TWI247067B - Non-woven fabric for electrical insulation, prepreg and laminate - Google Patents

Non-woven fabric for electrical insulation, prepreg and laminate Download PDF

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Publication number
TWI247067B
TWI247067B TW90123111A TW90123111A TWI247067B TW I247067 B TWI247067 B TW I247067B TW 90123111 A TW90123111 A TW 90123111A TW 90123111 A TW90123111 A TW 90123111A TW I247067 B TWI247067 B TW I247067B
Authority
TW
Taiwan
Prior art keywords
fiber
woven fabric
poly
electrical insulation
binder
Prior art date
Application number
TW90123111A
Other languages
English (en)
Inventor
Shigeru Kurumatani
Manabu Ochida
Hirokazu Hiraoka
Original Assignee
Shin Kobe Electric Machinery
Oji Paper Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery, Oji Paper Co filed Critical Shin Kobe Electric Machinery
Application granted granted Critical
Publication of TWI247067B publication Critical patent/TWI247067B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/08—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
    • B29C70/081—Combinations of fibres of continuous or substantial length and short fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/047—Reinforcing macromolecular compounds with loose or coherent fibrous material with mixed fibrous material
    • C08J5/048—Macromolecular compound to be reinforced also in fibrous form
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/247—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using fibres of at least two types
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4326—Condensation or reaction polymers
    • D04H1/4334—Polyamides
    • D04H1/4342—Aromatic polyamides
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/54—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by welding together the fibres, e.g. by partially melting or dissolving
    • D04H1/541—Composite fibres, e.g. sheath-core, sea-island or side-by-side; Mixed fibres
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
    • D04H1/587—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives characterised by the bonding agents used
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
    • D04H1/64—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives the bonding agent being applied in wet state, e.g. chemical agents in dispersions or solutions
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/70—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
    • D04H1/72—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
    • D04H1/732—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged by fluid current, e.g. air-lay
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
    • H01B3/50—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials fabric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2211/00—Chemical nature of organic luminescent or tenebrescent compounds
    • C09K2211/14—Macromolecular compounds
    • C09K2211/1408—Carbocyclic compounds
    • C09K2211/1425—Non-condensed systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2738—Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
    • Y10T442/2893—Coated or impregnated polyamide fiber fabric
    • Y10T442/2902—Aromatic polyamide fiber fabric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/696—Including strand or fiber material which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous compositions, water solubility, heat shrinkability, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/697—Containing at least two chemically different strand or fiber materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/699—Including particulate material other than strand or fiber material

Description

1247067 A7 B7 五、發明説明（1) (請先閱讀背面之注意事項再填寫本頁) 本發明係有關以para型芳香族聚醯胺纖維做爲主體之 電絕緣用不織布，且，以此電絕緣用不織布做爲基材之預 漬體及層合板（含印刷配線板’多層印刷配線板者）者。 ，此印刷配線板、多層印刷配線板適於做爲抵抗、I C等 之lead less chip (無導線半導體基板單位）零件之表面實 裝時之使用。 先行技術中，於組裝電子機器之印刷配線板中搭載 I C類之電子零件時，大槪，將此等電子零件做成半導體 基板單位後以表面實裝方式進行搭載者。表面實裝方式由 電子機器小型輕量化、高密度化之面觀之爲較理想方式者 。。又，伴隨印刷配線板之高密度化，爲使介著絕緣層之 配線向接續通過開啓於該絕緣層之I V H ( Interstitial Via Hole )，該I V Η主要係藉由激光照射加工所形成者， 因此，於印刷配線板以藉由激光照射後可望易於開孔加工 〇 . 又，於印刷配線板進行lead less chip零件之表面實裝 時，務必使印刷配線板之熱膨脹係數儘量調節成lead less chip零件之熱膨脹係數（2〜7 ppm /°C)。 經濟部智慧財產局S工消費合作社印製 更且，爲提升介著絕緣層之配線間連接的可靠性，儘 可能減少印刷配線基板尺寸之變化（加熱收縮）者宜。減 少此尺寸變化之重點特別在於多層印刷配電線板上。 由此觀點，做爲構成印刷配線板之絕緣層基材者，以 具有負極熱膨脹係數之para型芳香族聚醯胺纖維做爲主體 之不織布被開發之。此電絕緣用非織布如以下所示。 -4- 本紙裱尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 1247067 A7 B7 五、發明説明（2) (1 )將para型芳香族聚醯胺纖維（聚一對一二苯一 3 ，4 > -二苯醚對苯二甲醯胺纖維）短切纖維與軟化溫 (請先閲讀背面之注意事項再填寫本頁) 度2 2 0 °C以上之熱塑性樹脂短切纖維進行混合紡紗後， 此等相互纖維以熱硬化性樹脂粘合劑進行粘合之同時，使 軟化溫度2 2 0 °C以上熱塑性樹脂纖維碎纖熱融合於para 型芳香族聚醯胺纖維短切纖維後所形成之不織布（參考特 開平1〇一138381號公報）。 (2 )使para型芳香族聚醯胺纖維（聚一對—苯二甲 醯對苯二胺纖維）短切纖維與mata型芳香族聚醯胺之纖維 條相互進行混紡後，使mata型芳香族聚醯胺之纖維條絡合 於para型芳香族聚醯胺短切纖維後，所形成之不織布（參 考特開昭6 1 - 1 6 0 5 0 0號公報）。 經濟部智慧財產局資工消費合作社印製 含para型芳香族聚醯胺纖維之此等不織布係於藉由組 裝工法製造多層印刷配線板時做爲絕緣層基材使用之。於 此基材浸漬熱硬化性樹脂後，加熱乾燥所形成之預漬體表 面上使P E T薄膜進行層壓塑料，於其所定個處照射激光 後開孔後，於此孔中塡入焊錫膏狀導電材料。此導電材料 係於介著絕緣層之印刷配線間進行導通時使用之。此焊錫 膏狀導電材料由所塡充之預漬層剝離P E T薄膜後，於預 漬體兩面載置銅箔後，藉由加熱加壓成型使此等呈一體化 ’使銅箔加工於印 '刷配線後，形成具有第1印刷配線之印 刷配線板。 與上述相同，於此印刷配線板中塡入焊錫膏狀導電材 料後’介著另一預漬體層進行層合銅箔，再藉由加熱加壓 -5- 本紙浪尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） 1247067 Α7 Β7 五、發明説明（3) 成形後使此等呈一體化，此銅箔亦於印刷配線進行加工。 如此，依序調節印刷配線後，形成多層印刷配線板（特開 平5 - 1 7 5 6 5 0號公報、特開平7 _ 1 7 6λ· 8 4 6號 (請先閲讀背面之注意事項再填寫本頁) 公報）。 藉由此技術後，完全連接介著絕緣層後位於其上下之 印刷配線間之I V Η後，可實現製造多層印刷配線板。且 ，固化焊錫膏狀導電材料後所形成之導體上可形成I V Η 於上層之絕緣層上。 para型芳香族聚醯胺纖維之1的聚一對一二苯一 3， 4 / -二苯醚對苯二胺纖維爲提昇纖維強度、於紡紗時務 必進行延伸，惟被延伸之纖維經加熱而收縮之。以此纖維 做爲主體之不織布用於絕緣層之基材的印刷配線板其焊錫 回流時尺寸收縮（熱收縮）極大，因此，連接表面實裝相 互之零件的可靠性，介著絕緣層之印刷配線間之連接的可 靠性均有降低之缺點。 經濟部智慧財產局員工消費合作社印製 另一 para型芳香族聚醯胺纖維之聚-對-苯二甲醯對 苯二胺纖維其被液晶紡紗之結晶性極高，分子相互結合性 極強。以此纖維爲主體之不織布做爲基材之預漬體、印刷 配線板藉由激光照射後出現開孔加工之問題點。聚-對-苯二甲醯對苯二胺纖維其熱分解溫度高，藉由激光照射後 其基材材料之熱分解性、材料之飛散性比浸漬於不織布之 樹脂更爲低劣。因此，形成於基材之孔壁表面上出現凹凸 不平，、造成塡入焊錫膏狀導電材料產生滲色、電鍍性降低 、引起通過I V Η後配線間連接不良等問題。 -6- 本紙長尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 1247067 A7 B7 五、發明説明（4) 另外，此聚-對-苯二甲醯對苯二胺纖維並非延伸紡 紗而是被液晶紡紗者，因此，熱收縮少，尺寸安定性良好 。此纖維經抄造後，使粘合於熱硬化性樹脂粘合劑之不織 布用於預漬體後，可期待取得尺寸安定性良好、極少翹曲 之層合板。惟，並未必被證明一定可如期待者，因當預漬 體進行加熱時，收縮後將出現表面波紋、層合板經熱處理 後，同樣會產生翹曲。 本發明之1目的係提供一種以para型芳香族聚醯胺纖 維，特別是聚-對-苯二甲醯對苯二胺纖維做爲主體之不 織布用於絕緣層基材之印刷配線板藉由熱可使翹曲變小之 預漬體或層合板者。 本發明其他目的係提供一種於預漬體經過照射激光形 成之孔中塡入焊錫膏狀導電材料時可控制滲色於焊錫膏、 且於印刷配線板之絕緣層中照射激光後使啓開之I V Η， 通孔之孔壁的凹凸變小，可提升配線層相互連接之可靠性 的預漬體或層合板者。 本發明更有其他目的爲提供藉由熱可控制收縮之預漬 體者。 本發明更有其也目的係提供適用於可達成該目的之印 刷配線板的電絕緣用非織布者。 〔發明開示〕 本發明之電絕緣用非織布係以para型芳香族聚醯胺纖 維做爲主成分，相互之纖維以粘合劑粘合之不織布爲對象 本纸伕尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） · 7 - (請先閱讀背面之注意事項再填寫本頁) 裝· 訂 經濟部智慧財產局8工消費合作社印製 1247067 A7 B7 五、發明説明（5) ，而爲達成本發明目的，相互纖維係藉由熱硬化性樹脂粘 合劑與選自軟化溫度2 2 0 °C以上之熱塑性樹脂之短切纖 維以反纖維紙漿及預漬體之第二粘合劑進_行粘合a又，para 型芳香族聚醯胺纖維其含有（a )聚-對-苯二甲醯對苯 二胺纖維紙漿、或（b )聚一對-二苯對苯二甲醯胺纖維 短切纖維與聚-對-二苯對苯二甲醯胺纖維紙漿兩者配合 質量比率爲聚-對-二苯對苯二甲醯胺纖維短切纖維/聚 一對一二苯對苯二甲醯胺纖維紙漿=0/1 0 0〜9 5/ 5爲其特徵者。 如上述，para型芳香族聚醯胺纖維係以聚-對-苯二 甲醯對苯二胺纖維做爲主體，特別是含其纖維紙漿後，以 此不織布做爲絕緣層基材後所形成之層合板可有效控制藉 由熱引起尺寸收縮者。 又，以此不織布做爲基材之預漬體藉由激光照射後之 開孔性係藉由聚-對-苯二甲醯對苯二胺纖維紙漿之存在 而被改善之。 聚-對-苯二甲醯對苯二胺纖維紙漿係將其纖維碎片 打漿後細分枝後所形成者。分枝程度以打漿度（freeness csf)之指標示之。freeness愈小表示打獎性愈佳。理想之 freeness爲5 5 0 c s f以下，最佳者爲1〜200csf 者。本明細書所使用之打漿度（c s f )係依j I S - P 一 8 1 2 1所規定之ml値者。 細分支之纖維紙漿係埋入纖維碎片之間隙中，因此， 其具有高熱分解溫度之聚一對一二苯對苯二甲醯胺纖維呈 (請先閲讀背面之注意事項再填寫本頁) 裝·
•1T 經濟部智慧財產局P'工消f合作社印製 本紙浪尺度適用中國國家標孪（CNS ) A4規格（210、乂 297公潑1 ' 1247067 A7 _B7 __ 五、發明説明（6) (請先閱讀背面之注意事項再填寫本頁) 均勻分散於整體不織布之厚度方向者。其結果’照射激光 後開孔時，孔壁內面不會呈不均之易昇華個處與不易昇華 之個處，使孔壁最後呈完好狀態。亦即，孔壁無凹凸、介 著塡入孔中之導電性焊錫膏進行配線層間之連接可提昇可 靠性。且，於孔壁進行電鍍後，可提升進行配線層間連接 之可靠性。 單使用細纖維之纖維紙漿，或使用纖維紙漿配合比率 高之短切纖維與纖維紙漿之混紡後，因所佔不織布細纖維 比率高，因此，可輕易達成激光照射之開孔作業。惟，當 短切纖維與纖維紙漿混紡下其短切纖維之配合質量比率大 於9 5時，將造成埋入短切纖維間隙之纖維紙漿不足。激 光照射後開孔壁之凹凸大增。爲考量以此不織布做爲基材 之絕緣層耐熱性與孔壁減少凹凸下，其短切纖維與纖維紙 漿之配合質量比率以5 0/5 0〜9 0/1 0者宜。 經濟部智慧財產局員工消費合作社印製 爲抑制遇熱收縮預漬體與遇熱造成層合板之趨曲，因 此被要求提升不織布之彈性率。此係增加預漬體、層合板 之彈性率後，將可控制預漬體遇熱之收縮及控制層合板遇 熱產生翹曲者。 本發明中熱硬化性樹脂粘合劑係附著於纖維相互之交 叉點後，粘合相互之纖維後，第二粘合劑係熱融合於para 型芳香族聚醯胺纖維碎片後，及/或粘合絡合相互之纖維 者。此2個粘合劑組合係提升不織布彈性率者，換言之， 可抑制遇熱後降低預漬體，層合板之彈性率者。 - 第二粘合劑係至少1種選自軟化溫度2 2 〇 〇c以上之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公麈） -9 - 1247067 A7 B7 五、發明説明（7) (請先閱讀背面之注意事項再填寫本頁) 熱塑性樹脂之短切纖維與纖維紙漿以及纖條體之型態所成 者。短切纖維係切取可製成平滑纖維之所定尺寸者，纖維 紙漿係使短切纖維進行打漿者，纖條體係使薄膜狀樹脂進 行打漿者。短切纖維藉由熱融合，熱軟化後於變形下可進 行絡合，粘合不織布主成分之para型芳香族聚醯胺相互之 纖維。纖維紙漿、纖條體其自體有絡合能力、與 para 型芳 香族聚醯胺纖維一起藉由抄造後可粘合相互主成分纖維。 亦可加強適當加熱下，熱融合、熱軟化之第二粘合劑變形 下之絡合。 本發明之預漬體係浸漬熱硬化性樹脂於薄片狀基材後 ，乾燥之後所形成者，薄片狀基材係由該電絕緣用非織布 所成者。 又，本發.明之層合板係使熱硬化性樹脂浸漬於薄片狀 基材，乾燥後所形成之預漬體層經加熱加壓成型之後所形 成者，薄片狀基材係由該電.絕緣用非織布所成者。 〔發明實施之最佳形態〕 經濟部智慧財產局P'工消費合作社印製 以本發明電絕緣用非織布之一例，進行以下說明。 該例中，理想之纖維經爲1 _ 5旦尼爾以下之聚-對 -苯二甲醯對苯二胺纖維碎片與聚-對-苯二甲醯對苯二 胺纖維紙漿以及軟化溫度2 2 0 °C以上之熱塑性樹脂纖維 碎片所成之第二粘合劑經混紡後形成不織布，更於此混紡 不織布中藉由噴霧熱硬化性樹脂粘合劑後粘合相互纖維。· 熱硬化性樹脂粘合劑係附著於相互纖維之交叉點後粘 -10- 本纸張尺度適用中國國家標孪（CNS ) Μ規格（2l〇X297公釐） 1247067 A7 B7 五、發明説明（8) (請先閱讀背面之注意事項再填寫本頁) 合相互之纖維。第二粘合劑之熱塑性樹脂短切纖維係藉由 熱融合後，粘合相互纖維，藉由熱軟化變形後絡合纖維。 藉由此熱融合、熱軟化之絡合係於熱滾輥間加壓^不織布之 壓延步驟後達成之。 聚-對苯二甲醯對苯二胺纖維碎片之理想纖維長度爲 3〜6 m m。纖維長度愈短，則相互纖維之粘合點愈小， 不織布彈性率愈低。反之，纖維長度愈長，不織布彈性率 愈高，卻於抄造時產生纖維之糾結、分散群，均不織布密 布。 經濟部智惡財產局R工消費合作社印製 不織布中熱硬化性樹脂粘合劑含有率以5〜3 0質量 %爲宜。熱硬化性樹脂粘合劑含有率若小於5質量％時， 則相互纖維之粘合變弱。熱硬化性樹脂粘合劑爲5質量％ 係考量使不織布導入熱滾輥之壓延步驟時，可預先可附與 不織布充份強度之含有率者，且考量，預漬體之製造步驟 中可確保不織布耐溶劑性之強度及可控制焊錫膏之滲色的 含有率者。另外，當熱硬化性樹脂粘合劑大於3 0質量％ 時，則熱滾輥之壓延步驟中使纖維附著於熱滾輥，且，助 長預漬體之熱收縮，因此，熱硬化性樹脂粘合劑爲3 0質 量％係考量可防止附著於熱滾_，易於管理不織布之密度 ，且可控制預漬體之熱收縮於更理想範圍者之含有率。惟 ，當熱硬化性樹脂粘合劑使用超出3 0質量％並無造成困 擾。 熱硬化性樹脂粘合劑以環氧樹脂之異氰酸酯系樹脂做 爲硬化劑者宜。此時，環氧樹脂與異氰酸酯系樹脂之配合 -11 - 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） 1247067 A7 B7 五、發明説明（9) 質量爲當1 〇環氧樹脂時’異氰酸酯系樹脂爲0 · 5〜5 者。環氧樹脂粘合劑之硬化反應順利進行後將減少未反應 之官能基此乃藉由預漬體之熱減少彈性率降低之功能者 〇 又，不織布之第二粘合劑含有率係確定相互纖維之粘 合後，由控制預漬體之熱收縮及層合板之翹曲、扭曲之觀 點視之，含有率愈多愈好，惟，由層合板之耐熱性觀點視 之，則愈少愈好。因此，理想之該第二粘合劑含有率以5 〜1 5質量％者宜。 做爲第二粘合劑所使用之軟化溫度2 2 0 °C以上熱塑 性樹脂短切纖維有：間型芳香族聚醯胺纖維（聚-間-二 苯異苯二甲醯胺纖維）、聚酯纖維、6尼龍纖維、66尼 •龍纖維、聚烯丙酸酯纖維等之碎片被揭示之，一般只要軟 化溫度2 2 0 °C以上之熱塑性樹脂纖維者，並無特別限定 。惟，軟化溫度爲para型芳香族聚醯胺纖維之熱分解溫度 以下者。做爲第二粘合劑之mata型芳香族聚醯胺纖維碎片 之選擇時，以其纖維徑爲3旦尼爾以下、其纖維長爲3〜 1 0者宜。由於mata型芳香族聚醯胺纖維之融合至熱軟化 後極多絡合處，因此，其纖維長度愈長愈好，惟，爲使抄 造時，纖維分散性良好，則長度愈短愈好，因此，可適當 調整纖維長度。 ~ 又’做爲該第二粘合劑所使用之各短切纖維以未延伸 者且。、本明細書中，「未延伸」係指除未延伸者之外，亦 g延伸度少者。未延伸者易於進行藉由熱滾輥後熱融合或 本纸浪尺度適用中國國家標隼（〇1^)八4規格（210乂 297公釐） :12- 一 ' (請先閱讀背面之注意事項再填寫本頁) £ 訂 經濟部智¾財產局P'工消t合作社印製 1247067 A7 B7 五、發明説明（Ί 絡合之作業。 (請先閱讀背面之注意事項再填寫本頁) 第二粘合劑之形態除該短切纖維之外，亦可爲纖維紙 漿或纖條體均可，惟’若爲短切纖維時」則所抄造之不織 布空隙率大，製造層合板時，對於不織布之樹脂浸漬性良 好爲較理想者。短切纖維之選擇可提升層合板之耐濕絕緣 性因此較爲理想者。 層合板係以該不織布做爲基材使用後所製造者。首先 於該不織布中浸漬環氧樹脂淸漆後，加熱乾燥後，製造預 漬體。再將此預漬體以1片或複數片重疊加熱加壓成型之 ，一般，.於預漬體表面重疊合屬泊後，加熱加壓成型之後 ，做成貼有金屬箔之層合板者。印刷配線板係使此貼有金 屬箔層合板之金屬箔進行鈾刻後，配線加工之後所形成者 。此外，以預漬體層做爲絕緣層者可藉由組裝方式製造多 層印刷配線板者。 以下進行說明比較本發明幾個實施例，及比較例，先 行例者。 〔實施例1〕 經濟部智慧財產局工消費合作钍印製 (電絕緣用非織布之製造） 將Dupon公司製之商標品「Kevlar」之聚—對苯二甲 醯對苯二胺纖維之碎片及紙漿、與做爲第二粘合劑之帝人 製商標名「Conex」之聚—間—二苯異苯二甲醯胺纖維之碎 片分散於水中後進行混紡。此等纖維其纖維徑均爲1 · 5 旦尼爾，纖維長均爲3mm者。聚-對苯二甲醯對苯二胺 -13- 本纸浪尺度適用中國國家標擎（CNS ) A4規格（2丨OX 297公t ) 1247067 A7 B7 五、發明説明（11) 纖維紙漿係將纖維長3 m m之聚-對苯二甲醯對苯二胺短 切纖維進行打獎後做成freeness (打漿度）5 0 c s f者。 (請先閱讀背面之注意事項再填寫本頁) 適用於本實施例之熱硬化性樹脂粘合劑係以··做爲環氧 樹脂乳化劑之大日本ink化學工業製之商品名「Vc〇te A 」與做爲嵌段異氰酸酯樹脂之大日本ink化學工業製之商品 名「CR - 6 Ο B」做爲主成分，當環氧樹脂爲；[〇質量 時，嵌段異氰酸酯樹脂之配合質量（硬化劑質量）爲1。 將此熱硬化性樹脂粘合劑於該纖維抄造後，進行加壓、加 熱、乾燥後製造不織布。再將此不織布通過設定線壓力 2 0 0 k . N / m、溫度3 3 0 °C之一對熱滾輥間後，進行 加熱壓縮。 此不織布爲單位質量7 2 g/m2者，聚一對苯二甲醯 對苯二胺纖維碎片與聚-對苯二甲醯對苯二胺纖維紙獎之 配合質量比率（聚-對苯二甲醯對苯二胺纖維碎片/聚一 對苯二甲醯對苯二胺纖維紙漿）爲8 〇/2 0、不織布中 熱硬化性樹脂粘合劑含量爲1 7質釐％、不織布中第二粘 合劑含量爲9質量％之成份組成者（參考表1 (1))。 經濟部智慧財產局員工消f合作社印製 (預漬體之製造） 將溴化雙酚A型環氧樹脂淸漆浸漬於該不織布後，進-ί丁加熱乾燥後’製造樹脂含量爲5 2質量％之預清體。 (層合板之製造） 將4片該預漬體重疊後’其上下面載置1 8 //m厚的 、14- 本纸浪尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 1247067 A7 B7 五、發明説明（1弓 銅箔後，於溫度1 7 0 °c，壓力4 Μ P a下進行加熱加壓 成型後，製造貼銅層合板。 / - · 〔實施例2〜2 5、比較例1〕 除聚-對苯二甲醯對苯二胺纖維碎片/聚-對苯二甲 醯對苯二胺纖維紙漿之比率、聚-對苯二甲醯對苯二胺短 切纖維之纖維長度、聚-對苯二甲醯對苯二胺纖維紙漿之 打漿度、不織布中熱硬化性樹脂粘合劑含量、不織布中第 二粘合劑含量、熱硬化性樹脂粘合劑之硬化劑質量分別如 表1 (IV〜1 (6)之實施例2〜25所示之外，與實 施例1同法製造不織布後，以下，與實施例1同法製造預 漬體，貼銅層合板。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智楚財產局資工消費合作社印製 表 1 ( 1 ) 實施例. 1 · 2 3 4 5 短切纖維/纖維漿 80/20 0/100 45/55 50/50 90/10 纖維長（mm) 3 3 3 3 3 打漿度（csf) 50 50 50 50 50 熱硬化性樹脂粘合劑 17 17 17 17 17 (質量％) 第二粘合劑（質量％) 9 9 9 9 9 硬化劑質量 1 1 1 1 1 本紙浪尺度適用中國國家標準（CNS ) Μ規格（210X 297公釐） -15- 1247067 A7 B7 五、發明説明（1 表 1 ( 2 ) 實施例 參考例 1 參考例 27 6 7 8 短切纖維/纖維漿 95/5 80/20 80/20 80/20 80/20 纖維長（mm) 3 2 4 5 6 打漿度（csf) 50 50 50 50 50 熱硬化性樹脂粘合劑 (質量％) 17 17 17 17 17 第二粘合劑（質量％) 9 9 9 9 9 硬化劑質量; 1 1 1 1 1 表 1 ( 3 ) (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局Μ工消f合作钍印製 實施例 9 參考例 3 10 11 12 短切纖維/纖維漿 80/20 80/20 80/20 80/20 80/20 纖維長（mm) 7 3 3 3 3 打漿度（csf) 50 600 550 50 50 熱硬化性樹脂粘合劑 (質量％) 17 17 17 17 17 第二粘合劑（質量％) 9 9 9 4 5 硬化劑質量 1 1 1 1 1 本紙展尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -16 - 1247067 A7 B7 經濟部智慧財產局員工消f合作社印製 五、 發明説明（11 表 1 ( 4 ) 實施例 13 14 參考例 4 15 16 短切纖維/纖維獎 80/20 80/20 80/20 80/20 80/20 纖維長（mm) 3 3 3 3 3 打漿度（csf) 50 50 50 50 50 熱硬化性樹脂粘合劑 (質量％) 17 17 4 5 30 第二粘合劑（質量％) 15 16 9 9 9 硬化劑質量’ 1 1 1 1 1 表 1 ( 5 ) 實施例 17 18 19 20 參考例 5 短切纖維/纖維漿 80/20 80/20 80/20 80/20 80/20 纖維長（m m) 3 3 3 3 3 打漿度（csf) 50 50 50 50 50 熱硬化性樹脂粘合劑 (質量％) 40 17 17 17 17 第二粘合劑（質量％) 9 9 9 9 9 - 硬化劑質量 1 6 5 0,5 0.4 (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS ) A4規格（2K)X 297公釐） -17 - 1247067 Μ Β7 五、發明説明（^ 表 1 ( 6 ) __ 實施例 比較例1 短切纖維/纖維漿 97/3 纖維長（Π1 m) 3 打獎度（csf) 50 熱硬化性樹脂粘合劑 17 (質量％) 第二粘合劑（質量％) 9 硬化劑質量 _ 1 (請先閱讀背面之注意事項再填寫本頁) 裝 〔先行例1〕 除使用做爲聚一對一二苯一 3，4 / 一二苯醚對苯二 甲醯胺纖維之帝人製商品名「 Tecnola」之短切纖維與做 爲聚—間—二苯異苯二醯胺纖維之帝人製商品名「conex」 之短切纖維以及做爲粘合劑之與實施例1相同之熱硬化性 樹脂粘合劑之外，與實施例1同法製造不織布、預漬體、 貼銅層合板。此不織布爲單位質量7 2 g/m2者，聚一對 一二苯一 3 ，4 / 一二苯醚對苯二甲醯胺纖維碎片7 7質 量％、聚一間一二苯異苯二甲醯胺短切纖維1 5質量％， 熱硬化性樹脂粘合劑8質量％之成份組成者，聚一間-二 苯異苯二甲醯胺短切纖維係融合於聚-對一二苯一 3，4 /-二苯醚對苯二甲醯胺纖維碎片後所構成者。 〔先行例2〕 本纸浪尺度適用中國國家標隼（CNS )'4規格（210X 297公釐) ^18 - 訂 經濟部智慧財產局真工消費合作社印製 1247067 A7 B7 五、發明説明（ (請先閱讀背面之注意事項再填寫本頁) 除使用與實施例1相同之熱硬化性樹脂粘合劑做爲米占 合劑與dupon製商品名「kebra」之聚—對苯二甲醯對苯二 胺纖維碎片之外，與實施例1同法製造不織布、：預漬體、 貼銅層合板。此不織布爲單位質量7 2 g/m2者，聚—對 苯二甲醯對苯二胺短切纖維8 0質量％、熱硬化性樹/脂米占 合劑2 0質量％之成份組成者，熱硬化性樹脂粘合劑係粘 合相互聚-對苯二甲醯對苯二胺短切纖維所構成者。 表2 (1)〜（6)代表評定實施例1〜25、比較 例1及先行例1及2中預漬體、貼銅層合板之特性的結果 。其評定項·目與評定方法如下。 (1 )焊錫膏滲色 經濟部智慧財產局S工消費合作社印製 以P E T薄膜挾住預漬體，由其兩面進行加熱、層壓 塑料後，於此，以波動寬0 · 0 3 m s、波動周期3 m s 、波動數3波動、孔徑0 : 2 m m之條件下照射激光後開 平（開孔係未直接放置預漬體於支撑台上，於虛浮狀態下 進行者）。於如此形成之孔中塡入銅焊錫膏後，剝離 PET薄膜，於溫度170°C、壓力4 · 9MPa下進行 加熱加壓成型後，觀察孔壁截面。孔壁凹凸小，孔壁乾淨 者代表焊錫膏滲色少者。 (2 )尺寸變化率 於預漬體中照射激光後，以所定間隔開2個基準孔後 ’測定相隔2個孔之距離。再以P E T薄膜挾住此預漬體 -19- 本纸掁尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） Ϊ247067 A7 —^__ 九、發明説明（17) ’由其兩面進行加熱，層壓塑料後，測定層壓塑料後之孔 間隔距離。再算出層壓塑料前後之孔間距離之尺寸變化率 〇 二 (請先閱讀背面之注意事項再填寫本頁) (3 )層合板之翹曲 使0 . 1mm厚、330x 500mm之貼銅層合板 供與鈾刻步驟後，做成表裡分別之殘銅面積比率爲3 0 % ，8 0 %之印刷配線板後，此印刷配線板進行1 2 0 t， 3 5分鐘之加熱後，測定冷卻後之翹曲。 (4 )焊錫耐熱性 將2 5 X 2 5 m m之附銅試驗片浮於3 0 0 °C焊錫槽 中，測定試驗片於表層內側產生氣泡後出現表面膨脹爲止 之時間。 (5 )不織布強度 將2 5 Ox 1 5mm之不織布浸漬於丙酮中5分鐘後 ，測定其張力強度。 經濟部智慧財產局S(工消費合作社印製 (6 )預漬體彈性率 測定2 5 0 X 1 5 m m之預漬體張力彈性率。 (7 )纖維糾結 〇：代表不織布中無纖維糾結 X ··代表不織布中有纖維糾結 -20- 本紙掁尺度適用中國國家標孪（CNS ) A4規格（210X 297公楚） 1247067 A7 B7 經濟部智慧財產局資工消費合作社印製 五、 發明説明（巧 表 2 ( 1 ) 實施例 1 2 3 4 5 焊錫膏滲色（μιη) 6 4 5- 6 ·- 10 預漬體尺寸 變化率（％) 縱 -0.041 -0.05 -0.043 -0.045 -0.045 橫 -0.040 -0.05 -0.042 -0.042 -0.041 層合板翹曲（m m) 5.7 5.0 5.3 5.5 5.6 焊錫耐熱性（分） 20 10 12 17 18 不織布強度（N/15mm) 60.0 64.3 61.2 60.3 48.3 預漬體彈性率（GPa) 3.1 3.3 3.2 3.2 2.7 纖維糾結/ 〇 〇 〇 〇 〇 表 2 ( 2 ) 實施例 參考例 1 參考 例2 6 7 8 焊錫膏滲色（μιη) 16. 5 6 6 7 預漬體尺寸 變化率（％) 縱 -0.059 -0.045 -0.040 -0.041 -0.041 橫 -0.061 -0.042 -0.039 -0.039 -0.040 層合板翹曲（m m) 6.2 6.0 5.2 5.2 5.1 焊錫耐熱性（分） 18 20 20 20 20 不織布強度（N/15mm) 37.8 30.0 62.0 64.0 66.0 預漬體彈性率（GPa) 2.4 1.5 3.3 3.6 3.8 纖維糾結 〇 〇 〇 〇 〇 --------裝-- (請先閱讀背面之注意事項再填寫本頁) 訂 本紙ffe尺度適用中國國家標隼（CNS ) A4規格（2〖〇X 297公釐） -21 - 1247067 A7 B7 經濟部智慧財產局8工消費合作社印製 五、發明説明（5 表 2 ( 3 ) 實施例 9 參考 例3 10 11 12 焊錫膏滲色（μηΐ) 7 11 9 7 7 預漬體尺寸 縱 -0.043 -0.060 -0.054 -0.044 -0.046 變化率（％) 橫 -0.041 -0.055 -0.051 -0.043 -0.045 層合板翹曲（m m) 5.0 6.0 5.8 14.0 8.0 焊錫耐熱性（分） 20 20 20 17 18 不織布強度（N/15mm) 68.0 39.4 45.0 58.0 56.9 預漬體彈性售（GPa) 3.8 2.7 2.6 2.8 2.9 纖維糾結 X 〇 〇 〇 〇 表 2 ( 4 ) 實施例 13 14 參考例 4 15 16 焊錫膏滲色（μιη) 6 6 15 10 5 預漬體尺寸 縱 -0.046 -0.045 -0.044 -0.045 -0.047 變化率（％) 橫 -0.044 -0.044 -0.042 -0.042 -0.043 層合板翹曲（m m) 5.0 4.9 10.0 5.9 5.1 焊錫耐熱性（分） 16 10 19 20 20 不織布強度（N/15mm) 54.1 53.2 32.2 40.2 52.7 預漬體彈性率（GPa) 2.9 2.9 2.4 2.7 3.1 纖維糾結 〇 〇 〇 〇 〇 (請先閱讀背面之注意事項再填寫本頁) 本纸a尺度適用中國國家標隼（CNS ) A4規格（2[0X 297公釐） -22- 1247067 A7 B7 五、發明説明（3 表 2 ( 5 ) 實施例 17 18 19 20 參考例 5 焊錫膏滲色（μιη) 4 6 6 6 6 預漬體尺寸 縱 -0.052 -0.043 -0.045 -0.045 -0.046 變化率（％) 橫 -0.050 -0.041 -0.041 -0.043 -0.041 層合板曲（m m) 5.4 8.0 5.5 5.5 5.6 焊錫耐熱性（分） 20 20 20 20 20 不織布強度（N/15mm) 70.8 49.9 56.3 40.0 2 5.0 預漬體彈性聋（GPa) 3.1 1.5 2.5 3.0 3.0 纖維糾結 〇 〇 〇 〇 〇 (請先閱讀背面之注意事項再填寫本頁) 經濟部智¾財產局工消f合作社印製 表 2 ( 6 ) 實施例 比較1 從來例1 從來例2 焊錫膏滲色（μιη) '24 7 21 預漬體尺寸 縱 -0.061 -0.085 -0.150 變化率（％) 橫 -0.058 -0.066 -0.130 層合板翹曲（mm) 16.0 32.0 24.0 焊錫耐熱性（分） 17 10 11 不織布強度（N/15mm) 22.0 24.5 24.5 預漬體彈性率（GPa) 1.5 1.3 1.4 纖維糾結 〇 〇 〇 對照表1及表2後，可達成本發明目的之製造條件及 本纸長尺度適用中國國家標準（CNS )八4規格（210X 297公釐） -23- 1247067 A7 B7 五、發明説明（ 特別理想之條件，如以下。 (請先閱讀背δ之注意事項再填寫本頁) 除聚-對苯二甲醯對苯二胺纖維碎片與聚一對苯二甲 醯對苯二胺纖維紙漿之配合質量比率時」特別觀:察製造條 件相同之實施例1 - 6與比較例1之焊錫膏滲色，層合板 翹曲及不織布強度面判定聚-對苯二甲醯對苯二胺短切纖 維與聚對苯二甲醯對苯二胺纖維紙獎之配合質量比率爲 〇/1 0 0〜9 5/5亦可，較理想者爲5 0/5 0〜 9 0/1 0者。又，除聚一對苯二甲醯對苯二胺短切纖維 之纖維長外，由製造條件相同之實施例1、7〜1 1該纖 維長雖可爲2〜7，惟，由纖維糾結及預漬體彈性率之面 觀之，以3〜6mm者爲較理想。 同樣的，除聚-對苯二甲醯對苯二胺纖維紙漿之打漿 率外，製造條件相同之實施例1、10之不織布強度面觀之 ，聚-對苯二甲醯對苯二胺纖維紙漿之打漿度雖可6 0 0 c s f ，惟，以5 5 0 c s · f以下爲較理想者。 第二粘合劑之質量％除外，製造條件相同之實施例1 與實施例11〜14中，不織布中第二粘合劑之含量爲4〜 經濟部智慧財產局ί貝工消費合作社印製 1 6質量％者，惟，考量此等實施例比較下層合板之翹曲 及焊錫耐熱性後，以5〜1 5質量％者爲較佳。 除熱硬化性樹脂粘合劑外，製造條件相同之實施例1 -與實施例1 5〜1 7中，不織布中熱硬化性樹脂粘合劑含量爲 4〜4 0質量％者，惟，比較此等實施例後，由不織布強 度及預漬體尺寸變化率之面觀之，較理想者爲5〜3 0質 量％者。 -24- 本纸浪尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 1247067 A7 B7 五、發明説明（2弓 實施例1與實施例1 8〜20中，其熱硬化性樹脂粘合劑 以異氰酸酯系樹脂做爲硬化劑之環氧基樹脂時，環氧基樹 脂與異氰酸酯系樹脂之配合質量當1 0環氧樹脂··時，異氰 酸酯樹脂爲0 . 4〜6者，惟，比較此等實施例後，考量 不織布強度及預漬體彈性率後，理想者以1 0環氧樹脂時 ，異氰酸酯系樹脂爲0 .. 5〜5者。 如上述，以本發明之電絕緣用非織布做爲基材之預漬 體、絕緣層照射激光後開孔時，可使孔壁完的。又，可控 制減少遇熱之尺寸變化及層合板遇熱之翹曲。 〔產業上可利用性〕 本發明不織布可適用於表面實裝各種電子零件時所使 用之印刷配線板，特別是多層印刷配線基板之絕緣層用預 漬體，層合板者。 (請先閱讀背面之注意事項再填寫本頁) •裝
、tT 麵 經濟部智慧財產局S工消費合作社印製 -25- 本纸浪尺度適用中國國家標隼（CNS ) Μ規格（210X29*7公潑）

Claims (1)

1247067 A8 B8 C8 D8 六、申請專利範圍 (請先閱讀背面之注意事項存填寫本頁) 1 . 一種電絕緣用非織布，其特徵係以para型芳香族 聚醯胺纖維爲主成分，使相互纖維藉由5質量％以上之熱 硬化性樹脂粘合劑與選自軟化溫度2 2 0 °C以上之熱塑性 樹脂之短切纖維與纖維紙漿及纖條體之第二粘合劑所粘合 之不織布者，其中，該para型芳香族聚醯胺纖維係打漿度 (freeness)爲5 5 0 c s f以下之聚—對苯二甲醯對苯 二胺纖維紙漿，或含有纖維長爲3mm以上之聚-對苯二甲 驢對苯二胺纖維短切纖維與打漿度（freeness)爲5 5 〇 c s f以下之聚-對苯二甲醯對苯二胺纖維紙漿者，短切 纖維，兩者配合質量比率爲聚-對苯二甲醯對苯二胺短切 纖維/聚一對苯二甲醯對苯二胺纖維紙漿=〇 / i 〇 〇〜 9 5 / 1 0 者。 2 ·如申請專利範圍第1項之電絕緣用非織布，其中 該聚-對苯二甲醯對苯二胺短切纖維與聚一對苯二巾釀對· 苯二胺纖維紙漿之配合質量比率之聚-對苯二甲_胃苯二 胺短切纖維/聚-對苯二甲醯對苯二胺纖維紙獎爲5 〇 / 50 〜90/10 者。 經濟部智慧財產局員工消費合作社印製 3 _如申請專利範圍第2項之電絕緣用非織布，其中 該聚-對苯二甲醯對苯二胺短切纖維之纖維長爲3 ^ 6 m m者。 4 ·如申請專利範圍第1項之電絕緣用非織布，_中 該不織布中熱硬化性樹脂粘合劑之含量爲5〜3 ^胃胃％ 者。 5 ·如申請專利範圍第4項之電絕緣用非織布，其中 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -26-^---- 1247067 A8 B8 C8 D8 夂、申請專利範圍 該熱硬化性樹脂粘合劑係以環氧樹脂之異氰酸酯系樹脂做 爲硬化劑’該環氧樹脂與異氰酸酯系樹脂之配合質量當環 氧樹脂爲10該異氰酸酯系樹脂爲〇·5〜5者。 6 ·如申請專利範圍第4項之電絕緣用非織布，其中 該不織布中第二粘合劑之含量爲5〜1 5質量％者。 7 ·如申請專利範圍第5項之電絕緣用非織布，其中 該不織布中第二粘合劑之含量爲5〜1 5質量％者。 8 . —種預漬體’其特徵係使熱硬化性樹脂浸漬於薄 片狀基材後，乾燥之後所構成者，該薄片狀基材爲如申請 專利範圍第1項至第7項中任一項之電絕緣用不織布者。 9 · 一種層合板，其特徵係浸漬熱硬化性樹脂於薄片 狀基材後，乾燥之後所形成之預漬體層經加熱加壓成型後 所構成者，該薄片狀基材爲如申請專利範圍第1項至第7 項中任一項之電絕緣用非織布者。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -27 - |〇123111號專利申請案 文說明書修正本(含申請專利範圍） 1247067民國93‘年5月13日修正 申請曰期 90年 9月19日 案 號 90123111 類 別 P^f ι>ΰ^}ύ (以上各欄由本局填註）Kek/)
中 文 電絕緣用非織布，預漬體及層合板 發明 ❖ 型 新
茂學宏 谷田岡 車落平 ⑴01(¾ 名 姓· 煩請委員明示，本案修正後是否變更原實f^^曰慧財產Φ員工消費合作社印製 發明 創作/ 國 籍 住、居所 (1)日本國滋賀縣彥根市南川瀨町一四〇九一一二 (2)日本國滋賀縣彥根市高宮町一三五一 一五緣鎮杉原D二Ο五 (3 日本國滋賀縣神崎郡五箇荘町北町屋三五〇 — 一三
(1)宮嬝弘 0 鈐木正一郎 ⑴新神戶電機股份有限公司 新神戶電機株式会社 0王子製紙股份有限公司 王子製紙株式会社 (1)日本 （2)曰本 (1)日本國東京都中央匾日本橋本町二丁目八番t號 (2)日本國東京都中央區銀座四丁目七番五號 本紙張尺度適用中國國家標隼（CMS ) A4規格（2】0X297公釐） 裝 訂 線
TW90123111A 2000-09-20 2001-09-19 Non-woven fabric for electrical insulation, prepreg and laminate TWI247067B (en)

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Families Citing this family (9)

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Publication number Priority date Publication date Assignee Title
KR20040104144A (ko) * 2003-06-03 2004-12-10 삼성전기주식회사 솔더 레지스트 패턴 형성 방법
US20080105395A1 (en) * 2005-01-18 2008-05-08 Naoyuki Shiratori Polyketone Fiber Paper, Polyketone Fiber Paper Core Material For Printed Wiring Board, And Printed Wiring Board
US7084349B1 (en) * 2005-02-03 2006-08-01 E. I. Du Pont De Nemours And Company Insulated power cable
US20100151760A1 (en) * 2008-12-15 2010-06-17 E. I. Du Pont De Nemours And Company Non-woven sheet containing fibers with sheath/core construction
JP2012529155A (ja) * 2009-06-04 2012-11-15 ライドール，インコーポレーテッド 電気絶縁材とその製造および使用方法
KR20120123160A (ko) * 2009-08-20 2012-11-07 도요보 가부시키가이샤 전기 절연 시트 및 그 제조 방법
US10066341B2 (en) * 2013-07-18 2018-09-04 Teijin Aramid B.V. Fire-retardant sheet material
CN105517321B (zh) * 2015-11-30 2018-06-19 燕山大学里仁学院 电子元件封装体的覆金属层基板结构
US20190040554A1 (en) * 2018-01-02 2019-02-07 Intel Corporation Heat spreading cloths

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729921A (en) * 1984-10-19 1988-03-08 E. I. Du Pont De Nemours And Company High density para-aramid papers
US4897301A (en) * 1985-01-23 1990-01-30 Toyo Boseki Kabushiki Kaisha Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof
JP2543346B2 (ja) * 1986-07-25 1996-10-16 大福製紙株式会社 合成紙
JPH086277B2 (ja) * 1989-08-31 1996-01-24 日本アラミド有限会社 高強度芳香族ポリアミド紙の製造法
JP3026379B2 (ja) * 1991-10-18 2000-03-27 三菱製紙株式会社 耐熱シートおよびその製造法
US6942757B1 (en) * 1993-11-29 2005-09-13 Teijin Twaron B.V. Process for preparing para-aromatic polyamide paper
WO1996000323A1 (en) * 1994-06-23 1996-01-04 Akzo Nobel N.V. Process for producing para-aromatic polyamide paper
JPH10131017A (ja) * 1996-02-21 1998-05-19 Shin Kobe Electric Mach Co Ltd 積層板用基材及びその製造法ならびにプリプレグ及び積層板

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