DE60305091D1 - Bildaufnahmegerät - Google Patents

Bildaufnahmegerät

Info

Publication number
DE60305091D1
DE60305091D1 DE60305091T DE60305091T DE60305091D1 DE 60305091 D1 DE60305091 D1 DE 60305091D1 DE 60305091 T DE60305091 T DE 60305091T DE 60305091 T DE60305091 T DE 60305091T DE 60305091 D1 DE60305091 D1 DE 60305091D1
Authority
DE
Germany
Prior art keywords
imaging device
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305091T
Other languages
English (en)
Other versions
DE60305091T2 (de
Inventor
Yuichi Honda
Yuichi Atarashi
Masafumi Mizukami
Kazuo Tansho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of DE60305091D1 publication Critical patent/DE60305091D1/de
Application granted granted Critical
Publication of DE60305091T2 publication Critical patent/DE60305091T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE60305091T 2002-03-22 2003-03-20 Bildaufnahmegerät Expired - Lifetime DE60305091T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002081877A JP4061936B2 (ja) 2002-03-22 2002-03-22 撮像装置
JP2002081877 2002-03-22

Publications (2)

Publication Number Publication Date
DE60305091D1 true DE60305091D1 (de) 2006-06-14
DE60305091T2 DE60305091T2 (de) 2006-12-07

Family

ID=27785372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60305091T Expired - Lifetime DE60305091T2 (de) 2002-03-22 2003-03-20 Bildaufnahmegerät

Country Status (5)

Country Link
EP (1) EP1347637B1 (de)
JP (1) JP4061936B2 (de)
KR (1) KR100918140B1 (de)
DE (1) DE60305091T2 (de)
TW (1) TWI256738B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298888A (ja) 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
JP2004194223A (ja) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
JP4622237B2 (ja) * 2003-11-12 2011-02-02 コニカミノルタオプト株式会社 撮像装置及び撮像装置を備えた携帯端末
JP4574233B2 (ja) * 2004-06-02 2010-11-04 キヤノン株式会社 レンズ固定方法
CN1828354A (zh) * 2005-03-04 2006-09-06 普立尔科技股份有限公司 照相机模块及其制备方法
JP4233535B2 (ja) * 2005-03-29 2009-03-04 シャープ株式会社 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法
JP4233536B2 (ja) * 2005-03-31 2009-03-04 シャープ株式会社 光学装置用モジュール
JP2006295714A (ja) * 2005-04-13 2006-10-26 Olympus Corp 撮像装置
JP4486005B2 (ja) 2005-08-03 2010-06-23 パナソニック株式会社 半導体撮像装置およびその製造方法
KR100766495B1 (ko) * 2005-12-19 2007-10-15 삼성전자주식회사 촬상장치 및 이를 구비하는 데이터 처리 장치
JP4659848B2 (ja) * 2008-03-06 2011-03-30 オリンパスメディカルシステムズ株式会社 撮像モジュール
JP2010224549A (ja) * 2010-04-26 2010-10-07 Konica Minolta Opto Inc プラスチックレンズ
DE102010030228B4 (de) 2010-06-17 2018-06-07 pmdtechnologies ag Optische Vorrichtung
DE102011081066B4 (de) * 2011-06-30 2017-03-23 Ifm Electronic Gmbh Optikträger
KR101832496B1 (ko) * 2011-12-01 2018-02-26 삼성전기주식회사 카메라 모듈
CN103123436B (zh) * 2013-02-20 2015-03-25 苏州佳世达光电有限公司 具有防尘结构的光学装置
JP2015200787A (ja) * 2014-04-08 2015-11-12 オリンパス株式会社 レンズ固定方法およびレンズ組立体
JP7004620B2 (ja) * 2018-07-27 2022-02-10 京セラ株式会社 結合方法、レンズ、保持機構、カメラ装置および移動体
US11953722B2 (en) 2021-06-02 2024-04-09 Luminar Technologies, Inc. Protective mask for an optical receiver

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0330581A (ja) * 1989-06-28 1991-02-08 Hitachi Ltd 半導体装置及びそれを用いたビデオ・カメラ・ユニット並びにその製造方法
JP3062760B2 (ja) * 1989-03-14 2000-07-12 コニカ株式会社 複合レンズ
US5122909A (en) * 1991-06-25 1992-06-16 Butler Robert B Microlens connector
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
KR100272328B1 (ko) * 1993-12-22 2001-02-01 이중구 렌즈의 공기 간격 조절장치
JP3498775B2 (ja) * 1995-05-31 2004-02-16 ソニー株式会社 撮像装置
KR20040004472A (ko) * 1995-05-31 2004-01-13 소니 가부시끼 가이샤 촬상장치 및 그 제조방법, 촬상어댑터장치, 신호처리장치및 신호처리방법, 및 정보처리장치 및 정보처리방법
JPH09181287A (ja) * 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
JP3037163B2 (ja) * 1996-11-26 2000-04-24 キヤノン株式会社 光学素子支持装置、光学機器及びステッパー
JP3651577B2 (ja) * 2000-02-23 2005-05-25 三菱電機株式会社 撮像装置
JP4034031B2 (ja) 2000-08-01 2008-01-16 三菱電機株式会社 撮像装置
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens

Also Published As

Publication number Publication date
KR100918140B1 (ko) 2009-09-17
JP2003283892A (ja) 2003-10-03
JP4061936B2 (ja) 2008-03-19
TWI256738B (en) 2006-06-11
KR20030082366A (ko) 2003-10-22
EP1347637A3 (de) 2004-01-07
TW200306015A (en) 2003-11-01
EP1347637A2 (de) 2003-09-24
DE60305091T2 (de) 2006-12-07
EP1347637B1 (de) 2006-05-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition