TWI251623B - Apparatus for making thin film, making method thereof and chamber for its apparatus - Google Patents

Apparatus for making thin film, making method thereof and chamber for its apparatus Download PDF

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Publication number
TWI251623B
TWI251623B TW093101117A TW93101117A TWI251623B TW I251623 B TWI251623 B TW I251623B TW 093101117 A TW093101117 A TW 093101117A TW 93101117 A TW93101117 A TW 93101117A TW I251623 B TWI251623 B TW I251623B
Authority
TW
Taiwan
Prior art keywords
chamber
high pressure
pressure gas
workpiece
film coating
Prior art date
Application number
TW093101117A
Other languages
English (en)
Chinese (zh)
Other versions
TW200506092A (en
Inventor
Il-Ho Kim
Hyun-Jeong Kim
Kook-Huyng Cho
Il-Hwan Bang
Original Assignee
Charm Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34587841&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI251623(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Charm Engineering Co Ltd filed Critical Charm Engineering Co Ltd
Publication of TW200506092A publication Critical patent/TW200506092A/zh
Application granted granted Critical
Publication of TWI251623B publication Critical patent/TWI251623B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
TW093101117A 2003-08-08 2004-01-16 Apparatus for making thin film, making method thereof and chamber for its apparatus TWI251623B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0055114A KR100526009B1 (ko) 2003-08-08 2003-08-08 박막증착장치 및 방법, 그리고 박막증착장치용 챔버

Publications (2)

Publication Number Publication Date
TW200506092A TW200506092A (en) 2005-02-16
TWI251623B true TWI251623B (en) 2006-03-21

Family

ID=34587841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093101117A TWI251623B (en) 2003-08-08 2004-01-16 Apparatus for making thin film, making method thereof and chamber for its apparatus

Country Status (3)

Country Link
KR (1) KR100526009B1 (ko)
CN (1) CN100366787C (ko)
TW (1) TWI251623B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8663441B2 (en) 2009-02-24 2014-03-04 Industrial Technology Research Institute Vacuum coating apparatus with mutiple anodes and film coating method using the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101682523B1 (ko) 2015-03-26 2016-12-07 참엔지니어링(주) 기판 지지 장치
KR102100801B1 (ko) 2018-04-12 2020-04-14 참엔지니어링(주) 증착 장치 및 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2639544B2 (ja) * 1988-01-08 1997-08-13 財団法人生産開発科学研究所 三層ペロブスカイト構造をもつＬａＡ▲下２▼Ｃｕ▲下３▼Ｏ▲下７▼▲下−▼ｘの単結晶薄膜及びＬａＡ▲下２▼Ｃｕ▲下３▼Ｏ▲下７▼▲下−▼ｘ薄膜の製造法
JPH06170218A (ja) * 1992-12-09 1994-06-21 Hitachi Ltd 表面超構造作製方法及び装置
KR950007670B1 (ko) * 1993-03-31 1995-07-14 동부제강주식회사 상압 증기분사에 의한 증착도금장치
KR100389680B1 (ko) * 2001-08-11 2003-06-27 재단법인 포항산업과학연구원 샷 블래스트를 이용한 조선용 형강의 용접부위 도금막제거장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8663441B2 (en) 2009-02-24 2014-03-04 Industrial Technology Research Institute Vacuum coating apparatus with mutiple anodes and film coating method using the same

Also Published As

Publication number Publication date
KR100526009B1 (ko) 2005-11-08
TW200506092A (en) 2005-02-16
KR20050017164A (ko) 2005-02-22
CN1580318A (zh) 2005-02-16
CN100366787C (zh) 2008-02-06

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