1252134 ⑴ 玖、發明說明 【發明所屬之技術領域】 本發明爲關於液晶滴下貼合之方法,尤其係關於^ s 對直到塗布密封劑之前處理之設計値之製作誤差,可修正 密封劑之塗布條件之塗布裝置之製造方法。 【先前技術】 傳統上,如特開2000-284295號公報所示,形成閉合 於基板上之四角狀之密封圖案,於此中,直接滴下液晶, 重疊另一方之基板精密對合而未進行貼合,實用化生產 LCD面板之方式。 然而,於上述傳統技術上,形成於基板面之彩色濾光 片等之膜厚精確度係與設計値不同。此種情況,由於單元 之體積產生變化,故滴下設定量之液晶之後,當進行基板 貼合時將產生液晶過量不足之現象。 【發明內容】 如上述所述,本發明之目的係解決相關問題,且作爲 可改善良率之生產方法,而於液晶之單元組立工程之中, 設置LCD面板之設計,輸入生產資訊之手段,從所輸入 之資訊設置變更密封圖案之塗布條件,藉由控制密封塗布 剖面積,使得提供構成可修正液晶塡充容積之特徵之電糊 塗布機,與液晶塡充容積之修正方法及液晶滴下貼合製程 -5- 1252134 (2) 爲了達成上述目的,本發明於液晶單元組ί ,設置LCD面板之設計,輸入生產資訊之手 入之資訊設置變更密封圖案之塗布條件之手段, 密封塗布剖面積,使得構成可修正液晶塡充容賴 電糊塗布機,與液晶塡充容積之修正方法及液曰1 製程。 上述之設計,生產資訊,爲具有液晶基板澤 ,彩色濾光片高度設計資訊,電糊高度設計資計 差資訊,修正項目爲密封塗布寬度,密封塗布if 位置之修正(四角形密封內側尺寸修正)。 【實施方式】 以下,爲藉由圖面而說明本發明之實施形態 圖1爲表示本發明之液晶面板製造工程之一 方塊線圖。於圖1之中,係以前工程1 0 0,1 0 1 形成彩色濾光片,或於基板上形成液晶驅動用之 膜電晶體)。本發明係有關於前工程之結束之基 下液晶之工程和塗布密封劑及貼合工程。亦既, 電腦1 〇 2上,從面板之設計資訊1 〇 3 (譬如,基 大小,彩色濾光片之厚度或大小,形成之TFT 數,厚度等之資訊)和基板製造線(C F (彩色 製造線105 ’TFT基板製造線106),將對應於 之基板批號單位之上述設計資訊之數値做爲面板 訊104而具備記憶之資料庫。 工程之中 ,從所輸 藉由控制 之特徵之 滴下貼合 元設計値 ,生產誤 度,塗布 部分控制 於基板上 TFT (薄 板上,滴 於管理用 板厚度或 大小,個 濾光片) 實際製作 之生產資 -6- 1252134 (3) 於基板組立工程1 07上,係持續密封塗布1 08,電極 劑塗布1 09,及液晶滴下1 1 0工程,而進行面板貼合1 1 1 工程。此後,所貼合之基板,將搬送於模組工程1 1 2。於 本實施形態上,乃基於設計資訊而演算檢查於基板製造線 所製造之基板之結果之資料,與設計資料之誤差,當誤差 量超越容許値時,則修正於之後之工程製造條件。譬如, 當彩色濾光片之厚度等之資料超越容許範圍時,既需變更 塗布之密封劑量。若不予變更時,將滴下之液晶劑量爲一 定量時,將具有產生液晶劑將溢出(密封高度不足(塗布 量不足)時),或液晶劑不足而無法擴散於基板整體而產 生空間部(密封高度過多(塗布量過多)時)之問題。又 ,於本實施形態上,雖然係於形成TFT之基板測,塗布 密封材而滴下液晶來做爲說明,但是於彩色濾光片測之基 板,塗布密封材而作成滴下液晶之構造亦可,或於兩者之 基板,作成塗布密封材之構造亦可。 圖2爲表示電糊塗布機之整體構造斜視圖。 於圖之中,於機台1上,設置X軸移動平台3,藉由 X軸伺服馬達4使得滾球螺絲正轉或逆轉之旋轉(正逆轉 ),能夠於X軸方向移動Y軸移動平台5。於Y軸移動 平台5上,設置0軸移動平台8,藉由Y軸伺服馬達6於 Y軸方向移動。於β軸移動平台8上,設置保持基板9之 基板保持機構7。 另外,於機台1上,Ζ軸平台支撐架2係爲了跨越基 板保持機構7 (以門型形狀)而設置。於Ζ軸平台支撐機 -7- 1252134 (4) 台2上約爲中央部,安裝著Z軸移動平台支撐脫架10。 於Z軸移動平台支撐拖架1〇,設置著Z軸移動平台11。 於Z軸移動平台1 1,將電糊收納筒(針筒)1 3等藉由Z 軸伺服馬達〗2,將能於Z軸方向(上下方向)使其移動 。於電糊收納筒1 3,設置噴嘴支撐具1 4,將電糊收納筒 13內之電糊作成從噴嘴頭端吐出之構造。同時,與電糊 收納筒(針筒)1 3並排,爲了於Z軸方向移動,設置著 具備可照明之光源之鏡筒與畫像辨識照相機1 5。再者, 距離計16亦爲了可與電糊收納筒13 —起於Z軸方向移動 而加以設置之。 於機台1之下部,設置主控制部1 7,基於設置於裝 置內之各種感應資訊,控制各種驅動系統,而於基板上描 繪特定之電糊。副控制部1 8係於主控制部1 7以訊號配線 2 1所連接,於外部記憶裝置1 8a記憶控制資訊等。同時 ,於副控制部1 8連接監視器1 9或鍵盤20,能夠監視控 制之變更或各機器之動作。另外,從鍵盤20所輸入之資 料等,係記憶保管於外部記憶裝置之硬式磁碟機1 8a,或 軟式磁碟機1 8b等之記憶媒體。又,於本圖雖然未圖示但 是,於主控制部1 7,係連接著圖1所示之管理用電腦1 02 。主控制部1 7係基於從管理用電腦之資訊,具備修正電 糊之吐出量或噴嘴與基板之間隔等之功能。1252134 (1) 玖 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶A method of manufacturing a coating device. [Prior Art] Conventionally, as shown in Japanese Laid-Open Patent Publication No. 2000-284295, a four-corner sealing pattern which is closed on a substrate is formed, in which liquid crystal is directly dropped, and the other substrate is superposed and precisely bonded without being attached. The way to produce LCD panels in practical use. However, in the above conventional technique, the film thickness accuracy of the color filter or the like formed on the substrate surface is different from that of the design. In this case, since the volume of the cell changes, after the set amount of liquid crystal is dropped, a phenomenon that the liquid crystal excess is insufficient when the substrate is bonded. SUMMARY OF THE INVENTION As described above, the object of the present invention is to solve the related problems, and as a production method capable of improving the yield, in the liquid crystal unit assembly project, the design of the LCD panel is set, and the means for inputting the production information is The coating condition for changing the seal pattern is set from the input information, and the cross-sectional area of the seal coating is controlled to provide an electric paste coater that constitutes a feature capable of correcting the liquid crystal charge volume, a method for correcting the liquid crystal charge volume, and a liquid crystal drop sticker. Co-Processing-5- 1252134 (2) In order to achieve the above object, the present invention provides a liquid crystal cell group ί, sets the design of the LCD panel, inputs the information of the hand-in-hand information of the production information, and changes the coating condition of the sealing pattern, and seals the sectional area of the coating. The method for correcting the liquid crystal 塡 filling capacity and the liquid crystal charging volume and the liquid 曰 1 process are formed. The above design, production information, with liquid crystal substrate, color filter height design information, electronic paste height design accounting information, correction items for seal coating width, seal coating if position correction (square seal inner size correction) . [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a block diagram showing a manufacturing process of a liquid crystal panel of the present invention. In Fig. 1, a color filter is formed in the previous process of 100, 1 0 1 or a film transistor for driving a liquid crystal is formed on a substrate. The present invention relates to liquid crystal engineering and coating sealants and bonding processes at the end of the prior art. Also, on the computer 1 〇 2, from the panel design information 1 〇 3 (for example, base size, color filter thickness or size, the number of TFTs formed, thickness, etc.) and substrate manufacturing line (CF (color) The manufacturing line 105 'TFT substrate manufacturing line 106) has a memory database corresponding to the number of the above-mentioned design information corresponding to the substrate batch number unit as the panel signal 104. In the project, the characteristics of the control by the control are Dropping the design of the fitting element, the production error, the coating part is controlled on the TFT on the substrate (thin plate, dripping on the thickness or size of the management plate, a filter). The actual production of the production material -6- 1252134 (3) on the substrate On the assembly project 07, the system is continuously sealed and coated with 1 08, the electrode coating is applied for 1 09, and the liquid crystal is dropped 1 1 0, and the panel is bonded to the 1 1 1 project. Thereafter, the bonded substrate will be transferred to the module. In the present embodiment, based on the design information, the data of the result of inspecting the substrate manufactured by the substrate manufacturing line is calculated based on the design information, and the error of the design data is corrected when the error amount exceeds the allowable error. For the engineering manufacturing conditions, for example, when the thickness of the color filter exceeds the allowable range, it is necessary to change the applied sealing dose. If the liquid crystal dose is not changed, the liquid crystal will be produced. The agent will overflow (when the sealing height is insufficient (when the coating amount is insufficient), or the liquid crystal agent is insufficient to diffuse into the entire substrate to cause a space portion (when the sealing height is excessive (the coating amount is excessive)). Further, in the present embodiment, Although the substrate is formed by measuring the substrate of the TFT, the sealing material is applied and the liquid crystal is dropped. The substrate is coated with a color filter, and the sealing material is applied to form a liquid crystal, or a substrate thereof. Fig. 2 is a perspective view showing the overall structure of the electric paste coater. In the figure, on the machine 1, an X-axis moving platform 3 is provided, which is rolled by the X-axis servo motor 4. The ball screw rotates forward or reverse (positive reversal), and can move the Y-axis moving platform 5 in the X-axis direction. On the Y-axis moving platform 5, the 0-axis moving platform 8 is set by the Y-axis servo horse. 6. Moving in the Y-axis direction. On the β-axis moving platform 8, a substrate holding mechanism 7 for holding the substrate 9 is provided. Further, on the machine 1, the x-axis platform support frame 2 is for crossing the substrate holding mechanism 7 (with a gate type) Set in shape. On the stern platform support machine -7- 1252134 (4) The table 2 is about the central part, and the Z-axis moving platform is supported to support the detachment 10. The Z-axis moving platform supports the trailer 1 〇, which is set Z-axis moving platform 11. On the Z-axis moving platform 1, the electric-adhesive storage cylinder (syringe) 13 and the like can be moved in the Z-axis direction (up-and-down direction) by the Z-axis servo motor 〖2. The electric paste housing tube 13 is provided with a nozzle holder 14 and the electric paste in the electric paste housing tube 13 is configured to be discharged from the nozzle tip end. At the same time, the electric paste storage cylinder (syringe) 13 is arranged side by side, and in order to move in the Z-axis direction, a lens barrel having an illuminable light source and an image recognition camera 15 are provided. Further, the distance meter 16 is also provided to be movable in the Z-axis direction together with the electric paste housing tube 13. At the lower portion of the machine 1, a main control unit 17 is provided to control various drive systems based on various sensing information provided in the device, and a specific electric paste is drawn on the substrate. The sub-control unit 18 is connected to the main control unit 17 by the signal wiring 2 1 , and the control information and the like are stored in the external memory device 18 8 . At the same time, the sub-control unit 18 is connected to the monitor 19 or the keyboard 20, and it is possible to monitor the change of control or the operation of each device. Further, the information input from the keyboard 20 or the like is stored in a hard disk drive 18 8a stored in an external storage device, or a memory medium such as a flexible disk drive 18b. Further, although not shown in the figure, the main control unit 17 is connected to the management computer 102 shown in Fig. 1. The main control unit 17 has a function of correcting the discharge amount of the paste or the interval between the nozzle and the substrate based on the information from the management computer.
另外,於其他,設置著如圖4所示之負壓源22或負 壓調整器22a,正壓源23,正壓源調整器23a,閥單元24 ,電糊圖案內圍(內面積)量測用照相機26 ( 2維CCD 1252134 (5) 照相機或1維線性感應照相機)。 同時,電糊收納筒1 3,拆卸自如安裝於未圖示之線 性導引之可動部。且,具備可照明光源之鏡筒,和畫像辨 識照相機1 5 ’爲了定位基板9或電糊圖案之形狀辨識等 ,安裝成對向於基板9。 圖3爲表示放大圖2之電糊收納筒1 3與距離計1 6之 部分之斜視圖’而1 3 a爲噴嘴,9爲基板,於對應於圖2 之部分付與相同符號。 於圖3之中,距離計〗6係於下端部位在三角形之切 入部,於其切入部設置著發光元件與複數之感光元件。噴 嘴1 3 a係安裝於距離計1 6之切入部之下部。 距離計1 6係以非接觸之三角測法來量測從噴嘴i 3a 之頭端部直到藉由玻璃所形成之基板9之表面(上面)之 距離。亦既,於上述三角形之切入部之單邊斜面,設置發 光元件,從此發光元件所放射之雷射光L,係於基板9上 之量測點係於基板9上之量測點S反射,而於設置於上述 切入部之另一方之斜面之複數感光元件之任一者感光。因 此,雷射光L既無需被電糊收納筒1 3或噴嘴1 3 a所遮蓋 〇 另外,於基板9上之雷射光L之量測點S,與噴嘴 1 3 a之正下位置,於基板9上,雖然僅微微之距離△ X, △ Y,但是於此極小距離△ X,△ Y程度之偏移上,於基 板9表面之凹凸,由於無差距,故從距離計1 6之量測結 果與噴嘴1 3 a之頭端部,直到基板2 8表面(上面)之距 -9- 1252134 (6) 離之間,其差距幾乎不存在。因此,基於此距離計1 6之 量測結果,利用控制Z軸伺服馬達1 2,配合於基板表面 之凹凸(波狀),可維持一定從噴嘴1 3 a之頭端部至基板 9表面(上面)之距離。 如此一來,從噴嘴1 3 a之頭端部至基板9表面(上面 )之距離(間隔),將可維持於一定,且,藉由定量維持 從噴嘴1 3 a所吐出之每單位時間之電糊量,使得於基板9 上所塗布描繪之電糊圖案之寬度或厚度皆相同。 其次,說明有關本實施例子之控制方法。 圖4爲表示於圖2之控制部構造之方塊圖。主控制部 17,微電腦17a,馬達控制器17b,外部介面I7d,畫像 辨識裝置1 7e,各連接於資料通訊匯流排1 7c,更於馬達 控制器17b,連接X軸驅動裝置17f,Y軸驅動裝置17g ,0軸驅動裝置17h及Z軸驅動裝置17i之Χ,γ,Ζ,0 之各軸驅動裝置,連接於各驅動馬達。譬如,0軸驅動裝 置1 7h,係連接於0軸伺服馬達8a。於對應於圖1之圖面 部分,付與祖同符號。同時,於圖1亦具備量測描繪未圖 示之電糊圖案之內圍(內側面積)之照相機26。 於同一圖之中,主動控部1 7係內建著微電腦1 7a或 馬達控制器 17b,X,Y,Z,0之各軸驅動裝置 17f〜17i ,和處理於畫像辨識照相機1 5所取得之影像訊號之畫像 處理裝置1 7e,和副控制部1 8,或未圖示之管理用電腦 102之間之訊號傳送,或調整器22a、23a ’和閥單元24 之控制及進行距離計1 6之輸入之外部介面1 7d。 -10- 1252134 (7) 另外,於微電腦1 7a雖然未圖示,但是具備著主演算 部或收納爲了進行後述之塗布描繪之處理程式之ROM, 和收納於主演算部之處理結果或從外部介面1 7d及馬達控 制器1 7b之輸入資料之RAM,和存取外部介面1 7d或馬 達控制器1 7b與資料之輸出部等。 於各伺服馬達4、6、8 a、1 2,內建檢測旋轉量之編 碼器,將其結果返回於X、Y、Z、0之各軸驅動裝置 17f〜17i,而進行位置控制。 伺服馬達4、6、8 a、1 2,係基於從鍵盤2 0輸入而收 納於微電腦1 7a之RAM之資料而進行正逆轉。藉此,保 持於基板保持機構7 (圖2)之基板9,對安裝於Z軸移 動平台11 (圖2)之電糊收納筒13之設置之噴嘴13a( 圖3),可於X、Y軸方向移動任意距離。於基板9之移 動中,於電糊收納筒13持續施加少量氣壓,從噴嘴13a 之頭端部之吐出口吐出電糊,塗布描繪所期望之電糊於基 板9。 保持於基板保持機構7之基板9,往X、Y軸方向之 水平移動中,距離計1 4係量測噴嘴1 3 a和基板9之距離 。微電腦1 7 a,乃基於量測結果,爲了平常維持噴嘴1 3 a 和基板之一定間隔,故傳送控制指令於驅動控制伺服馬達 1 2之Z軸驅動裝置1 7 i。又,於本實施例上,雖然係說明 Z軸移動平台僅移動Z方向,但是即使將z軸移動平台支 撐拖架10作成Z軸平台支撐架台2之上部往X軸方向移 動亦可。更將Z軸平台支撐架台2作成往γ軸方向移動 -11 - 1252134In addition, the negative pressure source 22 or the negative pressure regulator 22a, the positive pressure source 23, the positive pressure source regulator 23a, the valve unit 24, and the inner circumference (inner area) of the electric paste pattern are provided as shown in FIG. Camera 26 (2-dimensional CCD 1252134 (5) camera or 1D linear sensing camera). At the same time, the electric paste housing tube 13 is detachably attached to a movable portion of a linear guide (not shown). Further, the lens barrel having the illuminable light source and the image recognition camera 15' are mounted to face the substrate 9 in order to recognize the shape of the substrate 9 or the electric paste pattern. Fig. 3 is a perspective view showing an enlarged view of a part of the electric charge storage tube 13 and the distance meter 16 of Fig. 2, wherein 13 a is a nozzle, 9 is a substrate, and the same reference numerals are given to portions corresponding to those of Fig. 2 . In Fig. 3, the distance meter 6 is a triangular-shaped cut-in portion at the lower end portion, and a light-emitting element and a plurality of light-receiving elements are provided at the cut-in portion. The nozzle 1 3 a is attached to the lower portion of the cut-in portion of the distance meter 16. The distance meter 16 measures the distance from the tip end of the nozzle i 3a to the surface (upper surface) of the substrate 9 formed by the glass by a non-contact triangulation method. Further, a light-emitting element is disposed on the one-sided inclined surface of the triangular cut portion, and the laser light L emitted from the light-emitting element is reflected on the measuring point S on the substrate 9 by the measuring point S on the substrate 9. One of the plurality of photosensitive elements disposed on the other inclined surface of the cut-in portion is sensitized. Therefore, the laser light L does not need to be covered by the electric paste receiving cylinder 13 or the nozzle 13 a. In addition, the measuring point S of the laser light L on the substrate 9 and the position directly below the nozzle 13 a are on the substrate. On the 9th, although only a slight distance Δ X, Δ Y, the offset of the extremely small distance Δ X, Δ Y on the surface of the substrate 9 , because there is no gap, the measurement from the distance meter 16 The result is almost non-existent with the end of the nozzle 13 a until the surface of the substrate 28 (the upper surface) is separated by a distance of -9 - 1252134 (6). Therefore, based on the measurement result of the distance meter 16, the Z-axis servo motor 12 can be controlled to fit the unevenness (wave shape) on the surface of the substrate, and it can be maintained from the end of the nozzle 13 a to the surface of the substrate 9 ( The distance above. In this way, the distance (interval) from the end of the nozzle 13 a to the surface (upper surface) of the substrate 9 can be maintained constant, and the unit time ejected from the nozzle 13 a is maintained by the quantitative amount. The amount of the paste is such that the width or thickness of the paste pattern drawn on the substrate 9 is the same. Next, a control method relating to the present embodiment will be described. Fig. 4 is a block diagram showing the structure of the control unit of Fig. 2; The main control unit 17, the microcomputer 17a, the motor controller 17b, the external interface I7d, and the image recognition device 17e are connected to the data communication busbar 17c, and further connected to the motor controller 17b, and connected to the X-axis driving device 17f, Y-axis drive. Each of the device 17g, the 0-axis driving device 17h, and the Z-axis driving device 17i, and the respective axis driving devices of γ, Ζ, 0 are connected to the respective driving motors. For example, the 0-axis drive unit 17h is connected to the 0-axis servo motor 8a. In the portion corresponding to the plane of Fig. 1, the ancestral symbol is paid. At the same time, Fig. 1 also has a camera 26 for measuring the inner circumference (inside area) of the electric paste pattern not shown. In the same figure, the active control unit 17 is built with the microcomputer 17a or the motor controller 17b, the X, Y, Z, 0 axis drive devices 17f to 17i, and the image recognition camera 15 Image signal processing device 1 7e, signal transmission between sub-control unit 1 8 or management computer 102 (not shown), or adjustment of regulators 22a, 23a' and valve unit 24 and distance meter 1 6 input external interface 1 7d. -10- 1252134 (7) In addition, the microcomputer 17 7a includes a main calculation unit or a ROM that stores a processing program for performing coating drawing described later, and a processing result stored in the main calculation unit or externally. The interface 1 7d and the RAM of the input data of the motor controller 17b, and the access external interface 17d or the motor controller 17b and the output of the data. The encoders for detecting the amount of rotation are built in the servo motors 4, 6, 8a, and 1 2, and the results are returned to the respective axis drive devices 17f to 17i of X, Y, Z, and 0 to perform position control. The servo motors 4, 6, 8a, and 12 are forward-reversed based on the data received from the keyboard 20 and received in the RAM of the microcomputer 17a. Thereby, the substrate 13 held by the substrate holding mechanism 7 (FIG. 2) and the nozzle 13a (FIG. 3) provided to the electric paste housing tube 13 attached to the Z-axis moving stage 11 (FIG. 2) can be X and Y. Move the axis direction any distance. During the movement of the substrate 9, a small amount of air pressure is continuously applied to the electric paste housing tube 13, and the electric paste is discharged from the discharge port of the tip end portion of the nozzle 13a, and the desired electric paste is applied to the substrate 9. The distance between the nozzle 13a and the substrate 9 is measured by the distance meter 14 in the horizontal movement of the substrate 9 held by the substrate holding mechanism 7 in the X and Y directions. The microcomputer 1 7 a is based on the measurement result, and in order to maintain the nozzle 1 3 a and the substrate at a certain interval, the control command is transmitted to the Z-axis driving device 1 7 i that controls the servo motor 12 . Further, in the present embodiment, although the Z-axis moving platform is only moved in the Z direction, the z-axis moving platform supporting tray 10 may be moved in the X-axis direction as the upper portion of the Z-axis platform supporting frame 2. Further, the Z-axis platform support frame 2 is moved to the γ-axis direction -11 - 1252134
,將可取代前述之X,Y軸移動平台。 其次,藉由圖5說明有關本實施例之裝置動作。 於圖5之中,首先,插入電源(步驟1〇〇)。插入電 源時,執行塗布機之起始設定(步驟200 )。於此起始設 定工程上,驅動使圖2所示之各平台移動之伺服馬達4、 6、8 a、1 2。藉此,將基板保持機構7往X、γ、0移動, 於定位於特定基準位之同時,噴嘴1 3 a (圖3 ),其電糊 吐出口爲了開始電糊塗布之位置(亦既,電糊塗布起始點 )’故設定於特定之原點位置。再進行電糊圖案資料或基 板位置資料,電糊吐出結束位置資料之設定。 輸入相關資料,係從鍵盤2 0 (圖2 )進行,所輸入之 資料’如前所述,係收納於內建於微電腦1 7 a (圖4 )之 RAM。 當此起始設定工程(步驟2 0 0 )結束時,其次,往步 驟3 00移動,主控制部1 7,係進行管理用電腦1 〇2,和設 計、生產資訊之通訊。 具體而言,如圖1所示,收納於管理用電腦1 0 2之面 板設計資訊1 0 3資料,譬如,液晶基板單元設計値,彩色 濾光片高度設計資訊,間隔物高度設計値等,和以收到對 所製造基板之前述設計値之檢查結果資料,來做爲面板生 產資訊1 04資料,收納於電糊塗布機之控制系統之外部記 憶裝置1 8,記憶於記憶體(RAM )。 其次,於步驟3 5 0上,從設計値及檢查結果之資訊, 於基板上執行進行塗布描繪之密封圖案之吐出條件,修正 -12- 1252134 (9) 値之計算。 於此,係將修正項目之密封塗布寬度,密封 ,塗布位置之修正(四角形密封內側尺寸修正) 加以說明。此種情況,塡充於面板之液晶量,於 中爲一定。 如圖6所示,當於】片基板上形成複數面板 描繪封閉於面板顯示領域外圍之四角形之密封圖 封圖案之塗布剖面積和塗布位置將能決定塡充液 容積。 換言之,如圖7所示,於基板上之密封圖案 繪位置之中,塗布後之形狀(H。、WQ)爲重疊 藉由進行貼合處理後之形狀爲(H 1、W1 )藉此 空間乃爲塡充液晶之空間。因此’爲了液晶塡充 定,做爲密封圖案之塗布裝置及塗布形狀,有必 高度,寬度(塗布量)因應於彩色濾光片等之形 進行加以修正。 圖9爲表示面板貼何時之狀態和彩色濾光片 圖。如圖9所示。於本實施形態上’於上基板 彩色濾光片5 3和配向膜5 2,而於下基板9則於 5 7形成配向膜5 2,更於環狀形成密封圖案P P 1 側分散間隔物5 5 ’滴下特定量之液晶5 6 °此等 9、5 9,保持於各下基板保持具5 0及上基板保 於真空中,進行上下基板定位之後’降下上基: 5 1而進行貼合。 塗布局度 做爲例子 容許範圍 時,能夠 案。此密 晶單元之 之塗布描 基板,而 所形成之 容積爲一 要以有關 成狀態而 部之放大 5 9,形成 T F 丁陣歹ij ,於其內 上下基板 ί 具 51, 板保持具 -13- 1252134 (10) 然而,如圖9 ( b )之放大圖所示,彩色濾光片5 3係 於厚方向形成具有凹凸之某形態,此凹凸若於設計之容許 値內時,既無問題,但是於於基板製造時,有時將會超出 容許値之情況。將超出容許値做爲全部不良基板而加以廢 棄時,將大幅降低製造良率。於是,當超越容許値時’乃 藉由變更後段工程之製造條件,使得吸收前述製造誤差。 於本實施例子上,變更(修正)於塗布工程之密封劑塗布 量或是塗布圖案,係於吸收誤差。 因此,如以上所述,藉由施加修正之密封圖案之塗布 條件,使得能夠進行電糊圖案之塗布描繪。增加塗布高度 ,係於調整噴嘴高度資料,爲了使對基板之噴嘴頭端位置 動作較爲高,而修正資料,反之,當降低塗布高度時’亦 可修正降低噴嘴高度之方向。 如圖8所示,改變部分塗布寬度而亦可調整容積。當 增寬塗布寬度時,係修正(提高)塗布壓力資料,於加寬 塗布寬度方向進行修正,反之,縮小時,係修正(降低) 塗布壓力資料,而於縮小塗布寬度方向進行修正。 另外,將塗布位置資料於加寬方向藉由修正四角密封 圖案之內側面積,而調整密封圖案之塗布位置,進而加寬 液晶之塡充容積。反之,於縮小內側面積方向修正資料, 係可縮小塡充容積。 若彩色濾光片比設計値之誤差範圍形成較爲厚時,以 設計値之高度與寬度形成密封圖案時,其液晶塡充容積不 變小,當將塡充之液晶量使用如設計値之數値時,將溢出 -14- 1252134 (11) 塡充之液晶而於浪費液晶之同時,藉由密封不良將降低良 率’而影響到局密度之顯示。同時,彩色濾光片之厚度比 設計値之誤差範圍較爲小時,以如設計値之數値塗布密封 圖案時,液晶塡充容積將變大,液晶於面板內不會擴散, 依情況於基板間將產生空間,而無法顯示高精密度之顯示 。因此,如前所述,將修正密封圖案之形成。 當此修正結束時,其次,於基板吸附機構7 (圖2 ) 搭載基板9而使其保持(步驟4 0 0 )。 其次,進行基板預備定位處理(步驟5 00 )。於此處 理上,將以畫像辨識照相機1 5來攝影搭載於基板保持機 構7之基板9之定位用符號,以畫像處理求出定位用符號 之重心位置,而檢測於基板9之0方向之傾斜,因應於此 驅動伺服a (圖4 ),亦修正此0方向之傾斜。 又,電糊收納筒1 3內之剩餘電糊較爲少時,於下個 電糊塗布作業上,於此作業途中爲了不使電糊中斷,故將 電糊收納筒1 3與噴嘴1 3 a同時交換。然而,當交換噴嘴 1 3 a時,有時將會產生位置偏移。因此,於未形成基板9 之電糊圖案處,使用交換之新噴嘴13a而進行十字描繪。 且,以畫像處理求出此十字描繪交點之重心位置,演算出 此重心位置和基板9上之定位用符號之重心位置間之距離 。將求出之距離做爲噴嘴1 3 a之電糊吐出口之偏移位置量 dx、dy,於微電腦17a收納內建之RAM。藉此,結束基 板預備定位處理(步驟5 00 )。噴嘴之偏離位置量dx 、dy,係於此後進行之電糊圖案之塗布描繪之動作時,進 -15- 1252134 (12) 行修正。 其次,進行電糊圖案描繪處理(步驟600 )。於此處 理上,於塗布起始位置上,爲了定位噴嘴13a之吐出口, 故使基板9移動,進行噴嘴位置之比較,調整移動。因此 ,首先,於先前基板預備定位處理(步驟5 00 )先取得, 而所收納於微電腦17a之RAM之噴嘴13a之偏移位置量 dx、dy,進行是否位於圖3所示之噴嘴13a之偏離位置量 之容許範圍△ X、△ Y。若於容許範圍內(△ X ^ dx及△ Y ^ dy )時,既保持原狀。若爲容許範圍外(△ X < dx或 △ Y < dy )時,基於此位置偏移量dx,dy,移動基板9, 而解除噴嘴1 3 a之電糊吐出口與基板9之所期望位置間之 偏移,將噴嘴1 3 a定位於所期望之位置。 其次,於電糊圖案描繪高度設定噴嘴13a之高度。基 於噴嘴之初期移動距離資料,初期移動距離部分降下噴嘴 1 3 a。於持續動作上,藉由距離計1 4來量測基板9表面高 度,確認噴嘴13a頭端是否設定於描繪電糊圖案之高度。 結果,當無法設定於描繪高度時,降下噴嘴1 3 a直到描繪 高度。 實際上,反覆進行上述基板9表面計測和噴嘴1 3 a之 微小距離降低,爲了噴嘴1 3 a頭端成爲塗布描繪電糊圖案 之高度而設定。同時,當未交換電糊收納筒13時’噴嘴 13a之偏移位置量dx、dy亦未紀錄。因此’進入電糊圖 案描繪處理(步騾6 0 0 )之後不久’立刻進行於上述說明 之噴嘴13a之高度設定。 -16- 1252134 (13) 當結束以上之處理時,其次,基於收納於微電腦17a 之RAM之電糊圖案資料,驅動伺服馬達4、6。藉此,噴 嘴1 3 a之電糊吐出口爲對向於基板2 8之狀態,因應於此 電糊圖案資料,基板9於X、Y方向移動之同時,於電糊 收納筒1 3施加微小氣壓,開始從噴嘴1 3 a之電糊吐出口 之電糊之吐出。藉此,開始往基板9之電糊圖案之塗布描 繪。 且,此和如先前所說明,微電腦1 7a係從距離計1 4 輸入噴嘴1 3 a之電糊吐出口和基板9之表面之間隔實際資 料,而測定基板9表面之凹凸,因應於此測定値,藉由驅 動Z軸驅動用之伺服馬達1 2,使得從基板9表面之噴嘴 1 3 a之設定高度能維持一定。 如此,進行電糊圖案之描繪。此動作中,噴嘴1 3 a之 電糊吐出口,係進行判斷是否爲藉由基板9上之上述電糊 圖案資料所決定之描繪圖案之終端,若爲終端時,再返回 於基板表面凹凸之測定處理,反覆上述之塗布描繪。如此 ,電糊圖案形成將持續到描繪圖案之終端。 同時,當到達於此描繪圖案終端時,驅動伺服馬達 1 2而使噴嘴〗3 a升高,結束此電糊圖案描繪工程(步驟 600 ) ° 當結束以上之工程時,其次,進入基板排出處理(步 驟700 ),於此圖2之中,解除基板9之保持,排出於裝 置外。 且,其次,判斷有無塗布之基板,(步驟8 00 ),以 -17- 1252134 (14) 其他相同圖案而具有形成電糊膜之基板時,將從步驟300 反覆,當全部基板結束一連串之處理時,作業將全部結束 (步驟9 0 0 )。 於上述之說明上,雖然係將形成彩色濾光片之基板做 爲例子而加以說明,但是即使有關形成TFT基板,亦可 進行相同之修正。 如以上說明之,若藉由本發明時,於液晶單元組立工 程之中,設置輸入LCD面板之設計,生產資訊之手段, 設置從輸入之資訊變更密封圖案之塗布條件之手段,藉由 控制密封塗布剖面積,使得可控制液晶塡充容積之修正, 可改善LCD面板之生產良率之電糊塗布機,和液晶塡充 容積之修正方法及製造液晶滴下貼合製程。 【圖式簡單說明】 圖1爲表示本發明之液晶基板之組立工程之槪略方塊 線圖。 圖2爲表示藉由本發明所產生之電糊塗布機之實施形 態斜視圖。 圖3爲表示於圖1所示之實施形態之電糊收納筒,和 距離量測計之配置關係斜視圖。 圖4爲表示於圖1所示之實施形態之控制系統方塊圖 〇 圖5爲表示圖1所示之實施形態之整體動作流程圖。 圖6爲表示說明塗布描繪於基板上之電糊圖案圖。 -18- 1252134 (15) 圖7爲表示說明貼核實之電糊圖案之狀態圖。 圖8爲表示說明藉由圖案修正所產生容積修正法圖。 圖9爲表示基板貼合之狀況,和彩色濾光片部之放大 圖。 主要元件對照表 1 基台 2 Z軸平台支撐基台 3 X軸移動平台 4 X軸伺服馬達 4 伺服馬達 5 Y軸移動平台 6 伺服馬達 7 基板保持機構 8 0軸移動平台 8a 伺服馬達 9 基板 10 Z軸移動平台支撐托架 1 1 Z軸移動平台 12 伺服馬達 1 3 電糊收納筒 13 收納筒 1 3 a噴嘴 14 噴嘴支撐具 -19- 1252134 (16) 15 畫像辨視照視機 16 距離計 17 主控制部 17a微電腦 17b馬達控制器 17c資料通訊匯流排 1 7 d外部介面 17e畫像辨識裝置 17f X軸驅動裝置 17g Y軸驅動裝置 1 7h Z軸驅動裝置 1 7i Z軸驅動裝置 18 硬式磁碟機 18 副控制部 1 8 a外部記憶裝置(硬式磁碟機) 1 8 b軟式磁碟機 19 監視器 20 鍵盤 2〇a調整器 2 1 訊號配線 2 1 配線 22 負電壓源 2 3 a調整器 23 正電壓源 -20- 1252134 (17) 2 4 閥單元 25 大氣 26 照相機 26 量測用 26 照相機 50 下基板 51 上基板 5 2 配向膜 53 彩色濾 5 5 間格物 5 6 液晶 5 6 液晶 5 7 TFT 陣 59 下基板 1 0 0前工程 1 0 1前工程 102管理用 1 〇 3面板之 1 〇 4面板之 105製造線 106 TFT 基 1 〇 7基板組 1 0 8密封塗 1 0 9電極劑 照相機 保持具 保持具 光片 列 電腦 設計資訊 生產資訊 板製造線 立工程 布 塗布 -21 1252134 (18) 1 1 〇液晶滴下工程 I 1 1面板貼合工程 II 2模組工程 X X軸 Υ Υ軸 Θ 0軸 ζ Ζ軸 △ X偏移位置之容許範圍 △ Υ偏移位置之容許範圍 -22-, will replace the aforementioned X, Y axis mobile platform. Next, the operation of the apparatus relating to the present embodiment will be described with reference to FIG. In Fig. 5, first, a power source is inserted (step 1). When the power is plugged in, the initial setting of the coater is performed (step 200). In this initial setting, the servo motors 4, 6, 8a, 1 2 for moving the platforms shown in Fig. 2 are driven. Thereby, the substrate holding mechanism 7 is moved to X, γ, and 0 to be positioned at a specific reference position, and the nozzle 13 3 a (FIG. 3) is in the position where the electric paste discharge port starts to apply the paste (also, The starting point of the electric paste coating is set to a specific origin position. Then, the electric paste pattern data or the substrate position data is set, and the setting of the end position data is discharged. The relevant data is input from the keyboard 20 (Fig. 2), and the input data is stored in the RAM built into the microcomputer 1 7 a (Fig. 4) as described above. When the initial setting project (step 200) ends, the next step is to move to step 00, and the main control unit 17 performs communication between the management computer 1 and the design and production information. Specifically, as shown in FIG. 1 , the panel design information stored in the management computer 102 is, for example, a liquid crystal substrate unit design, a color filter height design information, a spacer height design, and the like. And the inspection result data of the aforementioned design of the manufactured substrate is used as the panel production information 104 data, and the external memory device stored in the control system of the electric paste coating machine is stored in the memory (RAM). . Next, in step 350, the discharge condition of the seal pattern for coating drawing is performed on the substrate from the information of the design flaw and the inspection result, and the calculation of -12-1252134 (9) is corrected. Here, the correction coating width, sealing, and coating position correction (square size correction inside the square seal) of the correction item will be described. In this case, the amount of liquid crystal that is added to the panel is constant in the middle. As shown in Fig. 6, when a plurality of panels are formed on the substrate, the coating sectional area and the coating position of the sealed sealing pattern which is enclosed around the periphery of the panel display area can determine the filling volume. In other words, as shown in FIG. 7, in the position of the seal pattern on the substrate, the shape (H., WQ) after coating is overlapped and the shape after the bonding process is (H1, W1). It is a space for filling the LCD. Therefore, in order to charge the liquid crystal, the coating device and the coating shape of the seal pattern are required to have a high height, and the width (coating amount) is corrected in accordance with the shape of the color filter or the like. Figure 9 is a view showing the state of the panel sticker and the color filter. As shown in Figure 9. In the present embodiment, the upper substrate color filter 53 and the alignment film 52 are formed, and the lower substrate 9 is formed with the alignment film 52 in the fifth substrate, and the sealing pattern PP 1 side dispersion spacer 5 is formed in a ring shape. 5 'Drop a specific amount of liquid crystal 5 6 ° These 9, 5 9, keep the lower substrate holder 50 and the upper substrate in a vacuum, after positioning the upper and lower substrates, 'lower the upper base: 5 1 and fit . The coating degree is an example when the allowable range is available. The dense crystal unit is coated with a substrate, and the volume formed is a magnification of 5.9 in a state of formation, forming a TF 歹 歹 ij, in which the upper and lower substrates are 51, the plate holder-13 - 1252134 (10) However, as shown in the enlarged view of Fig. 9(b), the color filter 53 forms a form having irregularities in the thick direction, and the unevenness is not problematic if it is allowed in the design. However, when the substrate is manufactured, it may exceed the allowable condition. When the excess is exceeded as a defective substrate, the manufacturing yield is greatly reduced. Therefore, when the exceeding tolerance is exceeded, the manufacturing error is absorbed by changing the manufacturing conditions of the latter stage. In the present embodiment, the amount of the sealant applied or the applied pattern of the coating process was changed (corrected) to the absorption error. Therefore, as described above, by applying the modified coating condition of the seal pattern, the coating drawing of the electric paste pattern can be performed. Increasing the coating height is based on adjusting the nozzle height data. In order to make the position of the nozzle tip end of the substrate higher, the data is corrected. Conversely, when the coating height is lowered, the direction of the nozzle height can be corrected. As shown in Fig. 8, the volume can be adjusted by changing the partial coating width. When the coating width is widened, the coating pressure data is corrected (increased), and the coating width direction is corrected, and when it is reduced, the coating pressure data is corrected (reduced), and the coating width direction is corrected. Further, the coating position data is corrected in the widening direction by correcting the inner area of the square sealing pattern, thereby adjusting the coating position of the sealing pattern, thereby widening the filling volume of the liquid crystal. Conversely, if the correction data is corrected in the direction of the inner area, the volume of the charge can be reduced. If the color filter is thicker than the design flaw, when the seal pattern is formed by the height and width of the design, the liquid crystal charge volume does not become small, and when the liquid crystal amount is used, the design is used. When counting several times, it will overflow the -14252134 (11) liquid crystal and waste the liquid crystal, and the yield will be reduced by poor sealing, which will affect the display of local density. At the same time, the thickness of the color filter is smaller than the design flaw. When the seal pattern is applied as the design number, the liquid crystal charge volume will become larger, and the liquid crystal will not diffuse in the panel, depending on the substrate. There will be space between them, and it is impossible to display a high-precision display. Therefore, as described above, the formation of the seal pattern will be corrected. When the correction is completed, the substrate 9 is mounted on the substrate adsorption mechanism 7 (Fig. 2) and held (step 480). Next, a substrate preliminary positioning process (step 5 00) is performed. In this process, the image recognition camera 15 is used to image the positioning symbols of the substrate 9 mounted on the substrate holding mechanism 7, and the position of the center of gravity of the positioning symbol is obtained by image processing, and the tilt of the substrate 9 in the 0 direction is detected. In response to this drive servo a (Fig. 4), the tilt in the 0 direction is also corrected. Moreover, when there is a small amount of residual electric paste in the electric paste storage tube 1 3, in the next electric paste application operation, in order to prevent the electric paste from being interrupted during the operation, the electric paste storage tube 13 and the nozzle 13 are placed. a simultaneous exchange. However, when the nozzle 1 3 a is exchanged, a positional shift sometimes occurs. Therefore, cross-drawing is performed using the new nozzle 13a exchanged at the electric paste pattern in which the substrate 9 is not formed. Further, the position of the center of gravity of the cross drawing intersection is obtained by image processing, and the distance between the position of the center of gravity and the position of the center of gravity of the positioning symbol on the substrate 9 is calculated. The distance obtained is taken as the offset position amount dx, dy of the electric discharge port of the nozzle 13a, and the built-in RAM is stored in the microcomputer 17a. Thereby, the substrate preliminary positioning processing (step 5 00) is ended. The amount of deviation of the nozzles dx and dy is corrected by the coating drawing of the electric paste pattern performed thereafter, and is corrected in -15-1252134 (12). Next, an electric paste pattern drawing process is performed (step 600). Here, in order to position the discharge port of the nozzle 13a at the coating start position, the substrate 9 is moved, the nozzle positions are compared, and the movement is adjusted. Therefore, first, the previous substrate preliminary positioning processing (step 00) is first acquired, and the offset position amounts dx and dy of the nozzles 13a of the RAM stored in the microcomputer 17a are deviated from the nozzle 13a shown in Fig. 3. The allowable range of position amount △ X, △ Y. If it is within the allowable range (Δ X ^ dx and Δ Y ^ dy ), it remains as it is. When it is out of the allowable range (Δ X < dx or Δ Y < dy ), the substrate 9 is moved based on the positional shift amount dx, dy, and the electric discharge port of the nozzle 13 a and the substrate 9 are released. The offset between the desired positions is such that the nozzle 13 a is positioned at the desired position. Next, the height of the nozzle 13a is set in the electric paste pattern. Based on the initial movement distance data of the nozzle, the initial moving distance partially drops the nozzle 1 3 a. In the continuous operation, the surface height of the substrate 9 was measured by the distance meter 14 to confirm whether or not the head end of the nozzle 13a was set at the height of the drawing paste pattern. As a result, when it is not possible to set at the drawing height, the nozzle 13 3a is lowered until the drawing height. Actually, the surface measurement of the substrate 9 and the small distance reduction of the nozzle 13 3 are repeatedly performed, and the tip end of the nozzle 13 3 is set to the height of the application drawing paste pattern. At the same time, when the electric paste accommodating cylinder 13 is not exchanged, the offset position amounts dx and dy of the nozzle 13a are also not recorded. Therefore, the height of the nozzle 13a described above is set immediately after "going into the electric paste pattern drawing process (step 650)." -16- 1252134 (13) When the above processing is completed, the servo motors 4 and 6 are driven based on the paste pattern data stored in the RAM of the microcomputer 17a. Thereby, the electric paste discharge port of the nozzle 13a is in a state of being opposed to the substrate 28. According to the electric paste pattern data, the substrate 9 is moved in the X and Y directions, and the electric paste storage tube 13 is applied minutely. The air pressure starts to be discharged from the electric paste of the electric discharge port of the nozzle 13 a. Thereby, the coating of the paste pattern of the substrate 9 is started. Further, as described above, the microcomputer 17a is configured to measure the unevenness of the surface of the substrate 9 from the distance between the surface of the electric discharge port of the nozzle 13a and the surface of the substrate 9 from the distance meter 14. That is, by setting the servo motor 12 for driving the Z-axis, the set height of the nozzles 13 3 from the surface of the substrate 9 can be maintained constant. In this way, the drawing of the electric paste pattern is performed. In this operation, the electric discharge port of the nozzle 13 a is used to determine whether or not the end of the drawing pattern determined by the electric paste pattern data on the substrate 9 is returned to the surface of the substrate. The measurement process is repeated, and the above-described coating drawing is repeated. As such, the pattern formation will continue until the end of the pattern is drawn. At the same time, when the pattern terminal is reached, the servo motor 12 is driven to raise the nozzle _3 a, and the smear pattern drawing process is ended (step 600) ° when the above project is finished, and then, the substrate discharge processing is entered. (Step 700). In Fig. 2, the holding of the substrate 9 is released and discharged outside the apparatus. Then, it is determined whether or not the coated substrate is present (step 00), and when the substrate having the electric paste film is formed in the same pattern as -17-1252134 (14), the process proceeds from step 300, and when all the substrates are finished, a series of processes are completed. At the time, the job will all end (step 9000). In the above description, although the substrate on which the color filter is formed is described as an example, the same correction can be performed even if the TFT substrate is formed. As described above, according to the present invention, in the liquid crystal cell assembly project, the design of the input LCD panel, the means for producing information, and the means for changing the coating conditions of the seal pattern from the input information are set, by controlling the seal coating. The cross-sectional area makes it possible to control the correction of the liquid crystal charge volume, the electric paste coater which can improve the production yield of the LCD panel, the correction method of the liquid crystal charge volume, and the manufacturing process of the liquid crystal drop. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing the assembly process of a liquid crystal substrate of the present invention. Fig. 2 is a perspective view showing the embodiment of an electric paste coater produced by the present invention. Fig. 3 is a perspective view showing the arrangement relationship between the electric paste storage tube and the distance measuring instrument of the embodiment shown in Fig. 1; Fig. 4 is a block diagram showing a control system of the embodiment shown in Fig. 1. Fig. 5 is a flow chart showing the overall operation of the embodiment shown in Fig. 1. Fig. 6 is a view showing a pattern of an electric paste which is applied and printed on a substrate. -18- 1252134 (15) Fig. 7 is a view showing a state in which the paste pattern of the paste verification is explained. Fig. 8 is a view showing a volume correction method for explaining the pattern correction. Fig. 9 is an enlarged view showing a state in which a substrate is bonded and a color filter portion. Main components comparison table 1 base station 2 Z-axis platform support base 3 X-axis moving platform 4 X-axis servo motor 4 servo motor 5 Y-axis moving platform 6 servo motor 7 substrate holding mechanism 8 0-axis moving platform 8a servo motor 9 substrate 10 Z-axis moving platform support bracket 1 1 Z-axis moving platform 12 Servo motor 1 3 Electric paste storage cylinder 13 Storage cylinder 1 3 a nozzle 14 Nozzle support -19- 1252134 (16) 15 Image recognition camera 16 Distance meter 17 Main control unit 17a Microcomputer 17b Motor controller 17c Data communication busbar 1 7 d External interface 17e Image recognition device 17f X-axis drive device 17g Y-axis drive device 7 7 Z-axis drive device 7 7 Z-axis drive device 18 Hard disk Machine 18 Sub-control unit 1 8 a External memory device (hard disk drive) 1 8 b floppy disk drive 19 Monitor 20 Keyboard 2 〇 a adjuster 2 1 Signal wiring 2 1 Wiring 22 Negative voltage source 2 3 a regulator 23 Positive voltage source-20- 1252134 (17) 2 4 Valve unit 25 Atmosphere 26 Camera 26 Measurement 26 Camera 50 Lower substrate 51 Upper substrate 5 2 Alignment film 53 Color filter 5 5 Grid 5 6 Liquid crystal 5 6 Liquid crystal 5 7 Under TFT array 59 Board 1 0 0 Front Engineering 1 0 1 Front Engineering 102 Management 1 〇 3 Panel 1 〇 4 Panel 105 Manufacturing Line 106 TFT Base 1 〇 7 Substrate Group 1 0 8 Seal Coating 1 0 9 Electrode Camera Holder Holder Light film computer design information production information board manufacturing line engineering coating coating-21 1252134 (18) 1 1 〇 LCD drop project I 1 1 panel fitting project II 2 module engineering XX axis Υ axis Θ 0 axis Ζ axis △ X offset position allowable range △ Υ offset position allowable range -22-