CN1580318A - 镀膜装置和镀膜方法及该镀膜装置专用的镀膜室 - Google Patents
镀膜装置和镀膜方法及该镀膜装置专用的镀膜室 Download PDFInfo
- Publication number
- CN1580318A CN1580318A CNA2004100003608A CN200410000360A CN1580318A CN 1580318 A CN1580318 A CN 1580318A CN A2004100003608 A CNA2004100003608 A CN A2004100003608A CN 200410000360 A CN200410000360 A CN 200410000360A CN 1580318 A CN1580318 A CN 1580318A
- Authority
- CN
- China
- Prior art keywords
- coating chamber
- gas
- metal
- high pressure
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0055114 | 2003-08-08 | ||
KR10-2003-0055114A KR100526009B1 (ko) | 2003-08-08 | 2003-08-08 | 박막증착장치 및 방법, 그리고 박막증착장치용 챔버 |
KR1020030055114 | 2003-08-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1580318A true CN1580318A (zh) | 2005-02-16 |
CN100366787C CN100366787C (zh) | 2008-02-06 |
Family
ID=34587841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100003608A Ceased CN100366787C (zh) | 2003-08-08 | 2004-01-09 | 镀膜装置和镀膜方法及该镀膜装置专用的镀膜室 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100526009B1 (zh) |
CN (1) | CN100366787C (zh) |
TW (1) | TWI251623B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI379916B (en) | 2009-02-24 | 2012-12-21 | Ind Tech Res Inst | Vacuum coating device and coating method |
KR101682523B1 (ko) | 2015-03-26 | 2016-12-07 | 참엔지니어링(주) | 기판 지지 장치 |
KR102100801B1 (ko) | 2018-04-12 | 2020-04-14 | 참엔지니어링(주) | 증착 장치 및 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2639544B2 (ja) * | 1988-01-08 | 1997-08-13 | 財団法人生産開発科学研究所 | 三層ペロブスカイト構造をもつLaA▲下2▼Cu▲下3▼O▲下7▼▲下−▼xの単結晶薄膜及びLaA▲下2▼Cu▲下3▼O▲下7▼▲下−▼x薄膜の製造法 |
JPH06170218A (ja) * | 1992-12-09 | 1994-06-21 | Hitachi Ltd | 表面超構造作製方法及び装置 |
KR950007670B1 (ko) * | 1993-03-31 | 1995-07-14 | 동부제강주식회사 | 상압 증기분사에 의한 증착도금장치 |
KR100389680B1 (ko) * | 2001-08-11 | 2003-06-27 | 재단법인 포항산업과학연구원 | 샷 블래스트를 이용한 조선용 형강의 용접부위 도금막제거장치 |
-
2003
- 2003-08-08 KR KR10-2003-0055114A patent/KR100526009B1/ko active IP Right Review Request
-
2004
- 2004-01-09 CN CNB2004100003608A patent/CN100366787C/zh not_active Ceased
- 2004-01-16 TW TW093101117A patent/TWI251623B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100526009B1 (ko) | 2005-11-08 |
KR20050017164A (ko) | 2005-02-22 |
TW200506092A (en) | 2005-02-16 |
CN100366787C (zh) | 2008-02-06 |
TWI251623B (en) | 2006-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: CHARM ENGINEERIN CO., LTD. Free format text: FORMER NAME: CHARM CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Gyeonggi Do, South Korea Patentee after: Charm Engineerin Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Charm Engineerin Co., Ltd. |
|
C35 | Partial or whole invalidation of patent or utility model | ||
IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20140723 Decision number of declaring invalidation: 23353 Granted publication date: 20080206 |