TWI236949B - Dressing apparatus and polishing apparatus - Google Patents
Dressing apparatus and polishing apparatus Download PDFInfo
- Publication number
- TWI236949B TWI236949B TW091100738A TW91100738A TWI236949B TW I236949 B TWI236949 B TW I236949B TW 091100738 A TW091100738 A TW 091100738A TW 91100738 A TW91100738 A TW 91100738A TW I236949 B TWI236949 B TW I236949B
- Authority
- TW
- Taiwan
- Prior art keywords
- dresser
- trimmer
- polishing
- plate
- trimming
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims abstract description 187
- 238000009966 trimming Methods 0.000 claims description 77
- 230000007246 mechanism Effects 0.000 claims description 31
- 239000012530 fluid Substances 0.000 claims description 22
- 230000008859 change Effects 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 25
- 230000005540 biological transmission Effects 0.000 description 33
- 239000002245 particle Substances 0.000 description 21
- 239000007788 liquid Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000008439 repair process Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 238000013016 damping Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920003225 polyurethane elastomer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 206010029412 Nightmare Diseases 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 210000004712 air sac Anatomy 0.000 description 1
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- -1 propylene diene Chemical class 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001011730A JP4072810B2 (ja) | 2001-01-19 | 2001-01-19 | ドレッシング装置および該ドレッシング装置を備えたポリッシング装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI236949B true TWI236949B (en) | 2005-08-01 |
Family
ID=18878832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091100738A TWI236949B (en) | 2001-01-19 | 2002-01-18 | Dressing apparatus and polishing apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6899604B2 (enExample) |
| EP (1) | EP1261454B1 (enExample) |
| JP (1) | JP4072810B2 (enExample) |
| KR (1) | KR100798438B1 (enExample) |
| TW (1) | TWI236949B (enExample) |
| WO (1) | WO2002057051A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111872851A (zh) * | 2019-05-02 | 2020-11-03 | 三星电子株式会社 | 修整器和包括其的化学机械抛光装置 |
| TWI801997B (zh) * | 2021-05-20 | 2023-05-11 | 大陸商杭州眾硅電子科技有限公司 | 一種修整頭旋轉部件、拋光墊修整頭和修整器 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3922887B2 (ja) * | 2001-03-16 | 2007-05-30 | 株式会社荏原製作所 | ドレッサ及びポリッシング装置 |
| US7288165B2 (en) * | 2003-10-24 | 2007-10-30 | Applied Materials, Inc. | Pad conditioning head for CMP process |
| WO2007082556A1 (en) * | 2006-01-23 | 2007-07-26 | Freescale Semiconductor, Inc. | Method and apparatus for conditioning a cmp pad |
| CN100441377C (zh) * | 2006-12-05 | 2008-12-10 | 中国科学院上海光学精密机械研究所 | 用于环行抛光机的校正板 |
| US8042240B2 (en) | 2007-01-26 | 2011-10-25 | Honda Motor Co., Ltd. | Machine tool |
| JP4382099B2 (ja) * | 2007-01-26 | 2009-12-09 | 本田技研工業株式会社 | 工作機械 |
| JP5236515B2 (ja) * | 2009-01-28 | 2013-07-17 | 株式会社荏原製作所 | ドレッシング装置、化学的機械的研磨装置及び方法 |
| CN105122428B (zh) * | 2013-04-19 | 2017-11-28 | 应用材料公司 | 多盘化学机械抛光衬垫调节器与方法 |
| JP6592355B2 (ja) * | 2015-01-30 | 2019-10-16 | 株式会社荏原製作所 | 連結機構および基板研磨装置 |
| US10814457B2 (en) * | 2018-03-19 | 2020-10-27 | Globalfoundries Inc. | Gimbal for CMP tool conditioning disk having flexible metal diaphragm |
| KR102128780B1 (ko) * | 2018-12-03 | 2020-07-01 | 한국생산기술연구원 | Cmp설비용 컨디셔닝장치의 디스크결합체 |
| CN110125745A (zh) * | 2019-05-27 | 2019-08-16 | 广东技术师范大学 | 一种工业抛光打磨机器人 |
| CN114193326A (zh) * | 2021-12-22 | 2022-03-18 | 莱玛特·沃尔特斯（沈阳）精密机械有限公司 | 一种抛光机的抛光盘修整装置 |
| CN115771086A (zh) * | 2022-11-15 | 2023-03-10 | 重庆大学 | 一种万向浮动打磨机构 |
| CN116021427B (zh) * | 2023-02-01 | 2025-06-24 | 江西联洲研磨科技有限公司 | 一种树脂砂轮加工用表面修整装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5981056A (ja) | 1982-10-29 | 1984-05-10 | Tohoku Metal Ind Ltd | 定盤修正装置 |
| US5885137A (en) * | 1997-06-27 | 1999-03-23 | Siemens Aktiengesellschaft | Chemical mechanical polishing pad conditioner |
| US6200199B1 (en) | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
| US6263605B1 (en) * | 1998-12-21 | 2001-07-24 | Motorola, Inc. | Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor |
| JP3045236B1 (ja) | 1999-01-18 | 2000-05-29 | 株式会社東京精密 | 研磨布コンディショナを備えたウェハ研磨装置 |
| JP3945940B2 (ja) | 1999-06-02 | 2007-07-18 | 東京エレクトロン株式会社 | 試料研磨方法及び試料研磨装置 |
| US6217429B1 (en) * | 1999-07-09 | 2001-04-17 | Applied Materials, Inc. | Polishing pad conditioner |
| JP2001246550A (ja) | 2000-03-02 | 2001-09-11 | Ebara Corp | 研磨装置 |
| US6572446B1 (en) * | 2000-09-18 | 2003-06-03 | Applied Materials Inc. | Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane |
-
2001
- 2001-01-19 JP JP2001011730A patent/JP4072810B2/ja not_active Expired - Lifetime
-
2002
- 2002-01-17 EP EP02715775A patent/EP1261454B1/en not_active Expired - Lifetime
- 2002-01-17 US US10/204,600 patent/US6899604B2/en not_active Expired - Lifetime
- 2002-01-17 WO PCT/JP2002/000274 patent/WO2002057051A1/en not_active Ceased
- 2002-01-17 KR KR1020027012337A patent/KR100798438B1/ko not_active Expired - Lifetime
- 2002-01-18 TW TW091100738A patent/TWI236949B/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111872851A (zh) * | 2019-05-02 | 2020-11-03 | 三星电子株式会社 | 修整器和包括其的化学机械抛光装置 |
| CN111872851B (zh) * | 2019-05-02 | 2024-02-06 | 三星电子株式会社 | 修整器和包括其的化学机械抛光装置 |
| TWI801997B (zh) * | 2021-05-20 | 2023-05-11 | 大陸商杭州眾硅電子科技有限公司 | 一種修整頭旋轉部件、拋光墊修整頭和修整器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4072810B2 (ja) | 2008-04-09 |
| JP2002210650A (ja) | 2002-07-30 |
| EP1261454A1 (en) | 2002-12-04 |
| US6899604B2 (en) | 2005-05-31 |
| US20030148707A1 (en) | 2003-08-07 |
| WO2002057051A1 (en) | 2002-07-25 |
| KR20020092993A (ko) | 2002-12-12 |
| EP1261454B1 (en) | 2012-08-01 |
| KR100798438B1 (ko) | 2008-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI236949B (en) | Dressing apparatus and polishing apparatus | |
| JP4086722B2 (ja) | 基板保持装置及び研磨装置 | |
| EP1240977B1 (en) | Polishing apparatus | |
| US7357699B2 (en) | Substrate holding apparatus and polishing apparatus | |
| US8382558B2 (en) | Apparatus for dressing a polishing pad, chemical mechanical polishing apparatus and method | |
| US20070212988A1 (en) | Polishing apparatus | |
| CN100509287C (zh) | 衬底保持设备以及抛光装置 | |
| JP2001044150A (ja) | ケミカルメカニカルポリシングのための装置および方法 | |
| JPH10249707A (ja) | 化学的機械的研磨システム中で研磨パッドを調整する方法と装置 | |
| US7270594B2 (en) | Polishing apparatus | |
| JP4718107B2 (ja) | 基板保持装置及び研磨装置 | |
| JP4666300B2 (ja) | 化学機械研磨システムの振動低減機能付キャリアヘッド | |
| JP2003173995A (ja) | 基板保持装置及びポリッシング装置 | |
| JP2006324413A (ja) | 基板保持装置および研磨装置 | |
| JP3856634B2 (ja) | 基板保持装置及び該基板保持装置を備えたポリッシング装置 | |
| JPH11333677A (ja) | 基板の研磨装置 | |
| JPH08206952A (ja) | 曲面研磨具 | |
| JP2003220553A (ja) | 研磨ヘッド及び研磨方法 | |
| JP2000042902A (ja) | 研磨用工具及びそれを用いる研磨加工方法 | |
| JP2000202767A (ja) | 平坦化装置及び平坦化方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |