JP2005516377A - 集積回路センサのための改善された接続組立体 - Google Patents

集積回路センサのための改善された接続組立体 Download PDF

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Publication number
JP2005516377A
JP2005516377A JP2002592167A JP2002592167A JP2005516377A JP 2005516377 A JP2005516377 A JP 2005516377A JP 2002592167 A JP2002592167 A JP 2002592167A JP 2002592167 A JP2002592167 A JP 2002592167A JP 2005516377 A JP2005516377 A JP 2005516377A
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JP
Japan
Prior art keywords
sensor
integrated circuit
circuit board
connection
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002592167A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005516377A5 (enExample
Inventor
トマス エル アンドレイド
Original Assignee
アトルア テクノロジーズ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アトルア テクノロジーズ インコーポレイテッド filed Critical アトルア テクノロジーズ インコーポレイテッド
Publication of JP2005516377A publication Critical patent/JP2005516377A/ja
Publication of JP2005516377A5 publication Critical patent/JP2005516377A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
  • Optical Transform (AREA)
JP2002592167A 2001-05-22 2002-05-22 集積回路センサのための改善された接続組立体 Pending JP2005516377A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29286201P 2001-05-22 2001-05-22
PCT/US2002/016399 WO2002095801A2 (en) 2001-05-22 2002-05-22 Improved connection assembly for integrated circuit sensors

Publications (2)

Publication Number Publication Date
JP2005516377A true JP2005516377A (ja) 2005-06-02
JP2005516377A5 JP2005516377A5 (enExample) 2005-07-21

Family

ID=23126529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002592167A Pending JP2005516377A (ja) 2001-05-22 2002-05-22 集積回路センサのための改善された接続組立体

Country Status (6)

Country Link
US (1) US20030013328A1 (enExample)
EP (1) EP1407477A4 (enExample)
JP (1) JP2005516377A (enExample)
AU (1) AU2002310087A1 (enExample)
TW (1) TWI241531B (enExample)
WO (1) WO2002095801A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4160851B2 (ja) 2003-03-31 2008-10-08 富士通株式会社 指紋認識用半導体装置
US8999229B2 (en) 2010-11-17 2015-04-07 Alpha Sintered Metals, Inc. Components for exhaust system, methods of manufacture thereof and articles comprising the same
CN106127195B (zh) 2016-08-30 2017-11-17 广东欧珀移动通信有限公司 指纹模组、指纹模组制作方法及移动终端
CN111126351B (zh) * 2020-01-21 2024-02-09 北京京东方光电科技有限公司 指纹识别模组

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Also Published As

Publication number Publication date
WO2002095801A2 (en) 2002-11-28
EP1407477A2 (en) 2004-04-14
WO2002095801A8 (en) 2004-01-15
EP1407477A4 (en) 2006-06-07
AU2002310087A1 (en) 2002-12-03
US20030013328A1 (en) 2003-01-16
WO2002095801B1 (en) 2003-12-04
TWI241531B (en) 2005-10-11
WO2002095801A3 (en) 2003-10-30

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