets are separated and discharged. Next, the congratulatory device disclosed in the aforementioned Japanese Laid-Open Patent Publication No. 2_ ^ 2741 () (publication date: the following day) is described with reference to FIG. 19 as follows. Fig. 19 is a schematic configuration diagram of an inkjet device. As shown in FIG. 7F ', a linear recording head 211 made of a low-dielectric material (acrylic resin, ceramic, etc.) is contained in the holding member of the inkjet device, and is used as a congratulating ink head; and the ink of the recording head 211 The metal or the discharge holes are arranged opposite to each other: 7 丨 the opposing electrode 210 made of shell; an ink tank 212 for dispersing charged pigment particles is stored in a non-conductive ink medium; and the ink is arranged in the ink tank 212. Ink circulation system that circulates between the head 2 and 11 (pump 2 12 丨 puff, tube 21 $ & 21 outside); pulses are applied to each discharge electrode to attract the ink droplets that form the pixels of the recorded image 211 a pulse voltage generating device 2 丨 3; according to 95731.doc -10- 200523123 to control the driving circuit of the pulse voltage generating device 213 (not shown) according to the image data; the recording medium 230 is passed through the recording head 211 A recording medium conveying mechanism (not shown in the figure) with a gap between the opposite electrode 2 and 10; and a controller (not shown in the figure) that controls the entire device. The above-mentioned ink circulation system is constituted by connecting two officials 215a, 215b between the recording head 2 丨 丨 and the ink tank 2 丨 2, and two pumps 214a, 214b driven by the control of the controller. Then, the above-mentioned ink circulation system is divided into an ink supply system for supplying ink to the recording head 211 and an ink recovery system for recovering ink from the recording head 211. The ink supply system uses a pump 214a to suck ink from the ink tank 212, and the pressure is fed to the ink supply unit of the recording head 211 via a tube 215a. In addition, the ink recovery system sucks ink from the ink recovery section of the recording head 211 with a pump 2b and 5b, and forcibly recovers the ink into the ink tank 212 through the tube 215b. In addition, as shown in FIG. 20, the recording head 21 丨 is provided with an ink supply section 22a for expanding the ink fed from the tube 215a of the ink supply system to a line width, and ink from the ink supply section 220a. Guide the ink flow path 221 in a convex shape (mountain shape), connect the ink flow path 221 to the ink recovery part 220b of the tube 215b of the ink recovery system, and open the vertex of the ink flow path 221 to an appropriate width on the side of the opposite electrode 21 (Slit-like ink discharge holes 222 of about 0.2, a plurality of discharge electrodes 211a arranged in the ink discharge holes 222 at a specific pitch (about 0.2 mm), and arranged on both sides of each discharge electrode 211a And the above-mentioned low-dielectric (such as ceramic) separation wall 223. Each of the above discharge electrodes 21a is formed of metal such as copper, nickel, etc., and a low-dielectric film for preventing pigment adhesion (such as polyurethane) is formed on its surface. Amine 9573 l.doc -11-200523123 film). In addition, each discharge electrode 2: ^ is formed into a triangular pyramid shape at the front end, and each is discharged from the ink discharge hole 222 to the opposite electrode only with an appropriate length (70 μm to 80 μm). 2 The 10 side protrudes. The driving circuit basis not shown in the above figure The control of the controller supplies the control signal to the pulse private pressure generating device 213 only based on the time of the tone data contained in the image data. Thus, the pulse voltage generating device 213 will pulse Vp at the top of the pulse according to the type of the control signal. The high-voltage waste signal carried by the bias voltage vb is superimposed on the bias voltage Vb and output. Then, when the controller sends the image data, the two pumps 214a, 214b of the ink circulation system are driven. By this, the ink supply unit 22 〇a The ink is fed by pressure, and the ink recovery unit 220b becomes a negative pressure. The ink flowing into the ink flow path 221 flows into the gaps of the partition walls 223 by a capillary phenomenon, and infiltrates the front ends of the respective discharge electrodes 2Ua. A negative pressure is applied to the ink surface near the front end of 21 la, so the ink meniscus is formed at the front end of each discharge electrode 211 a. Furthermore, the recording medium conveyance mechanism is controlled by the controller, and is shown along the $ head in the figure. The recording medium 23 is conveyed in a specific direction, and the aforementioned high voltage signal is applied between the recording medium 23 and the discharge electrode 211a by controlling the driving circuit. Next, the above-mentioned Japanese publication will be described with reference to FIGS. 21 to 24. The operation of the meniscus before the liquid droplets of the inkjet device disclosed in the Lee Gazette "Japanese Patent Publication No. 200 (M 27410 (Publication Date: May 9, 2000)" is as follows. As shown in FIG. 21, from the pulse When the pulse voltage of the voltage generating device 213 is applied to the discharge electrode 211a in the recording head 211, an electric field is generated from the discharge electrode 21_ to the opposite electrode 210 side. At this time, because the discharge electrode 211a having a sharp tip is used, the strongest is generated near the tip 95731.doc -12- 200523123 When such an electric field is generated, as shown in FIG. 22, each of the charged pigment particles 20la in the ink solvent moves toward the ink surface by the force from the electric field (Figure Η). Thereby, the pigment concentration near the ink surface is concentrated. When the pigment concentration is concentrated, as shown in FIG. 23, near the ink surface, several π electric pigment particles 201a start to gather near the opposite side of the electrode. Then, when the pigment agglomerates 201 began to grow spherically near the ink surface, each electrostatic aggregative force f from the pigment agglomerates 2 (H began to act on each of the charged pigment particles 201a °, that is, from the pigment agglomerates 2 〇1 static repulsive force

The combined force f_ of the force of the electric field E from the self-pulsed electric power acts on each of the charged pigment rotors 2 0 a. Take the band where the electrostatic repulsive force between the charged pigment particles does not exceed the cohesive force of each other 'toward the total force f total of the pigment aggregate 201, and the shell material particles 2Gla (connected to the front end of the discharge electrode 2m and Among the pigment aggregates, the charged pigment particles on the straight line are charged with electrostatic repulsive force f_ from the pigment aggregate 201; ii) 'π electric pigment particles 20u grow in the pigment aggregate. The pigment aggregate 20m formed from the n charged pigment particles 20la is subjected to the electrostatic repulsion force Qi of the electric field E from the pulse voltage, and additionally subjected to the binding force F esc from the ink dissolution. When the static repulsion force FE and the binding force Fesc are balanced, Yan Gongcan's dagger is stable, and the polymer 201 is in a state where the liquid level is slightly protruding from the black and right.

The electrostatic repulsive force FE exceeds the binding force jp ′ and the pigment aggregates 201 are from the ink surface. Furthermore, the pigment aggregates 20 grow and eSC is separated as shown in FIG. 24 (a) to FIG. 24 (c). Furthermore, the principle of the previous electrostatic attraction method is to concentrate the charge in the center of the meniscus 95731.doc -13- 200523123 to generate the meniscus bulge. The radius of curvature of the Taylor line of the bulge & the mountain is determined by the concentration of the charge, and the electrostatic force of the amount of electricity and electric field strength is greater than the surface tension of the meniscus at this time. Separation. Since the maximum charge of the meniscus is determined by the physical properties of the ink and the radius of the meniscus adjacent rate, the smallest droplet size is determined by the physical properties of the ink (especially the surface tension) and the meniscus formed. It depends on the electric field strength.疋 In general, the surface tension of a liquid is lower than that of a pure solvent, even if it contains various solvents in the actual ink. Therefore, it is difficult to increase the surface tension®. Therefore, when the surface tension of the ink is considered constant, a method of reducing the droplet size by increasing the electric field strength is adopted. However, as described above, the conventional electrostatic attraction method has adopted a method of reducing the droplet size by increasing the electric field strength. However, the aforementioned Japanese Laid-Open Patent Publication No. 8-238774 (publication date: September 17, 1996) "And the inkjet device disclosed in the aforementioned Japanese Laid-Open Patent Gazette" Japanese Laid-Open Patent Publication No. 2000-12741 (Publication Date: May 9, 2000) ". The meniscus area, which is larger than the projected area of the discharged droplets, forms a field with a strong electric field intensity, so that the electric charge is concentrated in the center of the meniscus, and is discharged by an electrostatic force including the concentrated electric charge and the formed electric field strength. Because of this, a very high voltage of about 200V is required for the yoke, which makes driving control difficult, and there are also safety issues in operating the inkjet device. In view of such problems, we worked hard to review the results, and found out that below a certain nozzle diameter, the discharge phenomenon of a discharge film type different from the previous fluid discharge model was caused. By reducing the width or diameter of the ink discharge portion (starting discharge portion), Without applying high 95731.doc -14- 200523123 voltage, Γ§3 electric field strength can be improved. 25 (a) and 25 (b) will be used to examine the basic characteristics of the discharge of the electrostatically attracted microfluid, especially the surface potential formed by the charge stored in the meniscus at the tip of the nozzle. First, as shown in Fig. 25 (a), a simple structure of an electrostatic attraction type fluid discharge device is modeled. In the simple model, the driving electrode 251 is provided inside the sharp nozzle 250 at the front end, and the discharge material 252 is filled in the entire nozzle. Then, the substrate 254 is disposed opposite to the front end surface of the nozzle, and is grounded via the back electrode 255. When forming such a dry-pure structure model, the charge flowing from the power source 2 5 6 passes through the inside of the fluid 252 of the discharge material inside the nozzle 250, and the meniscus portion 257 with electrostatic capacitance at the front end of the nozzle is opposed to the substrate 254. A series circuit of the power supply voltage V0 and the resistance R inside the nozzle, and the electrostatic capacitance C between the meniscus 257 and the substrate 254 shown in FIG. 25 (b) can be assumed. The series circuit of V0RC can be expressed as follows using the stored charge Q⑴ on the meniscus 257. R dQ (t) / dt + Q (t) / C = V〇 ....... (5) When solving the differential equation of the formula (5), the stored charge Q (t) on the surface of the meniscus and The meniscus surface potential V (t) can be expressed as follows. Q⑴ = CV〇 [l-exp (-t / RC)] ..... (6) V (t) = V〇 [l-exp (-t / RC)] ... (7) As described above, it can be known that the stored charge Q (t) and the meniscus surface potential V⑴ at the time t depend on the resistance R inside the nozzle 250 and the electrostatic capacitance C between the meniscus 257 and the substrate 254. That is, in this type of electrostatic suction 95731.doc -15- 200523123 lead-type fluid discharge device, by reducing the resistance R inside the nozzle 25 °, it is easy to store electric charges on the surface of the meniscus 257 and shorten the discharge fluid.] Before the day · Mori. That is, the discharge frequency can be raised and high-speed drawing can be performed. -For the specific countermeasures for reducing the resistance R inside the nozzle 250, the driving electrode 251 must be as close to the ink end of the nozzle 250 as possible. The technique of forming an electrode inside a nozzle hole of an electrostatic suction type inkjet nozzle is disclosed in "Japanese Patent Application Laid-Open No. 10_175305" (publication date / June 30, 1998). Fig. 26 is a cross-sectional view showing a nozzle-type flat% process called "Japanese Patent Application Laid-Open No. 10-175305 (publication date: 199: June)". Using FIG. 26, a description will be given of the structure of the Japanese Patent Publication No. 4 inch Kaiping No. 10-1 75305 (publication date: June 30, 1998). The No. 301 series nozzle plate is formed with a plurality of ink storage recesses A · .. in the nozzle plate 30m, and the nozzle plate 3 (H is not coated with the ink reservoir concave β A surface. The photoresist layer 3202 of the electrically conductive electric ore 3G3 is not applied. Then, a nozzle hole B penetrating the nozzle plate such as the photoresist layer is formed to communicate with each of the ink storage recesses A, and the inner periphery of the nozzle is formed. Conductive electroplating 303. At this time, because the _μ, first resistive layer 302 is selected to not fix the conductive electroplating material, the conductive electrode 3 is only in the nozzle plate such as the interior and the solid nozzle plate 301. The surface on which the photoresist layer 302 is formed is fixed. In this way, the Japanese Laid-Open Patent Gazette ㈣G 丨 丨 753㈣ Gazette (Publication Date · June 30, 2010) is used to form an electrode layer inside the hole of the nozzle (electrolytic plating) 3. In addition, the Japanese Public Information Bulletin "Japanese Patent Publication No. Hei (Publication, Month, February 16, 1999)" discloses that the electrostatic suction type inkjet head is 95731.doc -16- 200523123 The structure of the electrode formed on the opposite surface of the flat plate and the recording medium. Figure 27 is awarded to Japan An illustration of the structure of an inkjet head in the Japanese Patent Laid-Open Publication "Japanese Patent Laid-Open Publication No. 42784 (Publication Date) · February 16, 1999". Use Figure 27 to clarify the material number of Japanese Patent Laid-open Publication "Japanese Patent Laid-Open No. 丨 丨 一" Bulletin (Publication date · February 16, 1999) ". The He ink head is formed with a control electrode 40 on the surface of the insulated control substrate 411, and a control electrode technique is formed on the back surface thereof, and a self ink tank 43 is formed. The penetrating ink discharge hole 413 allows the ink to pass through the control electrode 401 or 402. A protruding ink guide 4 丨 2 is provided on the aforementioned ink discharge hole 413, and is applied to the control electrode 4〇 [ The private field is focused on the front end of the ink guide 4 丨 2, and the ink droplet 4M is scattered by the electric field to the recording medium 42m provided through the opposite electrode 42. However, the Japanese Laid-Open Patent Gazette "Japanese Unexamined Patent Application No. 10_1753" Disclosed in the Official Gazette No. 5 (Publication Date: June 30, i998) and the "Patent Publication No. 142784 (Publication Date: June 16)"

This method has the following problems, and cannot be applied to an electrostatic suction type fluid discharge device that reduces the width or diameter of the ink discharge portion. "X Baixian" is a structure of Japanese Patent Publication "Japanese Patent Application Laid-Open No. 10_175305 (Publication Date: June 30th of the year of the thorax)", and thus is located outside the media-opposite side of the nozzle-type flat plate 301. The above-mentioned conductive electric money 303 is formed in the area, so the conductive electric ore formed in each of the ink storage recesses A and the nozzle holes 3 is electrically short-circuited with each other. Therefore, this nozzle type flat plate 301 can not only discharge the designated channel. To increase the resolution of the green image, the adjacent channels must be electrically separated. 95731.doc -17- 200523123 〇 The method is as follows ①② of method. = After the formation of the conductive electricity ore 3G3 ’, the nozzle-type flat plate is provided with the recess A ·· Xili and the ancients; ^ 乂 百 墨 贝丁 303. The ink is drawn into the side of the ink to be processed. 'Each channel breaks the conductive ore. ② Before the conductive plating 303 is formed, the same photoresist layer is formed on the side of the ink inflow side of the nozzle plate 301 as the same as the discharge surface. Do not increase the area of conductive electricity mine 303. * However, ① The method of breaking off after forming the 303 layer of conductive electric money. When using machining for cutting processing, dust such as cutting chips enters the nozzle hole B, and the nozzle is blocked. Breaking force ... Due to the thermal residual stress, the nozzle plate 301 is deformed by the above-mentioned stress. << In addition, it is also considered that the cutting process is performed by using rhenium, but when using the engraving, a photoresist pattern must be formed on the conductive plating 303 f formed on the ink inflow side of the nozzle plate. As mentioned above, when the nozzle-type flat plate of the electrostatic suction type fluid discharge device which is used to reduce the width or diameter of the ink discharge portion is used, the nozzle plate has a diameter of 10 or less. For accuracy, a nozzle base material of about 50 ° must be used. However, the thickness of such a thin nozzle plate is low. When making a photoresist pattern, it is easy to deform in the processing of the nozzle plate, and it cannot form a pattern with high accuracy. The method of the above ② is the same. Because the nozzle plate is thin, even before the conductive plating 3 is formed, there is also the problem that the nozzle plate is deformed, and a photoresist pattern with good accuracy cannot be formed, and it cannot be performed well. Channels are separated. 95731.doc -18-200523123 Furthermore, "Japanese Laid-Open Patent Gazette No. 10-1 75305 (Publication date · June 30, 1998) 丨 the method of too, soil, h, the nozzle aperture is small When it is less than 10, the supply of power mineral fluid is sufficient, and Zeng Yuge also has a problem that it is extremely difficult to stably form V% plating inside the hole of the mouth. ^ At this point, the most inadequate supply of plating solution is the end of the person. As mentioned above, the electrode must be as close as possible to the front end of the nozzle. ° This will not form the electrode stably at the front end of the most important nozzle. It is expected that the smaller the nozzle, the smaller the amount of fluid that can be discharged. The formation of instability. Therefore, the internal resistance of the nozzle at the end of the nozzle 各 of each channel is reduced, and the reaction frequency of each channel is' 夂, which makes it difficult to control the proper amount of liquid discharged between the channels. The print quality of the tracing image is significantly lowered. In addition, the insulation control substrate of the nozzle type flat plate disclosed in "Phase #Japanese Unexamined Patent Publication No. 4 (publication date: 19 &quot; February 16)" is disclosed. 411 by Formed in opposite surfaces of the recording medium 421 has a control electrode technique, it is possible to set a very high accuracy of the position of the electrode portion of the meniscus. Therefore, there is no problem with the structure of the Japanese published patent publication "Japanese Laid-Open Patent No. 1753505 Tiger Publication (Publication Date: June 3, 1998)", the discharge stability between the channels is high, and the electrical properties of adjacent channels are high. Fully separated. However, as shown in FIG. 28, the structure of Japanese Laid-Open Patent Publication "Japanese Unexamined Patent Publication ((aw) (publication date: February 16, 1999)") is on the opposite side of the insulating control substrate and the recording medium 421. At the same time, a bow K 酉 line 405 for applying a voltage to the control electrode 401 by a self-voltage application means is also formed, and an electric field is also generated from the lead-out wiring at this time. In particular, the bent portion 405a of the lead-out wiring 405 is prone to concentration. The electric field ', such as 95731.doc -19-200523123, etc., is very likely to damage electronic parts due to the electric field. [Abstract] 7 The purpose of the present invention is to provide _insert this ^ + w species $ Mouth-type flat plate and manufacturing method thereof, the mouth-type flat plate can be used for electrostatic suction type fluid discharge 2 clothes which discharges Super 镟 ® fluid, and can form electrodes near the front end of the nozzle. The electrical properties between several nozzle holes are # 人 v 丨 a, and the driving signal of the J mesh shell 1 ^ type plate is applied to the electrode formed in the nozzle hole portion. In order to achieve the above purpose, the nozzle plate of the present invention is provided in electrostatic Suction type fluid discharge It is discharged from the fluid discharge hole at the front end of the nozzle by y and lead-the fluid charged by the application of voltage and has several bird spray holes. Its structure is: a first nozzle layer with a thin layer, which The first nozzle layer is provided with a nozzle hole, and is arranged on the fluid discharge side, and at least one second nozzle layer is stacked on the fluid supply side of the first nozzle layer. The thickness of the upper two first nozzle layers is the same as the above. The first nozzle hole communicates, and it has a second nozzle hole: the nozzle hole forming the second nozzle hole of the nozzle hole portion, which is electrically connected to form a film. An electrode layer on the inner wall of the second nozzle hole. According to the above structure, the nozzle plate is connected to the first nozzle layer of the thin layer to the second nozzle layer of the 1 thick layer, so the second nozzle layer can ensure congratulations. The strength and rigidity of the flat plate itself can also make the first nozzle layer very thin. By making the layer thickness thin, the first spray hole formed in the first nozzle layer can form the aperture to be ultrafine, for example, less than 10 μηι, And can be used on the inner wall of this ultra-fine first nozzle hole The first electrode layer is formed into a film stably in the layer thickness direction, and the opening of the first nozzle hole of the fluid discharge surface is regarded as a flow 95731.doc -20- 200523123 To the fluid discharge hole. This can greatly reduce the resistance R inside the nozzle compared with the previous one, so as to increase the discharge frequency of the fluid, and can describe the recording medium at a high speed. The first electrode layer thus formed is formed in communication with the first nozzle hole. The second electrode layer of the first nozzle hole is electrically connected. Therefore, the driving signal can be supplied from the fluid supply side of the nozzle plate through the second electrode layer. Therefore, the lead wiring for the waste signal to the first electrode layer is not close to the medium. Nakazaki Media does not suffer electrical damage due to the electric field generated by the self-extracting wiring. In order to achieve the purpose described in the winter, the method of manufacturing the nozzle plate of the present invention includes the following steps: forming a first layer on the substrate, forming a first layer on the sacrificial layer, and forming a plurality of first layers on the first nozzle layer. -Nozzle holes; ld; the inner wall surface of each first nozzle hole is formed on the first nozzle layer to form a first electrode layer; machining is performed in the manner of residual / into »the inner wall of the first nozzle hole and the periphery of each first nozzle hole The first electrode layer mentioned above also contains the residual metal oxide layer I as a layer ~ + ... The electrode layer portion 'forms a second nozzle bank; the second nozzle layer includes a plurality of second nozzle holes with +, , :: The opening on the body discharge side is stored in the first spray remaining; Brother: the electrode layer is formed; the second nozzle layer: = the inner wall surface of each nozzle hole, forming the _ two L-containing The first spray gate 7 is a gate electrode layer, and the second electrode layer is processed in the manner of "electrical separation between adjacent two." Therefore, on a highly rigid substrate, the sacrificial layer is used to Sequentially the most pouting layer, the first-electrode layer, the second spray and the brother-bei corner layer The second electrode 屄. After the photoresist pattern is formed by the lithography technology, it is processed from the dry type to the shape 95731.doc -21-200523123, so the shape of the first nozzle hole and the second can be formed with very high shape accuracy. Nozzle hole, first electrode layer, second electrode layer. In addition, since the fluid discharge surface of the nozzle plate is protected by the sacrificial layer to the final stage of the step, therefore, in the nozzle plate process, there is no There is a danger that the fluid discharge hole may be deformed due to damage. As a result, the manufacturing yield of the nozzle plate is improved. The other objects, features, and advantages of the present invention are described below.

Can be fully understood. In addition, the advantages of the present invention will be apparent from the following description with reference to the accompanying drawings. [Embodiment ^ Hereinafter, the present invention will be described in more detail by way of examples and comparative examples. However, the present invention can more reliably reduce the voltage. Hereinafter, the present invention will be described in more detail through examples and comparative examples, but the present invention is not limited to these. [Prerequisite Technology]

First, an electrostatic suction type fluid discharge device constructed on the premise of the present invention will be described with reference to Figs. 1 to 6. It becomes the electrostatic suction type fluid discharge device with the structure previously mentioned in the present invention. The diameter is ⑽㈣ ~ 25 制, and the fluid can be discharged under the driving voltage. &amp; 41, In the fluid discharge model, the drive is caused by the reduction of the nozzle diameter ::：： The nozzle diameter below 50 ~ 70 μιη cannot be driven by the surface V without other measures Drain the ink. However, it was explored that the discharge phenomenon caused by a discharge model different from the previous 95731.doc -22 · 200523123 fluid discharge model below a certain nozzle diameter. The present invention is based on the new insights of such a fluid discharge model. First, a new fluid discharge model will be explained. A conductive fluid is injected into a nozzle having a diameter d (in the following description, as long as it is not specified before, it refers to the inner diameter of the nozzle hole), and it is assumed that it is set perpendicularly to the angle h from the infinite flat plate conductor. Figure 1 shows this state. At this time, the charge Q excited by the front end of the nozzle (nozzle hole) is assumed to be concentrated in the hemispherical portion formed by the fluid at the front end of the nozzle, and is similarly expressed by the following formula. Q = 2 π ε 〇a V〇d… (8) where Q: the charge excited by the tip of the nozzle (c), ε 〇 ·· vacuum dielectric reed number (F / m) d · diameter of the nozzle (M), vQ: total voltage applied to the nozzle. In addition, α is a proportional constant that depends on the shape of the nozzle, etc., and takes a value of about 5, especially when d «h (h: nozzle (to be precise, the nozzle hole) _distance between substrates (m)) is approximately 1. In addition, when a conductive substrate is used as the substrate, a mirrored charge Q 'having a polarity opposite to the above-mentioned charge Q is induced at a symmetrical position in the substrate opposite to the nozzle. When the substrate is an insulator, the image charge Q of the opposite polarity to the charge Q is induced at the symmetrical position determined by the dielectric constant. The concentrated electric field intensity E1 at the tip of the nozzle. . Assuming that the radius of curvature of the front end is R, it is ... ⑼ where k is a proportional constant that depends on the shape of the nozzle, etc., and takes a value of about 15 to 8.5, usually about 5 (PJ · Birdseye and DA Smith, Surface S —, 23 (1970), p. 19_). In addition, here 95731.doc -23- 200523123 is the model, while false m / 2. This is equivalent to a makeup that is raised by surface tension at the front end portion of the nozzle to have a shape corresponding to the diameter of the nozzle. Consider the balance of the pressure of the fluid acting on the front end of the nozzle. Firstly, when the working area of the pressure 2 at the front end of the spraying pressure is 8, it is P ^ ~ sEhc ^ El- -〇〇) According to the formula (8) ~ (1〇), the pressure PeKa = 1 ed kd kd2… ⑴) is expressed as 4, • Ύ The flow at the end of the mouth I # &gt;矣; The pressure of the surface tension of $ 上 、 々 丨 L 餸 is (12)

Among them, r · · surface tension, the electrostatic force increases the surface tension, and the relationship between the force ps is a condition for discharging by electrostatic force. Therefore, the pressure Pe of the static electricity and the pressure of the surface tension

Pe &gt; P (13) Figure 2 shows the pressure ps that imparts a surface tension of a certain diameter d to 1 %% Η

The relationship between static pressure pe. Fluid-The surface tension of an L-basket assumes that the fluid is water (-72 mN / m). When the corner pressure applied to the two nozzles is 700V, and the nozzle is 25 degrees light, the pressure of static electricity is displayed, and the pressure of the surface tension ρ〆requires the relationship between ^) and d, (14) Supply the minimum discharge voltage. In addition, the discharge friction force at this time △ p is △ P = Pe_Ps… (15) 95731.doc -24- 200523123 Therefore d… (16) For a nozzle that is directly controlled by d, the discharge stop is satisfied by the local electric field intensity The relationship between the time and the discharge series P is shown in FIG. 3, and the relationship with the discharge critical package C (that is, the lowest discharge of dust generated is shown in FIG. *. From FIG. 3, it can be seen that the discharge conditions are satisfied by the local electric field strength. The upper limit of the nozzle diameter is 25 # m at the time of assuming V〇700 V, r-72mN / m. The difference in Figure 4 assumes that the fluid is water &amp; = 72 mN / m) and the organic solvent is 20 mN / m ), Assuming k = 5. From this figure, understand the effect of the private city considering the fine nozzle. The discharge threshold voltage vc decreases as the diameter of the nozzle decreases. It is also known that when the fluid is water, the discharge threshold voltage% is about 700 when the nozzle diameter is 25 / ni ^ f. V. The electric field consideration method of the previous discharge model, that is, when only the electric field defined by the voltage V0 applied to the nozzle and the distance between the nozzle and the counter electrode 11 is taken into account ', as the diameter of the nozzle is small, the driving voltage required for discharge increases. On the other hand, if the new discharge model of the local electric field is used and the local electric field strength is focused on, the driving voltage during discharge can be reduced by making the nozzles finer. This reduction in driving voltage is extremely advantageous when the device is miniaturized and the nozzle density is increased. Of course, by reducing the driving voltage, a cost-effective low-voltage driver can also be used. Furthermore, in the above discharge model, since the electric field strength required for discharge depends on the local concentrated electric field strength, there is no need to have a counter electrode. That is, since the first discharge model is to apply an electric field between the nozzle and the substrate, the opposite electrode of the insulator substrate must be arranged on the opposite side of the nozzle, or the substrate 95731.doc -25- 200523123, that is, the substrate is an insulator. The plate becomes conductive. However, the thickness of the substrate that can be used in the configuration of the counter electrode is limited. On the other hand, the ejection models + and 1 of the present invention require not only an opposite electrode, but also printing on an insulating substrate and the like, and the flexibility of the structure of the dream garment 1 increases. In addition, printing can be performed even on thick insulators. In addition, Fig. 5 shows the relationship between the magnitude of the mirror image force acting on the toilet pin and the distance h from the substrate. It can be seen from the figure that the closer the distance between the substrate and the nozzle is, the more significant the image force is, and it is particularly significant when h is 20 m or less. Second, consider the precise control of discharge flow. The flow of the cylindrical flow path In the case of viscous flow, it is expressed by the following Hagen_poiseuiiie formula. At this time, a cylindrical nozzle is assumed, and the flow rate Q of the fluid flowing into the nozzle is expressed by the following formula. (17) where '7 ?: viscosity coefficient of fluid (Pa · s), L: flow path, that is, nozzle length (m), d: flow path, that is, nozzle hole diameter (m), Δp: pressure Poor (Pa). As can be seen from the above formula, since the flow rate q is proportional to the fourth power of the flow path radius, a fine nozzle can be used to limit the flow rate. The discharge pressure ΔP obtained by the formula (16) is substituted into the formula (17) to obtain the following formula.

Q

47ud2 VL 2s0V02 (18) This formula indicates the amount of fluid flowing from the nozzle when a voltage v is applied to a nozzle with a diameter d and a length L. Fig. 6 shows this state. The calculation uses L = 10mm, 7 / = 1 (mPa · s), and γ = 72 (mN / m). At this time, the nozzle diameter is assumed to be the minimum value of 50 / xm of the prior art. When the voltage v 95731.doc -26-200523123 is gradually applied, the discharge starts at the voltage vy_. This electric dust is equivalent to starting to discharge M as illustrated in the figure. At this time, the flow rate from the nozzle is displayed directly above the discharge power Vc, and the flow rate increases rapidly. In the remote-pull type calculation, by making the money slightly higher than Ve for precise control, a tiny flow rate should be obtained, but from the semi-logarithmic graph, it can be seen that it is actually impossible, especially it is not easy to achieve 10-10. Tiny amount at mW. In addition, when using a nozzle with a certain diameter, as shown in formula (14), is the minimum driving power determined? Therefore, as in the prior art, when a nozzle having a diameter of 50 μm or more is used, it is difficult to achieve a minute discharge amount of 10.1% or less and a driving voltage of 3 or less. As can be seen from the figure, the nozzle with a diameter of 25 divisions only needs a driving voltage below 700 ν, and a nozzle with a diameter of 10 mm can be controlled at 500 times. In addition, a nozzle with a diameter of 1 μm only needs to be 300 V or less. As described above, since the electrostatic suction type fluid discharge device of this embodiment is a new discharge model based on the local electric field strength, a fine nozzle with a nozzle diameter of 0.01 Am to 25 μm can be formed, and The discharge voltage can be controlled by driving voltage below 〇0V. In addition, according to the results of the above model, a driving voltage of 700 V or less is used for a nozzle with a diameter of 25 gm; a driving voltage of 500 V or less is used for a nozzle with a diameter of 10 μm or less; the diameter is i For nozzles smaller than μm, discharge control can be performed with a driving voltage of 300V or lower. As described above, the electrostatic suction type fluid discharge device of this embodiment can reduce the nozzle diameter and the driving voltage at the same time. However, compared with the previous electrostatic suction type fluid discharge device at this time, the following situation is remarkable. 95731.doc -27- 200523123 That is, when it is the above-mentioned electrostatic suction type fluid discharge device, its discharge characteristics basically depend on the resistance value in the discharge fluid flow path from the driving electrode inside the fluid discharge head to the front end of the nozzle. The lower the resistance value, the higher the anti-friction. That is, by reducing the resistance value in the flow path of the discharged fluid, the driving frequency can be improved, and the discharged fluid material with higher resistance can be discharged, and the choice of the discharged fluid material can be expanded. In order to reduce the above resistance value, the distance between the electrode and the tip of the nozzle can be shortened. [First Embodiment] An embodiment of the present invention will be described with reference to Figs. 7 to 12 as follows. (Nozzle-type flat plate) The drawing is a perspective view of a part of the nozzle-type flat plate 8 of this embodiment, and FIG. 7 (b) is a cross-sectional view taken along line A_A 'in FIG. 7 (a). The nozzle plate 8 is formed with a fluid discharge hole 9 above Ling, and two fluid discharge holes 9 are shown in FIG. In addition, 7 (c) is a three-dimensional view of a part of the nozzle plate 8 as viewed from the fluid supply side, as shown in Figures 7⑷ ~ ⑷. The nozzle plate 8 has injuries: the first nozzle layer and the second electrode layer. Layer 25, second electrode layer 26, and nozzle hole (nozzle hole portion) 11. The surface of the fluid discharge side of the corner-nozzle layer 1 constitutes the fluid discharge surface 8a 'of the nozzle plate 8 and forms the liquid-repellent layer 4, especially Gan ^ On the fluid supply side on the opposite side, ^ He nozzle layer 2. At this time, if the first nozzle layer 1 is formed to a thickness of 1 mm to 8 Mm, the second nozzle layer 2 with a layer thickness can ensure the nozzle type. The strength and rigidity of the plate 8. At this time, the second nozzle layer 2 for ensuring the strength and rigidity is a layer of 95731.doc -28- 200523123, but it can also be more than two layers. The nozzle hole 11 is formed by penetrating the first nozzle layer. The first nozzle hole 11a is composed of the second nozzle hole 11b penetrating through the second nozzle layer 2. At this time, the wall surface of the first nozzle hole Ua is approximately circular perpendicular to the fluid discharge surface 8a of the nozzle plate 8. A cylindrical shape, a substantially circular opening having a fluid discharge surface of the liquid-repellent layer 4 becomes a fluid discharge hole 9. Another The second nozzle hole lb is a cone shape (conical frustum shape) that is fan-shaped from the opening on the side communicating with the cylindrical first nozzle hole 11a, and passes through the second nozzle layer 2, The fluid supply surface 8b on the opposite side of the nozzle layer 1 opens. The substantially circular opening of the second nozzle hole i lb formed on the surface of the second nozzle layer 2 also has a fluid supply surface 8b as a fluid supply hole. 12. A first electrode layer 25 is formed on the inner wall of the brother Heming hole, and around the communication hole (connecting portion) llx where the first nozzle hole ua communicates with the second nozzle hole 11b. The first electrode layer 25 Including: the cylindrical portion 25a and the extension portion 25b, the circular identical portion 25a is formed on the entire inner wall of the nozzle hole Ha. The extension portion 25b is around the communication hole 11x where the first nozzle hole 11a and the second nozzle hole Ub communicate, A circular ring shape with the communication hole 1 as its approximate center is formed. The extension 25b is formed with a second nozzle hole in the shape of a truncated cone! Lb upper and lower Uy °, that is, the communication between the first nozzle hole 11a and the second nozzle hole lib When the diameter of the hole Ux (substantially circular) is D1, D1 is smaller than the first The diameter of the upper end of the nozzle hole 11b (the opening on the fluid discharge side) ny is 0. The outer diameter D3 of the extended portion 25b of the first electrode layer 25 that is formed in a ring shape is larger than the diameter D2. A second electrode layer 26 electrically connected to the first electrode layer 25 is formed on the inner wall of the nozzle hole nb. A part of the second electrode layer 26 is also equipped with 95731.doc -29- 200523123 on the fluid supply surface of the nozzle plate 8 On part 8b, as shown in FIG. 7 (c), a lead-out wiring 26a is formed and connected to a discharge signal voltage applying means (not shown in the figure). In addition, in FIGS. 7 (a) and 27 (C), in order to simplify the drawing, the first electrode layer 25 formed on each inner wall of the first nozzle hole 11a and the second nozzle hole lib constituting the blowing hole 11 is omitted. And the second electrode layer 26. Specific examples of the dimensions and materials of the parts will be described below, but the present invention is not limited to the specific examples. The bird spray layer 1 uses a polyimide film with a thickness of about 1, and the second nozzle layer 2 uses a thickness of about 1? 〇 μιη polyimide film. The first electrode layer has a thickness of 0-5 / xm and includes a metal material mainly composed of titanium, wherein a cylindrical portion 25a is formed to a fluid discharge side end portion of the inner wall of the first nozzle hole 1a. In addition, the outer diameter of the extension 1 (251) is about 20 / ^ 111. When an electrode layer or the like formed at the interface between the first mouthpiece layer 1 and the A-th sounding layer 2 is formed on the entire interface, it may cause warping due to the stress of the entire nozzle plate, but such extensions are sprayed separately. The structure in which the solid holes 11 are partially provided can reduce the charm caused by such stress. In addition, the thickness of the second electrode layer 26 is 0.5 division, and similarly contains a metal containing titanium as a main component. The second electrode layer 26 and the first electrode layer. As shown in FIG. 8, the connection portion 26b is in contact with the extension portion 25b of the first electrode layer ^ by a plane to ensure a high degree of connection reliability. … The diameter of the opening portion of the bird spray hole 11 a that becomes the fluid discharge hole 9 is about 3 mm. Since the first electrode layer 25 having a thickness of 0.5 μm is formed therein, the actual diameter (diameter) of the body discharge hole 9 is about It is 2 / m. In addition, the second nozzle 95731.doc -30- 200523123 has a diameter D2 of the upper and lower holes lly of 10 and the diameter of the mouth is 30 jicm. μΠ1 'is formed in the nozzle plate 8 which is the open structure of the fluid supply hole 12. In order to discharge ultra-small amount of fluid, it is necessary to make the fluid discharge hole 9 below ㈣_. The pore diameter (diameter) can be reduced to form a wide range of electric field, which can greatly reduce the voltage required to move the charge, that is, the voltage required to give the fluid the electrostatic charge required to attract the fluid. By using &amp;, since a high voltage of 2 V is not required as before, it is possible to improve the safety when using a fluid ejection device. * Especially when the shape is below, the electric field intensity distribution is effectively concentrated near the discharge surface of the fluid discharge hole, and the change in the distance from the counter electrode to the fluid protrusion hole of the nozzle does not affect the electric field intensity distribution. Thereby, the fluid can be discharged stably without being affected by the positional accuracy of the opposite electrode, the deviation of the material characteristics of the recording medium, and the thickness deviation. In addition, as described above, by concentrating the electric field intensity distribution near the discharge surface of the fluid discharge hole 9, a strong electric field can be formed in a narrow area, so that the amount of fluid that can be discharged can be made into a minute amount. Thereby, when the fluid is ink, the printed image can form a high resolution. In addition, the liquid-repellent layer 4 on the 'first nozzle layer 1 is formed by a molecular film of fluorine polymerization or silicon based on a thickness of about 0.05 μm. As described later, the liquid-repellent layer 4 removes the extra area covered step by step in the fluid discharge hole 9 by dry-type worming. In this embodiment, the shape of the fluid discharge hole 9 of the nozzle plate 8 which has a great influence on the spraying accuracy is determined by the degree of processing cancer of the 1 μm polyimide film, so the processing of the fluid discharge hole 9 The accuracy is very high, and the same as 95731.doc 200523123 can ensure very high spray accuracy. In addition, in order to improve the processing accuracy of the fluid discharge hole 9, and to reduce the film thickness of the first nozzle layer 1 exposed on the fluid discharge surface of the squeaking plate 8, a more accurate processing accuracy is obtained. At this time, by reducing the film thickness of the first nozzle layer 1, although the rigidity of the first nozzle layer 1 is reduced, the structural reliability of the fluid discharge hole 9 is reduced, but the first The two nozzle layers 2 are used to reinforce the first nozzle layer 丨, so that the structural properties of the first nozzle layer 丨 will not be reduced, and the shape accuracy of the fluid discharge hole 9 can be improved. That is, it is necessary to adopt such a structure when the nozzle-type flat plate 8 having the fluid discharge holes 9 of a small size is made. In addition, since the first electrode layer 25 is partially provided at each formation position of the nozzle hole, the first electrode layer 25 is electrically insulated from the first electrode layer arranged at the adjacent nozzle hole. Therefore, the exhaust signal can be applied to each channel separately, and there is less crosstalk, thereby improving the resolution of the drawn image. In addition, since the second nozzle hole Ub has a tapered shape, turbulent flow of the fluid is not easily generated inside the second nozzle hole lib, which can improve the discharge stability of the fluid, and because the inner wall of the nozzle hole 11b and the fluid supply surface make up for it The edges are widened, so it is possible to effectively suppress the breakage of the second electrode layer% extending to the fluid supply surface. In addition, by the liquid-repellent layer 4 formed on the fluid discharge surface of the nozzle plate 8, the fluid can be prevented from adhering to the vicinity of the fluid discharge hole 9. Outside of men, the material for the first electrode layer 25 is not limited to a metal material containing titanium as a main component. As long as it is the etching process of the second nozzle layer 2 and the stepwise etching of the liquid-repellent layer * covered in the sacrificial layer 5 and the fluid discharge hole 9 described later, a material with high resistance to the money | To the money carved gas (containing oxygen 95731.doc -32 · 200523123 electric water and s rat plasma, etc.) or etching maggots, etc.) high resistance to t A 虱, lice of potassium oxide solution) can. Specific iron, nickel, gold, ~ &quot;, sharp, etc. are: titanium, Ming, copper,-, can be selected by the combination of the above etching gas with two, two, and thorium metal materials, to choose. Similarly, the material used for the second electrode layer 26 is not limited to a metal material with Chin as the main component, as long as it is stepwise covered with the liquid-repellent layer 4 in the sacrificial layer 5 and the fluid discharge hole 9 described later. _, High resistance to materials that are etched, that is, engraved gas (electropolymerization and oxygen containing oxygen, two: or etchant (nitric acid, hydroxide)) and 俨 Λ? Ruler cold liquid temple) Materials. : "卞 Titanium, Ming, Copper, Ming, Iron, Nickel, Gold, Surface, ·, =, Sharp, etc. as the main component of the metal material, can be selected by the combination with the above-mentioned Qi or surname engraving. ', In addition, "for the first pouting voice", can be other than polyimide: Yazi :: not limited to polyimide. Also rSlQ ,. Bu Zhi-molecular organic materials, can also be oxidized stone 2 ) Fossil evening compound (Sl3N4) and other stone evening compound materials, or it can also be stone evening. The material used for the first nozzle layer 2 is not limited to polyimide. Mouth ^ Similarly, it can also be polystyrene For high-molecular organic materials other than amines, Γ may be a material of stone compounds such as oxygen cut and nitrogen cut, or may also be stone cut. + In addition, the second nozzle hole m in this embodiment is not limited to the first nozzle hole m. The conical frustum shape of the narrowing connection part of the nozzle hole 1U (conical angle shape is shown in Fig. 9, the nozzle plate 8 shown in Fig. 2). The surface 8a and the fluid supply surface are perpendicular to the so-called straight shape (cylindrical shape). On this day, the second nozzle hole 11b can flow The supply hole 12 makes the second nozzle hole 11b shown in Figs. 7 (a) to (c) 95731.doc -33- 200523123 smaller than the fluid supply hole formed by the shape of a truncated cone. This can improve the integration of the spray nozzle. In addition, as shown in FIG. 7 (b), when the nozzle plate 8 is used, the second electrode layer 26 is formed only on one side of the inner wall of the second nozzle hole 11b according to the manufacturing conditions, but as shown in FIG. 9 It can also be formed on the entire inner wall surface of the second nozzle hole 11b. By forming the nozzle plate 8 (8,) of the structure of this embodiment, the following functions ① to ⑤ can be exhibited. ① The fluid discharge hole 9 is of a caliber The nozzle flat plate 8 (8) 'below 8 _ can still form a structurally stable zero pole that can apply the discharge signal to the front end of the nozzle hole ii. ② On the fluid supply side of the second nozzle layer 2, by The second electrode layer 26 is separated to avoid electrical shorts between adjacent channels, and an exhaust signal can be easily applied to each channel with less crosstalk, thereby improving the resolution of the tracing image. ③ Since the second nozzle layer 2 can be maintained The rigidity of the nozzle plate 8 (8,), so the entire nozzle plate 8 ( 8.) The rigidity is improved and easy to handle. ④ The machining accuracy of the second nozzle hole m processed on the second nozzle layer 2 with a thicker film thickness is poor. The extension 25b of the first electrode layer 25 is stopped, so it does not affect the fluid discharge hole 9 that controls the fluid discharge amount. ⑤ Because the first electrode layer 25 and the second nozzle hole m formed in communication with the first nozzle hole ... The second electrode layer 26 is electrically connected, so the driving signal can be supplied from the fluid supply side of the nozzle plate 8 through the second electrode layer 26 ', so as not to supply the driving signal to the lead-out wiring for the first-generation Hongji layer 25. The electric field generated by 26a electrically damages the recording medium. 95731.doc 200523123 (Manufacturing method of nozzle plate) Next, a manufacturing method of the nozzle plate 8 according to this embodiment will be described. Fig. 10 (a) to Fig. 10 are explanatory diagrams of the manufacturing process of the flat nozzle 8 of the ytterbium type. First, a sacrificial layer is formed on a substrate 6 for temporary holding of any thickness including silicon, glass, and the like by wet plating (plating) using nickel. Further, a polyimide resin was applied on the sacrificial layer 5 by spin coating, and fired at 350 ° C for 2 hours to form a first nozzle layer. At this time, the thickness of the sacrificial layer 5 is 10 μm, and the thickness of the first nozzle layer 丨 is ^^^.

Next, an opening pattern of the first nozzle hole 1 is formed on the first nozzle layer with a photoresist, and the first nozzle hole 11a is processed by dry etching using a gas containing oxygen as a main component (refer to FIG. 1). 〇 (^).

The cost engraving method can process organic substances such as fluorene imine resin at high speed and high accuracy, and has high selectivity with that of sacrificial layer 5 (nickel is hardly etched). Therefore, the 'sacrifice layer 5 is not significantly damaged due to the above-mentioned processing, and the flatness of the surface of the sacrificial layer 5 can be maintained. Therefore, the flatness of the fluid discharge surface of the nozzle plate 8 formed on the surface of the sacrificial layer 5 is not deteriorated. In addition, since this processing is performed with a very high degree of accuracy, the famous engraved conditions with high anisotropy are used. In addition, as described by Pu Xinpu, Pu Shi, since the first nozzle layer 1 is extremely thin and only one, it is possible to process the first nozzle for discharging ultra-micro fluid with high accuracy.

Secondly, in the processing of the first nozzle hole U, "... A corner hole Ua-nozzle layer 1, a first electrode layer 25 is sputtered with a Feng + a knife-made Meng material. Advance: in the above" _ A photoresist pattern 27 (see FIG. 10 (b)) corresponding to the shape of the opening of the countersink is formed on the electrode layer 25. 1 This is because the above-mentioned first electrode layer 95731.doc • 35- 200523123 25 needs to be formed on the inner wall of the first nozzle hole na. Therefore, in order to improve the step-type coverage of the first electrode layer 25, the temperature is 30 °. Under the condition of chlorine pressure, the film thickness on a nozzle layer 1 was formed to 0.5 μm. The first electrode layer 25 was processed by electro-destructive dry etching using a gas containing argon as a main component, and the first electrode layer 25 was processed to have a diameter of about 20 Å remaining on the first nozzle layer i to become the above-mentioned extension 251). The shape is circular, and the photoresist is removed (see FIG. 10 (c)). § The processing steps are to suppress damage to the first electrode layer 25 (cylindrical portion 25a) formed on the inner wall of the first nozzle hole 11 &amp; and to remove the sacrificial layer 5 formed on the bottom of the first nozzle hole 11a. The first electrode layer was used, and φ was used for anisotropic worm | worming conditions. In addition, the extension portion partially remaining on the first nozzle layer is formed into a substantially circular shape at this time, but it does not need to be a substantially circular shape in the processing steps. As described later, as long as it is the second nozzle hole nb The upper sole may be arranged in the shape of the extension portion 25b formed by extending from the first nozzle hole "a" on the first nozzles. However, the nozzle plate is applied to the nozzle plate 8 of the electrostatic suction type fluid discharge device, and because the discharge signal is applied to the front end of the nozzle through the first electrode layer 25, the first electrode layer 25 is: The outer electric field is also concentrated at the end of the shape of the first nozzle layer. Because = the electric field at the end of the extension portion 25b concentrated on the above-mentioned first nozzle layer 1 is required to be uniform, the shape of the extension portion 25b must be processed to a shape close to a circular shape with high isotropy. Next, a second nozzle layer 2 is formed on the first nozzle layer 丨 and the first electrode layer 25 to a thickness of 20 (see FIG. 10 (d)). The second nozzle layer 2 is the same as No. 9573l.doc -36- 200523123-the nozzle layer 1 is coated with a coating type polyimide by a spin coating method, and fired at 35 ° C for 2 hours. And the thickness of 20μιη is formed. At this time, the first nozzle hole 11a is also buried with polyimide resin. The second nozzle layer 2 is formed based on the purpose of reinforcing the first nozzle layer with a thin film processed with high accuracy. The effect of improving the rigidity of the entire nozzle plate 8. The light concealment case 28 was formed on the second nozzle layer 2 by silk engraving eight times, and dry etching using a gas containing oxygen as its main component was performed. A frustum-shaped second nozzle hole ub is formed in the second nozzle layer 2 (see FIG.

⑺⑷). In addition, the dry etching described above may stop the extension portion 25a (25b) of the -electrode layer 2! Formed on the first nozzle layer 1. That is, the dry type of the gas containing oxygen as the main component has almost no first nozzle layer i formed by engraving a metal material with titanium as the main component. Therefore, dry etching does not require the first electrode layer h to be exposed. Then, the second nozzle layer 2 embedded in the first nozzle hole Ua can be easily removed in the previous step. In addition, the second nozzle hole Ub is guarded at the joint portion with the first nozzle layer r, and the second

The upper hole and the lower hole of the nozzle hole lib are patterned to be arranged in the portion 25b of the first electrode layer 25. When the taper angle shape of the second hole of the second hole is processed, the above-mentioned engraving is to make the #engraving rate of the light 1 and the pattern 28 equal to that of the polyimide resin of the second nozzle layer 2: The photoresist pattern ㈣ is post-baked for 60 minutes, and the photoresist pattern 28 is formed into a tapered shape, and the shape is transferred to the second nozzle layer 2 by ㈣.

That is, as shown in FIG. 11 (a), the engraving rate is approximately equal to the polyimide resin constituting the second nozzle layer 2, and a photoresist pattern with a tapered wall surface is formed. I 95731.doc -37- 200523123 and The photoresist pattern 28 is etched at the same speed as the etching of the second nozzle layer 2 to expand the edge of the photoresist pattern 28. At this time, as shown in FIG. 11 (b), the second nozzle layer 2 is also etched at the same time. As a result, as shown in FIG. U, the second nozzle layer 2 is formed to have a cone formed with a cone formed on the photoresist pattern 28. The corner wall surface 28 has a second nozzle hole lb of the same shape. In addition, at this time, since the photoresist pattern "is substantially equal to the etching rate of the second nozzle layer 2, the thickness of the photoresist pattern" must be formed = the thickness of the second nozzle layer 2 is thicker. The description of the portion of the first nozzle hole 11a formed in the first nozzle layer 1 is omitted in FIG. Next, on the second nozzle layer 2 are formed two electrode layers 26 including a metal material containing titanium as a main component. At this time, the ion beam sputtering method is used to suppress the scattering of titanium particles due to argon atoms under an argon gas pressure of 0.2 mTorr, and the substrate is tilted so that the titanium particles reach the direction of the arrow K, and are formed only in the second nozzle. One side of the inner wall surface of the layer 2 and a part of the second electrode layer% forms an electrical short circuit with the first electrode layer 25 (see FIG. 10 (a)). The film thickness is 0 5 ^ claw. In this way, the second electrode layer% is formed by incident titanium particles from an oblique direction, so that the second electrode layer 26 can be prevented from adhering to the first nozzle hole Ua, and thereby the shape change and blockage of the first nozzle hole 11a can be prevented. Next, a photoresist pattern 29 is formed on the second electrode layer 26 to cover a portion of the second nozzle hole 1 b and the second electrode layer% formed on the second nozzle layer 2 (see FIG. 10 (g)). The photoresist pattern 29 only needs to form a part covering the second nozzle hole nb and the second electrode layer 26 formed on the second nozzle layer 2, but in this embodiment, it is formed on the second nozzle layer 2. The second electrode layer 26 has a shape that can be processed into a circular shape having a diameter of approximately 50 mm. At this time, since the photoresist pattern 29 forms a buried second nozzle hole mountain, the thickness of the photoresist layer is very thick in the deepest region * of the second nozzle hole 95731.doc -38- 200523123 m. Therefore, the photoresist pattern must be used as a pattern of the photoresist. In addition, at this time, it is necessary to use the above-mentioned photoresist pattern 29 and use the second electrode layer 26 on the second spray layer 2 to form the lead-out wiring 26a. At this time, since it is not necessary to create the lead-out wiring 26a separately, the steps can be simplified. In addition, as described above, the lead-out wiring can be arranged on the opposite side of the recording medium via the nozzle plate 8, so that it can be sufficiently separated from the recording medium. Distance to avoid serious electrical damage to the recording medium caused by the electric field generated by the lead-out wiring. Secondly, according to the above-mentioned photoresist pattern 29, the second electrode layer 26 is processed by using argon as the main component to remove photoresist. Pattern 29 (Tea Photo Figure 1 () (h)). Since this processing step requires the second electrode layer to be processed into the desired shape, it is etched under the condition of highly anisotropic engraving. In addition, the system The photoresist pattern M is removed using a photoresist stripping solution. Next, after the photoresist pattern 29 is removed, it is immersed in an aqueous solution containing nitric acid and water as main components, only the sacrificial layer 5 is etched, and the nozzle plate 8 is taken out of the substrate 6 ( Fig. 10 (small. As mentioned above, due to the formation of the polyimide resin of the first nozzles and the second nozzle layer 2 and the formation of the stoppers or the exhaust hole layer ", the titanium is hardly corroded by the sacrificial layer 5 described above. Etching liquid etching, so that the shape change and structural reliability reduction caused by the etching of the sacrificial layer 5 can be avoided, and the liquid-repellent layer 4 is formed on the surface of the first nozzle layer 丨 where the sacrificial layer 5 is removed (Figure 10⑴). Considering the purpose of coating convenience, a fluoropolymer is used, and it is applied to the surface of the first nozzle layer i by stamping or the like, and a liquid-repellent layer having a thickness of 0.05 is formed with a sub film in between. In addition, the liquid-repellent layer 4 that covers the first nozzle hole step by step is formed after the liquid-repellent 95731.doc -39- 200523123 layer 4 is formed, and then it is removed using an oxygen-containing electrocut. This is a small limit. Water can be dry-etched from the side of the second nozzle hole by 1 lb. The damage degree of the spray-type plate 8 can be maximized as described above. Etching can form the first and second electrode layers 25, 26 of each channel on the μ-type flat plate 8 on which the electrostatically attracted fluid discharge clothing which discharges a very small amount of fluid is formed. Each channel applied the exhaust signal early and independently, so the string image was resolved In addition, since thin first nozzles can be formed, by controlling the film formation of the first electrode layer 25 formed on the inner wall of the first nozzle hole 11a, the film can be formed stably. It is near the fluid discharge hole 9. As a result, the resistance R from the tip of the electrode supply nozzle is stable, and the discharge characteristics between the channels are stable. In addition, the sacrificial layer 5 of this embodiment uses nickel, the first nozzle layer ^ and the second nozzle layer. Polyimide resin is used for the 2 series, μ is used for the first and second electrode layers, and titanium is used for the 26 series, but it is not limited to this combination. The sacrificial layer 5 is used for the first nozzle layer 1 except for nickel. , The second nozzle layer 2, the first electrode layer 25 and the second electrode layer% of the material combination, can use aluminum, copper and other materials soluble in nitric acid or KOH solution, or polyimide, etc. Material that can be etched by oxygen plasma. As the method for forming the sacrificial layer 5, in addition to electroplating, a vapor deposition method, a sputtering method, a coating method, or the like can be used depending on the material. &quot; &quot; As the first nozzle layer 1, the second nozzle layer 2, and the second electrode layer 26, a material that is slightly damaged by the etching of the sacrificial layer 5 can be used. In addition, the first electrode layer 25 95731.doc -40- 200523123 is a material that is resistant to both the sacrificial layer 5 and the second nozzle hole 刻. Here, Fig. 12 shows the materials used (sacrifice layer, first nozzle layer, first electrode layer, second electrode layer, second electrode layer) and processing method (first nozzle hole, first electrode layer, first ridge). The best example of the combination of the hole, the second electrode layer, and the sacrificial layer is removed. As shown in FIG. 12, the first what is interesting # # 贺贺鸣 层 1 and the second nozzle layer 2 are not limited to poly I Yayue Yue said that the southern molecular organic materials can also be selected from Shixi or Oxidized Shixi compounds. However, in order to dry-type carved stone Xixiu and Shixi, it is necessary to use a gas containing reaction gas. Titanium used in this embodiment has low resistance, so it is necessary to use a material such as gold or an inscription resistant material as the first electrode layer M or the second electrode layer 26. In addition, the first electrode layer 25 or the second electrode layer 26. In addition to titanium, the materials described in this table can also be used in accordance with the combination shown in Figure 12. In addition, the titanium of the "first-electrode layer 25" material, even if it uses four gaseous carbon (a mixed gas with oxygen Plasma can still be engraved at a faster speed. However, it is formed in titanium. The first nozzle layer (polyimide) is affected by the plasma of the above gas: the etching speed is faster than titanium, and it is greatly damaged. Therefore, the actual-one in the first electrode layer 25 and the second electrode layer 26 During patterning, dry etching using argon ions is used. The remaining etch rate of the two IT first electrode layers 25 or the second electrode layers 26, and the argon ions with small differences in the etching rate of the first nozzle layer 2 or the second nozzle layer 2. In the fifth method, the damage of the first nozzle layer 1 or the second nozzle layer 2 can be suppressed to a minimum, and the first electrode layer 25 or the second electrode layer can be patterned 95731.doc -41-200523123. In this embodiment, the sacrificial layer 5 is completely removed by etching, but it is not necessary to completely remove the sacrificial layer 5, and only the portion of the sacrificial layer 5 that is in contact with the first nozzle layer 1 can be removed from the substrate 6 by etching. Type flat plate 8. In addition, the liquid-repellent layer 4 is not limited to a fluoropolymer, and a silicon-based polymer film, DLC (similar to diamond carbon), etc. can also be used. By using the above processing steps, the above-mentioned ① ~ ⑤ Nozzle type flat plate 8. '

[Second Embodiment] Another embodiment of the present invention will be described below with reference to Figs. 13 to 16. In addition, for the convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted. (Nozzle-type flat plate) FIG. 13 (a) is a partial perspective view of a nozzle-type flat plate 80 of this embodiment, and FIG. 13 (b) is a cross-sectional view taken along line B_B of FIG. 13 (a). Nozzle-type plate ⑼ is formed

Two or more fluid discharge holes 9 are shown in Fig. 13 (2). In addition, Fig. 13 (c) is a perspective view of the nozzle plate ribs as viewed from the fluid supply side. ^ As shown in FIGS. 13 (a) to 13 (c), the nozzle plate 80 is formed at the first nozzle hole Ue of the first -1 purple layer 10, and is similar to the second nozzle hole in a tapered shape and is formed in the nozzle plate. In the fluid discharge surgery of 80, a surface electrode layer 81 'is formed to block the part on the fluid discharge side of the first-bouthole hole i ie, and the through hole formed in the surface electrode layer 81 is turned into a fluid discharge ^ 9. Then, the surface electrode layer 81 is electrically connected to the first electrode layer 25 formed in the first nozzle hole inner layer 95731.doc -42- 200523123, and can be self-nozzled through the first electrode layer 25 and the second electrode layer 26. A driving signal is applied to the fluid supply side of the plate 80. The 4 'second nozzle layer 20 is also one layer, but it may be two or more layers. In addition, in FIGS. 13 (a) and (c), the first electrode layer 25 formed on each inner wall of the first nozzle hole 丨 lc and the second nozzle hole lb constituting the nozzle hole 11 is omitted for simplicity. And the second electrode layer 26. Hereinafter, specific examples of the dimensions and materials of each part will be described, but the present invention is not limited to the specific examples. The surface electrode layer 81 is made of a metal material containing platinum as a main component, and is formed into a substantially circular shape with a diameter of 5 in order to reduce the stress of a flat plate 80. In addition, the thickness of the surface electrode layer 81 is 0.5 μm. The first nozzle layer of the original shape is composed of an organic material containing silicon oxide as a main component, and has a thickness of 2 μm. The second nozzle layer 20 contains an organic material containing polyimide resin as a main component, and forms a film thickness of ⑼ ^ ㈤. The first electrode layer 25 and the second electrode layer 26 are made of a metal material containing titanium as a main component, and formed into a film thickness of 0.5 μm. The mouth #lu of the fluid discharge hole 9 formed in the through hole 81a of the surface electrode layer 81 is 2 Mm, and the film surface is processed vertically to the communication portion with the first nozzle hole uc (through hole). At this time, for the same reason as in the first embodiment, the diameter of the fluid discharge hole 9 must be "10 µm or less", and more preferably ㈣㈣ or less. Sixth, in addition, the communication portion of the first nozzle hole 丨 lc and the fluid discharge hole 9, that is, the opening portion of the body discharge side is processed to a diameter of 4 μm, and processed into a fan shape to expand to the communication portion with the second nozzle hole 11b Taper angle shape (conical frustum shape) In addition, the connecting portion of the second nozzle hole 11b and the first nozzle hole Uc, that is, 95731.doc -43- 200523123, the opening on the fluid discharge side is processed to a diameter of 20 μm, which is enlarged in a sector The cone-shaped shape (conical frustum shape) passes through the second nozzle layer 20 and opens on the fluid supply surface 80b of the nozzle plate 80. In addition, the first conical frustum-shaped first nozzle hole 11c is upper and lower. It is a circular shape with the fluid discharge hole 9 as the center, and a part of the surface electrode layer 8 i forms the upper bottom llcy and is exposed. Therefore, the communication hole Ilex (substantially circular) of the fluid discharge hole 9 and the first nozzle hole Uc is exposed. The diameter of the second nozzle hole is smaller than that of the first nozzle hole 1. The outer diameter of the upper bottom 1 ley (outside of the above-mentioned communication hole lcx first nozzle hole}) is smaller than the first nozzle hole 11b. Upper bottom 丨 The first nozzle hole lie is The shape of the ring shape in the center, a part of the first electrode layer is formed by the upper bottom llby and exposed. Therefore, the diameter of the communication hole llbx (substantially circular) of the first nozzle hole Uc and the second nozzle hole lib is smaller than that of the second nozzle The upper diameter of the hole 1b is smaller than the outer diameter of the first nozzle hole (the shape of the second nozzle hole of the communication hole lbx) is small. In addition, at least a part of the inner wall of the first nozzle hole 11c is second at the first nozzle hole lief. The peripheral portion communicating with the nozzle hole 11b is formed with the second private electrode layer 25 which becomes the extension portion 25b. At this time, due to the oxidation of the first nozzle layer 10, the oxygen-containing electricity is processed during the processing of the _nozzle hole ib described in t. The dry-type surname is engraved with impatience, so the extension part of the first electrode layer 25 is not formed. Even if the second shell layer 10 or the first nozzle hole 11c is exposed to the second nozzle hole ⑽, it is almost not ㈣ '第 _Nozzle hole ⑴'s shape will not be deformed. 0 Conversely, when the first nozzle layer 10 is processed with the second nozzle hole 11b, the resistance is low 95731.doc -44 · 200523123 material (such as the case of the first embodiment, the -The nozzle layer 10 and the second nozzle layer 20 are the same material), the The electrode layer 25 must be formed to cover the entire inner wall of the first nozzle hole 11c. That is, in the processing step of the second nozzle hole &quot; b, the first electrode layer 25 plays a role in protecting the first nozzle hole mountain or the first nozzle layer. Avoid the function of the protective layer carved by #. In addition, a second electrode layer 26 electrically connected to the first electrode layer ^ is formed on the inner wall of the second nozzle hole 11b. In addition, a part of the second electrode layer ^ is also disposed on the The fluid-supply-side surface of the second nozzle layer 20 forming the fluid-supplying surface of the nozzle plate 80 is shown in Fig. 13 (a). It is connected to a driving signal voltage applying means not shown in the figure. The liquid-repellent layer 4 is formed of a polymer material having a thickness of fluoropolymer of 0-〇5 # m. In addition, since the surface electrode layer 81 has a method for engraving the first nozzle hole nc, the shape of the fluid discharge hole 9 is not deformed by the above-mentioned first spray UUlca. In addition, 'after the discharge of the fluid of the nozzle-type flat plate which has a great influence on the accuracy of spraying, the shape is determined by the processing accuracy of the above-mentioned titanium film which becomes the surface electrode layer 81, so fluid = hole The processing accuracy of 9 is very high, so that it can ensure a very high spraying accuracy. In addition, in order to improve the film thickness of the electrode 9 of the fluid discharge hole, although it is possible, the surface can be reduced with more accuracy. In order to improve the processing accuracy of the grain, the thickness of the surface electrode layer 81 is reduced, the rigidity of the surface electrode layer 81 is reduced, and the reliability of the structure of the discharge hole 9 is reduced. However, 'the nozzle layer 95731.doc -45- 200523123 〇 is arranged by contacting the surface electrode 如此 in this way, the surface electrode layer 81 can be reinforced without reducing the surface electrode layer. As a result, the accuracy of the shape of the fluid discharge hole 9 can be improved. Since the first-electrode layer 25 is highly resistant to the engraving means of the second nozzle hole claw, the shape of the first nozzle hole Ue is not greatly deformed by the processing of the second nozzle hole ib, and the first nozzle layer _ As a result of the over-etching of the second nozzle hole 11 b, it was completely removed. In addition, the material used for the outer surface electrode layer 81 is not a metal material with the beginning as the main blade. As long as it is the first nozzle hole mountain, the second nozzle hole m, and the sacrificial layer% described later, and the step of the liquid-repellent layer 4 covering the fluid discharge hole%, it has a high Financial materials, that is, as long as it is resistant to fluorine-containing plasma, oxygen-containing plasma, potassium nitrate aqueous solution of potassium oxide, etc., it can be engraved with sacrificial layers, hole processing and It is a combination of two nozzle hole processing methods. In particular, for example, the metallic materials including Shao, copper, Ming, iron, brocade, gold, and so on as the main components can be selected through the combination of the above-mentioned button gas or last name engraving agent. The other materials of the first nozzle layer 10, the second nozzle layer 20, the first electrode layer 25 and the second electrode layer 26 are not limited to those described above, and a preferable combination of the materials and the manufacturing method is described later. In addition, the second nozzle hole ib in this embodiment is a conical frustum shape (tapered angle shape) in which the communication hole (connecting portion) 11bx of the first nozzle hole He is narrowed, but f is not limited to this. The nozzle flat plate 80 according to the modification shown in FIG. 14 may also be formed in a so-called straight shape (cylindrical shape) in which the side wall of the first nozzle hole 1 ib is perpendicular to the stop layer 3. At this time, the fluid supply hole 12 95731.doc -46-200523123 of the second nozzle hole 11b can be made smaller, and the integrated degree of the nozzle can be further improved. In addition, as shown in FIG. 14, the second electrode layer 26 may also be formed on the entire inner wall surface of the second nozzle hole Ub. At this time, the reliability of the second electrode layer 26 with respect to electrical conduction is improved. In addition, at this time, one through-hole 81a 'is formed for one surface electrode layer corresponding to 丨 nozzle holes 丨 丨. However, it is also possible to form several through-holes in 丨 surface electrode layer 8ι. For 丨 nozzles, The hole 丨 丨 has a structure of a plurality of fluid discharge holes 9. In addition, as in the case of the nozzle plate 8 of the first embodiment, the first nozzle hole 1 lc may be formed into a so-called straight shape (cylindrical shape) whose side wall is perpendicular to the surface of the nozzle plate. At this time, since the machining accuracy of the _th nozzle hole is improved, the shape of the surface electrode layer 81 can be reduced, and the surface electricity: the stress generated by the layer 81 can be reduced. The nozzle-type flat plate 80 (80,) which forms the structure of this embodiment, besides the above items ① to ⑤, can also play the following functions. ⑥ Since the first nozzle hole Ue is formed in a tapered shape, the coverage of the first electrode layer 25 formed in the first nozzle hole 11C and the reliability of the conductivity are improved. ⑦ Because the through-holes formed on the surface electrode layer 81 of the thin film ... become the fluid discharge holes 9, the machining accuracy is very high, and the shape of the fluid discharge holes 9 is not changed by the formation of the first electrode layer 25, so the discharge reliability is improved . (Manufacturing method of spray-type flat plate) Next, a manufacturing method of the nozzle type flat plate 8g of this embodiment is demonstrated. 15 (a) to (g) are explanatory diagrams of a nozzle-type flat plate 80 manufacturing process. 95731.doc -47- 200523123 First, a sacrificial layer 50 is formed on the substrate 6 in the same manner as in the first embodiment (Fig. 15 (a)). At this time, the thickness of the sacrificial layer 50 is 10 mm. Further, a platinum film having a thickness of 0.05 is formed on the sacrificial layer 50 by a method such as vapor deposition, and the surface electrode layer 81 is partially formed on the nozzle hole n to form a W-blade shape by photo-etching and a fluid discharge hole. Photoresist pattern in the shape of 9 through holes 8 丨 &amp;. Then, the above-mentioned external shape of the surface electrode layer 81 and the fluid discharge hole 9 are simultaneously processed by a dry etching method. Since the platinum film is a chemically inert material, at this time, the dry etching method described above uses sputtering etching using argon, and physical processing is performed by a dominant method. In addition, since this process is performed with a very high degree of accuracy, it uses a highly anisotropic rhyme condition. At this time, the shape of the surface electrode layer 81 is processed into a substantially circular shape with a diameter of 5 µm. In addition, the fluid discharge holes 9 arranged inside the surface electrode layer 81 are formed into a substantially circular shape with a two diameters. Next, on the sacrificial layer 50 and the surface electrode layer 81, a first nozzle layer 10 including a silicon oxide film is formed by a p_cvD method. With this 1 &gt; &lt; 1) method%, the stress of the silicon oxide film formed can be controlled by the gas composition, gas pressure, and RF power used to generate the plasma for the film formation, and the step formation is The uniformity of the film is good, so the stepped portion of the surface electrode layer 8 丨 described above does not cause cracks and the like, and has high structural reliability. Therefore, the reliability of the overall structure of the nozzle plate is improved (see FIG. 150)). Next, a photoresist pattern is formed on the first nozzle layer 10 by photoetching, and is processed by reactive ion etching (RIE) containing fluorine gas and oxygen. After processing, the photoresist is removed by a photoresist stripping solution. Resistance (see Figure 15 (b)). This etching method 95731.doc -48- 200523123 method, because the fluorine activated by the plasma selectively reacts with silicon atoms, so the etching speed of silicon oxide is very high. On the other hand, as described above, since it is a chemically stable material, it hardly reacts with the aforementioned activated fluorine. Therefore, the etching speed of platinum is slow, whereby the etching can be stopped accurately at the interface between the surface electrode layer 81 and the first nozzle layer 10. In addition, this processing step is to set the etching speed of silicon oxide and photoresist to the same degree by using a plasma containing fluorine gas and oxygen. The first embodiment is used in the step of processing the second nozzle layer 20. A method reflecting the shape of the photoresist is used to process silicon oxide, and the first nozzle hole Uc is processed into a tapered shape. At this time, the shape of the first nozzle hole 11c located at the junction with the surface electrode layer 81 is formed into a substantially circular shape with a diameter of 4 μm, and the opening diameter of the interface with the second nozzle layer 20 is 6 μm. In addition, the shape of the first nozzle hole Uc is processed to be larger than the fluid discharge hole 9, and the fluid discharge hole 9 is arranged in the pattern of the first nozzle hole Uc. In addition, since the first nozzle hole 110 only needs to be bonded to the surface electrode layer 81, in addition to the tapered shape, it may be a so-called straight shape perpendicular to the nozzle surface. Next, by ion beam sputtering, a titanium film is formed in the direction of the arrow (18 is formed on the surface of the first nozzle layer 10), and a portion of the surface electrode layer 81 and the first nozzle hole lie and the first nozzle layer 10 are formed. A first electrode layer 25 having a thickness of 0.5 is formed thereon. At this time, the shape of the first nozzle hole i 丨 c and the thickness of the first nozzle layer 10 must be considered to determine the incident direction of the titanium particles, so as to prevent the titanium film from forming inside the fluid discharge hole 9 formed in the surface electrode layer 81. membrane. In addition, at this time, the substrate is fixed to form the first electrode layer 25. However, after setting the above-mentioned incident angle of 9573 l.doc -49- 200523123, the substrate can be suspected to be rotated by taking the normal direction of the nozzle surface as the center. A first electrode layer is formed on the sidewall of the first nozzle hole 11c. The thus formed first electrode material attached to the entire side wall of the first nozzle hole can play the role of the protective layer of the first nozzle hole mountain during the processing of the second nozzle hole described later. + Secondly, the dry-type method of the above-mentioned electrode layer 25 is shaped on the first back layer. This processing is performed using the processing method implemented when the second electrode layer 26 is processed in the first embodiment. That is, after forming a desired pattern with a positive-type photoresist, processing is performed by using a plasma using argon as a main component to dry it. At this time, the shape of the first electrode layer 25 disposed at the interface between the first nozzle layer 10 / and the second nozzle layer 20 is formed into a substantially circular shape with a diameter of M (see FIG. 15 (0). Secondly, in the first The second nozzle layer 2 () is formed on the nozzle layer 10 'to form a coating type polyimide film with a thickness of 20 mm' (refer to the figure). At this time, the above-mentioned coating type polyimide The resin was applied to the first nozzle layer 10 by a spin coating method, and was fired at 350 tT for 2 hours. At this time, the fluid discharge hole 9 and the first nozzle hole Uc were also polyimide resin. Buried. Secondly, on the above-mentioned second nozzle layer 20, a photoresist pattern is formed by light engraving, and dry engraving using a gas containing oxygen as a main component is performed to form a cone on the second nozzle layer 20. The second nozzle hole 11 b having an angular shape (conical frustum shape) (see FIG. 15 (e)). In addition, the above-mentioned dry etching may be performed by the first nozzle layer 10, the first electrode layer 25, or the surface electrode layer 81. That is, except for the first nozzle hole mountain, the exposed part of the first nozzle layer 10 or the -electrode layer 25 is not subjected to excessive dry etching 95731 .doc • 50-20 0523123. In addition, similarly, the surface electrode layer 81 is not exposed to the surface of the surface electrode layer 8i except for the above-mentioned fluid discharge hole 9. Excessive dry etching is not performed. That is, in the guarding process of the second nozzle hole m, The first nozzle hole 11c and the fluid discharge hole 9 buried by the polyimide resin in the previous step are reproduced by removing the polyimide resin, and the fluid discharge hole 9 is formed by a pattern formed on the surface electrode layer μ. The material of the second nozzle layer 20 existing in the determined shape is removed, and the shape buried in the polyimide resin in the previous step is reproduced.

Titanium particles are radiated to form the second electrode layer 26, which prevents the second electrode layer% from adhering to the fluid discharge hole 9, thereby preventing the shape change and blockage of the fluid discharge hole 9. Next, the photoresist pattern 70 is removed using a photoresist stripping solution, and a second electrode layer 26 containing a metal material containing titanium as a main component is formed on the second nozzle layer 20. Yin uses the low-level ion beam method at g_2 mT. &quot; Titanium particles scattered under the pressure of chlorine are scattered by argon atoms, and the substrate is tilted so that the particles reach the direction of the arrow K2, and are formed only on one side of the inner wall surface of the second nozzle layer 20. Part of the layer 26 is electrically short-circuited with the first electrode layer 25 (see Fig. Qiu)). The film thickness was 0.5 barriers. So, by entering from the oblique direction

The person-A knows that the second electrode layer 26 is processed. This step is the same as that of the first embodiment, and therefore it is omitted. The shape of the second electrode layer 26 formed on the second nozzle layer is a circular shape having a diameter of approximately 70 μm. Next, the nozzle plate 80 was removed from the substrate 6 by immersing only the sacrificial layer 50 'in an aqueous solution containing nitric acid and water as main components (Fig. 15B). As described, the beginning of the formation of the oxidized stone of the first-nozzle layer 10, the formation of the second imide resin of the second nozzle layer M and the formation of the surface electrode, and the formation of the first electrical 95731.doc -51. 200523123 ^ 与 弟The titanium of the two-electrode layer 26 is hardly engraved by the etching solution of the sacrificial layer 50, so that the shape change and structural reliability are not reduced due to the etching of the sacrificial layer 50. Next, the liquid-repellent layer 4 is formed on the surface of the first nozzle layer 10 (FIG. 15 (g)). At this time, a fluoropolymer is used for the purpose of considering the convenience of coating, and it is applied to the surface of the first nozzle layer 10 by a method such as stamping to form a liquid-repellent layer 4 with a polymer film. In addition, the liquid-repellent layer that covers the first nozzle hole step-by-step is formed after the liquid-repellent layer is formed by using an oxygen-containing plasma to dry-etch it from the 1 lb side of the second nozzle hole. This can minimize the damage and privacy of the nozzle plate 80. In this embodiment, the step coverage is removed by dry etching using an oxygen-containing plasma. However, in this embodiment, As described above, there is a surface electrode layer 81 having high resistance to dry etching using an oxygen-containing plasma on the fluid discharge surface. Since the surface electrode layer 81 determines the shape of the fluid discharge hole 9, the shape of the fluid discharge hole 9 It does not change due to the dry etching described above. Therefore, it is possible to form a nozzle hole with a very high precision. Specifically, each of the nozzle plate 80 having 200 fluid discharge holes 9 made using the steps of this embodiment is evaluated. When the shape of the fluid discharge hole 9 can be guarded with very high accuracy, the deviation is only ± Qi5. In addition, the nozzle plate 80 is very flat, and its warpage is also less than 10 / xm. In addition, this embodiment The sacrificial layer 50 is made of nickel, the surface electrode layer 81 is made of white oxide, the second nozzle layer 20 is made of polyimide resin, the first electrode layer 25 is made of titanium, and the second electrode layer is made of white oxide. 26 uses titanium, but is not limited to this combination. 95731.doc -52- 200523123 In addition to nickel, the sacrificial layer 50 can also be used for the surface electrode layer 81, the first I is the layer 10, and the second nozzle layer 20 The combination of the above materials uses aluminum, copper and other materials that are soluble in nitric acid or KOH solution. In addition, the method of forming the sacrifice layer 50 can be used in addition to electroplating. Shot method, coating method, etc. The second nozzle layer 20 and the second electrode layer 26 may be made of a material that is slightly damaged by the etching of the sacrificial layer 50. However, it is considered to be the same as that of the first nozzle layer or the surface electrode layer 81 described later. When the last name is selective, it must be an organic resin that can be used to describe the use of oxygen-containing electropolymerization. In addition, when using an organic resin with a two-part structure with a bridge reaction of each molecular bond, the second nozzle layer 2 Both heat resistance and environmental resistance can improve the reliability of the nozzle plate In addition, the first nozzle layer 10 and the first electrode layer 25 may be made of a material having high resistance to etching the sacrificial layer 50 and the second nozzle hole 11b. Furthermore, the surface electrode layer 81 may use the sacrificial layer 50. Materials with high resistance to etching, etching of the second nozzle hole, and the first nozzle hole 11 c. Figure 16 shows the materials used (sacrifice layer, surface electrode layer, first nozzle layer, second nozzle layer, first electrode Layer, the formation area of the first electrode layer, the second electrode layer) and the processing method (the fluid discharge hole, the first nozzle hole, the second nozzle hole, and the sacrificial layer are removed). As shown in FIG. —The nozzle layer 1G or the second nozzle layer 2 () can form a nozzle layer by a combination of an organic resin such as polystyrene and a silicon compound such as silicon oxide. However, if the combination of silicon oxide / silica and the combination of polyimide / polyimide is used in the processing of the second nozzle hole, the combination of the first nozzle layer ⑺ will be damaged. The inner wall of the hole Uc is fully formed with 9573l.doc -53- 200523123 first electrode layer 25 to protect the first nozzle hole Uc. In addition, in this embodiment, the sacrifice layer 50 is completely removed by _, and it is not necessary to completely remove the sacrifice layer 50. Only the portion of the sacrifice sound that is in contact with the first nozzle ㈣ can be removed from the substrate by the last name; Tablet 80. Γ Beam type Silicon-based high scores can also be used. In addition, the liquid-repellent layer 4 is not limited to a fluoropolymer film and DLC (diamond-like carbon). By using the nozzle plate 80 of the above processing steps. Can be manufactured to fulfill the above ① ~ ⑦ functions

In addition, as described in each of the embodiments', a structure in which the liquid-repellent layer 4 is not formed can be adopted. By not forming the liquid-repellent layer 4 on the surface electrode layer 81 or the first nozzle layer i, the shape accuracy of the fluid discharge hole 9 is further improved. In addition, as in the above embodiments, it may be a so-called laminate composed of a plurality of thin films including a surface electrode layer 81, a brother-clad electrode layer 25, a second electrode layer 26, and a metal film mainly composed of the above-mentioned materials. membrane.

In addition, each of the above-mentioned embodiments describes a method for manufacturing a nozzle plate δ.80 by forming a sacrificial layer Π on the substrate 6 and sacrifice the sacrificial layer 5.50 ', but in addition, if The first nozzle layer 1 · 10 is directly formed on a substrate, such as a nickel plate, containing a material that can be subjected to the same method as that of the sacrificial layer 5.50. In addition, the present invention is not limited to the above-mentioned various implementation states, and various changes can be made within the scope of the patent application. Appropriate combinations are separately disclosed in different implementation centroid technologies. The implementation forms obtained by using slaves are also included in Within the technical scope of the present invention. 95731.doc -54- 200523123 As mentioned above, the flat plate of the present invention is provided in the electrostatic discharge type fluid discharge device which is statically discharged from the fluid discharge hole at the front end of the nozzle and is applied by electromigration. And has a plurality of nozzles: its structure has: a thin first nozzle layer having a first nozzle: sub-arranged on the fluid discharge side; and at least one second nozzle layer i stacked on the first nozzle The fluid supply side of the layer is thicker than the second nozzle, and communicates with the first nozzle hole, and has a hole Mm with the first nozzle reduction nozzle hole; and an electrical connection is formed on the inner wall of the first nozzle hole. The first electrode layer and the electrode layer formed on the inner wall of the second nozzle hole. The nozzle plate from the above structure is on the first nozzle layer of the thin layer to the second nozzle layer stacked with a thick layer of V. Therefore, the strength and rigidity of the nozzle plate can be ensured by the second nozzle layer. Make the material of the first nozzle layer sufficiently thin. By reducing a— another layer of 厗, the first nozzle a formed in the mouth of the first-he mouth can superfinely form apertures such as 彳 Λ, ^ 10_, and can be formed on the inner wall of this ultra-fine-he-heming hole ，-The first electrode layer is formed stably in the direction of the layer as far as possible. 'The fluid is discharged from the surface. 4. Rishi, U _ The opening of the nozzle hole as the fluid discharge hole-α becomes the first electrode. Fluid exits near the hole. As a result, the resistance R of 1 ^ 円 4 in the nozzle can be greatly reduced compared with the previous, and the discharge frequency of the fluid can be increased, and the C recording medium can be inserted at a high speed. And because of this, a younger brother has an electrode layer and a second nozzle formed on the first nozzle?丨 + #, ^ Emperor and Brother electrode layers are electrically connected, so the drive signal can be supplied from the M-body discharge side of the nozzle-type plate via the second electrode layer. Therefore, &quot; t, the drive wiring for the drive signal to the electrode layer is not close to the media, 95731.doc -55- 200523123. The recorded media will not suffer electrical damage due to the electric field generated by the outgoing wiring. / The nozzle plate of the invention may also constitute the interface between the first electric second layer at the + th nozzle layer and the second nozzle layer, and extend from the -nozzle hole to the first, and the first electrode layer extends to the first. The part on the nozzle layer is electrically connected with the first electrode layer. In the above structure, since the first electrode layer is located at the interface between the first nozzle layer and the second nozzle layer and extends from the first nozzle hole to the first nozzle layer, the second electrode layer is electrically connected to the first electrode layer at the extended portion.性 连 #, because λ the first electrode layer and the second electrode layer &lt; the connection is not in the cross section of each electrode layer, but on the surface of the electrode layer. Therefore, although there are structures for connecting different electrode layers, k. The electrical connection of the non-electrode layer has high reliability, which can greatly reduce the risk that the drive signal cannot be effectively applied to the first electrode layer due to a disconnection, etc., and improve the discharge reliability. In addition, the nozzle plate of the present invention may further form the first electrode layer formed on the entire inner wall of the first nozzle hole. Because the above structure is formed with the first electrode layer on the inner wall of the first nozzle hole, a uniform electric field can be applied to the fluid in the fluid discharge hole. If the fluid discharge surface of the nozzle plate has a plurality of fluid discharge holes, the spray accuracy of each fluid discharge hole is different when the formation position of the Taylor connection is different, but the Taylor connection of each fluid discharge hole is thereby taken. The formation position is stable, which can improve the spraying accuracy. In addition, the nozzle plate of the present invention may further constitute the first electrode layer extending from the first nozzle hole to the first nozzle layer at the interface between the first nozzle layer and the second nozzle layer, and the second nozzle hole The opening on the communication side with the first nozzle hole 95731.doc -56- 200523123 is provided in the first electrode layer portion extending to the first nozzle layer. Because the above-mentioned structure is at the interface between the first nozzle layer and the second nozzle layer, and the portion where the first electrode layer extends to the first nozzle layer is provided with the opening portion of the second nozzle hole on the communication side with the first nozzle hole, When the second nozzle hole is engraved, the extension portion of the first electrode layer functions as a ㈣stop: to prevent the first nozzle hole or the first nozzle layer from being deformed due to the damage caused by the etching during the formation of the second nozzle hole. As described above, when the first nozzle layer outside the extended portion of the first electrode layer is engraved, the first electrode layer is separated from the nozzle plate and removed, but the nozzle can be stably manufactured by the above structure. Style tablet. The flat plate of the present invention can further constitute the openings on the fluid discharge side of the first and second nozzle holes and the nozzle holes that are larger than the fluid supply side. The upper structure is to form the first nozzle hole and / or the second nozzle hole with the fluid discharge side enlarged ^^ 4 隹 &amp; ^ ^, 'angular shape, so the inner wall surface of the nozzle hole is first sprayed: layer = second The angles of the surfaces of the pouting layer are obtuse. By I, when the second nozzle layer is formed from the first nozzle hole or the inner wall surface of the first nozzle hole to the surface of each nozzle layer, due to the angle formed by the inner wall surface and the nozzle layer surface, the danger of the layer: line is low , Can form an electrode layer with high conductivity and reliability. When the liquid is discharged from the nozzle to the tip of the nozzle, there is little danger of turbulence in the nozzle, and the discharged liquid can be supplied stably. : The nozzle plate of the invention can also be further structured = hole = fluid discharge side is equipped with a surface electrode layer with through holes, and the carcass discharge side openings of the plugged and dagger holes are formed. -57- 200523123 is connected, and the surface electrode layer is electrically connected to the first electrode layer. In the above structure, since the through hole of the surface electrode layer provided on the fluid discharge surface of the nozzle plate becomes the fluid discharge π, the surface electrode layer can be etched to process the fluid discharge hole which has a great influence on the spray accuracy of the discharged fluid. Thereby, the shape of the fluid discharge hole is more stable than the fluid discharge side opening of the first nozzle hole constituting the first electrode layer of the first electrode layer formed on the inner wall, and the spray accuracy is more stabilized. In addition, the nozzle-type flat plate of the present invention may further constitute a second electrode layer of the above-mentioned second nozzle layer closest to the fluid supply side. The fluid supply gauge of the second nozzle layer is electrically connected between adjacent nozzle holes. Separation. 'The above structure is because of the nozzle plate having a plurality of countersunk holes, the second electrode layer of the second nozzle layer closest to the fluid supply side is between the nozzle hole portions adjacent to the fluid supply side of the second nozzle layer. It is electrically separated, so it can drive pure nozzle holes independently, and can trace green with high resolution. ::: The nozzle-type flat plate of the present invention can further form the closest to the fluid :: The second electrode layer of the second nozzle layer is also formed on the surface of the &lt; IL body supply side of the second, s, on the surface It is patterned to form a lead-out wiring. _ 死 = Fabrication: Use the ΓΓΓ of the second nozzle layer closest to the fluid supply side! The fluid discharge side surface of the two nozzle layers is used as an electrical distribution separation second step. At the same time, the layer Α% s between adjacent nozzle holes . Therefore, the 'separation step' and the formation of the lead-out wiring VV become a step, the second electrode 内 1 of the inner wall of the simple hole is distributed. Since the same electrode layer is processed on the lead-out wiring system formed in the second "jade layer", 9573 l.do, • 58-200523123 Formed 'so the reliability of the connection between the second electrode layer and the lead-out wiring is very ancient. / In addition to the dagger, the nozzle plate of the present invention can also be advanced-further forming the opening σ portion of the fluid discharge side of the %% nozzle The diameter of the hole or the diameter of the through hole formed in the upper electrode layer is 8 μηι or less. 2) The aforementioned "by forming the diameter of the discharge hole of the nozzle to form the fine diameter of the sun" generates a local electric field, which can be reduced by forming a fine nozzle. The driving power μ at the time of discharge. This reduction of the driving power M is extremely beneficial to the miniaturization of the device and the high density of the nozzle. Of course, by reducing the driving voltage, it can also make: a cost-effective low-voltage driving driver, It is also possible to improve the safety in use. Furthermore, since the electric field strength required for the above discharge model depends on the local concentrated electric field strength, there is no need for a counter electrode. That is, the insulating substrate can be printed without the need for a counter electrode, the flexibility of the device structure is increased, and printing can also be performed for a thick insulator. Among them, the diameter of the fluid discharge hole of the nozzle as described above is as described above. The ground is set to φ8 μm or less, the electric field intensity distribution is effectively concentrated near the discharge surface of the fluid discharge hole, and the change in the distance from the counter electrode to the fluid discharge hole does not affect the electric field intensity distribution, so it is not affected by the position accuracy of the counter electrode, The effects of material characteristics and thickness deviations of redundant recording media allow stable fluid discharge. In addition, by effectively concentrating the electric field intensity distribution near the discharge surface of the fluid discharge hole, stable formation of strong fluid can be achieved in a narrow area. The electric field can surely discharge a very small amount of fluid, so that the printed image can reach a high resolution. As described above, the method for manufacturing a nozzle flat plate of the present invention includes a method of forming a sacrifice on a substrate with 95731.doc -59- 200523123. Layer; forming a first nozzle layer on the sacrificial layer; forming several first layers on the first nozzle layer A nozzle hole; on the first nozzle layer, the first pole layer is formed by including the inner wall surface of each first nozzle hole; the above is processed in a manner that remains on the inner wall of each first nozzle hole and around the first nozzle hole # A first electrode layer; on the first nozzle layer, a second nozzle layer is also formed by covering each of the remaining first electrode layer portions; and a plurality of second nozzle holes are formed on the second nozzle layer so that each second The opening of the nozzle hole on the fluid discharge side is stored in the first electrode layer portion remaining on the first nozzle layer; on the second nozzle layer, the inner J surface of each second nozzle hole is included: Two electrode layers; and holes by means of electrical separation between adjacent ones, so that, on a substrate with high rigidity, a first ⑨ electrode layer, a second nozzle layer, and a second electrode layer are sequentially stacked through a sacrificial layer. Therefore, after the photoresist pattern is formed by industrial technology, the heart can be formed by dry silver engraving with mouth holes and a Γ shape. Therefore, the first spray nozzle-nozzle hole, the first electrode layer, and Second electrode layer. In addition, since the fluid of the nozzle flat plate reaches the final stage of the step, ... the system is protected by the sacrificial layer ▼ Jun. Therefore, in the flat flat plate manufacturing step, the discharge hole is not damaged and the nL is increased. The yield rate of the nozzle-type flat plate is further improved. In addition, the manufacturing method of the nozzle-type flat plate of the present invention can be further improved by forming the first step on the sacrificial layer and forming the first sacrificial layer on the sacrificial layer. The surface electrode layer is separated from the formation part of the nozzle hole. &Quot; The surface electrode layer is formed in each separation part 95731.doc -60- 200523123 == a perforation step; the first nozzle on the sacrificial layer is formed. The step of forming a layer includes forming a first nozzle layer on the separated surface electrode layer. Method for manufacturing a two-nozzle flat plate 'Since the fluid discharge hole can be processed as a through hole formed on the sacrificial and electric layer, the shape of the flow-out hole is not caused by the formation of the first electric material in the first nozzle hole. The production body is shaped by a "knife cloth", and a nozzle-type flat plate with higher accuracy of the L-body discharge hole can be manufactured. In addition, the manufacturing method of the nozzle-type flat plate of the present invention further forms the above-mentioned second electrode sound. The film-forming surface is incident. Θ ^, on the surface of the mouth-type flat plate, the method of manufacturing the flat plate of self-orthogonal ^ outer square is further, and the film-forming particles can also be incident on the surface. The oblique incidence of the abdomen + nozzle hole side wall with 20% of the electrode layer (first-, second) pairs of yin ...: good in nature. Furthermore, for sputtering dry or steam source shape ... no electrode layer is formed Therefore, the first nozzle when the layer can be layered; ^ Take a package of through-holes of the electrode surface electrode layer, etc. = the portion formed on the surface of the shadow when the first electrode layer is formed, and the area where the electrode layer is formed β ^ The area where the electrode layer is formed with the area where the electrode layer is not formed The adhesion of the electrode layer. I can be extracted into the nozzle hole of the electrode layer: "outside" the method of manufacturing the nozzle plate of the present invention-== the second nozzle hole step _ the resistance of the second layer, compared to the first Two sprays and two sprays: 9573l.d0 &lt; -61-200523123 pieces. As a result, the first electrode layer can stop the etching for forming the second nozzle hole with good accuracy, so the first nozzle hole and the first nozzle layer No damage is caused by excessive etching of the second nozzle hole, and a nozzle plate with high shape accuracy can be manufactured.

In addition, the manufacturing method of the nozzle plate of the present invention is further advanced. In the step of forming the first nozzle hole and the step of forming the second nozzle hole, the etching resistance of the above-mentioned surface electrode layer is selected by using etching to compare with the first And the condition that the second nozzle layer has high resistance to etching. As a result, the surface: the electrode layer w 遭受 is damaged due to excessive engraving when the first nozzle hole is formed or excessive ㈣ when the second nozzle hole is formed. Therefore, the fluid discharge holes of the through-holes of the surface electrode layer are not deformed due to excessive deformation, which leads to deterioration in accuracy, and a nozzle-type flat plate with high spray accuracy can be stably manufactured.

In addition, in the method for manufacturing a nozzle plate according to the present invention, the step of electrically separating the second electrode layer is further performed using dry etching. Therefore, because the second electrode layer is separated and processed by dry money engraving, the shape of this processing is high, and because the material in the processed area is removed in a gaseous state: the material of the polar layer ', thus avoiding the dust generated by accompanying processing such as chips. ^ The nozzle hole is blocked by the purple hole in the soil. Therefore, a nozzle plate with high discharge reliability can be stably produced. The specific implementation patterns or examples in the implementation item are only for the purpose of explaining this test: The technique # 内 谷 者 'should not be interpreted narrowly to be limited to this specific example, ^ Within the scope of the Chinese patent, the name can be implemented as 95731.doc • 62- 200523123. [Brief description of the figure] Field intensity Fig. 1 is an explanatory diagram for calculating two nozzles in the basic discharge model of the present invention. Correlation Figure 2 is a model calculation result showing surface tension pressure, electrostatic pressure and nozzle flexibility. Model calculation results of the correlation between Figure 2 and Figure 3 show the discharge pressure and nozzle diameter. Figure 0

Fig. 4 is a graph showing the results of the correlation between the discharge limit voltage and the nozzle diameter. FIG. 5 is a graph showing the relationship between the mirror image force between the charged droplet and the substrate and the distance between the nozzle and the substrate. Fig. 6 is a model calculation result diagram showing the correlation between the flow rate from the nozzle and the applied voltage.

Figs. 7 (a) and 7 (c) are stand-up diagrams showing a nozzle plate according to an embodiment of the present invention. Fig. 7 (b) is a sectional view taken along line A-A 丨 in Fig. 7 (a). Fig. 8 is an explanatory view showing a connection portion between the first electrode layer and the second electrode layer of the nozzle plate. Fig. 9 shows a modification of the nozzle plate according to this embodiment, and corresponds to the cross-sectional view of Fig. 7 (c). Fig. 10 (a) and Fig. 10 (a) are explanatory diagrams showing the nozzle-type flat plate manufacturing method according to the present embodiment by a cross-sectional structure. Figs. 11 (a) to U (c) are diagrams illustrating the steps shown in Fig. 10 (e) in more detail through the sectional structure of the nozzle plate. 95731.doc -63 · 200523123 Fig. 12 is an explanatory diagram showing a preferred combination of materials and processing methods for each layer when the nozzle flat plate of this embodiment is manufactured. Figs. 13 (a) and 13 (c) are perspective views showing a nozzle plate according to another embodiment of the present invention, and Fig. 13 (b) is a sectional view taken along line B-B of Fig. 13 (a). Fig. 14 shows a modification of the nozzle plate of another embodiment, and is a cross-sectional view corresponding to Fig. 13 (c). Figs. 15 (a) to 15 (g) are explanatory diagrams showing a method for manufacturing the above-mentioned nozzle plate according to another embodiment by the structure of the cross section. Fig. 16 is an explanatory diagram showing a preferred combination of materials and processing methods for each layer when a nozzle plate of another embodiment is manufactured. Figure Π is a schematic cross-sectional view of a conventional electrostatic suction inkjet device. 18 (a) to 18 (c) are explanatory diagrams of the meniscus formed by the ink of the inkjet device shown in FIG. FIG. 19 is a schematic configuration diagram of another conventional electrostatic suction type ink nozzle device. Fig. 20 is a schematic cross-sectional perspective view of a bird's clothing rental section of the ink jet device shown in Fig. 19; An illustration of the principle. Particles when a voltage is applied. Fig. 21 is an ink discharge diagram of the inkjet device shown in Fig. 19. Fig. 22 is an explanatory diagram of the state of the inkjet device shown in Fig. 19 at a nozzle portion. Figure 2 3 is an explanatory diagram of the principle of rye spray as shown in Figure 19. Γ :) forming a microparticle body in the T mouth part: FIG. 24 is an explanatory diagram of the ink formation meniscus of the inkjet device shown in FIG. 19, and FIG. 25 is a schematic view of the electrostatic discharge bow type fluid row W Structure 95731.doc -64- 200523123 25 (b) is its equivalent circuit. Fig. 26 is a side sectional view of a conventional nozzle type flat plate used for an electrostatic attraction type inkjet device. Fig. 27 is a sectional view showing the structure of a recording head of a conventional electrostatic attraction type ink jet device. Fig. 28 is a partially enlarged sectional plan view showing an ink discharge hole of a recording head portion of the electrostatic attraction type ink jet device of Fig. 27; [Description of main component symbols] 1 First nozzle layer 2 Second nozzle layer 4 Liquid-repellent film 5 Sacrifice layer 8 Nozzle plate 9 Fluid discharge hole 10 First nozzle layer 11 Nozzle hole (nozzle hole portion) 11a First nozzle hole 11c first nozzle hole lib second nozzle hole 20 second nozzle layer 25 first electrode layer 25b extension (extended first electrode layer portion) 26 second electrode layer 50 sacrificial layer 95731.doc -65- 200523123 80 81 nozzle Surface electrode layer

95731.doc 66-

Claims (1)

200523123 Scope of patent application: 1. A nozzle type flat plate, which is located in an electrostatic suction type fluid discharge system. The fluid discharge hole at the front end of the nozzle is discharged by electrostatic attraction. The fluid charged by voltage is provided with several nozzles. The hole portion is provided with a first nozzle layer having a binding layer, which is provided with a first nozzle hole, and is disposed on the fluid discharge side; and, a bird hole, a sub-hole has at least a second layer nozzle layer, and a fluid supply side thereof, Thicker than the above-mentioned nozzle layer, and: ^ nozzle layer nozzle hole; and the tweeter hole constitutes the second% of the nozzle hole, and is connected to form the first nozzle hole inner film on the second nozzle hole inner wall. Two electrode layers: 胄 electrode layer and formation 2. If requested, the nozzle plate, the interface between the basin nozzle layer and the second nozzle layer, from the M second electrode layer on the first nozzle sound, u ,. To the first addiction, the second electrode layer extends to the first electrode layer, and is electrically connected to the first electrode layer. The part on the bird layer 3. The inner wall of the first nozzle hole is as described in the nozzle plate. The elder brother-electrode layer is formed on the nozzle plate as described above. The interface between a nozzle layer and a second nozzle layer, the pole layer is on the above-mentioned nozzle layer, and the hole of the second nozzle hole is extended to the first opening portion and is located within the communication of the first nozzle hole. The first electrode layer part 5. If the nozzle plate of the requester, Jiang Di Yihe mouth and / or the second 95731.doc 200523123 nozzle hole are larger than the fluid discharge side to form the opening on the fluid supply side. The nozzle plate of claim 1, wherein a surface electrode layer having a through hole is disposed on the fluid discharge side of the first nozzle hole so as to block the opening portion of the fluid discharge side of the first nozzle hole. The spray is connected by holes, and the surface electrode layer is electrically connected to the first electrode layer. 7. The nozzle-type flat plate of claim 1, wherein the second electrode layer of the second nozzle layer on the fluid supply side is located there. The fluid supply side of the second nozzle layer is electrically separated from adjacent nozzle hole portions. 8. The nozzle-type flat plate of claim 7, wherein the second electrode layer of the second nozzle layer on the fluid supply side is also the second electrode layer. Formed in The fluid supply side surface of the second nozzle layer is patterned on the surface to form the lead-out wiring. 9 · The nozzle plate of claim 1, wherein the diameter of the opening on the fluid discharge side of the first nozzle hole is formed. The diameter of the through hole in the surface electrode layer is 8 // m or less. 10. A method for manufacturing a nozzle plate is characterized by having the following steps: forming a sacrificial layer on a substrate; and forming a first on the sacrificial layer. A nozzle layer; forming a plurality of first nozzle holes on the first nozzle layer, and including the first electrode layer on each of the first nozzle layers; an inner wall surface of the nozzle hole and a portion around the nozzle hole; Remaining on the inner wall of each first nozzle hole and each first method, the above-mentioned first electrode layer is processed; each remaining first electrode layer portion is also formed on the above-mentioned first nozzle layer to form a second nozzle layer; 95731.doc 200523123 at ^ The second nozzle layer is formed by storing a plurality of second nozzle holes in the openings on the discharge side of the body of each second nozzle hole in the first pole layer 残留 remaining on it; Floor / On the second mouth and mouth layer of Shishu, the inner wall surface of each second mouth and mouth is formed to form a first electrode layer, and the second electrode is processed by means of electrical separation between the connected second nozzle holes. Floor. 11. The manufacturing method of the nozzle type flat plate as described in item H), wherein the step of forming a sacrificial layer on the substrate and the step of forming a first nozzle layer on the sacrificial layer include: forming a surface electrode layer on the sacrificial layer; A step of separating the surface electrode layer corresponding to the nozzle hole portion forming portion and forming a through hole in each separating portion; the step of forming the first nozzle layer on the sacrificial layer also includes forming on the separated surface pen layer First nozzle layer. 12. The method for manufacturing a nozzle-type flat plate according to t, in which in the above step of forming the second electrode layer, film-forming particles are incident on the surface of the nozzle-shaped flat plate from an oblique direction. 13. The method for manufacturing a nozzle plate as described above, wherein in the above-mentioned step of forming the first electrode layer, film-forming particles are incident on the surface of the nozzle plate from an oblique direction. The method for manufacturing a nozzle-type flat plate of Nu Ming seeking item 10 or 11, wherein in the above-mentioned step of forming the first nozzle hole, etching is used to select the first electrode layer which is more resistant to money engraving than the second nozzle mouth layer. Conditions for high resistance to engraving 0 95731.doc 200523123 1 5 · The method for manufacturing a nozzle-type flat plate as claimed in item 11, wherein the step of forming the first nozzle hole and the step of forming the second nozzle hole use etching The condition that the surface electrode layer has a higher resistance to a single engraving than the first and the second mouth layers to a money engraving is selected. 16. A method for manufacturing a nozzle-type flat plate as described in the claim, the dry separation is performed in the step of isolating the second electrode, Yoshihana Satoshi Co., Ltd., T. 95731.doc