TWI256738B - Image pickup device - Google Patents

Image pickup device

Info

Publication number
TWI256738B
TWI256738B TW092105940A TW92105940A TWI256738B TW I256738 B TWI256738 B TW I256738B TW 092105940 A TW092105940 A TW 092105940A TW 92105940 A TW92105940 A TW 92105940A TW I256738 B TWI256738 B TW I256738B
Authority
TW
Taiwan
Prior art keywords
image sensor
optical member
lens portion
base board
outer frame
Prior art date
Application number
TW092105940A
Other languages
English (en)
Other versions
TW200306015A (en
Inventor
Yuichi Honda
Yuichi Atarashi
Masafumi Mizukami
Kazuo Tansho
Original Assignee
Konica Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Corp filed Critical Konica Corp
Publication of TW200306015A publication Critical patent/TW200306015A/zh
Application granted granted Critical
Publication of TWI256738B publication Critical patent/TWI256738B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
TW092105940A 2002-03-22 2003-03-18 Image pickup device TWI256738B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002081877A JP4061936B2 (ja) 2002-03-22 2002-03-22 撮像装置

Publications (2)

Publication Number Publication Date
TW200306015A TW200306015A (en) 2003-11-01
TWI256738B true TWI256738B (en) 2006-06-11

Family

ID=27785372

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092105940A TWI256738B (en) 2002-03-22 2003-03-18 Image pickup device

Country Status (5)

Country Link
EP (1) EP1347637B1 (zh)
JP (1) JP4061936B2 (zh)
KR (1) KR100918140B1 (zh)
DE (1) DE60305091T2 (zh)
TW (1) TWI256738B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298888A (ja) 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
JP2004194223A (ja) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
JP4622237B2 (ja) * 2003-11-12 2011-02-02 コニカミノルタオプト株式会社 撮像装置及び撮像装置を備えた携帯端末
JP4574233B2 (ja) * 2004-06-02 2010-11-04 キヤノン株式会社 レンズ固定方法
CN1828354A (zh) * 2005-03-04 2006-09-06 普立尔科技股份有限公司 照相机模块及其制备方法
JP4233535B2 (ja) * 2005-03-29 2009-03-04 シャープ株式会社 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法
JP4233536B2 (ja) * 2005-03-31 2009-03-04 シャープ株式会社 光学装置用モジュール
JP2006295714A (ja) * 2005-04-13 2006-10-26 Olympus Corp 撮像装置
JP4486005B2 (ja) 2005-08-03 2010-06-23 パナソニック株式会社 半導体撮像装置およびその製造方法
KR100766495B1 (ko) * 2005-12-19 2007-10-15 삼성전자주식회사 촬상장치 및 이를 구비하는 데이터 처리 장치
JP4659848B2 (ja) * 2008-03-06 2011-03-30 オリンパスメディカルシステムズ株式会社 撮像モジュール
JP2010224549A (ja) * 2010-04-26 2010-10-07 Konica Minolta Opto Inc プラスチックレンズ
DE102010030228B4 (de) 2010-06-17 2018-06-07 pmdtechnologies ag Optische Vorrichtung
DE102011081066B4 (de) * 2011-06-30 2017-03-23 Ifm Electronic Gmbh Optikträger
KR101832496B1 (ko) * 2011-12-01 2018-02-26 삼성전기주식회사 카메라 모듈
CN103123436B (zh) * 2013-02-20 2015-03-25 苏州佳世达光电有限公司 具有防尘结构的光学装置
JP2015200787A (ja) * 2014-04-08 2015-11-12 オリンパス株式会社 レンズ固定方法およびレンズ組立体
JP7004620B2 (ja) * 2018-07-27 2022-02-10 京セラ株式会社 結合方法、レンズ、保持機構、カメラ装置および移動体
US11953722B2 (en) 2021-06-02 2024-04-09 Luminar Technologies, Inc. Protective mask for an optical receiver

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0330581A (ja) * 1989-06-28 1991-02-08 Hitachi Ltd 半導体装置及びそれを用いたビデオ・カメラ・ユニット並びにその製造方法
JP3062760B2 (ja) * 1989-03-14 2000-07-12 コニカ株式会社 複合レンズ
US5122909A (en) * 1991-06-25 1992-06-16 Butler Robert B Microlens connector
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
KR100272328B1 (ko) * 1993-12-22 2001-02-01 이중구 렌즈의 공기 간격 조절장치
JP3498775B2 (ja) * 1995-05-31 2004-02-16 ソニー株式会社 撮像装置
US6122009A (en) * 1995-05-31 2000-09-19 Sony Corporation Image pickup apparatus fabrication method thereof image pickup adaptor apparatus signal processing apparatus signal processing method thereof information processing apparatus and information processing method
JPH09181287A (ja) * 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
JP3037163B2 (ja) * 1996-11-26 2000-04-24 キヤノン株式会社 光学素子支持装置、光学機器及びステッパー
JP3651577B2 (ja) * 2000-02-23 2005-05-25 三菱電機株式会社 撮像装置
JP4034031B2 (ja) 2000-08-01 2008-01-16 三菱電機株式会社 撮像装置
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens

Also Published As

Publication number Publication date
EP1347637A3 (en) 2004-01-07
DE60305091T2 (de) 2006-12-07
KR100918140B1 (ko) 2009-09-17
KR20030082366A (ko) 2003-10-22
EP1347637A2 (en) 2003-09-24
JP2003283892A (ja) 2003-10-03
DE60305091D1 (de) 2006-06-14
TW200306015A (en) 2003-11-01
JP4061936B2 (ja) 2008-03-19
EP1347637B1 (en) 2006-05-10

Similar Documents

Publication Publication Date Title
TWI256738B (en) Image pickup device
ATE272922T1 (de) Bildaufnahmevorrichtung und bildaufnahmelinse
EP1475960A3 (en) Solid-state imaging device, camera module, and camera-module manufacturing method
EP1351523A3 (en) System for enhancing the quality of an image
GB0227894D0 (en) Image projection device with an integrated photodiode light source
WO2003098913A3 (en) Miniature camera head
TW200507800A (en) Saccadic motion sensing
GB2363927B (en) An improved light sensor with increased dynamic range
EP0871319A4 (en) CONTACT IMAGE SENSOR
EP1757967A3 (en) Image pickup lens with four lenses, image pickup unit and portable terminal
JP2000089092A5 (zh)
WO2002067016A3 (fr) Dispositif support d"appareil photographique
AU2001225490A1 (en) Radiation image sensor and scintillator panel
TW200636315A (en) Image pickup module and manufacturing method of image pickup module
DE69940076D1 (de) Mundstück
EP1434081A3 (en) Electro-optical device encased in mounting case, projection display apparatus, and mounting case
JP2002300348A5 (zh)
EP1263055A3 (en) CMOS image sensor
AU2001289736A1 (en) Small-size imaging apparatus, in particular photographic appliance or camera
WO2005036450A3 (en) Print scanner systems and methods
EP1253442A4 (en) X-RAY IMAGE SENSOR
WO2003003287A8 (fr) Dispositif pour la detection de deplacements d'une surface d'un objet
WO2007120232A3 (en) Self-aligning optical sensor package
WO2003021360A3 (en) Phase-shift-moire focus monitor
GB2357835A8 (en) Detecting the incident angle of an optical light beam

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees