TWI257162B - Overhang support for a stacked semiconductor device, and method of forming thereof - Google Patents
Overhang support for a stacked semiconductor device, and method of forming thereofInfo
- Publication number
- TWI257162B TWI257162B TW093134432A TW93134432A TWI257162B TW I257162 B TWI257162 B TW I257162B TW 093134432 A TW093134432 A TW 093134432A TW 93134432 A TW93134432 A TW 93134432A TW I257162 B TWI257162 B TW I257162B
- Authority
- TW
- Taiwan
- Prior art keywords
- die
- forming
- semiconductor device
- stacked semiconductor
- preferred
- Prior art date
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- Power Engineering (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56969104P | 2004-05-10 | 2004-05-10 | |
US10/881,605 US7116002B2 (en) | 2004-05-10 | 2004-06-30 | Overhang support for a stacked semiconductor device, and method of forming thereof |
Publications (2)
Publication Number | Publication Date |
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TW200537670A TW200537670A (en) | 2005-11-16 |
TWI257162B true TWI257162B (en) | 2006-06-21 |
Family
ID=35476405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW093134432A TWI257162B (en) | 2004-05-10 | 2004-11-11 | Overhang support for a stacked semiconductor device, and method of forming thereof |
Country Status (4)
Country | Link |
---|---|
US (1) | US7116002B2 (zh) |
JP (1) | JP2005322887A (zh) |
CN (2) | CN100424871C (zh) |
TW (1) | TWI257162B (zh) |
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TWI424525B (zh) * | 2010-05-28 | 2014-01-21 | Nanya Technology Corp | 晶片封裝體的承載裝置及承載組件 |
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US20070109756A1 (en) * | 2005-02-10 | 2007-05-17 | Stats Chippac Ltd. | Stacked integrated circuits package system |
US7365417B2 (en) * | 2006-01-06 | 2008-04-29 | Stats Chippac Ltd. | Overhang integrated circuit package system |
US8629537B2 (en) * | 2006-01-23 | 2014-01-14 | Stats Chippac Ltd. | Padless die support integrated circuit package system |
US7449369B2 (en) * | 2006-01-23 | 2008-11-11 | Stats Chippac Ltd. | Integrated circuit package system with multiple molding |
KR100764682B1 (ko) * | 2006-02-14 | 2007-10-08 | 인티그런트 테크놀로지즈(주) | 집적회로 칩 및 패키지. |
JP4954569B2 (ja) * | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | 半導体装置の製造方法 |
TWI339436B (en) * | 2006-05-30 | 2011-03-21 | Advanced Semiconductor Eng | Stackable semiconductor package |
TWI298198B (en) * | 2006-05-30 | 2008-06-21 | Advanced Semiconductor Eng | Stackable semiconductor package |
US20080042265A1 (en) * | 2006-08-15 | 2008-02-21 | Merilo Leo A | Chip scale module package in bga semiconductor package |
TWI317993B (en) | 2006-08-18 | 2009-12-01 | Advanced Semiconductor Eng | Stackable semiconductor package |
JP5166716B2 (ja) * | 2006-09-26 | 2013-03-21 | 積水化学工業株式会社 | 半導体チップ積層体及びその製造方法 |
US7635913B2 (en) * | 2006-12-09 | 2009-12-22 | Stats Chippac Ltd. | Stacked integrated circuit package-in-package system |
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US8956914B2 (en) * | 2007-06-26 | 2015-02-17 | Stats Chippac Ltd. | Integrated circuit package system with overhang die |
US20090032926A1 (en) * | 2007-07-31 | 2009-02-05 | Advanced Micro Devices, Inc. | Integrated Support Structure for Stacked Semiconductors With Overhang |
TW200952149A (en) * | 2008-06-02 | 2009-12-16 | Kun Yuan Technology Co Ltd | Stack structure of integrated circuit with caulking element |
JP2010040835A (ja) * | 2008-08-06 | 2010-02-18 | Toshiba Corp | 積層型半導体装置の製造方法 |
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KR20110133945A (ko) * | 2010-06-08 | 2011-12-14 | 삼성전자주식회사 | 스택 패키지 및 그의 제조 방법 |
US9287249B2 (en) * | 2012-04-11 | 2016-03-15 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
KR20140078472A (ko) * | 2012-12-17 | 2014-06-25 | 에스케이하이닉스 주식회사 | 칩 패키지 제조 방법 및 제조 장비 |
US20150221570A1 (en) * | 2014-02-04 | 2015-08-06 | Amkor Technology, Inc. | Thin sandwich embedded package |
JP6483498B2 (ja) | 2014-07-07 | 2019-03-13 | ローム株式会社 | 電子装置およびその実装構造 |
TWI582916B (zh) * | 2015-04-27 | 2017-05-11 | 南茂科技股份有限公司 | 多晶片封裝結構、晶圓級晶片封裝結構及其製程 |
US9947642B2 (en) | 2015-10-02 | 2018-04-17 | Qualcomm Incorporated | Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages |
US10163871B2 (en) | 2015-10-02 | 2018-12-25 | Qualcomm Incorporated | Integrated device comprising embedded package on package (PoP) device |
US10636767B2 (en) * | 2016-02-29 | 2020-04-28 | Invensas Corporation | Correction die for wafer/die stack |
KR102647175B1 (ko) | 2016-12-13 | 2024-03-14 | 삼성전자주식회사 | 반도체 패키지 및 이의 제조 방법 |
GB2572934B (en) * | 2017-01-06 | 2021-11-17 | Rockley Photonics Ltd | Copackaging of ASIC and silicon photonics |
US10877217B2 (en) | 2017-01-06 | 2020-12-29 | Rockley Photonics Limited | Copackaging of asic and silicon photonics |
US10761262B2 (en) | 2017-08-01 | 2020-09-01 | Rockley Photonics Limited | Module with transmit and receive optical subassemblies with specific pic cooling architecture |
US10629539B2 (en) * | 2017-11-07 | 2020-04-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and method of fabricating the same |
US11145575B2 (en) | 2018-11-07 | 2021-10-12 | UTAC Headquarters Pte. Ltd. | Conductive bonding layer with spacers between a package substrate and chip |
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CN1145211C (zh) * | 1998-09-21 | 2004-04-07 | 大众电脑股份有限公司 | 一种多晶片半导体封装结构 |
JP3565319B2 (ja) * | 1999-04-14 | 2004-09-15 | シャープ株式会社 | 半導体装置及びその製造方法 |
WO2001018864A1 (fr) * | 1999-09-03 | 2001-03-15 | Seiko Epson Corporation | Dispositif a semi-conducteurs, son procede de fabrication, carte de circuit et dispositif electronique |
JP2001320014A (ja) * | 2000-05-11 | 2001-11-16 | Seiko Epson Corp | 半導体装置及びその製造方法 |
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JP2002176137A (ja) | 2000-09-28 | 2002-06-21 | Toshiba Corp | 積層型半導体デバイス |
US6680219B2 (en) | 2001-08-17 | 2004-01-20 | Qualcomm Incorporated | Method and apparatus for die stacking |
JP4123027B2 (ja) * | 2003-03-31 | 2008-07-23 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
-
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- 2004-06-30 US US10/881,605 patent/US7116002B2/en not_active Expired - Lifetime
- 2004-11-11 TW TW093134432A patent/TWI257162B/zh active
-
2005
- 2005-03-03 JP JP2005058970A patent/JP2005322887A/ja active Pending
- 2005-05-10 CN CNB2005100694460A patent/CN100424871C/zh active Active
- 2005-05-10 CN CNB2007101275586A patent/CN100539129C/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI424525B (zh) * | 2010-05-28 | 2014-01-21 | Nanya Technology Corp | 晶片封裝體的承載裝置及承載組件 |
Also Published As
Publication number | Publication date |
---|---|
CN100539129C (zh) | 2009-09-09 |
US7116002B2 (en) | 2006-10-03 |
CN100424871C (zh) | 2008-10-08 |
CN1700466A (zh) | 2005-11-23 |
CN101110411A (zh) | 2008-01-23 |
JP2005322887A (ja) | 2005-11-17 |
US20050248019A1 (en) | 2005-11-10 |
TW200537670A (en) | 2005-11-16 |
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