KR20060061198A - 레이저 열 처리용 가열 척 - Google Patents

레이저 열 처리용 가열 척 Download PDF

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Publication number
KR20060061198A
KR20060061198A KR1020040106671A KR20040106671A KR20060061198A KR 20060061198 A KR20060061198 A KR 20060061198A KR 1020040106671 A KR1020040106671 A KR 1020040106671A KR 20040106671 A KR20040106671 A KR 20040106671A KR 20060061198 A KR20060061198 A KR 20060061198A
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KR
South Korea
Prior art keywords
wafer
heater module
top plate
temperature
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020040106671A
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English (en)
Korean (ko)
Inventor
쉐리프이크발에이
랜도이고르
마클데이비드에이
탈워소미트
톰슨마이클오
앤젤로브이블린에이
저우써나안
Original Assignee
울트라테크 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 울트라테크 인크. filed Critical 울트라테크 인크.
Publication of KR20060061198A publication Critical patent/KR20060061198A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020040106671A 2004-12-01 2004-12-15 레이저 열 처리용 가열 척 Ceased KR20060061198A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/001,954 2004-12-01
US11/001,954 US7731798B2 (en) 2004-12-01 2004-12-01 Heated chuck for laser thermal processing

Publications (1)

Publication Number Publication Date
KR20060061198A true KR20060061198A (ko) 2006-06-07

Family

ID=36566421

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040106671A Ceased KR20060061198A (ko) 2004-12-01 2004-12-15 레이저 열 처리용 가열 척

Country Status (4)

Country Link
US (1) US7731798B2 (https=)
JP (1) JP5031984B2 (https=)
KR (1) KR20060061198A (https=)
TW (1) TWI257158B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098575A (ko) * 2018-02-14 2019-08-22 주식회사 이오테크닉스 리플로우 솔더링 장치 및 리플로우 솔더링 방법
WO2025005568A1 (ko) * 2023-06-28 2025-01-02 (주)알엔알랩 웨이퍼 구조체에 대한 레이저 열처리 방법 및 이를 적용한 반도체 소자의 제조 방법

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US9343307B2 (en) * 2013-12-24 2016-05-17 Ultratech, Inc. Laser spike annealing using fiber lasers
KR102343226B1 (ko) 2014-09-04 2021-12-23 삼성전자주식회사 스팟 히터 및 이를 이용한 웨이퍼 클리닝 장치
WO2016148855A1 (en) * 2015-03-19 2016-09-22 Applied Materials, Inc. Method and apparatus for reducing radiation induced change in semiconductor structures
ITUA20162821A1 (it) * 2016-04-22 2017-10-22 Advanced Techne S R L Dissipatore per elettronica di potenza, relativo procedimento di produzione, e macchina per attuare tale procedimento.
CN107052586B (zh) * 2017-04-14 2019-07-12 东莞市启天自动化设备股份有限公司 一种硅片激光打标机
JP6976658B2 (ja) * 2017-12-15 2021-12-08 住友重機械工業株式会社 チャックプレート及びアニール装置
WO2019116826A1 (ja) * 2017-12-15 2019-06-20 住友重機械工業株式会社 チャックプレート、アニール装置、及びアニール方法
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
KR102188261B1 (ko) * 2019-08-02 2020-12-09 세미기어, 인코포레이션 기판 냉각 장치 및 방법
US11610792B2 (en) * 2019-08-16 2023-03-21 Applied Materials, Inc. Heated substrate support with thermal baffles
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
EP3970899B1 (en) 2020-09-18 2023-11-22 Laser Systems & Solutions of Europe Method of and system for uniformly irradiating a frame of a processed substrate having a plurality of frames
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US12583043B2 (en) * 2021-08-31 2026-03-24 Yield Engineering Systems, Inc. Process chamber with UV irradiance
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
CN114496866B (zh) * 2022-01-20 2023-03-28 无锡昌鼎电子有限公司 芯片恒温载盘机构
JP7699561B2 (ja) * 2022-03-22 2025-06-27 三菱電機株式会社 半導体装置の製造方法および半導体製造装置
CN116153840B (zh) * 2023-02-24 2023-11-03 长春光华微电子设备工程中心有限公司 一种卡盘
CN119772291B (zh) * 2025-03-07 2025-06-03 深圳市紫宸激光设备有限公司 基于视觉定位和检测的晶圆微凸点制备设备及方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098575A (ko) * 2018-02-14 2019-08-22 주식회사 이오테크닉스 리플로우 솔더링 장치 및 리플로우 솔더링 방법
WO2025005568A1 (ko) * 2023-06-28 2025-01-02 (주)알엔알랩 웨이퍼 구조체에 대한 레이저 열처리 방법 및 이를 적용한 반도체 소자의 제조 방법
KR20250001055A (ko) * 2023-06-28 2025-01-06 (주)알엔알랩 웨이퍼 구조체에 대한 레이저 열처리 방법 및 이를 적용한 반도체 소자의 제조 방법

Also Published As

Publication number Publication date
US7731798B2 (en) 2010-06-08
TWI257158B (en) 2006-06-21
JP5031984B2 (ja) 2012-09-26
US20060113290A1 (en) 2006-06-01
TW200620596A (en) 2006-06-16
JP2006156915A (ja) 2006-06-15

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