TWI241531B - Improved connection assembly for integrated circuit sensors - Google Patents

Improved connection assembly for integrated circuit sensors Download PDF

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Publication number
TWI241531B
TWI241531B TW091110793A TW91110793A TWI241531B TW I241531 B TWI241531 B TW I241531B TW 091110793 A TW091110793 A TW 091110793A TW 91110793 A TW91110793 A TW 91110793A TW I241531 B TWI241531 B TW I241531B
Authority
TW
Taiwan
Prior art keywords
circuit board
connection
patent application
sensor
item
Prior art date
Application number
TW091110793A
Other languages
English (en)
Chinese (zh)
Inventor
Thomas Lester Andrade
Original Assignee
Atrua Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atrua Technologies Inc filed Critical Atrua Technologies Inc
Application granted granted Critical
Publication of TWI241531B publication Critical patent/TWI241531B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Multi-Conductor Connections (AREA)
  • Optical Transform (AREA)
  • Wire Bonding (AREA)
TW091110793A 2001-05-22 2002-05-22 Improved connection assembly for integrated circuit sensors TWI241531B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29286201P 2001-05-22 2001-05-22

Publications (1)

Publication Number Publication Date
TWI241531B true TWI241531B (en) 2005-10-11

Family

ID=23126529

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091110793A TWI241531B (en) 2001-05-22 2002-05-22 Improved connection assembly for integrated circuit sensors

Country Status (6)

Country Link
US (1) US20030013328A1 (enExample)
EP (1) EP1407477A4 (enExample)
JP (1) JP2005516377A (enExample)
AU (1) AU2002310087A1 (enExample)
TW (1) TWI241531B (enExample)
WO (1) WO2002095801A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4160851B2 (ja) 2003-03-31 2008-10-08 富士通株式会社 指紋認識用半導体装置
US8999229B2 (en) 2010-11-17 2015-04-07 Alpha Sintered Metals, Inc. Components for exhaust system, methods of manufacture thereof and articles comprising the same
CN106127195B (zh) 2016-08-30 2017-11-17 广东欧珀移动通信有限公司 指纹模组、指纹模组制作方法及移动终端
CN111126351B (zh) * 2020-01-21 2024-02-09 北京京东方光电科技有限公司 指纹识别模组

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Also Published As

Publication number Publication date
WO2002095801A8 (en) 2004-01-15
WO2002095801B1 (en) 2003-12-04
JP2005516377A (ja) 2005-06-02
US20030013328A1 (en) 2003-01-16
EP1407477A4 (en) 2006-06-07
EP1407477A2 (en) 2004-04-14
AU2002310087A1 (en) 2002-12-03
WO2002095801A3 (en) 2003-10-30
WO2002095801A2 (en) 2002-11-28

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