TWI241310B - Compositions and methods for thermosetting molecules in organic compositions - Google Patents

Compositions and methods for thermosetting molecules in organic compositions Download PDF

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Publication number
TWI241310B
TWI241310B TW090117706A TW90117706A TWI241310B TW I241310 B TWI241310 B TW I241310B TW 090117706 A TW090117706 A TW 090117706A TW 90117706 A TW90117706 A TW 90117706A TW I241310 B TWI241310 B TW I241310B
Authority
TW
Taiwan
Prior art keywords
aryl
polymer
patent application
group
aryl group
Prior art date
Application number
TW090117706A
Other languages
English (en)
Chinese (zh)
Inventor
Kreisler S Lau
Geng-Quan Liu
Boris Korolev
Emma Brouk
Ruslan Zherebin
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/618,945 external-priority patent/US6469123B1/en
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Application granted granted Critical
Publication of TWI241310B publication Critical patent/TWI241310B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/30Post-polymerisation treatment, e.g. recovery, purification, drying
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/60Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Formation Of Insulating Films (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW090117706A 2000-07-19 2001-07-19 Compositions and methods for thermosetting molecules in organic compositions TWI241310B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/618,945 US6469123B1 (en) 2000-07-19 2000-07-19 Compositions and methods for thermosetting molecules in organic compositions
US09/897,936 US20020022708A1 (en) 2000-07-19 2001-07-05 Compositions and methods for thermosetting molecules in organic compositions

Publications (1)

Publication Number Publication Date
TWI241310B true TWI241310B (en) 2005-10-11

Family

ID=27088367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090117706A TWI241310B (en) 2000-07-19 2001-07-19 Compositions and methods for thermosetting molecules in organic compositions

Country Status (9)

Country Link
US (2) US20020022708A1 (enExample)
EP (1) EP1309639A4 (enExample)
JP (1) JP2004504455A (enExample)
KR (1) KR100620207B1 (enExample)
CN (1) CN1458945A (enExample)
AU (1) AU2001280549A1 (enExample)
MY (1) MY134260A (enExample)
TW (1) TWI241310B (enExample)
WO (1) WO2002008308A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6987147B2 (en) * 2001-10-01 2006-01-17 Honeywell International Inc. Low dielectric constant materials with improved thermo-mechanical strength and processability
US20030143332A1 (en) * 2002-01-31 2003-07-31 Sumitomo Chemical Company, Limited Coating solution for forming insulating film
JP4878779B2 (ja) 2004-06-10 2012-02-15 富士フイルム株式会社 膜形成用組成物、絶縁膜及び電子デバイス
JP4516857B2 (ja) * 2005-02-28 2010-08-04 富士フイルム株式会社 カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス
JP2007119706A (ja) * 2005-09-28 2007-05-17 Fujifilm Corp 重合体および膜形成用組成物
JP2007161780A (ja) * 2005-12-09 2007-06-28 Fujifilm Corp 膜形成用組成物、該組成物を用いた絶縁膜及び電子デバイス
JP4792282B2 (ja) * 2005-12-09 2011-10-12 富士フイルム株式会社 重合体および膜形成用組成物
US20080159114A1 (en) * 2007-01-02 2008-07-03 Dipietro Richard Anthony High density data storage medium, method and device
US7558186B2 (en) * 2007-01-02 2009-07-07 International Business Machines Corporation High density data storage medium, method and device
JP2008192879A (ja) 2007-02-06 2008-08-21 Fujifilm Corp 半導体集積回路の絶縁膜
JP2008231174A (ja) * 2007-03-19 2008-10-02 Fujifilm Corp 膜形成用組成物、絶縁膜及び電子デバイス
GB2451865A (en) 2007-08-15 2009-02-18 Univ Liverpool Microporous polymers from alkynyl monomers
JP5012372B2 (ja) * 2007-09-27 2012-08-29 住友ベークライト株式会社 有機絶縁膜及び半導体装置
US7799843B2 (en) 2008-02-29 2010-09-21 Fujifilm Corporation Film
JP5401118B2 (ja) 2008-12-10 2014-01-29 富士フイルム株式会社 組成物
JP6666138B2 (ja) 2015-12-24 2020-03-13 エア・ウォーター株式会社 多価アルキン化合物、その製法および用途

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918158A (en) * 1986-07-21 1990-04-17 Fluorochem Inc. 1,3-diethynyladamantane and methods of polymerization thereof
US5017734A (en) * 1989-12-11 1991-05-21 Kurt Baum Ethynyl adamantane derivatives and methods of polymerization thereof
JPH04314394A (ja) 1991-04-12 1992-11-05 Fujitsu Ltd ガラスセラミック回路基板とその製造方法
US5347063A (en) 1993-03-09 1994-09-13 Mobil Oil Corporation Method for direct arylation of diamondoids
US5576355A (en) * 1993-06-04 1996-11-19 Mobil Oil Corp. Diamondoid derivatives for pharmaceutical use
US5744399A (en) 1995-11-13 1998-04-28 Lsi Logic Corporation Process for forming low dielectric constant layers using fullerenes
DE69930874T2 (de) * 1998-11-24 2006-11-02 Dow Global Technologies, Inc., Midland Eine zusammensetzung enthaltend einen vernetzbaren matrixpercursor und eine porenstruktur bildendes material und eine daraus hergestellte poröse matrix
US6413202B1 (en) * 1999-01-21 2002-07-02 Alliedsignal, Inc. Solvent systems for polymeric dielectric materials
US6509415B1 (en) * 2000-04-07 2003-01-21 Honeywell International Inc. Low dielectric constant organic dielectrics based on cage-like structures
US6444715B1 (en) * 2000-06-06 2002-09-03 Honeywell International Inc. Low dielectric materials and methods of producing same
US6469123B1 (en) * 2000-07-19 2002-10-22 Honeywell International Inc. Compositions and methods for thermosetting molecules in organic compositions
US6423811B1 (en) * 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks

Also Published As

Publication number Publication date
CN1458945A (zh) 2003-11-26
JP2004504455A (ja) 2004-02-12
EP1309639A1 (en) 2003-05-14
EP1309639A4 (en) 2004-12-08
MY134260A (en) 2007-11-30
KR100620207B1 (ko) 2006-09-13
WO2002008308A1 (en) 2002-01-31
KR20030031123A (ko) 2003-04-18
AU2001280549A1 (en) 2002-02-05
US20030096938A1 (en) 2003-05-22
US20020022708A1 (en) 2002-02-21
US6803441B2 (en) 2004-10-12

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MM4A Annulment or lapse of patent due to non-payment of fees