JP2004504455A - 有機組成物における熱硬化性分子の組成物および方法 - Google Patents
有機組成物における熱硬化性分子の組成物および方法 Download PDFInfo
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- JP2004504455A JP2004504455A JP2002514210A JP2002514210A JP2004504455A JP 2004504455 A JP2004504455 A JP 2004504455A JP 2002514210 A JP2002514210 A JP 2002514210A JP 2002514210 A JP2002514210 A JP 2002514210A JP 2004504455 A JP2004504455 A JP 2004504455A
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- Prior art keywords
- aryl
- polymer
- arylene ether
- branched
- dielectric constant
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/30—Post-polymerisation treatment, e.g. recovery, purification, drying
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Formation Of Insulating Films (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/618,945 US6469123B1 (en) | 2000-07-19 | 2000-07-19 | Compositions and methods for thermosetting molecules in organic compositions |
| US09/897,936 US20020022708A1 (en) | 2000-07-19 | 2001-07-05 | Compositions and methods for thermosetting molecules in organic compositions |
| PCT/US2001/022204 WO2002008308A1 (en) | 2000-07-19 | 2001-07-13 | Compositions and methods for thermosetting molecules in organic compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004504455A true JP2004504455A (ja) | 2004-02-12 |
| JP2004504455A5 JP2004504455A5 (enExample) | 2008-08-21 |
Family
ID=27088367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002514210A Withdrawn JP2004504455A (ja) | 2000-07-19 | 2001-07-13 | 有機組成物における熱硬化性分子の組成物および方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US20020022708A1 (enExample) |
| EP (1) | EP1309639A4 (enExample) |
| JP (1) | JP2004504455A (enExample) |
| KR (1) | KR100620207B1 (enExample) |
| CN (1) | CN1458945A (enExample) |
| AU (1) | AU2001280549A1 (enExample) |
| MY (1) | MY134260A (enExample) |
| TW (1) | TWI241310B (enExample) |
| WO (1) | WO2002008308A1 (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006233128A (ja) * | 2005-02-28 | 2006-09-07 | Fuji Photo Film Co Ltd | カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス |
| JP2007119706A (ja) * | 2005-09-28 | 2007-05-17 | Fujifilm Corp | 重合体および膜形成用組成物 |
| JP2007161780A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 膜形成用組成物、該組成物を用いた絶縁膜及び電子デバイス |
| JP2007161788A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 重合体および膜形成用組成物 |
| JP2008231174A (ja) * | 2007-03-19 | 2008-10-02 | Fujifilm Corp | 膜形成用組成物、絶縁膜及び電子デバイス |
| US7501185B2 (en) | 2004-06-10 | 2009-03-10 | Fujifilm Corporation | Film-forming composition, insulating material-forming composition, insulating film and electronic device |
| JP2009088028A (ja) * | 2007-09-27 | 2009-04-23 | Sumitomo Bakelite Co Ltd | 有機絶縁膜及び半導体装置 |
| WO2010067683A1 (ja) | 2008-12-10 | 2010-06-17 | 富士フイルム株式会社 | 組成物 |
| US7750102B2 (en) | 2007-02-06 | 2010-07-06 | Fujifilm Corporation | Insulating film for semiconductor integrated circuit |
| US7799843B2 (en) | 2008-02-29 | 2010-09-21 | Fujifilm Corporation | Film |
| KR20170076578A (ko) | 2015-12-24 | 2017-07-04 | 에아.워타 가부시키가이샤 | 다가 알킨 화합물, 그 제법 및 용도 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6987147B2 (en) * | 2001-10-01 | 2006-01-17 | Honeywell International Inc. | Low dielectric constant materials with improved thermo-mechanical strength and processability |
| US20030143332A1 (en) * | 2002-01-31 | 2003-07-31 | Sumitomo Chemical Company, Limited | Coating solution for forming insulating film |
| US20080159114A1 (en) * | 2007-01-02 | 2008-07-03 | Dipietro Richard Anthony | High density data storage medium, method and device |
| US7558186B2 (en) * | 2007-01-02 | 2009-07-07 | International Business Machines Corporation | High density data storage medium, method and device |
| GB2451865A (en) | 2007-08-15 | 2009-02-18 | Univ Liverpool | Microporous polymers from alkynyl monomers |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918158A (en) * | 1986-07-21 | 1990-04-17 | Fluorochem Inc. | 1,3-diethynyladamantane and methods of polymerization thereof |
| US5017734A (en) * | 1989-12-11 | 1991-05-21 | Kurt Baum | Ethynyl adamantane derivatives and methods of polymerization thereof |
| JPH04314394A (ja) | 1991-04-12 | 1992-11-05 | Fujitsu Ltd | ガラスセラミック回路基板とその製造方法 |
| US5347063A (en) | 1993-03-09 | 1994-09-13 | Mobil Oil Corporation | Method for direct arylation of diamondoids |
| US5576355A (en) * | 1993-06-04 | 1996-11-19 | Mobil Oil Corp. | Diamondoid derivatives for pharmaceutical use |
| US5744399A (en) | 1995-11-13 | 1998-04-28 | Lsi Logic Corporation | Process for forming low dielectric constant layers using fullerenes |
| DE69930874T2 (de) * | 1998-11-24 | 2006-11-02 | Dow Global Technologies, Inc., Midland | Eine zusammensetzung enthaltend einen vernetzbaren matrixpercursor und eine porenstruktur bildendes material und eine daraus hergestellte poröse matrix |
| US6413202B1 (en) * | 1999-01-21 | 2002-07-02 | Alliedsignal, Inc. | Solvent systems for polymeric dielectric materials |
| US6509415B1 (en) * | 2000-04-07 | 2003-01-21 | Honeywell International Inc. | Low dielectric constant organic dielectrics based on cage-like structures |
| US6444715B1 (en) * | 2000-06-06 | 2002-09-03 | Honeywell International Inc. | Low dielectric materials and methods of producing same |
| US6469123B1 (en) * | 2000-07-19 | 2002-10-22 | Honeywell International Inc. | Compositions and methods for thermosetting molecules in organic compositions |
| US6423811B1 (en) * | 2000-07-19 | 2002-07-23 | Honeywell International Inc. | Low dielectric constant materials with polymeric networks |
-
2001
- 2001-07-05 US US09/897,936 patent/US20020022708A1/en not_active Abandoned
- 2001-07-13 CN CN01815765A patent/CN1458945A/zh active Pending
- 2001-07-13 EP EP01958944A patent/EP1309639A4/en not_active Withdrawn
- 2001-07-13 KR KR1020037000737A patent/KR100620207B1/ko not_active Expired - Fee Related
- 2001-07-13 WO PCT/US2001/022204 patent/WO2002008308A1/en not_active Ceased
- 2001-07-13 JP JP2002514210A patent/JP2004504455A/ja not_active Withdrawn
- 2001-07-13 AU AU2001280549A patent/AU2001280549A1/en not_active Abandoned
- 2001-07-19 TW TW090117706A patent/TWI241310B/zh not_active IP Right Cessation
- 2001-12-13 MY MYPI20015668A patent/MY134260A/en unknown
-
2002
- 2002-10-08 US US10/267,380 patent/US6803441B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7501185B2 (en) | 2004-06-10 | 2009-03-10 | Fujifilm Corporation | Film-forming composition, insulating material-forming composition, insulating film and electronic device |
| JP2006233128A (ja) * | 2005-02-28 | 2006-09-07 | Fuji Photo Film Co Ltd | カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス |
| JP2007119706A (ja) * | 2005-09-28 | 2007-05-17 | Fujifilm Corp | 重合体および膜形成用組成物 |
| JP2007161780A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 膜形成用組成物、該組成物を用いた絶縁膜及び電子デバイス |
| JP2007161788A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 重合体および膜形成用組成物 |
| US7750102B2 (en) | 2007-02-06 | 2010-07-06 | Fujifilm Corporation | Insulating film for semiconductor integrated circuit |
| JP2008231174A (ja) * | 2007-03-19 | 2008-10-02 | Fujifilm Corp | 膜形成用組成物、絶縁膜及び電子デバイス |
| JP2009088028A (ja) * | 2007-09-27 | 2009-04-23 | Sumitomo Bakelite Co Ltd | 有機絶縁膜及び半導体装置 |
| US7799843B2 (en) | 2008-02-29 | 2010-09-21 | Fujifilm Corporation | Film |
| WO2010067683A1 (ja) | 2008-12-10 | 2010-06-17 | 富士フイルム株式会社 | 組成物 |
| KR20170076578A (ko) | 2015-12-24 | 2017-07-04 | 에아.워타 가부시키가이샤 | 다가 알킨 화합물, 그 제법 및 용도 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1458945A (zh) | 2003-11-26 |
| TWI241310B (en) | 2005-10-11 |
| EP1309639A1 (en) | 2003-05-14 |
| EP1309639A4 (en) | 2004-12-08 |
| MY134260A (en) | 2007-11-30 |
| KR100620207B1 (ko) | 2006-09-13 |
| WO2002008308A1 (en) | 2002-01-31 |
| KR20030031123A (ko) | 2003-04-18 |
| AU2001280549A1 (en) | 2002-02-05 |
| US20030096938A1 (en) | 2003-05-22 |
| US20020022708A1 (en) | 2002-02-21 |
| US6803441B2 (en) | 2004-10-12 |
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