JP2007152870A5 - - Google Patents
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- JP2007152870A5 JP2007152870A5 JP2005354697A JP2005354697A JP2007152870A5 JP 2007152870 A5 JP2007152870 A5 JP 2007152870A5 JP 2005354697 A JP2005354697 A JP 2005354697A JP 2005354697 A JP2005354697 A JP 2005354697A JP 2007152870 A5 JP2007152870 A5 JP 2007152870A5
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- JP
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- Prior art keywords
- nozzle
- plate
- liquid
- nozzle plate
- diameter
- Prior art date
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Claims (13)
前記ノズルプレートは、
前記ノズルの吐出孔が形成されている面がフラットで体積抵抗率が1015Ω・m以上のガラスからなる第1プレートと、
前記第1プレートに重ねて、該第1プレートの前記吐出孔に連通する大径穴を有する体積抵抗率が1015Ω・m以上の樹脂又はガラスからなる第2プレートと、で積層構成されていることを特徴とするノズルプレート。 In a nozzle plate used for a liquid discharge head having a nozzle from which liquid is discharged as droplets from a discharge hole,
The nozzle plate is
A first plate made of glass having a flat surface on which the discharge holes of the nozzle are formed and a volume resistivity of 10 15 Ω · m or more;
And a second plate made of a resin or glass having a volume resistivity of 10 15 Ω · m or more and having a large-diameter hole communicating with the discharge hole of the first plate, overlaid on the first plate. A nozzle plate characterized by
体積抵抗率が10Volume resistivity is 10 1515 Ω・m以上のガラス基板にフォトリソグラフィ処理及びドライエッチング処理を行い前記吐出孔を設けることで、前記ガラス基板を第1プレートとする第1プレート製造工程と、A first plate manufacturing process using the glass substrate as a first plate by performing photolithography processing and dry etching processing on a glass substrate of Ω · m or more and providing the discharge holes;
体積抵抗率が10Volume resistivity is 10 1515 Ω・m以上の樹脂基板又はガラス基板に前記第1プレートに重ねて、該第1プレートの前記吐出孔に連通する大径穴を設けることで、前記樹脂基板又は前記ガラス基板を第2プレートとする第2プレート製造工程と、The resin substrate or glass substrate is overlapped with the first plate on a resin substrate or glass substrate of Ω · m or more, and a large-diameter hole communicating with the discharge hole of the first plate is provided. A second plate manufacturing process,
前記第1プレートに設けた前記吐出孔と前記第2プレートに設けた前記大径穴とが連通するように該第1プレートと該第2プレートとを貼り合わせる工程と、を有することを特徴とするノズルプレートの製造方法。Bonding the first plate and the second plate so that the discharge hole provided in the first plate and the large-diameter hole provided in the second plate communicate with each other. A method for manufacturing a nozzle plate.
前記ガラス基板に金属膜を設ける工程と、Providing a metal film on the glass substrate;
前記金属膜にフォトリソグラフィ処理及びエッチング処理を行い前記吐出孔の金属膜のパターンマスクを形成する工程と、Performing a photolithography process and an etching process on the metal film to form a pattern mask of the metal film of the discharge hole;
前記吐出孔の金属膜のパターンマスクを用いてドライエッチング処理を行い前記吐出孔を形成する工程と、Forming a discharge hole by performing a dry etching process using a pattern mask of the metal film of the discharge hole;
前記金属膜を除去する工程と、を有することを特徴とする請求項6に記載のノズルプレートの製造方法。The method of manufacturing a nozzle plate according to claim 6, further comprising a step of removing the metal film.
前記ノズルプレートと貼り合わせることで、前記ノズルに連通するキャビティとなるキャビティ溝が形成されたボディープレートとを備え、A body plate in which a cavity groove serving as a cavity communicating with the nozzle is formed by bonding with the nozzle plate,
前記ノズル内の液体と前記ノズルプレートの液滴を吐出する面に対向して設けられた基材との間に形成される電界から受ける静電吸引力により液滴を吐出し前記基材に着弾させる液体吐出ヘッドにおいて、The droplets are ejected by the electrostatic attraction force received from the electric field formed between the liquid in the nozzle and the substrate provided opposite to the droplet ejection surface of the nozzle plate, and land on the substrate. In the liquid discharge head to be
前記ノズルプレートは、請求項1乃至5の何れか一項に記載のノズルプレート又は請求項6乃至11の何れか一項に記載のノズルプレートの製造方法により製造されるノズルプレートであって、The nozzle plate is a nozzle plate manufactured by the nozzle plate according to any one of claims 1 to 5 or the nozzle plate according to any one of claims 6 to 11,
前記ノズルの前記吐出孔から吐出される液体と前記基材間に静電電圧が印加されて静電吸引力を発生させる静電電圧印加手段を備えていることを特徴とする液体吐出ヘッド。A liquid discharge head, comprising: an electrostatic voltage applying unit that generates an electrostatic suction force by applying an electrostatic voltage between the liquid discharged from the discharge hole of the nozzle and the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005354697A JP4807060B2 (en) | 2005-12-08 | 2005-12-08 | Nozzle plate, nozzle plate manufacturing method, and liquid discharge head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005354697A JP4807060B2 (en) | 2005-12-08 | 2005-12-08 | Nozzle plate, nozzle plate manufacturing method, and liquid discharge head |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007152870A JP2007152870A (en) | 2007-06-21 |
JP2007152870A5 true JP2007152870A5 (en) | 2009-01-22 |
JP4807060B2 JP4807060B2 (en) | 2011-11-02 |
Family
ID=38237811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005354697A Expired - Fee Related JP4807060B2 (en) | 2005-12-08 | 2005-12-08 | Nozzle plate, nozzle plate manufacturing method, and liquid discharge head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4807060B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101325939B1 (en) * | 2011-10-24 | 2013-11-07 | 전자부품연구원 | Method for manufacturing droplet delivery nozzle and electrostatic droplet delivery apparatus using nozzle manufactured by the mathod |
KR102290907B1 (en) * | 2015-02-06 | 2021-08-18 | 세메스 주식회사 | Unit for supplying chemical and Apparatus treating substrate with the unit |
JPWO2023276009A1 (en) * | 2021-06-29 | 2023-01-05 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001179988A (en) * | 1999-12-24 | 2001-07-03 | Ricoh Co Ltd | Nozzle forming member, ink jet head and ink jet recorder |
JP2002144581A (en) * | 2000-11-09 | 2002-05-21 | Ricoh Co Ltd | Ink jet head and its nozzle forming method |
JP3956224B2 (en) * | 2002-09-24 | 2007-08-08 | コニカミノルタホールディングス株式会社 | Liquid ejection device |
-
2005
- 2005-12-08 JP JP2005354697A patent/JP4807060B2/en not_active Expired - Fee Related
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