TWI246448B - Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby - Google Patents
Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby Download PDFInfo
- Publication number
- TWI246448B TWI246448B TW090120699A TW90120699A TWI246448B TW I246448 B TWI246448 B TW I246448B TW 090120699 A TW090120699 A TW 090120699A TW 90120699 A TW90120699 A TW 90120699A TW I246448 B TWI246448 B TW I246448B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- substrate
- carrier
- head
- during
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 661
- 238000000034 method Methods 0.000 title claims abstract description 97
- 239000000126 substance Substances 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 373
- 239000002002 slurry Substances 0.000 claims abstract description 73
- 239000012530 fluid Substances 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 230000008569 process Effects 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 59
- 230000005540 biological transmission Effects 0.000 claims description 22
- 125000006850 spacer group Chemical group 0.000 claims description 17
- 230000033001 locomotion Effects 0.000 claims description 15
- 230000008859 change Effects 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 238000011068 loading method Methods 0.000 claims description 12
- 238000011010 flushing procedure Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 10
- 238000007517 polishing process Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 239000002324 mouth wash Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000004537 pulping Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 5
- 206010016717 Fistula Diseases 0.000 claims description 4
- 238000003490 calendering Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 230000003890 fistula Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 2
- 235000002566 Capsicum Nutrition 0.000 claims 2
- 239000006002 Pepper Substances 0.000 claims 2
- 241000722363 Piper Species 0.000 claims 2
- 235000016761 Piper aduncum Nutrition 0.000 claims 2
- 235000017804 Piper guineense Nutrition 0.000 claims 2
- 235000008184 Piper nigrum Nutrition 0.000 claims 2
- 235000008429 bread Nutrition 0.000 claims 2
- 206010013781 dry mouth Diseases 0.000 claims 2
- 241000251468 Actinopterygii Species 0.000 claims 1
- 241000220645 Leonotis nepetifolia Species 0.000 claims 1
- 241001465754 Metazoa Species 0.000 claims 1
- 241000238413 Octopus Species 0.000 claims 1
- 206010036790 Productive cough Diseases 0.000 claims 1
- 239000003086 colorant Substances 0.000 claims 1
- 230000003467 diminishing effect Effects 0.000 claims 1
- 238000011049 filling Methods 0.000 claims 1
- 230000014759 maintenance of location Effects 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 210000003802 sputum Anatomy 0.000 claims 1
- 208000024794 sputum Diseases 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
- 210000002435 tendon Anatomy 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 66
- 230000002079 cooperative effect Effects 0.000 description 13
- 238000013461 design Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 230000008901 benefit Effects 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 235000012054 meals Nutrition 0.000 description 7
- 239000003082 abrasive agent Substances 0.000 description 5
- 238000013459 approach Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 229940051866 mouthwash Drugs 0.000 description 4
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000013518 transcription Methods 0.000 description 2
- 230000035897 transcription Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 235000002505 Centaurea nigra Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000257303 Hymenoptera Species 0.000 description 1
- 241001073755 Mylopharodon Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65296300A | 2000-08-31 | 2000-08-31 | |
| US65363600A | 2000-08-31 | 2000-08-31 | |
| US09/652,855 US6527625B1 (en) | 2000-08-31 | 2000-08-31 | Chemical mechanical polishing apparatus and method having a soft backed polishing head |
| US09/652,854 US6540590B1 (en) | 2000-08-31 | 2000-08-31 | Chemical mechanical polishing apparatus and method having a rotating retaining ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI246448B true TWI246448B (en) | 2006-01-01 |
Family
ID=27505281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090120699A TWI246448B (en) | 2000-08-31 | 2001-08-23 | Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP2004518270A (fr) |
| KR (1) | KR100920709B1 (fr) |
| AU (1) | AU2001286972A1 (fr) |
| TW (1) | TWI246448B (fr) |
| WO (1) | WO2002018101A2 (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI400139B (zh) * | 2006-08-30 | 2013-07-01 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 具有不均勻間隔之溝槽的ｃｍｐ墊 |
| TWI572442B (zh) * | 2009-05-14 | 2017-03-01 | 應用材料股份有限公司 | 研磨頭區域邊界平滑化 |
| TWI574778B (zh) * | 2015-02-11 | 2017-03-21 | 國立勤益科技大學 | 硏磨拋光機 |
| CN109661721A (zh) * | 2016-06-27 | 2019-04-19 | 先进尼克斯有限公司 | 湿式处理系统用工件固持器 |
| CN114905386A (zh) * | 2021-02-01 | 2022-08-16 | 中国石油化工股份有限公司 | 一种适用于均匀腐蚀速率试验用挂件前处理装置及方法 |
| TWI829909B (zh) * | 2019-04-03 | 2024-01-21 | 日商可樂麗股份有限公司 | 研磨墊 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7507148B2 (en) * | 2002-09-27 | 2009-03-24 | Sumco Techxiv Corporation | Polishing apparatus, polishing head and polishing method |
| KR100752181B1 (ko) * | 2005-10-05 | 2007-08-24 | 동부일렉트로닉스 주식회사 | 화학적 기계적 연마장치 |
| US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
| CN107214614A (zh) * | 2017-07-25 | 2017-09-29 | 蒋南 | 一种自动锯片抛光机 |
| JP7113626B2 (ja) * | 2018-01-12 | 2022-08-05 | ニッタ・デュポン株式会社 | 研磨パッド |
| US12017322B2 (en) * | 2018-08-14 | 2024-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
| JP2944176B2 (ja) * | 1990-09-19 | 1999-08-30 | 三菱マテリアル株式会社 | ウェーハの超精密研磨方法及び研磨装置 |
| US5584746A (en) * | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
| US5624299A (en) * | 1993-12-27 | 1997-04-29 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved carrier and method of use |
| JPH08267357A (ja) * | 1995-03-31 | 1996-10-15 | Nec Corp | 基板の研磨装置及びその研磨方法 |
| US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
| JP2708022B2 (ja) * | 1995-08-21 | 1998-02-04 | 日本電気株式会社 | 研磨装置 |
| JP3106418B2 (ja) * | 1996-07-30 | 2000-11-06 | 株式会社東京精密 | 研磨装置 |
| JPH10156712A (ja) * | 1996-11-29 | 1998-06-16 | Oki Electric Ind Co Ltd | ウエハ研磨装置 |
| JP3183204B2 (ja) * | 1997-01-08 | 2001-07-09 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
| US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
| JP2897207B1 (ja) * | 1997-04-04 | 1999-05-31 | 株式会社東京精密 | 研磨装置 |
| US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| JPH10315126A (ja) * | 1997-05-16 | 1998-12-02 | Tokyo Seimitsu Co Ltd | ディストリビュータリングを用いた研磨方法及び研磨装置 |
| US6007411A (en) * | 1997-06-19 | 1999-12-28 | Interantional Business Machines Corporation | Wafer carrier for chemical mechanical polishing |
| JP3006568B2 (ja) * | 1997-12-04 | 2000-02-07 | 日本電気株式会社 | ウエハ研磨装置および研磨方法 |
| JPH11226865A (ja) * | 1997-12-11 | 1999-08-24 | Speedfam Co Ltd | キャリア及びｃｍｐ装置 |
| US6093651A (en) * | 1997-12-23 | 2000-07-25 | Intel Corporation | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| US5993302A (en) * | 1997-12-31 | 1999-11-30 | Applied Materials, Inc. | Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
| JPH11216663A (ja) * | 1998-02-03 | 1999-08-10 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
| KR100550034B1 (ko) * | 1998-04-06 | 2006-02-08 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
| KR20000025003A (ko) * | 1998-10-07 | 2000-05-06 | 윤종용 | 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드 |
| US6110012A (en) * | 1998-12-24 | 2000-08-29 | Lucent Technologies Inc. | Chemical-mechanical polishing apparatus and method |
| US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| US6225224B1 (en) * | 1999-05-19 | 2001-05-01 | Infineon Technologies Norht America Corp. | System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
| JP2001298006A (ja) * | 2000-04-17 | 2001-10-26 | Ebara Corp | 研磨装置 |
| CN100433269C (zh) * | 2000-05-12 | 2008-11-12 | 多平面技术公司 | 抛光装置以及与其一起使用的基片托架 |
| US6409579B1 (en) * | 2000-05-31 | 2002-06-25 | Koninklijke Philips Electronics N.V. | Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish |
| JP2002046061A (ja) * | 2000-07-31 | 2002-02-12 | Mitsubishi Materials Corp | 研磨ヘッド |
-
2001
- 2001-08-23 TW TW090120699A patent/TWI246448B/zh not_active IP Right Cessation
- 2001-08-30 WO PCT/US2001/027151 patent/WO2002018101A2/fr active Search and Examination
- 2001-08-30 JP JP2002523058A patent/JP2004518270A/ja not_active Withdrawn
- 2001-08-30 AU AU2001286972A patent/AU2001286972A1/en not_active Abandoned
- 2001-08-30 KR KR1020037003077A patent/KR100920709B1/ko active IP Right Grant
-
2012
- 2012-04-04 JP JP2012085828A patent/JP5562370B2/ja not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI400139B (zh) * | 2006-08-30 | 2013-07-01 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 具有不均勻間隔之溝槽的ｃｍｐ墊 |
| TWI572442B (zh) * | 2009-05-14 | 2017-03-01 | 應用材料股份有限公司 | 研磨頭區域邊界平滑化 |
| TWI574778B (zh) * | 2015-02-11 | 2017-03-21 | 國立勤益科技大學 | 硏磨拋光機 |
| CN109661721A (zh) * | 2016-06-27 | 2019-04-19 | 先进尼克斯有限公司 | 湿式处理系统用工件固持器 |
| CN109661721B (zh) * | 2016-06-27 | 2023-09-19 | 先进尼克斯有限公司 | 湿式处理系统用工件固持器 |
| TWI829909B (zh) * | 2019-04-03 | 2024-01-21 | 日商可樂麗股份有限公司 | 研磨墊 |
| CN114905386A (zh) * | 2021-02-01 | 2022-08-16 | 中国石油化工股份有限公司 | 一种适用于均匀腐蚀速率试验用挂件前处理装置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2001286972A1 (en) | 2002-03-13 |
| KR100920709B1 (ko) | 2009-10-07 |
| WO2002018101A9 (fr) | 2003-10-30 |
| WO2002018101A3 (fr) | 2003-01-23 |
| KR20030064393A (ko) | 2003-07-31 |
| WO2002018101A2 (fr) | 2002-03-07 |
| JP5562370B2 (ja) | 2014-07-30 |
| JP2004518270A (ja) | 2004-06-17 |
| JP2012151501A (ja) | 2012-08-09 |
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