TWI257158B - Heated chuck for laser thermal processing - Google Patents

Heated chuck for laser thermal processing

Info

Publication number
TWI257158B
TWI257158B TW093138893A TW93138893A TWI257158B TW I257158 B TWI257158 B TW I257158B TW 093138893 A TW093138893 A TW 093138893A TW 93138893 A TW93138893 A TW 93138893A TW I257158 B TWI257158 B TW I257158B
Authority
TW
Taiwan
Prior art keywords
heater module
wafer
laser
thermal
heat
Prior art date
Application number
TW093138893A
Other languages
English (en)
Chinese (zh)
Other versions
TW200620596A (en
Inventor
Iqbal A Shareef
Igor Landau
David A Markle
Somit Talwar
Michael O Thompson
Original Assignee
Ultratech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultratech Inc filed Critical Ultratech Inc
Publication of TW200620596A publication Critical patent/TW200620596A/zh
Application granted granted Critical
Publication of TWI257158B publication Critical patent/TWI257158B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093138893A 2004-12-01 2004-12-15 Heated chuck for laser thermal processing TWI257158B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/001,954 US7731798B2 (en) 2004-12-01 2004-12-01 Heated chuck for laser thermal processing

Publications (2)

Publication Number Publication Date
TW200620596A TW200620596A (en) 2006-06-16
TWI257158B true TWI257158B (en) 2006-06-21

Family

ID=36566421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093138893A TWI257158B (en) 2004-12-01 2004-12-15 Heated chuck for laser thermal processing

Country Status (4)

Country Link
US (1) US7731798B2 (https=)
JP (1) JP5031984B2 (https=)
KR (1) KR20060061198A (https=)
TW (1) TWI257158B (https=)

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CN107052586B (zh) * 2017-04-14 2019-07-12 东莞市启天自动化设备股份有限公司 一种硅片激光打标机
JP6976658B2 (ja) * 2017-12-15 2021-12-08 住友重機械工業株式会社 チャックプレート及びアニール装置
WO2019116826A1 (ja) * 2017-12-15 2019-06-20 住友重機械工業株式会社 チャックプレート、アニール装置、及びアニール方法
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US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US12583043B2 (en) * 2021-08-31 2026-03-24 Yield Engineering Systems, Inc. Process chamber with UV irradiance
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
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JP7699561B2 (ja) * 2022-03-22 2025-06-27 三菱電機株式会社 半導体装置の製造方法および半導体製造装置
CN116153840B (zh) * 2023-02-24 2023-11-03 长春光华微电子设备工程中心有限公司 一种卡盘
KR102790101B1 (ko) * 2023-06-28 2025-04-04 (주)알엔알랩 웨이퍼 구조체에 대한 레이저 열처리 방법 및 이를 적용한 반도체 소자의 제조 방법
CN119772291B (zh) * 2025-03-07 2025-06-03 深圳市紫宸激光设备有限公司 基于视觉定位和检测的晶圆微凸点制备设备及方法

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Also Published As

Publication number Publication date
US7731798B2 (en) 2010-06-08
JP5031984B2 (ja) 2012-09-26
US20060113290A1 (en) 2006-06-01
TW200620596A (en) 2006-06-16
JP2006156915A (ja) 2006-06-15
KR20060061198A (ko) 2006-06-07

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MM4A Annulment or lapse of patent due to non-payment of fees